Dust sticking machine

Abstract

The dust sticking machine comprises a rack, a cleaning roller set and a first guide plate frame. Wherein the number of the cleaning roller sets is multiple, and each cleaning roller set is installed on the machine frame. The first guide plate frame is selectively detachably installed on the machine frame, and when the first guide plate frame is installed on the machine frame, the first guide plate frame is located between every two adjacent cleaning roller sets. According to the thickness of the packaging substrate to be cleaned, the first guide plate frame which can be selectively mounted or dismounted is introduced between the cleaning roller sets of the dust sticking machine, so that the distance between every two adjacent cleaning roller sets is adjusted through the first guide plate frame, the cleaning requirements of the packaging substrates with different thicknesses are flexibly met, the flatness of the thin packaging substrate is guaranteed, and the cleaning efficiency is improved. And the cleaning efficiency of the packaging substrate is also considered.

Description

Technical Field

[0001] The present application relates to the technical field of cleaning packaging substrates, and in particular to a dust collecting machine. Background Art

[0002] During the processing of package substrate products, an auxiliary device, a dust collector, is required to clean the board surface and reduce the impact of tiny particles on product yield.

[0003] Generally speaking, when a package substrate is thick, a straight cylindrical cleaning roller assembly is used. When a package substrate is thin, a straight lotus root-shaped cleaning roller assembly is used. Therefore, it's difficult for the same dust collecting machine to process both thick and thin package substrates. Instead, different dust collecting machines must be matched to the thickness of the package substrate being processed, which is cumbersome. Utility Model Content

[0004] The purpose of the present application is to provide a dust collecting machine to solve the problem that the same dust collecting machine is difficult to process thick packaging substrates and thin packaging substrates at the same time.

[0005] One aspect of the present application provides a dust collecting machine for cleaning a packaging substrate. The dust collecting machine includes: a frame, a cleaning roller group, and a first guide plate frame. There are multiple cleaning roller groups, and each cleaning roller group is installed on the frame; the first guide plate frame can be selectively removed and installed from the frame, and when the first guide plate frame is installed on the frame, the first guide plate frame is located between each adjacent two cleaning roller groups.

[0006] Optionally, a spacing area is provided between each two adjacent cleaning roller groups; each first guide plate frame is located in the corresponding spacing area; along the conveying direction of the packaging substrate, the width of each first guide plate frame is not less than 1 / 3 of the width of the corresponding spacing area; along the conveying direction perpendicular to the packaging substrate, the length of each first guide plate frame is not less than 1 / 2 of the length of the corresponding spacing area.

[0007] Optionally, along the conveying direction of the package substrate, the width of each first guide frame is equal to 1 / 2 of the width of the corresponding spacer; along the conveying direction perpendicular to the package substrate, the length of each first guide frame is equal to the length of the corresponding spacer.

[0008] Optionally, along a conveying direction perpendicular to the package substrate, a center line of each first guide frame coincides with a center line of a corresponding spacing area.

[0009] Optionally, each cleaning roller group includes a corresponding first roller and a second roller, and each first roller and the corresponding second roller are respectively located on opposite sides of the packaging substrate; each first guide plate frame is arranged between two adjacent first rollers or second rollers, and each first guide plate frame includes a first pressing surface facing the packaging substrate; the plane where the tangent line of the rim of the corresponding first roller or second roller facing the packaging substrate is located is flush with the first pressing surface.

[0010] Optionally, the dust collecting machine also includes a plurality of second guide plate racks detachably arranged on the frame, each second guide plate rack including a second pressing surface facing the packaging substrate; wherein, when the first guide plate rack is installed on the frame, each first guide plate rack is located between two adjacent first rollers, and each first pressing surface is flush with the plane where the tangent line of the rim of the corresponding first roller facing the packaging substrate is located; when the second guide plate rack is installed on the frame, each second guide plate rack is located between two adjacent second rollers, and each second pressing surface is flush with the plane where the tangent line of the rim of the corresponding second roller facing the packaging substrate is located.

[0011] Optionally, each first guide plate frame and the corresponding second guide plate frame are arranged opposite to each other and are symmetrically arranged along the packaging substrate.

