Leveling device for copper-clad plate
By setting a transition structure and a height adjustment device in front of the leveling roller, the problem of copper clad laminate damage caused by excessive pressure of the leveling roller is solved, efficient and damage-free copper clad laminate leveling is achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202422379038.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-09-29
AI Technical Summary
During the leveling process in copper clad laminate production, excessive pressure from the leveling roller causes damage to the copper clad laminate and uneven leveling.
A leveling device for copper-clad laminates was designed. A transition structure and a height adjustment device were set in front of the leveling roller to avoid excessive pressure on the leveling roller. The height of the leveling roller was precisely adjusted by a flexible support plate and a spiral adjustment device to prevent damage to the copper-clad laminate. At the same time, multiple tooling can be connected to achieve simultaneous leveling of multiple samples.
It effectively prevents the damage of copper clad laminate caused by excessive pressure of the leveling roller, improves the leveling efficiency, realizes the leveling of multiple samples at the same time, and improves production efficiency.
Smart Images
Figure CN223352589U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of copper clad laminates, and in particular to a leveling device for copper clad laminates. Background Art
[0002] Currently, copper clad laminate production faces the problem of uneven coating. For example, the thickness of the central coating of the copper clad laminate is 100um, while the thickness of the periphery / surroundings is 80um. In this case, a leveling roller is required for leveling. However, the pressure of the leveling roller is relatively high and there is a height difference between the copper clad laminate and the roller, which easily leads to defects and errors during the leveling process.
[0003] For this reason, it is necessary to improve the existing leveling tooling. Utility Model Content
[0004] In order to overcome the above shortcomings, the purpose of the present application is to provide a leveling device for copper-clad laminates, which can prevent the copper-clad laminates from being damaged by excessive pressure from the leveling rollers.
[0005] In order to achieve the above objectives, this application adopts the following technical solutions:
[0006] Base and leveling components,
[0007] The leveling assembly is arranged on one side of the base, an opening is arranged on the top of the leveling assembly, and a transition structure is arranged on the circumference thereof, the transition structure surrounds the opening,
[0008] The leveling assembly includes a leveling component, which is arranged in the opening portion, and the leveling component includes a first support plate and a second support plate arranged in sequence.
[0009] A height adjustment component is provided on the side of the second supporting plate away from the first supporting plate, and the height adjustment component is used to adjust the height of the leveling component.
[0010] Preferably, the first support plate of the copper-clad laminate leveling device is a flexible support plate.
[0011] Preferably, the transition structure of the copper-clad laminate leveling device is a slope, and the angle between the slope and the horizontal plane is between 30° and 60° (such as 45°, 60°).
[0012] Preferably, the cross section of the leveling component of the copper-clad laminate leveling device is in an eight-shaped or trumpet-shaped shape.
[0013] Preferably, the height adjustment component of the copper-clad laminate leveling device includes a sleeve and a screw adjustment device, one end of the sleeve abuts against the second supporting plate, and the other end is equipped with the screw adjustment device.
[0014] Preferably, the spiral adjustment device of the copper-clad laminate leveling device is provided with a thread, and a thread matching the thread of the spiral adjustment device is provided inside the sleeve on the side where the spiral adjustment device is installed.
[0015] Preferably, the pitch of the thread set by the screw adjustment device of the copper-clad laminate leveling device is between 0.4-0.8 mm (such as the pitch is 0.5 mm).
[0016] Preferably, the screw adjustment device of the copper-clad laminate leveling device includes a screw having threads on its circumferential upper surface. The sleeve is provided with threads on the inner side of the side where the screw adjustment device is mounted, which match the threads on the screw. The screw is used to adjust the height (horizontally) of the first and second support plates. The rise or fall of the screw drives the first and second support plates to move synchronously within their movable range.
[0017] Preferably, the spiral adjustment device of the copper-clad laminate leveling device includes a scale structure, the scale of the scale structure is N, and when the scale structure is rotated, the screw moves a distance of pitch / N for precise height adjustment.
[0018] Preferably, a splicing device is provided on the side of the base of the copper-clad laminate leveling device for connecting multiple copper-clad laminate leveling devices.
[0019] Beneficial effects
[0020] The copper-clad laminate leveling device proposed in this application incorporates a transition structure (climbing zone) around the device / tooling. A height adjustment mechanism adjusts the leveling roller height and prevents excessive pressure from damaging the copper-clad laminate. A connecting structure is also provided on the bottom device for connecting multiple toolings, enabling simultaneous leveling of multiple samples and improving leveling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings are intended to facilitate understanding of the technical solutions of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solutions of the present disclosure and do not constitute a limitation of the technical solutions of the present disclosure. The shapes and sizes of the components in the accompanying drawings do not reflect the actual scale and are intended only to illustrate the contents of this application.
