Quartz substrate bonding heating device
By designing a pushing mechanism for the quartz substrate bonding and heating device, the problem of the quartz substrate being difficult to lift when it is flat on the placement plate is solved, thus achieving fast handling and efficient processing.
Patent Information
- Application Number
- CN202422764133.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-11-13
AI Technical Summary
The quartz substrate is laid flat on the placement plate, which makes it difficult for workers to lift it up quickly, reducing processing efficiency.
A quartz substrate bonding and heating device is designed, which includes a heating box, a placement plate and a pushing mechanism. The pushing mechanism includes a push plate, a connecting plate, a connecting rod and a spring. The vertical movement of the push plate drives the quartz substrate to separate from the placement plate, providing convenience.
It realizes the rapid transportation of quartz substrates, improves processing efficiency and facilitates workers' operation.
Smart Images
Figure CN223357561U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of quartz substrate processing, and in particular to a quartz substrate bonding and heating device. Background Art
[0002] Quartz substrates are a high-purity, high-hardness, and temperature-stable material with a wide range of applications. Heating a quartz substrate for bonding is a process involving specific techniques and technologies, typically used to ensure a strong bond between the quartz substrate and other materials. The following is a possible quartz substrate bonding heating process and its associated key points: Preparation: Specialized heating tools and materials, such as a quartz lamp, heater, and quartz adhesive, are required. Before using these heating tools, confirm the material's temperature range and instructions to avoid damage to the quartz substrate. Place the quartz substrate to be bonded on a stable workbench and ensure it remains steady. Use a quartz lamp or heater to heat the quartz substrate and the surrounding area until the adhesive begins to melt. The heating temperature and duration should be adjusted according to the specific requirements of the adhesive. After the adhesive melts, quickly bond the quartz substrate to the other material (such as another quartz substrate or sensor). Apply pressure to ensure sufficient penetration and a strong bond. After heating and bonding, allow the quartz substrate to cool naturally to ensure the adhesive is fully cured. Perform necessary inspections and tests to ensure the desired bonding results.
[0003] After the quartz substrate is bonded, it needs to be manually removed from the placement plate. During the operation, workers need to wear gloves to carry it. Because the quartz substrate is laid flat on the placement plate, workers wearing gloves cannot quickly lift the quartz substrate from the placement plate, reducing the processing efficiency of the quartz substrate. Utility Model Content
[0004] The purpose of the present application is to provide a quartz substrate bonding and heating device to solve the problem raised in the above background technology that because the quartz substrate is laid flat on the placement plate, workers wearing gloves cannot quickly lift the quartz substrate from the placement plate.
[0005] To achieve the above-mentioned objectives, the present application provides the following technical solutions: a quartz substrate bonding and heating device, comprising: a heating box, a placing plate and a pushing mechanism, a rectangular groove is opened in the central part of the placing plate, and a vertical hole is opened at the bottom of the rectangular groove of the placing plate, the pushing mechanism is arranged below the placing plate, the pushing mechanism includes a push plate arranged inside the placing plate, the push plate consists of an upper rectangular plate and an integrally formed trapezoidal block below, the rectangular plate of the push plate is arranged in the rectangular groove of the placing plate, and the trapezoidal block of the push plate is arranged in the vertical hole of the placing plate, the pushing mechanism also includes a connecting plate welded on the outer wall of the push plate, a connecting rod welded under the placing plate and a spring sleeved on the connecting rod, the connecting plate is vertically slidably connected to the connecting rod through the opened circular hole, and the two ends of the spring are respectively welded to the outer walls of the placing plate and the connecting plate.
[0006] By adopting the above technical solution, the upper quartz substrate can be pushed away from being attached to the placement plate.
[0007] Preferably, the pushing mechanism further includes a screw rod fixed on one side below the hole of the placement plate and a guide rod fixed on the other side below the hole of the placement plate.
[0008] By adopting the above technical solution, the structure on the outer wall can be stably moved.
[0009] Preferably, the pushing mechanism further comprises a No. 1 block arranged on the screw rod and a No. 2 block arranged on the guide rod.
[0010] By adopting the above technical solution, the structure connected to the outer wall can be driven to move synchronously during the movement.
[0011] Preferably, the pushing mechanism further includes a moving block with both ends respectively welded to the outer walls of block No. 1 and block No. 2, the moving block is trapezoidal in shape, and the moving block is attached to the outer wall of the push plate.