[0012] Optionally, both the first pressing surface and the second pressing surface are covered with a layer of Teflon coating.

[0013] Optionally, the first pressing surface is further covered with a Teflon coating.

[0014] Optionally, the first roller and the second roller are both in the shape of a straight cylinder, including a cylindrical rolling surface.

[0015] The dust collecting machine provided in the present application includes: a frame, a cleaning roller group, and a first guide plate frame. There are multiple cleaning roller groups, and each cleaning roller group is installed on the frame. The first guide plate frame can be selectively detached and installed with the frame, and when the first guide plate frame is installed on the frame, the first guide plate frame is located between each two adjacent cleaning roller groups. According to the thickness of the packaging substrate to be cleaned, a first guide plate frame that can be selectively installed or removed is introduced between the cleaning roller groups of the dust collecting machine, so that the distance between each two adjacent cleaning roller groups can be adjusted by the first guide plate frame, so as to flexibly respond to the cleaning needs of packaging substrates of different thicknesses, thereby ensuring the flatness of thin packaging substrates and taking into account the cleaning efficiency of packaging substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present invention, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0017] Figure 1 is a top view of an exemplary dust sticking machine of the present application, wherein the dust sticking machine includes a frame;

[0018] Figure 2 This is an exemplary schematic diagram of the dust collecting machine of the present application, with the frame removed;

[0019] Figure 3 This is another exemplary schematic diagram of the dust collecting machine of the present application, with the frame removed.

[0020] Description of reference numerals:

[0021] 10, cleaning roller assembly; 11, first roller; 12, second roller; 20, first guide plate rack; 30, frame; 40, spacing area; 50, packaging substrate; 60, second guide plate rack; a, conveying direction of packaging substrate 50; b, conveying direction perpendicular to packaging substrate 50; c, wheel rim tangent. DETAILED DESCRIPTION

[0022] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0023] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0024] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application.

[0025] It should be noted that the term "plurality" used in this document refers to two or more. "And / or" describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. The character " / " generally indicates an "or" relationship between the associated objects.

[0026] During the processing of package substrate products, dust collectors can remove dust and impurities from the surface of the package substrates. Existing cleaning roller assemblies can include straight lotus root-shaped cleaning roller assemblies and straight cylindrical cleaning roller assemblies. Straight lotus root-shaped cleaning roller assemblies can be used to process thin package substrates, reducing the risk of thin package substrates curling and scrapping. However, due to the small contact area of ​​the straight lotus root-shaped roller, its dust collection effect is not as good as that of the straight cylindrical cleaning roller assemblies. Furthermore, thick package substrates are prone to indentation. Straight cylindrical cleaning roller assemblies are suitable for processing thick package substrates, but are prone to curling when processing thin package substrates.

[0027] Therefore, this embodiment proposes a dust collecting machine, which introduces a first guide plate frame that can be optionally installed or removed between the cleaning roller groups of the dust collecting machine according to the thickness of the packaging substrate to be cleaned, so that the distance between each adjacent two cleaning roller groups can be adjusted by the first guide plate frame to flexibly respond to the cleaning needs of packaging substrates of different thicknesses, thereby ensuring the flatness of thin packaging substrates and taking into account the cleaning efficiency of packaging substrates.

[0028] See also Figure 1 The present application provides a dust collecting machine for cleaning packaging substrates. The dust collecting machine includes a frame 30, a cleaning roller group 10 and a first guide plate frame 20. There are multiple cleaning roller groups 10, and each cleaning roller group 10 is installed on the frame 30. According to the thickness of the packaging substrate, the first guide plate frame 20 can be selectively detached and installed with the frame 30. When the first guide plate frame 20 is installed on the frame 30, the first guide plate frame 20 is located between each adjacent two cleaning roller groups 10, thereby adjusting the distance between each adjacent two cleaning roller groups 10, so that the portion of the packaging substrate located between each adjacent two cleaning roller groups 10 can also be pressed by the first guide plate frame 20, thereby avoiding the curling phenomenon of the thin packaging substrate, thereby ensuring the flatness of the thin packaging substrate.