[0022] Figure 1 A three-dimensional schematic diagram of a leveling device for a copper-clad laminate provided in this embodiment;
[0023] Figure 2 A schematic diagram of a copper clad laminate leveling device provided in this embodiment at one viewing angle;
[0024] Figure 3 for Figure 2 Schematic diagram of the cross section at AA in the middle;
[0025] Figure 4 for Figure 2 Schematic diagram of the cross section at the middle BB;
[0026] Figure 5 A schematic structural diagram of the leveling assembly provided in this embodiment;
[0027] Figure 6 A schematic structural diagram of the leveling component provided in this embodiment;
[0028] Figure 7 A schematic structural diagram of the base provided in this embodiment;
[0029] Figure 8 A schematic structural diagram of the spiral adjustment device provided in this embodiment;
[0030] Figure 9 This is a schematic diagram of the copper clad laminate provided in this embodiment being leveled by the leveling device. DETAILED DESCRIPTION
[0031] The above scheme is further described below with reference to specific examples. It should be understood that these examples are intended to illustrate the present application and are not intended to limit the scope of the present application. The implementation conditions used in the examples can be further adjusted according to the conditions of the specific manufacturer. The implementation conditions not specified are generally those used in routine experiments.
[0032] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should have the usual meanings understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. In this article, "electrical connection" includes the situation where constituent elements are connected together through an element with some electrical function. "Element with some electrical function" is not particularly limited as long as it can transfer electrical signals between connected constituent elements. "Element with some electrical function" can be, for example, an electrode or wiring, or a switching element such as a transistor, or other functional elements such as a resistor, inductor or capacitor. “Up,” “down,” “left,” “right,” etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0033] In this application, terms such as "upper," "lower," "inner," and "middle" indicate positions or locations based on those shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to specific positions, or to their construction or operation in a specific position.
[0034] The present application discloses a leveling device for copper-clad laminates, which includes: a base and a leveling assembly. The leveling assembly is arranged on the base, and an opening is arranged on the top of the base. A transition portion is arranged on the side of the opening, which is in the shape of an eight or a trumpet. A leveling component is placed in the opening. The leveling component includes a first (flexible pallet) pallet and a second pallet (rigid pallet) arranged in sequence. A height adjustment component is provided on the side of the second pallet away from the first pallet, by which the height of the leveling component is adjusted. A transition structure (climbing area) is provided around the device / tooling. During leveling, the leveling roller first contacts the transition structure (climbing area) and then enters the (flat area) for leveling, thereby preventing the copper-clad laminate from being damaged by excessive pressure from the leveling roller. A connecting structure is provided on the bottom device, which can be used to connect multiple toolings, so that multiple samples can be leveled at the same time, thereby improving the leveling efficiency.
[0035] Next, attach Figures 1-9 To describe the copper clad laminate leveling device (hereinafter referred to as the leveling device) provided in an embodiment of the present application.
[0036] The leveling device 100 includes a base 120 and a leveling assembly 110.
[0037] The leveling assembly 110 is disposed on a base 120, with an opening 111 at its top and a transition structure 112 disposed laterally of the opening 111. The transition structure 112 is tilted. In one embodiment, a through hole 114 is disposed in the leveling assembly 110 for passing the sleeve of the leveling component 130.
[0038] A leveling component 130 is placed in the opening 111, and a first support plate 131 and a second support plate 132 are sequentially arranged on the leveling component 130. The mechanical strength of the first support plate 131 is less than that of the second support plate 132, and a height adjustment component 133 is provided on the side of the second support plate away from the first support plate, and the height adjustment component 133 is partially located in the base.
[0039] In one embodiment, the high first support plate is a flexible support plate, and its material may be Teflon.
[0040] In one embodiment, the transition portion is a slope. Preferably, the cross section is in an eight-shaped or trumpet-shaped shape (see Figure 3 or 4). The slope extends from the opening side to the base 120 side.
[0041] The height adjustment member 133 includes a sleeve 133 a and a screw adjustment device. One end of the sleeve 133 a can abut against the second support plate 132 , and the other end is mounted with the screw adjustment device. The sleeve 133 a can be fixed to the base 120 or fixed to the through hole 114 .
[0042] The screw adjustment device includes a screw 133b, with threads 133b11 disposed on at least a portion of its surface. The sleeve 133a, on which the screw adjustment device is mounted, has matching threads (not shown). The pitch of the threads provided on the screw adjustment device is between 0.4 and 0.8 mm (preferably, a pitch of 0.5 mm). Rotating the screw 133b causes the second support plate 132 to rise or fall, synchronously moving the first support plate 131 thereon. Rotating the screw 133b adjusts the height of the leveling member 130. The first support plate 131 is bonded to the second support plate 132 with adhesive.
