Heat dissipation device
By driving the fan unit to move to target the local high-temperature location through the drive component, combined with the automatic adjustment of the temperature sensor and controller, the heat dissipation problem of small sports stadiums and factories in hot summer is solved, achieving rapid heat dissipation and reduced energy consumption.
Patent Information
- Application Number
- CN202422844979.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-11-21
AI Technical Summary
In the existing technology, small sports stadiums and factories have difficulty in effectively dissipating local heat in the hot summer, which may cause heatstroke to athletes or overheating of equipment. In addition, the traditional method of increasing the power of the fan unit leads to increased energy consumption.
A heat dissipation device is designed, which drives the fan unit to move to align with the local high-temperature location through a driving component, and combines a temperature sensor and a controller to achieve automatic temperature adjustment to avoid increasing the power of the fan unit.
It achieves rapid heat dissipation of local high-temperature areas, reduces energy consumption, improves heat dissipation effect and automation, and reduces manual intervention.
Smart Images

Figure CN223360804U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of heat dissipation equipment, and particularly relates to a heat dissipation device. Background Art
[0002] Currently, most small sports stadiums and factories use natural ventilation to dissipate heat and ventilate their indoor environments. However, in the hot and dreary summer weather, this method is difficult to effectively cool the indoor environment. In small sports stadiums, athletes can easily suffer from heatstroke, and in factories, equipment can easily overheat, requiring cooling. Utility Model Content
[0003] The purpose of the embodiments of the present application is to provide a heat dissipation device that can effectively dissipate heat from a local area with a higher temperature, improve the heat dissipation effect, reduce heat dissipation power consumption, and achieve ambient temperature regulation.
[0004] To achieve the above objectives, the technical solution adopted in this application is to provide a heat dissipation device, comprising:
[0005] frame;
[0006] A plurality of fan groups, each of which is mounted on the rack and spaced apart along a first direction;
[0007] A driving assembly is installed on the frame and is configured to drive the plurality of fan groups to move relative to the frame along a first direction.
[0008] Optionally, the driving assembly includes a guide rail and multiple sliders, the guide rail is installed on the frame, and the multiple sliders are installed on the sliders and are respectively arranged in one-to-one correspondence with the multiple fan groups, and are also configured to drive the multiple fan groups to move along the first direction.
[0009] Optionally, the heat dissipation device also includes a controller and a temperature sensor or an infrared thermal imaging sensor. The controller is installed on the rack, and the temperature sensor or the infrared thermal imaging sensor is electrically connected to the controller and is used to detect the temperature of the area to be dissipated. The controller is configured to control the slider to drive the fan group to move in a first direction when the local temperature of the area to be dissipated exceeds a preset threshold so that the fan group is facing the local high temperature position.
[0010] Optionally, the powers of any two adjacent wind turbine groups are different.
[0011] Optionally, the temperature sensor or infrared thermal imaging sensor is provided in plurality, and the plurality of temperature sensors or infrared thermal imaging sensors are all electrically connected to the controller.
[0012] Optionally, a plurality of the temperature sensors or infrared thermal imaging sensors are symmetrically distributed on the rack.
[0013] Optionally, the frame includes two cross beams and two vertical beams, wherein one of the vertical beams is installed at one end of the two cross beams and is located between the two cross beams, and the other vertical beam is installed at the other end of the two cross beams and is located between the two cross beams.
[0014] Optionally, the frame further includes a support beam, which is installed between the two horizontal beams and located between the two vertical beams.
[0015] Optionally, the supporting beams are provided in plurality, and the plurality of supporting beams are installed between the two cross beams.
[0016] Optionally, the drive components are provided in two groups, and both groups of the drive components are mounted on the rack and are symmetrically distributed.