[0012] By adopting the above technical solution, the structure on one side can be pushed to move in the vertical direction during the horizontal movement.
[0013] Preferably, the quartz substrate bonding and heating device also has an extrusion mechanism, which includes: a cylinder and a pressure plate, the cylinder is fixed in the center above the outer wall of the heating box, the pressure plate is arranged on the output end of the bottom of the cylinder, and the pressure plate is arranged inside the heating box.
[0014] By adopting the above technical solution, the quartz substrate can be squeezed, thereby performing subsequent heating and bonding work.
[0015] Preferably, the quartz substrate bonding and heating device further comprises: slide rails, which are fixed on both sides of the inner wall of the heating box, and the placement plate is horizontally slidably connected to the inside of the slide rails.
[0016] By adopting the above technical solution, the structure in the track can be stably moved in the horizontal direction.
[0017] Preferably, the quartz substrate bonding and heating device further comprises: a handle, which is welded to the outer wall of the placement plate.
[0018] By adopting the above technical solution, it is convenient for people to move the structure connected on one side by holding it.
[0019] In summary, the present application includes the following beneficial effects: by providing a pushing mechanism, when the quartz substrate placed on the placement plate cannot be moved quickly, the vertical movement of the push plate drives the quartz substrate to move synchronously in the vertical direction. At this time, a gap will be generated between the quartz substrate and the placement plate, providing convenience for workers to hold it. Through the squeezing of the spring, the push plate can be quickly driven to return to the inside of the placement plate, facilitating the continued processing of the next batch of quartz substrates. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic diagram of the three-dimensional structure of this application;
[0021] Figure 2 This is a schematic diagram of a three-dimensional side cross-sectional structure of the present application;
[0022] Figure 3 This is a schematic diagram of the three-dimensional cross-sectional structure when viewed from above of the present application;
[0023] Figure 4 This is a schematic diagram of the three-dimensional structure of the moving block of this application.
[0024] In the figure: 1. Heating box; 2. Extrusion mechanism; 201. Cylinder; 202. Pressing plate; 3. Slide rail; 4. Placement plate; 5. Handle; 6. Pushing mechanism; 601. Screw; 602. Guide rod; 603. Block No. 1; 604. Block No. 2; 605. Moving block; 606. Pushing plate; 607. Connecting plate; 608. Connecting rod; 609. Spring. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0026] The following is combined with Figure 1-4 The embodiments of the present application are described in further detail.
[0027] Example 1
[0028] See also Figure 1-Figure 4 , this embodiment provides a technical solution: a quartz substrate bonding and heating device, comprising: a heating box 1, an extrusion mechanism 2, a slide rail 3, a placement plate 4, a handle 5 and a pushing mechanism 6;
[0029] The heating box 1 is provided with a heater for heating the interior of the heating box 1, so that the adhesive on the quartz substrate can be quickly melted after the temperature is raised. The extrusion mechanism 2 contains a cylinder 201 fixed to the center of the upper outer wall of the heating box 1 and connected by bolts. The cylinder 201 can drive the structure connected to the bottom output end to move vertically. The pressure plate 202 is connected to the output end at the bottom of the cylinder 201 by bolts. The pressure plate 202 can squeeze the quartz substrate set below during the vertical movement, so as to perform subsequent bonding work. The pressure plate 202 is set inside the heating box 1, and the slide rail 3 is fixed on both sides of the inner wall of the heating box 1. The slide rail 3 is connected to the heating box 1 by bolts. On both sides of the inner wall of the box 1, the structure in the track can be provided with stable horizontal movement, and the placement plate 4 is horizontally slidably connected to the inside of the slide rail 3. The quartz substrate can be placed on the top of the placement plate 4, so as to facilitate the subsequent extrusion, heating and bonding work of the quartz substrate. A rectangular groove is provided in the center of the placement plate 4, which can provide the internal structure with vertical movement and facilitate the storage of the internal structure. A vertical hole is provided at the bottom of the rectangular groove of the placement plate 4, which can provide the internal structure with stable vertical displacement. The handle 5 is welded on the outer wall of the placement plate 4 and can be provided for workers to hold, thereby driving the placement plate 4 connected on one side to move stably inside the slide rail 3.
