Semiconductor clamping device

Abstract

The utility model provides a semiconductor clamping device. The semiconductor clamping device comprises two clamping pieces which are symmetrically arranged, a driving mechanism which drives the two clamping pieces to be close to each other or far away from each other, and at least one group of guide mechanisms which are arranged on the clamping pieces to guide the two clamping pieces to move along a straight line, the guiding mechanism comprises a horizontal displacement guiding piece and a guiding piece which are oppositely arranged on the two clamping pieces, and the guiding piece extends towards the horizontal displacement guiding piece and is movably connected to the horizontal displacement guiding piece so as to guide the two clamping pieces to linearly move in the horizontal direction. According to the invention, it is ensured that the two clamping pieces can stably move along the linear path, so that the preset clamping force is uniformly applied to the edge of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor clamping device. Background Art

[0002] During the processing of semiconductor substrates (taking "wafers" as an example), automated equipment is usually used to implement process steps, such as clamping and fixing the wafers during cleaning, etching, developing, and coating processes.

[0003] However, the clamping device for clamping wafers in the prior art is difficult to move strictly along a straight path when driving the clamping member to clamp the wafer, resulting in deviation in the motion trajectory, causing the clamping member to generate lateral force or deflection during movement, resulting in uneven distribution of clamping force and increasing the risk of damage to the wafer.

[0004] It should be noted that the above introduction to the background technology is merely for the purpose of providing a clear and complete description of the technical solutions of this application and facilitating understanding by those skilled in the art. Simply because these solutions are described in the background technology section of this application, it should not be assumed that the above technical solutions are well known to those skilled in the art. Utility Model Content

[0005] The purpose of the present utility model is to disclose a semiconductor clamping device for solving the many defects of the clamping devices for clamping wafers in the prior art, especially to ensure that two clamping parts can move smoothly along a straight path.

[0006] To achieve the above-mentioned object, the present invention provides a semiconductor clamping device, comprising: two symmetrically arranged clamping members, a driving mechanism for driving the two clamping members to move closer to or away from each other, and at least one set of guide mechanisms configured on the clamping members to guide the two clamping members to move in a straight line;

[0007] The guide mechanism includes: a horizontal displacement guide and a guide member arranged opposite to the two clamping members, the guide member extends toward the horizontal displacement guide member and is movably connected to the horizontal displacement guide member to guide the two clamping members to move linearly along the horizontal direction.

[0008] As a further improvement of the present invention, multiple groups of the guide mechanisms are symmetrically arranged on both sides of the clamping member.

[0009] As a further improvement of the present invention, the guide member extends toward the horizontal displacement guide member to form a guide rod, and the horizontal displacement guide member is constructed with a guide groove for accommodating the guide rod.

[0010] As a further improvement of the present invention, the driving mechanism includes driving arms respectively connected to the two clamping members, and the driving mechanism drives the two driving arms to move closer to or away from each other to drive the two clamping members to move synchronously, so as to enable the two clamping members to clamp or release the edge of the wafer.

[0011] As a further improvement of the present invention, the clamping member protrudes to form a protrusion that fits against the edge of the wafer.

[0012] As a further improvement of the present invention, the protrusion is configured to fit onto a semi-circumferential edge of the wafer.

[0013] As a further improvement of the present invention, the protrusions are configured as a plurality and are arranged at equal intervals around half the circumference of the wafer.

[0014] As a further improvement of the present invention, the protrusion is configured to fit onto a partial half-circumferential edge of the wafer. When the two clamps clamp the edge of the wafer, there is a gap between the two ends of the protrusion along its arc length direction and the two ends of the other protrusion along its arc length direction.

[0015] As a further improvement of the present invention, the clamping member is configured as a frame structure, and the frame structure is constructed with a window area exposing a portion of the wafer surface, and the protrusion is formed at the bottom of the frame structure.

[0016] As a further improvement of the present invention, the driving mechanism also includes: a driving motor, a transmission screw controlled by the driving motor to rotate, the transmission screw passes through the driving arm and is threadedly connected to the driving arm, and the driving arm is symmetrically arranged on both sides of the transmission screw in the horizontal direction.