[0017] The beneficial effects of the heat dissipation device provided by this application are:
[0018] The present application designs a temperature-guided intelligent ventilation and heat dissipation system for venues. Unlike ordinary ventilation and heat dissipation, the present application monitors the ambient temperature and adaptively adjusts the fan position to quickly cool down local high temperatures, thereby ensuring personnel comfort and equipment operating performance. The heat dissipation device provided in the embodiment of the present application, when the local high temperature in the area to be dissipated is reached, can drive the corresponding fan group to move along the first direction through the driving component, so that the corresponding fan group is facing the local high temperature position, thereby achieving rapid heat dissipation of the local high temperature position. Compared with the related art of achieving heat dissipation of local high temperature positions by increasing the power of the fan group, it can avoid the increase in energy consumption of the fan group caused by the increase in the power of the fan group, which helps to reduce the cost of heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0020] Figure 1 This is a front view of the heat dissipation device provided in an embodiment of the present application.
[0021] Figure 2 A top view of the heat dissipation device provided in an embodiment of the present application.
[0022] Figure 3 Schematic diagram of the installation position of the heat dissipation device provided in an embodiment of the present application.
[0023] Among them, the reference numerals in the figures are:
[0024] 100, frame; 110, crossbeam; 120, vertical beam; 130, support beam;
[0025] 200, fan group; 210, first fan group; 220, second fan group; 230, third fan group; 240, fourth fan group; 250, fifth fan group; 260, sixth fan group;
[0026] 300, drive assembly; 310, guide rail; 320, slider; 321, first block; 322, second block; 323, third block; 324, fourth block; 325, fifth block; 326, sixth block;
[0027] 400, controller;
[0028] 500, temperature sensor;
[0029] 600. Heat dissipation device. DETAILED DESCRIPTION
[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0031] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.
[0032] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0034] Based on this, the utility model provides a heat dissipation device, which can drive the corresponding fan group 200 to move through the driving component 300, so that the fan group 200 is directly facing the local high temperature position of the heat dissipation area, and can achieve rapid heat dissipation of the heat dissipation area.
[0035] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a heat dissipation device 600, comprising a rack 100, a plurality of fan assemblies 200, and a drive assembly 300. The plurality of fan assemblies 200 are mounted on the rack 100 and spaced apart along a first direction. The drive assembly 300 is mounted on the rack 100 and configured to drive the plurality of fan assemblies 200 to move relative to the rack 100 along the first direction.
[0036] It should be noted that in this embodiment, the number of the fan groups 200 is set to six as an example. Of course, in other embodiments, the number of the fan groups 200 can also be set to two, three, four, etc. according to actual application requirements, and this is not limited here.
[0037] It should be noted that the first direction mentioned above and below refers to the bidirectional direction of the shortest connection line between the two vertical beams 120, specifically Figure 1 The X-axis shown in .
[0038] The heat dissipation device provided in the embodiments of the present application, when a local high temperature is present in an area to be dissipated, can drive the corresponding fan assembly 200 to move in a first direction via the drive assembly 300, so that the corresponding fan assembly 200 faces the local high temperature location, thereby achieving rapid heat dissipation at the local high temperature location. Compared to the related art method of achieving heat dissipation at the local high temperature location by increasing the power of the fan assembly 200, this method avoids the increased energy consumption of the fan assembly 200 caused by the increased power of the fan assembly 200, thereby helping to reduce heat dissipation costs.
[0039] In one embodiment of the present application, see Figure 1 and Figure 2The driving assembly 300 includes a guide rail 310 and a plurality of sliders 320. The guide rail 310 is mounted on the frame 100. The plurality of sliders 320 are mounted on the slider 320 and are respectively arranged in one-to-one correspondence with the plurality of fan groups 200. The driving assembly 300 is also configured to drive the plurality of fan groups 200 to move along the first direction.
[0040] It should be noted that in this embodiment, the number of sliders 320 is set to six. Of course, in other embodiments, depending on actual application requirements, the number of sliders 320 can also be set to two, three, four, or any other number, and this is not a limitation. In this embodiment, the six sliders 320 are arranged from left to right along the first direction as a first block 321, a second block 322, a third block 323, a fourth block 324, a fifth block 325, and a sixth block 326. The first block 321, the second block 322, the third block 323, the fourth block 324, the fifth block 325, and the sixth block 326 are all capable of moving along the first direction under the drive of an external actuator.