[0030] The pushing mechanism 6 is arranged below the placement plate 4. The pushing mechanism 6 can quickly push the quartz substrate on the placement plate 4, thereby creating a gap between the quartz substrate and the placement plate 4, which is convenient for subsequent workers to carry it by hand. The pushing mechanism 6 includes a push plate 606 arranged inside the placement plate 4. The push plate 606 can push the quartz substrate placed above it to move in the vertical direction. The push plate 606 is composed of an upper rectangular plate and an integrally formed trapezoidal block below, which can be more stable in the process of vertical movement. The rectangular plate of the push plate 606 is vertically slidably connected to the rectangular groove of the placement plate 4, which can drive the upper quartz substrate to move in the vertical direction during the displacement. The trapezoidal block of the push plate 606 is vertically slidably connected to the vertical hole of the placement plate 4. When the trapezoidal block of the push plate 606 is squeezed in the horizontal direction, it can move stably in the vertical direction.
[0031] The pushing mechanism 6 also includes a connecting plate 607 welded on the outer wall of the push plate 606, a circular hole is opened inside the connecting plate 607, and a connecting rod 608 is welded under the placement plate 4. The connecting rod 608 can provide the outer connecting plate 607 with stable vertical movement. The spring 609 mounted on the connecting rod 608 can squeeze the lower connecting plate 607 vertically downward, thereby driving the push plate 606 to move synchronously.
[0032] The quartz substrate is placed horizontally on the placement plate 4, and the placement plate 4 can be stably moved to the inside of the heating box 1 through the slide rail 3 on the inner wall of the heating box 1. The worker can quickly drive the placement plate 4 to move by holding the handle 5, and the interior of the heating box 1 is heated by the heating device inside the heating box 1. The cylinder 201 drives the lower pressure plate 202 to squeeze the quartz substrate, so as to quickly perform the bonding work of the quartz substrate. After the bonding of the quartz substrate is completed, the placement plate 4 is slid out from the inside of the heating box 1. At this time, the vertical movement of the push plate 606 drives a gap between the upper quartz substrate and the placement plate 4, which is convenient for the worker to carry and remove. The push plate 606 squeezes the connecting plate 607 vertically downward through the spring 609 on the outer wall of the connecting rod 608, thereby synchronously driving the push plate 606 to reset to the inside of the placement plate 4.
[0033] Example 2
[0034] See also Figure 1-Figure 4 , this embodiment provides a technical solution: a quartz substrate bonding and heating device, including: a screw rod 601, a guide rod 602, a first block 603, a second block 604 and a moving block 605;
[0035] The screw rod 601 is fixed on one side below the hole of the placement plate 4, and the two ends of the screw rod 601 are connected to the bottom of the placement plate 4 by fixing block bolts, and the screw rod 601 can be rotated on the fixing block, which can provide the structure on the rod to rotate continuously. The guide rod 602 is fixed on the other side below the hole of the placement plate 4, and the two ends of the guide rod 602 are connected to the bottom of the placement plate 4 by fixing block bolts, which can provide the structure on the rod to move stably. The No. 1 block 603 is set on the screw rod 601, and the No. 1 block 603 is connected to the screw rod 601 by a thread. The No. 1 block 603 can rotate in the process of the screw rod 601. The second block 604 is arranged on the guide rod 602, and the second block 604 is horizontally slidably connected to the guide rod 602. The two ends are respectively welded to the movable block 605 on the outer wall of the first block 603 and the second block 604. The movable block 605 is trapezoidal in shape. During the rotation of the screw rod 601, it can drive the movable block 605 to stably move horizontally on the guide rod 602, and the movable block 605 is attached to the outer wall of the push plate 606. During the horizontal movement of the movable block 605, it can squeeze the push plate 606 to provide the push plate 606 with vertical movement.
[0036] The two ends of the moving block 605 are connected to block No. 1 603 and block No. 2 604. By rotating the screw rod 601, the screw rod 601 drives block No. 1 603 on the rod to rotate. The moving block 605 connected to block No. 1 603 is connected to block No. 2 604, so that it can move stably on the guide rod 602. At this time, when the moving block 605 moves in the horizontal direction, it pushes the push plate 606, thereby driving the push plate 606 to move in the vertical direction.