[0029] Specifically, the first guide plate frame 20 can be connected to the rack 30 through a connection mechanism, wherein the connection mechanism can be a quick lock mechanism, such as a buckle, a knob or a quick release pin; it can also be a magnetic connection, such as using the attraction of a strong magnet to adsorb the first guide plate frame 20 on the rack 30; it can also be a slide rail and a slot, such as the first guide plate frame 20 is designed with a slide rail or a slot, which can be easily slid along the corresponding track on the rack 30 for insertion or removal.

[0030] The cleaning roller assembly 10 can be used to directly contact and clean tiny particles, such as dust and impurities, from the surface of the package substrate. Each cleaning roller assembly 10 can include at least one cleaning roller, which can be covered with a special sticky material, such as sticky rubber or sticky cloth, to effectively absorb tiny particles from the surface of the package substrate.

[0031] The first operating state of the dust collecting machine is when the first guide plate frame 20 is installed between each pair of adjacent cleaning roller assemblies 10; in this state, the dust collecting machine is used to process thin package substrates. The second operating state is when the first guide plate frame 20 is removed from between each pair of adjacent cleaning roller assemblies 10; in this state, the dust collecting machine is used to process thick package substrates.

[0032] Specifically, when processing thin package substrates, the first guide frame 20 is mounted on the machine frame 30. As the thin package substrate passes through the cleaning roller assembly 10, the sticky material on the cleaning roller assembly 10 absorbs dust and particles from the package substrate's surface. Because the first guide frame 20 is located between each pair of adjacent cleaning roller assemblies 10, the first guide frame 20 provides transitional support as the thin package substrate passes between them, preventing it from curling. The thin package substrate is then transported to the next cleaning roller assembly 10 for further cleaning.

[0033] When processing thick package substrates, due to their strong rigidity, thick package substrates are less likely to deform even when passing through the relatively wide gap 40 between two adjacent cleaning roller assemblies 10. Therefore, the first guide frame 20 in the gap 40 between each pair of adjacent cleaning roller assemblies 10 can be removed to prevent the thick package substrates from being damaged by collision, hanging, or other such effects when passing between the two adjacent cleaning roller assemblies 10.

[0034] Further, see Figure 1 and Figure 2 In the dust collecting machine, multiple cleaning roller assemblies 10 are arranged in sequence, with a spacing area 40 between each adjacent cleaning roller assemblies 10. The spacing area 40 is the distance between each adjacent cleaning roller assemblies 10. Because thin package substrates 50 are prone to curling when passing through this spacing area 40, each first guide frame 20 is located within a corresponding spacing area 40.

[0035] Along the conveying direction a of the package substrates 50, the width of each first guide frame 20 is no less than 1 / 3 of the width of the corresponding spacer 40. This prevents the first guide frame 20 from being too narrow to provide sufficient lateral support for the package substrates 50, thereby preventing lateral deviation or warping due to the ductility of the thin package substrates 50. Furthermore, this prevents the first guide frame 20 from being too wide, thereby increasing frictional resistance when the package substrates 50 pass through the spacer 40. In one specific embodiment, the width of each first guide frame 20 can be equal to 1 / 2 of the width of the corresponding spacer 40.

[0036] Along the conveying direction b perpendicular to the packaging substrates 50, the length of each first guide frame 20 is no less than 1 / 2 the length of the corresponding spacer 40. This is because if the length of the first guide frame 20 is too short, it will be difficult for the packaging substrate 50 to accurately align with the next cleaning roller assembly 10 when passing through the spacer 40, and it will be difficult to provide sufficient vertical support for the thin packaging substrate 50. By ensuring that the length of each first guide frame 20 is no less than 1 / 2 the length of the corresponding spacer 40, the first guide frame 20 can provide stable and uniform support for the packaging substrate 50. In particular, when handling thin packaging substrates 50, deformation and deviation caused by the ductility of the thin packaging substrates 50 can be avoided, and vibration and deviation of the packaging substrates 50 when passing through the cleaning roller assembly 10 can be minimized. In a specific embodiment, along the conveying direction b perpendicular to the packaging substrates 50, the length of each first guide frame 20 is equal to the length of the corresponding spacer 40.

