Display module
By forming a removable second encapsulation layer and an immutable first encapsulation layer on the surface of the module light board of the display module, the processing difficulties and defects of the PET film method are solved, and precise maintenance and uniformity of the display module are achieved.
Patent Information
- Application Number
- CN202422603147.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-25
AI Technical Summary
The existing display modules use PET film during maintenance, which has processing difficulties, defects such as white edges and burrs on the edges, affecting the display effect. In addition, PET film is prone to shrinkage and fading in high temperature and high ultraviolet light environments.
A first encapsulation layer and a second encapsulation layer are sequentially formed on the surface of the module light board of the display module, wherein the second encapsulation layer can be completely removed by ultraviolet light irradiation, and the first encapsulation layer maintains its structure unchanged under ultraviolet light, allowing single-point repair and ensuring ink color consistency and thickness uniformity.
It achieves precise repair of the display module, solves the problem of repair marks, ensures the uniformity and consistency of the display effect, and avoids defects such as white edges and burrs.
Smart Images

Figure CN223349029U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a display module. Background Art
[0002] The mainstream packaging technology for display modules uses molding, a process that uses epoxy glue for a single-step molding and lamination process to form a sealing adhesive layer on the display surface. In practice, since display modules are viewed at close range, extremely high requirements are placed on the ink color consistency of the module surface. Therefore, defects that may occur during repair are unacceptable, which poses new challenges to the packaging and repair processes.
[0003] In order to solve the above problems, the current common practice in the industry is to apply a PET film to the surface of the encapsulation layer after the molding process. This solution can ensure the consistency of the surface and color of the film through batch processing of PET film materials, so that when the display module is repaired, the problem of repair marks can be solved by re-applying the same PET film material to ensure its ink color consistency. However, in actual use, it was found that in this method, the PET film material needs to be attached to the surface of the encapsulation layer through OCA. Since OCA is relatively flexible and the material of PET film material is also relatively soft, the overall processing is difficult, and during the overall molding, the edges of the film material are prone to defects such as white edges and burrs, which seriously affect the display effect of the display module. At the same time, in an environment with high temperature and high ultraviolet rays, the PET film material itself is also prone to problems such as shrinkage and fading, which will further aggravate the problem of white edges. Utility Model Content
[0004] The embodiment of the present application provides a display module, which aims to improve the existing display module using PET film to solve the problem of repair marks. It is not only difficult to process, but also prone to defects such as white edges and burrs, which seriously affect the display effect of the display module.
[0005] To this end, an embodiment of the present application provides a display module, including a module light board, wherein a first encapsulation layer and a second encapsulation layer are sequentially formed on the display surface of the module light board in a direction away from the display surface, wherein the second encapsulation layer can be completely removed by ultraviolet light irradiation when the display module is maintained, and the first encapsulation layer can maintain its structure unchanged under ultraviolet light irradiation.
[0006] Optionally, in some embodiments of the present application, the thickness of the first packaging layer is 0.05 mm to 0.8 mm.
[0007] Optionally, in some embodiments of the present application, the first encapsulation layer is any one of an epoxy resin material layer, a silicone material layer, and a fluoropolymer material layer, and the first encapsulation layer is doped with an anti-UV additive or a UV absorber.
[0008] Optionally, in some embodiments of the present application, the thickness of the second encapsulation layer is 0.01 mm to 0.2 mm.
[0009] Optionally, in some embodiments of the present application, the second encapsulation layer is an epoxy resin material layer or a silicone material layer.
[0010] Optionally, in some embodiments of the present application, the interior of the second encapsulation layer is doped with melanin.
[0011] Optionally, in some embodiments of the present application, the first encapsulation layer and the second encapsulation layer are respectively any one of a molded structure, a potting structure, or a glue-bonded structure.
[0012] Optionally, in some embodiments of the present application, an anti-glare layer is further formed on the surface of the second encapsulation layer away from the first encapsulation layer. The anti-glare layer can also be completely removed by ultraviolet light irradiation during maintenance of the display module.
[0013] Optionally, in some embodiments of the present application, the anti-glare layer has a thickness of 0.003 mm to 0.007 mm.
[0014] Optionally, in some embodiments of the present application, the anti-glare layer is an acrylic material layer or an epoxy resin material layer.
[0015] The technical solution provided by the present application is that a first encapsulation layer and a second encapsulation layer are sequentially formed on the display surface of the module light board in a direction away from the display surface, wherein the second encapsulation layer can be completely removed by ultraviolet light irradiation when the display module is maintained, and the first encapsulation layer can maintain its structure unchanged under ultraviolet light irradiation. In this way, through the above-mentioned structural setting, when the display module is repaired, the second encapsulation layer can be completely removed by ultraviolet light irradiation on the display surface of the module light board, while retaining the complete first encapsulation layer to ensure the accuracy of the thickness of the repair removal layer. At this time, the display module can be repaired at a single point. After the repair is completed, the same second encapsulation layer can be re-formed on the surface of the first encapsulation layer to solve the problem of repair marks while ensuring the consistency of the ink color and thickness uniformity of the display module after repair. It can be seen that the present technical solution can effectively improve the existing display module using PET film to solve the problem of repair marks, which is not only difficult to process, but also prone to defects such as white edges and burrs on the edges, which seriously affect the display effect of the display module. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0017] Figure 1 Schematic diagram of the structure of the display module in the embodiment of the present application. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0019] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0020] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by this application.