[0041] Specifically, in this embodiment, see Figure 1 and Figure 2 The six fan groups 200 are arranged from left to right along the first direction as a first fan group 210, a second fan group 220, a third fan group 230, a fourth fan group 240, a fifth fan group 250, and a sixth fan group 260. The first fan group 210 is mounted on a first block 321, the second fan group 220 is mounted on a second block 322, the third fan group 230 is mounted on a third block 323, the fourth fan group 240 is mounted on a fourth block 324, the fifth fan group 250 is mounted on a fifth block 325, and the sixth fan group 260 is mounted on a sixth block 326.
[0042] When the local high temperature location of the area to be cooled is located between the first group of fans 210 and the second group of fans 220, the external driver drives the first block 321 to move the first group of fans 210 in the first direction toward the second group of fans 220 until the first group of fans 210 is facing the local high temperature location. Alternatively, the external driver drives the second block 322 to move the second group of fans 220 in the first direction toward the first group of fans 210 until the second group of fans 220 is facing the local high temperature location.
[0043] When a local high-temperature location in the area to be cooled is located between the second and third fan groups 220, 230, the external driver drives the second block 322 to move the second fan group 220 in the first direction toward the third fan group 230 until the second fan group 220 is directly facing the local high-temperature location. Alternatively, the external driver drives the third block 323 to move the third fan group 230 in the first direction toward the second fan group 220 until the third fan group 230 is directly facing the local high-temperature location.
[0044] When a local high-temperature location in the area to be cooled is located between the third and fourth fan groups 230, 240, the external driver drives the third block 323 to move the third fan group 230 in the first direction toward the fourth fan group 240 until the third fan group 230 is directly facing the local high-temperature location. Alternatively, the external driver drives the fourth block 324 to move the fourth fan group 240 in the first direction toward the third fan group 230 until the fourth fan group 240 is directly facing the local high-temperature location.
[0045] When the local high temperature location of the area to be cooled is located between the fourth fan group 240 and the fifth fan group 250, the external driver drives the fourth block 324 to move the fourth fan group 240 in the first direction toward the fifth fan group 250 until the fourth fan group 240 is directly facing the local high temperature location. Alternatively, the external driver drives the fifth block 325 to move the fifth fan group 250 in the first direction toward the fourth fan group 240 until the fifth fan group 250 is directly facing the local high temperature location.
[0046] When a local high-temperature location in the area to be cooled is located between the fifth and sixth fan groups 250, 260, the external driver drives the fifth block 325 to move the fifth fan group 250 in the first direction toward the sixth fan group 260 until the fifth fan group 250 faces the local high-temperature location. Alternatively, the external driver drives the sixth block 326 to move the sixth fan group 260 in the first direction toward the fifth fan group 250 until the sixth fan group 260 faces the local high-temperature location.
[0047] This arrangement, using multiple sliders 320, allows the fan unit 200 to move in the first direction according to the location of the local high temperature, using the slider 320 closest to the local high temperature location, so that the fan unit 200 is directly facing the local high temperature location. This prevents the fan unit 200 from moving too far, which could result in the fan unit 200 being unable to quickly dissipate heat from the local high temperature location, thereby further improving the heat dissipation effect. Furthermore, this prevents the fan unit 200 from moving too far, which could increase heat dissipation costs, thereby further reducing heat dissipation costs.
[0048] Optionally, the guide rail 310 is configured as a linear roller guide rail 310 .
[0049] In one embodiment of this application, please refer to Figure 1 The heat dissipation device also includes a controller 400 and a temperature sensor 500. The controller 400 is installed on the rack 100. The temperature sensor 500 is electrically connected to the controller 400 and is used to detect the temperature of the area to be dissipated. The controller 400 is configured to control the slider 320 to drive the fan group 200 to move along the first direction when the local temperature of the area to be dissipated exceeds a preset threshold value so that the fan group 200 is facing the local high temperature position.
