LED support structure

Abstract

An embodiment of the utility model discloses an LED support structure which comprises a substrate, a support fixed welding function area is arranged in the middle of the substrate, an etching groove is arranged on the periphery of the support fixed welding function area, the etching groove is arranged on the outer side of the support fixed welding function area in a surrounding mode, and the etching groove and the support fixed welding function area are in contact. And a titanium dioxide layer is arranged in the etching groove. According to the embodiment of the utility model, the etching groove is arranged on the peripheral side of the fixed welding functional area of the bracket, and the titanium dioxide layer is covered in the etching groove, so that compared with the existing bracket structure, the uniformity of the amount of sprayed titanium dioxide glue is controllable, the glue spraying area is controllable, the titanium dioxide glue is not easy to spray on a chip to reduce the lighting effect, the probability of reject ratio is lower, and the production efficiency is improved. And meanwhile, the titanium dioxide layer has high reflectivity and good optical performance, so that reflection and scattering of light can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED bracket structure. Background Art

[0002] LED light sources are currently widely used in the lighting field, but improving luminous efficiency has always been a key focus of the industry. Traditional EMC bracket structures and spray adhesive processes have certain limitations in improving luminous efficiency, making it difficult to meet the market demand for higher-efficiency LED light sources.

[0003] See also Figure 1 The conventional EMC bracket has uneven glue amount after spraying, and the spraying area cannot be controlled, which easily leads to a high defective rate of the product and the light efficiency improvement effect is not obvious.

[0004] Therefore, we propose an LED bracket structure. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the present invention is that the amount of glue on conventional EMC brackets is uneven after spraying, and the spraying area cannot be controlled, which easily leads to a high defective rate of the product and a relatively unobvious effect on improving the light efficiency.

[0006] In order to solve the above problems, an embodiment of the present invention provides an LED bracket structure, including a substrate, a bracket fixing welding functional area is opened at the middle position of the substrate, an etching groove is opened on the surrounding side of the bracket fixing welding functional area, the etching groove is surrounded by the outside of the bracket fixing welding functional area and the two are in contact, and a titanium dioxide layer is arranged in the etching groove.

[0007] Optionally, a plurality of groups of LED chips are arranged on the bracket fixing welding functional area.

[0008] Optionally, the depth of the etched groove is 0.085±0.01 mm.

[0009] Optionally, the height of the titanium dioxide layer is 0.070-0.085 mm.

[0010] Optionally, a negative electrode welding wire area is provided on one side of the bracket fixing welding functional area.

[0011] Optionally, a positive electrode welding wire area is provided on the other side of the bracket fixing welding functional area.

[0012] Optionally, the LED chips are arranged in 4-10 groups.

[0013] Optionally, the cathode of one of the two adjacent LED chips is welded to the anode of the other.

[0014] Optionally, a negative electrode notch is provided at one end of the substrate on the side where the negative electrode welding wire area is located.

[0015] Optionally, the cathode of one of the two adjacent LED chips is connected to the anode of the other by welding with a welding wire.

[0016] Compared with the prior art, the technical effects achieved by the embodiments of the present invention include:

[0017] In the embodiment of the present invention, etching grooves are provided on the peripheral sides of the bracket fixing functional area, and a titanium dioxide layer is covered in the etching grooves. Compared with the existing bracket structure, the uniformity of the amount of titanium dioxide glue sprayed is controllable, and the spraying area is controllable. It is not easy to spray onto the chip and reduce the light efficiency, and the probability of defective rate is low, which is conducive to improving the product yield. At the same time, because the titanium dioxide layer has high reflectivity and good optical properties, it can effectively improve the reflection and scattering of light. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention.

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0021] Figure 1 This is the main structural diagram of the utility model.

[0022] Figure 2 This is the main structural diagram of the substrate.

[0023] Reference numerals

[0024] 1. Substrate; 2. LED chip; 3. Titanium dioxide layer; 4. Bracket fixing welding functional area; 5. Etched groove; 6. Welding line; 7. Cathode welding line area; 8. Positive welding line area; 9. Cathode notch. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments. Similar component numbers in the drawings represent similar components. Obviously, the embodiments described below are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0026] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0027] It should also be understood that the terms used in this specification of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the specification of the embodiments of the present invention and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0028] See also Figure 1-2 The present invention provides an LED bracket structure, comprising a substrate 1, an LED chip 2, and a titanium dioxide layer 3. Multiple groups of LED chips 2 are arranged in the middle of the substrate 1, and the titanium dioxide layer 3 is arranged on the outer periphery of the LED chip 2. Furthermore, a bracket fixing welding functional area 4 is provided in the middle of the substrate 1, and the LED chip 2 is provided on the bracket fixing welding functional area 4; an etching groove 5 is provided on the outer side of the bracket fixing welding functional area 4, and the etching groove 5 is provided around the outer side of the bracket fixing welding functional area 4, and the two are in contact. The titanium dioxide layer 3 is arranged in the etching groove 5. By providing the etching groove 5, the uniformity of the amount of titanium dioxide glue sprayed and the spraying area can be controlled, and it is not easy to be sprayed onto the chip to reduce the light efficiency, so the probability of defective rate is low.