[0017] Compared with the prior art, the beneficial effects of the present invention are: during the clamping process, power is provided by the driving mechanism to drive the two clamping members to approach each other, and in the process of the two clamping members approaching each other, the guiding mechanism guides the clamping members to move in a straight line in the horizontal direction to avoid lateral deviation of the clamping members, so that the two clamping members can accurately clamp the edges of both sides of the wafer, and evenly apply a preset clamping force to the edge of the wafer to fix the edge of the wafer, thereby improving the accuracy and stability of the clamping process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of the semiconductor clamping device disclosed in the present utility model;

[0019] Figure 2 for Figure 1 Cross-sectional view along the AA axis;

[0020] Figure 3is a schematic diagram of the clamping member without clamping the wafer, wherein the horizontal displacement guide, the guide member and the driving arm are cut away;

[0021] Figure 4 A schematic diagram of a clamp holding a wafer;

[0022] Figure 5 is a bottom view schematic diagram of the protrusions clamping the edge of the wafer;

[0023] Figure 6 is a bottom view schematically showing a protrusion clamping an edge of a wafer in another embodiment;

[0024] Figure 7 FIG. 1 is a bottom view of another embodiment of the protrusions clamping the edge of the wafer. FIG. DETAILED DESCRIPTION

[0025] The present invention is described in detail below with reference to the various embodiments shown in the accompanying drawings. However, it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in this field based on these embodiments are all within the scope of protection of the present invention.

[0026] The drawings in the present invention are not drawn strictly to scale, and the specific dimensions of each structure can be determined according to actual needs. The drawings described in the present invention are only schematic structural diagrams.

[0027] The present application discloses a semiconductor clamping device 100 for clamping wafers. Compared to conventional wafer clamping devices, the semiconductor clamping device 100 utilizes a guide mechanism 30 to guide the clamping member 10 along a horizontal linear path. This prevents lateral forces or deflection on the wafer during the clamping process, thereby avoiding additional stress on the wafer and distributing the clamping force evenly across the wafer's edges, reducing the risk of wafer damage.

[0028] Please refer to Figures 1 to 7 A specific embodiment of a semiconductor clamping device 100 is disclosed. The semiconductor clamping device 100 includes two symmetrically arranged clamping members 10, a driving mechanism 20 that drives the two clamping members 10 toward or away from each other, and at least one guide mechanism 30 disposed on the clamping members 10 to guide the two clamping members 10 in linear motion. The guide mechanism 30 includes a horizontal displacement guide 31 and a guide member 32 disposed oppositely on the two clamping members 10. The guide member 32 extends toward the horizontal displacement guide 31 and is movably connected to the horizontal displacement guide 31 to guide the two clamping members 10 in linear motion in a horizontal direction.

[0029] In the initial position (such as Figure 3), the two clamping members 10 are in a distanced state to reserve loading space for the wafer, ensuring that there is enough space to safely place or remove the wafer and avoid accidental damage to the wafer during operation. During the clamping process, the driving mechanism 20 provides power to drive the two clamping members 10 to approach each other. In the process of the two clamping members 10 approaching each other, the guiding mechanism 30 guides the clamping members 10 to move in a straight line in the horizontal direction to avoid lateral deviation of the clamping members 10, so that the two clamping members 10 can accurately clamp the edges of both sides of the wafer and evenly apply a preset clamping force to the edges of the wafer to fix the edges of the wafer (such as Figure 4 ), thereby improving the accuracy and stability of the clamping process. And through the uniform distribution of the clamping force, it is possible to prevent the local stress on the edge of the wafer from being too large, reducing the risk of wafer damage. During the release process, the drive mechanism 20 works in the reverse direction, driving the two clamping members 10 away from each other (such as Figure 3 ) so that the clamping member 10 releases the edge of the wafer, and the guide mechanism 30 continues to guide the clamping member 10 to separate smoothly along a straight path to smoothly release the wafer.

[0030] In some examples, multiple sets of guide mechanisms 30 are symmetrically arranged on either side of the clamping member 10. These multiple sets of guide mechanisms 30 form multiple guide points for guiding the clamping member 10 along a linear path, making the movement of the clamping members 10 closer or farther apart more precise and further preventing lateral deviation of the clamping members 10. Furthermore, the symmetrical arrangement of the multiple sets of guide mechanisms 30 provides support for the clamping member 10, making it less susceptible to vibration during operation and thereby improving the accuracy of the wafer clamping position.

[0031] like Figure 3 As shown, in this embodiment, two sets of guide mechanisms 30 are symmetrically arranged on both sides of the clamping member 10. The two sets of guide mechanisms 30 guide the clamping member 10 to move smoothly along a straight path, and provide support and stability to the clamping member 10, which is suitable for most standard-sized wafers. By symmetrically arranging the two sets of guide mechanisms 30, it is possible to simplify the structure and reduce costs while ensuring accuracy and stability, making it suitable for large-scale production. In some cases, such as when processing wafers of larger size or higher precision requirements, more guide mechanisms 30 can be added on both sides of the clamping member 10 to provide more support points, further improving the movement accuracy and stability of the clamping member 10, making it suitable for high-end manufacturing processes and ensuring higher processing quality and reliability.