[0021] In one embodiment, Figure 1 As shown, an embodiment of the present application provides a display module 100, which may specifically include a module light board 110, and a first encapsulation layer 120 and a second encapsulation layer 130 are sequentially formed on the display surface of the module light board 110 in a direction away from the display surface, wherein the second encapsulation layer 130 can be completely removed by ultraviolet light irradiation when the display module 100 is maintained, and the first encapsulation layer 120 can maintain its structure unchanged under ultraviolet light irradiation.
[0022] It is understandable that the display module 100 of the embodiment of the present application can be used for independent display or can be specifically applied to a display screen, so that a number of display modules 100 are arranged in a certain manner to form a corresponding display screen. The display module 100 of the embodiment of the present application can adopt a bottom shell structure design or a bottom shell-free structure design. When it adopts a bottom shell structure design, in addition to the module light board 110, it also includes a module bottom shell, which is installed on the side surface of the module light board 110 away from the display surface. The above-mentioned module light board 110 can specifically include a module main board 111, a number of module lamp beads 112 and a number of module ICs 113. The number of module lamp beads 112 are distributed in a certain regular pattern on the first surface of the module main board 111, so that the first surface of the module main board 111 forms the above-mentioned display surface. The number of module ICs 113 are distributed in a certain regular pattern on the second surface of the module main board 111, so that the second surface of the module main board 111 forms the driving surface. The first surface and the second surface of the module mainboard 111 are specifically two side surfaces in the thickness direction of the module mainboard 111. When the display module 100 adopts a bottom shell structure design, the module bottom shell is specifically installed on the driving surface.
[0023] In addition, the first encapsulation layer 120 of the embodiment of the present application differs from existing encapsulation layers primarily in that it is designed to be UV-resistant (i.e., ultraviolet light) or designed to absorb UV light, allowing it to maintain its original structure under ultraviolet light irradiation. The second encapsulation layer 130 of the embodiment of the present application differs from the first encapsulation layer 120 primarily in that the second encapsulation layer 130 has neither a UV-resistant nor a UV-absorbing design, allowing it to be completely removed under ultraviolet light irradiation.
[0024] In this way, the display module 100 of the embodiment of the present application has a first encapsulation layer 120 and a second encapsulation layer 130 formed in sequence on the display surface of the module light board 110 in a direction away from the display surface, wherein the second encapsulation layer 130 can be completely removed by ultraviolet light irradiation when the display module 100 is maintained, and the first encapsulation layer 120 can maintain its structure unchanged under ultraviolet light irradiation. In this way, through the above-mentioned structural setting, when the display module 100 is repaired, the second encapsulation layer 130 can be completely removed by ultraviolet light irradiation on the display surface of the module light board 110, while retaining the complete first encapsulation layer 120 to ensure the accuracy of the thickness of the repair removal layer. At this time, the display module 100 can be repaired at a single point. After the repair is completed, the same second encapsulation layer 130 can be re-formed on the surface of the first encapsulation layer 120 to solve the problem of repair marks while ensuring the consistency of ink color and thickness uniformity of the display module 100 after repair.
[0025] In some examples, such as Figure 1 As shown, the thickness of the first encapsulation layer 120 is 0.05 mm to 0.8 mm. Thus, through the structural design of this thickness parameter, it can be ensured that the first encapsulation layer 120 can play a good encapsulation and protection role on the display surface of the module light board 110 (specifically the module lamp beads 112 mentioned above).
[0026] It is understandable that the first packaging layer 120 in this example can completely cover all module lamp beads 112 on the module main board 111 , so that they are completely placed in the packaging protection of the first packaging layer 120 .
[0027] In some examples, such as Figure 1 As shown, the first encapsulation layer 120 is any one of an epoxy resin layer, a silicone layer, and a fluoropolymer layer, and is doped with an anti-UV additive or a UV absorber. This structure allows the first encapsulation layer 120 to provide excellent encapsulation and protection for the module lamp beads 112 without affecting their display quality, while also providing excellent UV resistance or UV absorption, allowing them to maintain their original structure even under ultraviolet light.
[0028] It is understood that the UV-resistant additives mentioned in this example can specifically be light stabilizers, including Hindered Amine Light Stabilizers (HALS, such as the Tinuvin series (e.g., Tinuvin 770, Tinuvin 123)) and silicone light stabilizers (e.g., siloxanes). They can also be antioxidants, such as BHT (butyl hydroxytoluene) and other synthetic antioxidants. They can also be modified polymers, that is, certain polymers can be modified to enhance their UV resistance, such as through copolymerization or cross-linking to improve material stability. The UV absorbers mentioned in this example can specifically be phenylbenzimidazole (PBM), benzotriazoles (e.g., BT-UV), benzophenones (e.g., BP-1, BP-3), trifluorochlorides (e.g., TBC), etc. The first encapsulation layer 120 mentioned in this example is doped with an anti-UV additive or UV absorber. The weight ratio of the anti-UV additive or UV absorber in the first encapsulation layer 120 is 30% to 40%, ensuring that the first encapsulation layer 120 has high UV resistance or UV absorption capabilities.