[0043] In one embodiment, the screw adjustment device includes a screw 133b1 with a circumferentially defined thread 133b11. Screw 133b1 is sleeved with a graduated structure 133b2 and an adjustment portion 133b3. During adjustment, rotating adjustment portion 133b3 causes screw 133b1 to move (forward or backward). The graduated structure is scaled in units of N, for example, N is 50, and the pitch of thread 133b11 is 0.5 mm. Rotating adjustment portion 133b3 causes the graduated structure to move the screw by a distance equal to the pitch / N, allowing for precise height adjustment, similar to the structure of a micrometer.
[0044] In one embodiment, a copper-clad laminate is placed on a flexible support, supported by a rigid support. Four threaded height adjustment devices are located beneath the rigid support. The precision threads of the screw adjustment devices have a pitch of 0.5 mm, and the movable scale has 50 equally divided scales. Each rotation of the movable scale advances or retreats the screw by 0.5 mm. Therefore, each small rotation is equivalent to advancing or retreating the screw by 0.5 / 50 = 0.01 mm. Each small division of the movable scale represents 0.01 mm, and the screw adjustment device can be accurate to 0.01 mm. This meets the leveling requirements of the copper-clad laminate.
[0045] In one embodiment, a splicing device is provided on the side of the base 120. The splicing device includes a protrusion 121 and a groove 122, through which multiple copper-clad laminate leveling devices are connected. Preferably, the inner side of the groove 122 is provided with a reinforcement portion 122a. Preferably, the base 120 is provided with reinforcing ribs 123, which enclose a cavity 124. This cavity 124 can accommodate a portion of the height adjustment component 133. Preferably, the bottom 113 of the leveling assembly 110 contacts the base 120.
[0046] The leveling device 100 is used for leveling. Figure 9, placed on the transmission device 300, and moved toward the leveling roller 200. The leveling roller 200 first contacts the transition area on the leveling device 100 and then moves to the flat area. This prevents excessive pressure from the leveling roller from damaging the copper-clad laminate. The leveling device 100 can also be connected to multiple fixtures through the connection structure at the bottom during leveling, allowing multiple samples (copper-clad laminates) to be leveled simultaneously, improving leveling efficiency.
[0047] The above embodiments are intended only to illustrate the technical concepts and features of this application. Their purpose is to enable those familiar with the art to understand the content of this application and implement it accordingly. They are not intended to limit the scope of protection of this application. Any equivalent changes or modifications made in accordance with the spirit of this application shall be included in the scope of protection of this application.
Claims
1. A leveling device for a copper clad laminate, characterized in that: include: Base and leveling components, The leveling assembly is arranged on one side of the base, an opening is arranged on the top of the leveling assembly, and a transition structure is arranged on the circumference thereof, the transition structure surrounds the opening, The leveling assembly includes a leveling component, which is arranged in the opening portion, and the leveling component includes a first support plate and a second support plate arranged in sequence. A height adjustment component is provided on the side of the second supporting plate away from the first supporting plate, and the height adjustment component is used to adjust the height of the leveling component.
2. The copper-clad laminate leveling device according to claim 1, wherein: The first support plate is a flexible support plate, and the mechanical strength of the first support plate is smaller than the mechanical strength of the second support plate.
3. The copper-clad laminate leveling device according to claim 1, wherein: The transition structure is a slope.
4. The copper-clad laminate leveling device according to claim 3, wherein: The cross section of the leveling component is in an eight-shaped or trumpet-shaped form.
5. The copper clad laminate leveling device according to claim 1, wherein: The height adjustment component includes a sleeve and a screw adjustment device. One end of the sleeve abuts against the second supporting plate, and the other end is installed with the screw adjustment device.
6. The copper-clad laminate leveling device according to claim 5, wherein: The screw adjusting device is provided with a thread, and a thread matching the thread of the screw adjusting device is provided inside the sleeve on the side where the screw adjusting device is installed.
7. The copper-clad laminate leveling device according to claim 6, wherein: The pitch of the thread of the screw adjustment device is between 0.4-0.8 mm.
8. The copper-clad laminate leveling device according to claim 5, wherein: The spiral adjustment device includes a screw rod, a thread is provided on the circumferential upper surface of the screw rod, and a thread matching the thread on the screw rod is provided inside the sleeve on the side where the spiral adjustment device is installed. The height of the first support plate and the second support plate are adjusted by the screw rod.
9. The copper-clad laminate leveling device according to claim 8, wherein: The screw adjustment device includes a scale structure, the scale of the scale structure is N, and the scale structure is rotated to move the screw, and the distance the screw moves is pitch / N, which is used for precise height adjustment.
10. The copper clad laminate leveling device according to claim 1, wherein: A splicing device is provided on the side of the base for connecting a plurality of copper clad plate leveling devices.