[0037] Furthermore, along the conveying direction b perpendicular to the package substrates 50, the centerline of each first guide frame 20 coincides with the centerline of the corresponding spacer 40. That is, each first guide frame 20 is positioned in the middle of the corresponding spacer 40. Specifically, the centerline of the first guide frame 20 is the central axis along its length, while the centerline of the spacer 40 is the central axis along the direction perpendicular to the conveying direction of the package substrates 50. By aligning the centerlines of the first guide frame 20 and the spacer 40, the package substrates 50 can be less likely to warp or deflect between the cleaning rollers when passing through the spacer 40, ensuring a smooth cleaning process for the package substrates 50.

[0038] Further, see Figure 2 Each cleaning roller assembly 10 includes a first roller 11 and a second roller 12 that are correspondingly arranged. Each first roller 11 and the corresponding second roller 12 are located on opposite sides of the packaging substrate 50; that is, Figure 2 As shown, the first roller 11 and the second roller 12 are arranged on the upper and lower opposite sides of the packaging substrate 50. Each first guide plate frame 20 is arranged between two adjacent first rollers 11 or second rollers 12, and each first guide plate frame 20 includes a first pressing surface facing the packaging substrate 50. The plane where the tangent line c of the rim of the corresponding first roller 11 or second roller 12 facing the packaging substrate 50 is located is flush with the first pressing surface. When the packaging substrate 50 passes through the gap 40 between two adjacent cleaning roller groups 10 and tends to seesaw, the first pressing surface of the first guide plate frame 20 can contact the packaging substrate 50 and provide support for the packaging substrate 50 to prevent the packaging substrate 50 from being deformed or deviated. The moment when the first roller 11 or the second roller 12 contacts the packaging substrate 50 is the rim contact point, and the tangent direction of the rim contact point is flush with the first pressing surface.

[0039] Furthermore, the first pressing surface is covered with a Teflon coating. Because the Teflon coating has an extremely low coefficient of friction, it can be used to reduce friction between the packaging substrate 50 and the first guide plate frame 20. Therefore, in this embodiment, when a first guide plate frame 20 coated with Teflon is installed in the larger spacing 40 between two adjacent cleaning roller assemblies 10 of the dust collecting machine, the first guide plate frame 20 not only reduces scratches on thin packaging substrates 50 caused by friction between the board surfaces, but also prevents the packaging substrates 50 from warping or sagging. Furthermore, because the Teflon coating reduces friction between the packaging substrate 50 and the first guide plate frame 20, the first guide plate frame 20 does not even need to be removed when processing thick packaging substrates 50, making it more convenient to use the same dust collecting machine to process both thick and thin packaging substrates 50.

[0040] Further, see Figure 3 The dust collecting machine also includes a plurality of second guide plate frames 60 detachably arranged on the frame 30, and each second guide plate frame 60 includes a second pressing surface facing the packaging substrate 50; wherein, when the first guide plate frame 20 is installed on the frame 30, each first guide plate frame 20 is located between two adjacent first rollers 11, and each first pressing surface is flush with the plane where the tangent line c of the rim of the corresponding first roller 11 facing the packaging substrate 50 is located; when the second guide plate frame 60 is installed on the frame 30, each second guide plate frame 60 is located between two adjacent second rollers 12, and each second pressing surface is flush with the plane where the tangent line c of the rim of the corresponding second roller 12 facing the packaging substrate 50 is located.

[0041] Specifically, the second guide plate frame 60 can also be removed from or mounted on the frame 30, and its position is different from that of the first guide plate frame 20. The second pressing surface can be a surface of the second guide plate frame 60 that contacts the packaging substrate 50. When the packaging substrate 50 passes through the gap 40 between two adjacent cleaning roller assemblies 10 and tends to tilt, the first pressing surface of the first guide plate frame 20 can contact and support the packaging substrate 50. At the same time, the second pressing surface of the second guide plate frame 60 can also contact and support the packaging substrate 50, thereby preventing the packaging substrate 50 from deforming or deviating.

[0042] Furthermore, each first guide plate frame 20 and corresponding second guide plate frame 60 are positioned opposite each other and symmetrically along the package substrate 50. Both the first and second pressing surfaces are coated with a Teflon coating. Specifically, by coating the first pressing surfaces of the first guide plate frames 20 and the second pressing surfaces of the second guide plate frames 60 within the spacer 40 of the dust collector with a Teflon coating, the dust collector can be used to clean both thick and thin package substrates 50.