[0029] In some examples, such as Figure 1 As shown, the thickness of the second encapsulation layer 130 is 0.01 mm to 0.2 mm. Thus, through the structural design of this thickness parameter, the second encapsulation layer 130 can well ensure the ink color consistency and thickness uniformity of the display module 100 without affecting the display effect of the module lamp beads 112.
[0030] In some examples, such as Figure 1 As shown, the second encapsulation layer 130 is a layer of epoxy resin or silicone material. This structure ensures that the second encapsulation layer 130 maintains the ink color consistency and thickness uniformity of the display module 100 without affecting the display effect of the module lamp beads 112, and can be completely removed under ultraviolet light. Furthermore, the second encapsulation layer 130 is doped with melanin. This structure further ensures that the second encapsulation layer 130 maintains the ink color consistency of the display module 100.
[0031] It can be understood that the second encapsulation layer 130 mentioned in this example is doped with melanin, and the weight ratio of melanin in the second encapsulation layer 130 is 3‰ to 10‰, so as to ensure that the second encapsulation layer 130 can well guarantee the ink color consistency of the display module 100 without affecting the display effect of the module lamp bead 112.
[0032] In some examples, such as Figure 1 As shown, the first encapsulation layer 120 and the second encapsulation layer 130 are respectively any one of a molded structure, a potting structure, or a glued structure. In this way, it can be ensured that the first encapsulation layer 120 and the second encapsulation layer 130 both have good encapsulation protection effects.
[0033] In some examples, such as Figure 1 As shown, an anti-glare layer 140 is also formed on the surface of the second encapsulation layer 130 away from the first encapsulation layer 120. The anti-glare layer 140 can also be completely removed by ultraviolet light irradiation during maintenance of the display module 100. Thus, through the above-mentioned structural arrangement, the surface of the display module 100 also has an anti-glare function, further improving its display effect. Since the anti-glare layer 140 can also be completely removed by ultraviolet light irradiation during maintenance of the display module 100, after repair, the same second encapsulation layer 130 and anti-glare layer 140 can be re-formed on the surface of the first encapsulation layer 120 to eliminate the problem of repair marks while ensuring the consistency of ink color and thickness uniformity of the display module 100 after repair.
[0034] In some examples, such as Figure 1 As shown, the thickness of the anti-glare layer 140 is 0.003mm to 0.007mm. Thus, through the structural design of this thickness parameter, it is ensured that the anti-glare layer 140 can provide a good anti-glare effect while not affecting the display effect of the module lamp beads 112. Furthermore, the anti-glare layer 140 is a layer of acrylic material or epoxy resin material. Thus, through the above structural arrangement, the anti-glare layer 140 has a good anti-glare effect while ensuring that it can be completely removed under ultraviolet light.
[0035] The above embodiments are intended only to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they may modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. However, such modifications or replacements do not deviate from the spirit and scope of the technical solutions of the various embodiments of this application.
Claims
1. A display module, characterized in that: It includes a module light board, on the display surface of which a first encapsulation layer and a second encapsulation layer are sequentially formed in a direction away from the display surface, wherein the second encapsulation layer can be completely removed by ultraviolet light irradiation when the display module is maintained, and the first encapsulation layer can maintain its structure unchanged under ultraviolet light irradiation.
2. The display module according to claim 1, wherein: The thickness of the first packaging layer is 0.05 mm to 0.8 mm.
3. The display module according to claim 1, wherein: The first encapsulation layer is any one of an epoxy resin material layer, a silicone material layer, and a fluoropolymer material layer, and the first encapsulation layer is doped with an anti-UV additive or a UV absorber.
4. The display module according to claim 1, wherein: The thickness of the second packaging layer is 0.01 mm to 0.2 mm.
5. The display module according to claim 1, wherein: The second packaging layer is an epoxy resin material layer or a silicone material layer.
6. The display module according to claim 1, wherein: The second encapsulation layer is doped with melanin.
7. The display module according to claim 1, wherein: The first encapsulation layer and the second encapsulation layer are respectively any one of a molded structure, a potting structure, or a glue-bonded structure.
8. The display module according to any one of claims 1 to 6, wherein: An anti-glare layer is further formed on the surface of the second encapsulation layer away from the first encapsulation layer. The anti-glare layer can also be completely removed by ultraviolet light irradiation during maintenance of the display module.
9. The display module according to claim 8, wherein: The anti-glare layer has a thickness of 0.003 mm to 0.007 mm.
10. The display module according to claim 8, wherein: The anti-glare layer is an acrylic material layer or an epoxy resin material layer.