[0032] Ginseng Figure 3 and Figure 4As shown, in some examples, the guide member 32 extends toward the horizontal displacement guide member 31 to form a guide rod 321, and the horizontal displacement guide member 31 is constructed to accommodate the guide rod 321. During the clamping process, when the drive mechanism 20 drives the clamping members 10 toward each other, the guide rod 321 slides within the guide groove 311 to ensure that the clamping members 10 move smoothly along a straight path, ensuring that the clamping members 10 can apply a uniform clamping force to the edge of the wafer, protecting the wafer from damage. After the wafer is firmly clamped, the guide rod 321 is stably positioned within the guide groove 311, ensuring that the position of the clamping member 10 is fixed and immovable, so as to maintain the stability of the wafer during various subsequent processing steps. During the release process, when the drive mechanism 20 drives the clamping members 10 away from each other, the guide rod 321 slides along the guide groove 311 to ensure that the clamping members 10 move smoothly along a straight path, guiding the clamping members 10 to smoothly separate from the wafer, and avoiding any unnecessary pressure or impact on the wafer.

[0033] In some examples, during the clamping process, when the driving mechanism 20 drives the clamping members 10 to approach each other, the guide rod 321 is inserted into the guide groove 311 to slide in the guide groove 311, thereby guiding the clamping member 10 to move smoothly along a straight path, and enabling the clamping member 10 to apply a uniform clamping force to the edge of the wafer to protect the wafer from damage; during the release process, the guide rod 321 is disengaged from the guide groove 311 (this state is not shown). Since the guide rod 321 does not contact the guide groove 311 in the non-clamped state, unnecessary wear is reduced and the service life of the component is extended. Compared with the implementation method in which the guide rod 321 is inserted into the guide groove 311 during clamping and disengaged from the guide groove 311 during release, in this embodiment, Figure 3 and Figure 4 As shown, the guide rod 321 slides in the guide groove 311 during the clamping or releasing process, so that the guide rod 321 always remains in the guide groove 311 during the entire clamping and releasing process, thereby providing higher movement accuracy and stability to the clamping member 10.

[0034] Ginseng Figures 1 to 4As shown, in some examples, the drive mechanism 20 includes a drive arm 21 connected to each of the two clamps 10. The drive mechanism 20 drives the two drive arms 21 toward or away from each other to drive the two clamps 10 to move synchronously, thereby enabling the two clamps 10 to clamp or release the edge of the wafer. When the drive mechanism 20 drives the two drive arms 21 toward each other, the clamps 10 move synchronously toward the edge of the wafer, uniformly applying a predetermined clamping force to the edge of the wafer to secure the wafer. The drive arms 21 ensure that the two clamps 10 can move synchronously, that is, move toward or away from each other at the same time, thereby ensuring that the clamping force of the clamps 10 is evenly distributed across the contact surface with the edge of the wafer, protecting the wafer from damage. After the wafer is firmly clamped, the drive arms 21 continue to maintain the position of the clamps 10 to keep the wafer stable during various subsequent processing steps. When the drive mechanism 20 operates in the reverse direction, the drive arms 21 drive the clamps 10 synchronously away from each other, ensuring a smooth release of the wafer and avoiding any unnecessary pressure or impact on the wafer.

[0035] Ginseng Figure 2 As shown, in some examples, the clamping members 10 extend to form protrusions 11 that fit against the edge of the wafer. When the drive mechanism 20 drives the clamping members 10 toward each other, protrusions 11 first contact the edge of the wafer and apply a uniform clamping force. Because protrusions 11 only contact the edge, the clamping force is applied directly to the edge of the wafer, ensuring uniform clamping force distribution, avoiding unnecessary stress concentration, and minimizing impacts on the wafer surface, thereby ensuring wafer quality.

[0036] Ginseng Figure 5 As shown, in some examples, the protrusion 11a is configured to fit over half of the wafer's circumferential edge. The protrusion 11a on a single clamp 10 fits over only half of the wafer's circumferential edge. The combined action of the protrusions 11a on both clamps 10 completely wraps around the wafer's edge, ensuring the entire wafer edge is securely clamped, providing all-around protection and further ensuring that the clamping force is evenly distributed across the wafer's edge.

[0037] Ginseng Figure 7 As shown, in some examples, the protrusions 11b are configured as a plurality and are evenly spaced around half the circumference of the wafer. After the two clamps 10 clamp the edge of the wafer, the multiple protrusions 11b are evenly spaced around the edge of the wafer. This ensures that the clamping force is evenly distributed along the edge of the wafer through the multiple protrusions 11b, thereby increasing the number of clamping points and further improving the stability and firmness of the wafer edge clamping.