[0043] Furthermore, the first roller 11 and the second roller 12 are both in the shape of a straight cylinder, including a cylindrical rolling surface. Compared to the straight lotus root-shaped rolling surface, the straight cylindrical rolling surface of this embodiment has a larger contact area with the packaging substrate 50, resulting in better dust collection and easier cleaning and maintenance.

[0044] In this utility model, unless otherwise specified or limited, the terms "disposed (provided with)" and "connected" should be understood in a broad sense. For example, it can mean fixed connection, detachable connection, or integration; it can mean mechanical connection or electrical connection; it can mean direct connection or indirect connection through an intermediate medium; it can mean internal communication between two elements or interaction between two elements. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances.

[0045] In the description of this specification, the description of reference terms such as "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0046] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limiting the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention. Therefore, any changes or modifications made in accordance with the claims and description of the present invention should fall within the scope of the present invention.

Claims

1. A dust collecting machine for cleaning a packaging substrate, characterized in that: The dust sticking machine comprises: frame; A cleaning roller assembly, wherein there are multiple cleaning roller assemblies, and each cleaning roller assembly is mounted on the frame; The first guide plate frame is selectively detachable from the frame, and when the first guide plate frame is installed on the frame, the first guide plate frame is located between every two adjacent cleaning roller groups.

2. The dust collecting machine according to claim 1, characterized in that: A spacing area is provided between each two adjacent cleaning roller groups; Each of the first guide plate frames is located in the corresponding spacer area; Along the conveying direction of the package substrate, the width of each first guide frame is not less than 1 / 3 of the width of the corresponding spacer; Along a conveying direction perpendicular to the package substrate, the length of each first guide plate frame is not less than 1 / 2 of the length of the corresponding spacer.

3. The dust collecting machine according to claim 2, characterized in that: Along the conveying direction of the package substrate, the width of each first guide frame is equal to 1 / 2 of the width of the corresponding spacer; Along a conveying direction perpendicular to the package substrate, the length of each first guide frame is equal to the length of the corresponding spacer.

4. The dust collecting machine according to claim 2, characterized in that: Along a conveying direction perpendicular to the package substrate, a center line of each first guide plate frame coincides with a center line of the corresponding spacing area.

5. The dust collecting machine according to any one of claims 1 to 4, characterized in that: Each of the cleaning roller assemblies includes a first roller and a second roller that are correspondingly arranged, and each of the first rollers and the corresponding second roller are respectively located on opposite sides of the packaging substrate; Each of the first guide plate frames is disposed between two adjacent first rollers or second rollers, and each of the first guide plate frames includes a first pressing surface facing the packaging substrate; A plane corresponding to a tangent line of a wheel edge of the first roller or the second roller facing the packaging substrate is flush with the first pressing surface.

6. The dust collecting machine according to claim 5, characterized in that: The dust collecting machine further comprises a plurality of second guide plate frames detachably arranged on the frame, each of the second guide plate frames comprising a second pressing surface facing the packaging substrate; When the first guide plate frame is installed on the frame, each first guide plate frame is located between two adjacent first rollers, and each first pressing surface is flush with a plane where a tangent line of a wheel edge of the corresponding first roller facing the packaging substrate is located; When the second guide plate frame is installed on the frame, each second guide plate frame is located between two adjacent second rollers, and each second pressing surface is flush with the plane where the tangent line of the corresponding second roller rim facing the packaging substrate is located.

7. The dust collecting machine according to claim 6, characterized in that: Each first guide plate frame and the corresponding second guide plate frame are arranged opposite to each other and are symmetrically arranged along the packaging substrate.

8. The dust collecting machine according to claim 6, characterized in that: The first pressing surface and the second pressing surface are both covered with a layer of Teflon coating.

9. The dust collecting machine according to claim 5, characterized in that: The first pressing surface is also covered with a Teflon coating.

10. The dust collecting machine according to claim 5, characterized in that: The first roller and the second roller are both in the shape of a straight cylinder and include a cylindrical rolling circumference.

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