[0050] It should be noted that when the local temperature of the area to be dissipated exceeds the preset threshold, that is, when the temperature at the local high temperature location is lower than the preset threshold, the controller 400 will not control the movement of the slider 320 via the external driver. When the temperature at the local high temperature location is higher than the preset threshold, the controller 400 will control the movement of the slider 320 via the external driver.
[0051] With such a configuration, the temperature sensor 500 is used to quickly and accurately detect the temperature of the area to be dissipated, and the detection result can be transmitted to the controller 400. With the cooperation of the controller 400, when the local temperature of the area to be dissipated exceeds a preset threshold, the external driver can be controlled to drive the corresponding slider 320 to move, thereby driving the corresponding fan unit 200 to move along the first direction to face the local high-temperature position, thereby quickly dissipating heat from the local high-temperature position. In summary, the use of the temperature sensor 500 and the controller 400 can control the fan unit 200 to quickly and accurately dissipate heat from the local high-temperature position, greatly improving the heat dissipation effect, and the high degree of automation greatly reduces manual intervention, which helps to improve the convenience of use.
[0052] Optionally, the temperature sensor is configured as a wireless temperature sensor.
[0053] In one embodiment of the present application, see Figure 1 and Figure 2 , the power of any two adjacent wind turbine groups 200 is different.
[0054] With this configuration, since any two adjacent fan units 200 have the same power, one fan unit 200 will inevitably have a lower power. When dissipating heat at a localized high-temperature location, the controller 400 controls the external driver to preferentially drive the lower-power fan unit 200 directly toward the localized high-temperature location, further reducing heat dissipation energy consumption and cooling costs.
[0055] In one embodiment of the present application, see Figure 1 , the temperature sensor 500 is set to be multiple, and the multiple temperature sensors 500 are all electrically connected to the controller 400.
[0056] With such an arrangement, multiple temperature sensors 500 are used to detect the temperature of the area to be dissipated from multiple different positions. Compared with setting only one temperature sensor 500, local high-temperature positions can be detected more quickly and accurately, which helps to further improve the heat dissipation effect of the device.
[0057] In one embodiment of this application, please refer to Figure 1 and Figure 2, multiple temperature sensors 500 are symmetrically distributed on the rack 100 .
[0058] With this arrangement, since the multiple temperature sensors 500 are symmetrically distributed on the rack 100 , when detecting the area to be radiated, the temperature of the area to be radiated can be evenly detected from different positions, which helps to further improve the heat dissipation effect of the device.
[0059] In one embodiment of the present application, see Figure 1 and Figure 2 The frame 100 includes two horizontal beams 110 and two vertical beams 120 , wherein one vertical beam 120 is installed at one end of the two horizontal beams 110 and is located between the two horizontal beams 110 , and the other vertical beam 120 is installed at the other end of the two horizontal beams 110 and is located between the two horizontal beams 110 .
[0060] Such a configuration, using two horizontal beams 110 and two vertical beams 120, facilitates installation of multiple fan units 200, drive components 300, controllers 400, and temperature sensors 500, thereby improving ease of use and, in addition, contributing to improved structural stability of the device.
[0061] In one embodiment of the present application, see Figure 1 and Figure 2 The frame 100 further includes a support beam 130 , which is installed between the two horizontal beams 110 and located between the two vertical beams 120 .
[0062] Such a configuration uses the support beam 130 to support the top crossbeam 110, which helps to further improve the structural stability of the device and further helps to increase the service life of the device.
[0063] In one embodiment of this application, please refer to Figure 1 and Figure 2 , a plurality of support beams 130 are provided, and the plurality of support beams 130 are installed between the two cross beams 110 .
[0064] Such a configuration, using multiple support beams 130 , helps to further improve the structural stability of the device compared to providing only one support beam 130 .
[0065] In one embodiment of the present application, see Figure 1 and Figure 2 The drive components 300 are set into two groups, and both groups of drive components 300 are installed on the frame 100 and are symmetrically distributed.
[0066] In this way, the driving components 300 are arranged into two groups, which can improve the stability of the multiple fan groups 200 during the movement process, and can quickly and accurately direct the fan groups 200 to the local high-temperature positions.