[0038] Ginseng Figure 6As shown, in some examples, the protrusion 11c is configured to fit partially to the edge of the wafer, and when the two clamps 10 clamp the edge of the wafer, a gap exists between the two ends of the protrusion 11 along its arc length direction and the two ends of the other protrusion 11 along its arc length direction. The protrusion 11c fits partially to the edge of the wafer, and when the two clamps 10 clamp the edge of the wafer, a gap exists between the two ends of the protrusion 11c along its arc length direction and the two ends of the other protrusion 11c along its arc length direction. The gap can avoid direct contact between the two protrusions 11c, reducing local stress concentration caused by uneven clamping force. It also allows the edge of the wafer to have a certain degree of freedom, preventing damage to the wafer caused by excessive clamping.

[0039] Ginseng Figure 2 and Figure 4 As shown, the clamping member 10 is configured as a frame structure 12, and the frame structure 12 is constructed with a window area 13 that exposes part of the wafer surface, and the protrusion 11 is formed at the bottom of the frame structure 12. The frame structure 12 can enhance the overall rigidity of the clamping member 10, reduce the shaking or jamming phenomenon during the movement of the clamping member 10, and improve stability. In addition, the frame structure 12 can better disperse the driving force applied by the drive mechanism 20 to the clamping member 10, reduce local stress concentration, and protect the clamping member 10 and the wafer. The wafer surface is exposed through the window area 13 to reduce the contact area of ​​the clamping member 10 on the wafer surface and reduce the risk of contamination.

[0040] Ginseng Figure 1 and Figure 2 As shown, the drive mechanism 20 also includes: a drive motor 22, a transmission screw 23 that is controlled by the drive motor 22 to rotate, the transmission screw 23 passes through the drive arm 21 and is threadedly connected to the drive arm 21, and the drive arm 21 is symmetrically arranged on both sides of the transmission screw 23 in the horizontal direction. When it is necessary to clamp the wafer, the drive motor 22 drives the transmission screw 23 to rotate, and the transmission screw 23 drives the drive arm 21 to move in a straight line through the threaded connection. The drive arm 21 moves inward synchronously with the rotation of the transmission screw 23 to drive the two clamps 10 to approach each other, and finally fit and clamp the edge of the wafer. After the clamp 10 firmly clamps the wafer, the drive motor 22 stops rotating, maintains the current position of the drive arm 21, and keeps the drive arm 21 in a fixed position in the clamping state, so as to keep the wafer stable during various subsequent process treatments. When the wafer needs to be released, the drive motor 22 drives the transmission screw 23 to rotate in the opposite direction, and drives the drive arm 21 to move outward in a straight line through the threaded connection, so as to drive the two clamping parts 10 away from each other and finally smoothly detach from the edge of the wafer.

[0041] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0042] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0043] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A semiconductor clamping device, characterized in that: include: Two symmetrically arranged clamping members, a driving mechanism for driving the two clamping members to move closer to or away from each other, and at least one set of guide mechanisms configured on the clamping members to guide the two clamping members to move in a straight line; The guide mechanism includes: a horizontal displacement guide and a guide member arranged opposite to the two clamping members, the guide member extends toward the horizontal displacement guide member and is movably connected to the horizontal displacement guide member to guide the two clamping members to move linearly along the horizontal direction.

2. The semiconductor holding device according to claim 1, wherein: A plurality of guide mechanisms are symmetrically arranged on both sides of the clamping member.

3. The semiconductor holding device according to claim 1, wherein: The guide member extends toward the horizontal displacement guide member to form a guide rod, and the horizontal displacement guide member is configured with a guide groove for accommodating the guide rod.

4. The semiconductor holding device according to claim 1, wherein: The driving mechanism includes driving arms respectively connected to the two clamping members. The driving mechanism drives the two driving arms to move closer to or away from each other to drive the two clamping members to move synchronously, so that the two clamping members can clamp or release the edge of the wafer.

5. The semiconductor holding device according to any one of claims 1 to 4, characterized in that: The clamping piece protrudes to form a protrusion that fits the edge of the wafer.

6. The semiconductor holding device according to claim 5, wherein: The protrusion is configured to be attached to a semi-circumferential edge of the wafer.

7. The semiconductor holding device according to claim 5, wherein: The protrusions are configured in plural and are arranged at equal intervals around half the circumference of the wafer.

8. The semiconductor holding device according to claim 5, wherein: The protrusion is configured to fit partially around the edge of the wafer. When the two clamps clamp the edge of the wafer, a gap exists between the two ends of the protrusion along its arc length and the two ends of the other protrusion along its arc length.

9. The semiconductor holding device according to any one of claims 6 to 8, characterized in that: The clamping member is configured as a frame structure, and the frame structure is constructed with a window area exposing a portion of the wafer surface, and the protrusion is formed at the bottom of the frame structure.

10. The semiconductor holding device according to claim 4, wherein: The driving mechanism further includes: a driving motor, a transmission screw controlled to rotate by the driving motor, the transmission screw passing through the driving arm and being threadedly connected to the driving arm, and the driving arms are symmetrically arranged on both sides of the transmission screw in the transverse direction.

Images