[0037] The implementation principle of a quartz substrate bonding and heating device of the present application is as follows:
[0038] First, the quartz substrate is placed horizontally on the placement plate 4. The placement plate 4 can be stably moved to the inside of the heating box 1 through the slide rail 3 on the inner wall of the heating box 1. The worker can quickly move the placement plate 4 by holding the handle 5. The heating device inside the heating box 1 is used to heat the inside of the heating box 1. The cylinder 201 drives the pressing plate 202 below to squeeze the quartz substrate, thereby quickly performing the bonding work of the quartz substrate.
[0039] Secondly, after the bonding of the quartz substrate is completed, the placement plate 4 is slid out from the inside of the heating box 1. At this time, the vertical movement of the push plate 606 creates a gap between the upper quartz substrate and the placement plate 4, which is convenient for workers to carry and remove. The two ends of the moving block 605 are connected to the No. 1 block 603 and the No. 2 block 604. The screw rod 601 is rotated, and the screw rod 601 drives the No. 1 block 603 on the rod to rotate. The moving block 605 connected to the No. 1 block 603 is connected to the No. 2 block 604, so that it can move stably on the guide rod 602. At this time, the moving block 605 pushes the push plate 606 during the horizontal movement, thereby driving the push plate 606 to move in the vertical direction.
[0040] Finally, when the moving block 605 is no longer in contact with the push plate 606, the push plate 606 vertically presses the connecting plate 607 downward through the spring 609 on the outer wall of the connecting rod 608, thereby synchronously driving the push plate 606 to return to the inside of the placement plate 4.
[0041] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
Claims
1. A quartz substrate bonding and heating device, characterized in that: include: Heating box (1); A placement plate (4), wherein a rectangular groove is provided at the center of the placement plate (4), and a vertical hole is provided at the bottom of the rectangular groove of the placement plate (4); A pushing mechanism (6) is arranged below the placement plate (4), and the pushing mechanism (6) includes a push plate (606) arranged inside the placement plate (4). The push plate (606) is composed of an upper rectangular plate and a lower integrally formed trapezoidal block. The rectangular plate of the push plate (606) is arranged in a rectangular groove of the placement plate (4), and the trapezoidal block of the push plate (606) is arranged in a vertical hole of the placement plate (4). The pushing mechanism (6) further comprises a connecting plate (607) welded to the outer wall of the pushing plate (606), a connecting rod (608) welded below the placement plate (4), and a spring (609) sleeved on the connecting rod (608); the connecting plate (607) is vertically slidably connected to the connecting rod (608) through a circular hole, and the two ends of the spring (609) are respectively welded to the outer walls of the placement plate (4) and the connecting plate (607).
2. The quartz substrate bonding and heating device according to claim 1, characterized in that: The pushing mechanism (6) further comprises a screw rod (601) fixed on one side below the hole of the placement plate (4) and a guide rod (602) fixed on the other side below the hole of the placement plate (4).
3. The quartz substrate bonding and heating device according to claim 2, characterized in that: The pushing mechanism (6) further comprises a first block (603) arranged on the screw rod (601) and a second block (604) arranged on the guide rod (602).
4. The quartz substrate bonding and heating device according to claim 3, characterized in that: The pushing mechanism (6) further comprises a moving block (605) whose two ends are respectively welded to the outer walls of the first block (603) and the second block (604); the moving block (605) is trapezoidal in shape and is attached to the outer wall of the pushing plate (606).
5. The quartz substrate bonding and heating device according to claim 1, characterized in that: The quartz substrate bonding and heating device further comprises a pressing mechanism (2), wherein the pressing mechanism (2) comprises: A cylinder (201), the cylinder (201) is fixedly mounted on a central portion above the outer wall of the heating box (1); A pressing plate (202) is arranged on the output end of the bottom of the cylinder (201), and the pressing plate (202) is arranged inside the heating box (1).
6. The quartz substrate bonding and heating device according to claim 5, characterized in that: The quartz substrate bonding and heating device further comprises: The slide rails (3) are fixed on both sides of the inner wall of the heating box (1), and the placement plate (4) is horizontally slidably connected to the inside of the slide rails (3).
7. The quartz substrate bonding and heating device according to claim 6, characterized in that: The quartz substrate bonding and heating device further comprises a handle (5), which is welded to the outer wall of the placement plate (4).