[0067] like Figure 3 As shown, the heat dissipation device 600 of the present invention can be installed in a stadium or a factory building. The usual installation position is on the upper side of the stadium or the factory building, and it is symmetrically arranged to better achieve ventilation and heat dissipation.
[0068] The working principle of this application is: the fan operates normally in the working state. For some local locations with high temperatures or dense crowds, the temperature sensor (for crowds, it can also be replaced with an infrared thermal imaging sensor) (preferably a total of 6 groups, upper and lower) detects the surrounding temperature and its distribution at the current location, and transmits the temperature information to the controller 400 through LoRa wireless communication. The controller 400 controls the slider of the drive component to move in parallel to effectively ventilate and dissipate heat in areas with higher temperatures.
[0069] The fan of the present application is designed to be movable by a drive assembly and is no longer fixed. Therefore, a fan with lower power can be selected to achieve effective heat dissipation in the entire area, thereby realizing energy conservation and emission reduction while achieving the purpose of heat dissipation. The fan position is adjusted in real time based on temperature changes and local high temperature conditions, so that local high temperatures can be quickly dissipated, thereby realizing intelligent adjustment of the venue's ambient temperature.
[0070] The one or more embodiments of this application are intended to encompass all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this application should be included in the scope of protection of this application.
Claims
1. A heat dissipation device, characterized in that: include: rack(100); A plurality of fan groups (200), wherein the plurality of fan groups (200) are all mounted on the frame (100) and are spaced apart and distributed along a first direction; A drive assembly (300) is mounted on the frame (100) and is configured to drive the plurality of fan units (200) to move relative to the frame (100) along a first direction.
2. The heat dissipation device according to claim 1, wherein: The driving assembly (300) includes a guide rail (310) and a plurality of sliders (320), wherein the guide rail (310) is mounted on the frame (100), and the plurality of sliders (320) are mounted on the slider (320) and are respectively arranged in a one-to-one correspondence with the plurality of fan groups (200), and are further configured to be able to drive the plurality of fan groups (200) to move along a first direction.
3. The heat dissipation device according to claim 2, wherein: The heat dissipation device further comprises a controller (400) and a temperature sensor (500) or an infrared thermal imaging sensor. The controller (400) is mounted on the rack (100). The temperature sensor (500) or the infrared thermal imaging sensor is electrically connected to the controller (400) and is used to detect the temperature of the area to be dissipated. The controller (400) is configured to control the slider (320) to drive the fan unit (200) to move along a first direction when the local temperature of the area to be dissipated exceeds a preset threshold value so that the fan unit (200) faces the local high-temperature position.
4. The heat dissipation device according to claim 3, wherein: The powers of any two adjacent fan groups (200) are different.
5. The heat dissipation device according to claim 3, wherein: The temperature sensor (500) or infrared thermal imaging sensor is provided in plurality, and the plurality of temperature sensors (500) or infrared thermal imaging sensors are all electrically connected to the controller (400).
6. The heat dissipation device according to claim 5, wherein: The plurality of temperature sensors (500) or infrared thermal imaging sensors are symmetrically distributed on the rack (100).
7. The heat dissipation device according to any one of claims 1 to 6, wherein: The frame (100) comprises two cross beams (110) and two vertical beams (120), wherein one of the vertical beams (120) is installed at one end of the two cross beams (110) and is located between the two cross beams (110), and the other vertical beam (120) is installed at the other end of the two cross beams (110) and is located between the two cross beams (110).
8. The heat dissipation device according to claim 7, wherein: The frame (100) further comprises a support beam (130), wherein the support beam (130) is installed between the two transverse beams (110) and is located between the two vertical beams (120).
9. The heat dissipation device according to claim 8, wherein: The support beams (130) are provided in plurality, and the plurality of support beams (130) are all installed between the two cross beams (110).
10. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The drive components (300) are arranged in two groups, and the two groups of drive components (300) are both mounted on the frame (100) and are symmetrically distributed.