[0029] In the present invention, the depth of the etched groove 5 is 0.085±0.01mm, which is much smaller than the thickness of the substrate 1 and will not affect the arrangement of other structures on the substrate 1. It will not cause the titanium dioxide layer 3 to be difficult to lay out or easier to pour out due to the depth being too small, which is beneficial to improving the success rate of the layout of the titanium dioxide layer 3; the thickness of the titanium dioxide layer 3 is 0.070-0.085mm, and is less than or equal to the depth of the etched groove 5, so that the titanium dioxide layer 3 will not overflow and be sprayed onto the chip. The width of the titanium dioxide layer 3 is 0.22±0.05mm, which is not too small, resulting in a small effect of improving the light efficiency, nor too large, thereby greatly affecting the size design of the bracket fixing welding functional area 4.

[0030] See also Figure 2 In the present invention, the LED chips 2 are set to 8 groups, including but not limited to these. They can also be other groups among the 4-10 groups, or 1-3 groups, or more than 10 groups. The specific settings can be based on the size of the LED chip 2, the size of the bracket fixing functional area 4, and the light efficiency requirements; the negative pole of one of the two adjacent LED chips 2 is welded to the positive pole of the other, and they are not connected to each other, that is, the negative pole of the first group of LED chips 2 is welded to the positive pole of the second group of LED chips 2, the negative pole of the second group of LED chips 2 is welded to the positive pole of the third group of LED chips 2, and the negative pole of the second to last group of LED chips 2 is welded to the positive pole of the first to last group of LED chips 2, specifically, the connection is achieved by welding the welding wire 6.

[0031] See Continue Figure 2 A negative electrode bonding wire area 7 is provided on one side of the bracket fixing welding functional area 4, and a positive electrode bonding wire area 8 is provided on the other side of the bracket fixing welding functional area 4, wherein the negative electrode bonding wire area 7 is connected to the negative electrode of the last group of LED chips 2, and the positive electrode bonding wire area 8 is connected to the positive electrode of the first group of LED chips 2; a negative electrode notch 9 is opened at one end of the substrate 1 on the side where the negative electrode bonding wire area 7 is located, which is used as a mark so that the staff can quickly identify the position of the negative electrode bonding wire area 7 and the position of the positive electrode bonding wire area 8 on the opposite side of the negative electrode bonding wire area 7.

[0032] Compared with the prior art, the technical effects achieved by the embodiments of the present invention include:

[0033] In the embodiment of the present invention, etching grooves are provided on the peripheral sides of the bracket fixing functional area, and a titanium dioxide layer is covered in the etching grooves. Compared with the existing bracket structure, the uniformity of the amount of titanium dioxide glue sprayed is controllable, and the spraying area is controllable. It is not easy to spray onto the chip and reduce the light efficiency, and the probability of defective rate is low, which is conducive to improving the product yield. At the same time, because the titanium dioxide layer has high reflectivity and good optical properties, it can effectively improve the reflection and scattering of light.

[0034] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0037] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0039] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0040] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, as long as these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

[0041] The above description is a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An LED bracket structure, characterized in that: It includes a substrate, a bracket fixing welding functional area is opened in the middle position of the substrate, an etching groove is opened around the bracket fixing welding functional area, the etching groove is surrounded by the outside of the bracket fixing welding functional area and the two are in contact, and a titanium dioxide layer is arranged in the etching groove.

2. The LED support structure according to claim 1, characterized in that: A plurality of groups of LED chips are arranged on the support fixing welding functional area.

3. The LED support structure according to claim 1, characterized in that: The depth of the etched groove is 0.085±0.01 mm.

4. The LED support structure according to claim 1, characterized in that: The height of the titanium dioxide layer is 0.070-0.085 mm.

5. The LED support structure according to claim 1, characterized in that: A negative electrode welding wire area is provided on one side of the bracket fixing welding functional area.

6. The LED support structure according to claim 5, characterized in that: A positive electrode welding wire area is provided on the other side of the bracket fixing welding functional area.

7. The LED support structure according to claim 2, characterized in that: The LED chips are arranged in 4-10 groups.

8. The LED support structure according to claim 2, characterized in that: The cathode of one of the two adjacent LED chips is welded to the anode of the other.

9. The LED support structure according to claim 5, characterized in that: A negative electrode notch is provided at one end of the substrate on the side where the negative electrode welding wire area is located.

10. The LED support structure according to claim 8, characterized in that: The cathode of one of the two adjacent LED chips is connected to the anode of the other by welding with a welding wire.

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