Packaging device

Abstract

The utility model relates to a packaging device. The packaging device is provided with the following components: a conveying flow path which is composed of a plurality of tracks and can be used for conveying a carrying disc which carries an integrated circuit component along the conveying flow path; a plurality of operation stations, a feeding station, a thermal interface material applying station, a glue material coating station, a glue material coating station and a conveying flow path are sequentially arranged along the conveying flow path, wherein the feeding station can provide the carrying disc carrying the integrated circuit element; the thermal interface material applying station enables a thermal interface material to be applied and formed on the integrated circuit element; the glue material coating station enables a glue material to be coated on the integrated circuit element; the loading disc can be used for loading the integrated circuit element, the cover implanting and placing station is used for implanting an upper cover on the integrated circuit element, the cover pressing station is used for pressing the upper cover on the integrated circuit element, and the material collecting station can be used for collecting the loading disc loaded with the integrated circuit element; therefore, the packaging efficiency and the compatibility of thermal interface material application are improved.

Description

Technical Field

[0001] The utility model relates to a packaging device, and in particular to a packaging device for packaging integrated circuit (IC) components. Background Art

[0002] Taiwan Patent No. I568324, "Heat Sink Implantation Method and Apparatus," discloses a prior art integrated circuit component packaging process, which utilizes a serial production line formed by packaging equipment including a coating device, a wafer implantation device, and a pressing device to perform a coating step, a wafer implantation step, and a pressing and curing step. A composition having a chip already placed on a substrate is subjected to a coating step by a coating device having a glue valve and a glue needle before a heat sink (generally referred to as a top cover) is implanted. A first adhesive having a ∟-shaped frame facing the center is first applied to each of the four corners of the substrate surrounding the chip, for adhesion and attachment of the lower-level frame edge of the heat sink. A second adhesive having a cross-shaped shape is applied to the upper surface of the chip for adhesion and attachment of the inner edge of the central raised surface of the heat sink. The wafer implantation step is then performed by the wafer implantation device. A heat sink is placed on the adhesive-coated substrate and chip. The pressing and curing step is then performed by the pressing device. The heat sink is pressurized, heated, and then subjected to a temperature-returning process to cure the liquid adhesive to complete the packaging.

[0003] In the previous packaging process, liquid adhesive was used as a bonding agent for (1) the adhesion between the periphery of the heat sink and the substrate; (2) heat transfer between the chip and the heat sink. With the rapid development of technology, the process of integrated circuit components is moving towards 2.5D IC and even 3D IC packaging. The chip is no longer directly fixed to the substrate, but has advanced to a chip stacking structure (Chip on Chip) formed through a wire carrier (interposer). The wafer, such as Cow), and there may be multiple chips packaged on the substrate. The heat dissipation requirements generated by them can no longer be met by simply coating the second adhesive in a cross pattern on the surface of a chip. In addition, when the prior art uses a coating device to perform the coating step, it is necessary to use a glue valve and glue needle to apply the first adhesive to the substrate around the chip and the second adhesive to the chip surface. This will consume a lot of work time for the coating device at the same workstation. The glue valve and glue needle of the coating device can only allow liquid adhesive to be coated and cannot adapt to the application of non-liquid adhesive between the chip and the heat sink. In addition, as the precision of integrated circuit components increases, defects that occur after the various operating devices perform preset operations on the integrated circuit components may affect the quality of the integrated circuit components. However, the prior art only performs relevant inspections after the glue coating and pressing and curing steps, which cannot meet today's quality requirements. It can be seen that there is still room for improvement in the prior art. Utility Model Content

[0004] Therefore, an object of the present invention is to provide a packaging device that can improve at least one disadvantage of the prior art.

[0005] The packaging device according to the purpose of the present invention is provided with: a conveying flow path, which is composed of multiple tracks and can be used to transport a carrier carrying an integrated circuit component along the conveying flow path; multiple working stations are sequentially provided along the conveying flow path, including a feeding station that can provide the carrier carrying the integrated circuit component, a thermal interface material application station that applies a thermal interface material to form the integrated circuit component, a glue coating station that applies a glue to the integrated circuit component, a cover placement station that implants a top cover on the integrated circuit component, a cover pressing station that presses the top cover onto the integrated circuit component, and a material receiving station that can collect the carrier carrying the integrated circuit component.

[0006] Another packaging device according to the purpose of the present invention is provided with: a conveying flow path, which is composed of multiple tracks and can be used to convey a carrier carrying an integrated circuit component along the conveying flow path; multiple working stations are sequentially provided along the conveying flow path, including a thermal interface material application station for applying a thermal interface material to form the integrated circuit component, and a thermal interface material inspection station for visually inspecting the thermal interface material applied to the integrated circuit component.

[0007] Another packaging device according to the purpose of the present invention is provided with: a conveying flow path, which is composed of multiple tracks and can be used to transport a carrier carrying an integrated circuit component along the conveying flow path; multiple work stations are sequentially provided along the conveying flow path, including a cover placement station for placing a top cover on the integrated circuit component, and a cover inspection station for visually inspecting the top cover placed on the integrated circuit component.

[0008] In the packaging device of the present invention, the operation of forming the thermal interface material on the integrated circuit element is not performed at the same operation station as the operation of applying the adhesive material to the integrated circuit element by using a glue valve or glue needle, but is arranged in a sequential operation station in the conveying flow path and is independently applied in the pre-process operation station of the adhesive material application operation. Therefore, it can independently apply, for example, thermal interface film (Film Tim), metal thermal interface material (Metal Tim) or liquid metal thermal interface material (Liquid Metal Tim). Tim), and different application mechanisms are used according to the application of different thermal interface materials. For example, the thermal interface film can be applied in a laminating manner, and is not affected by the operation station for coating the adhesive material, which can only apply thermosetting adhesive with adhesive valves and adhesive needles, so that the packaging efficiency is improved and the compatibility with the application of thermal interface materials is improved; in addition, the thermal interface material inspection station is provided after the thermal interface material application station along the conveying flow path, and the cover inspection station is provided after the cover planting station along the conveying flow path, so that the defects of the integrated circuit components after the thermal interface material is applied at the thermal interface material application station or the upper cover is planted at the cover planting station can be discovered immediately. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a three-dimensional diagram illustrating that the integrated circuit element in the embodiment of the present invention is provided with a chip and a substrate.

[0010] Figure 2 It is a three-dimensional exploded view illustrating that the package of the integrated circuit element in the embodiment of the present invention is to place a cover on the integrated circuit element.

[0011] Figure 3 It is a three-dimensional exploded view illustrating that the integrated circuit elements are arranged in a matrix on a carrier in an embodiment of the present invention.

[0012] Figure 4 It is a three-dimensional exploded view illustrating that the upper covers are arranged in a matrix on the material tray in the embodiment of the present invention.

[0013] Figure 5 It is a schematic diagram illustrating the packaging device and its various operating stations in an embodiment of the present invention.

[0014] Figure 6 It is a schematic diagram illustrating the conveying flow path of the packaging device in an embodiment of the present utility model.

[0015] Figure 7 It is a schematic diagram illustrating the working head and driving mechanism of each working station in the embodiment of the present utility model.

[0016] Figure 8It is a schematic diagram illustrating the conveying flow path, the operating head and the driving mechanism in each operating station in the embodiment of the present utility model.

[0017] Figure 9 2 is a schematic diagram illustrating the preset operations performed by each of the operation stations on the integrated circuit element in an embodiment of the present invention.

[0018]

Explanation of symbols

[0019] 1: Integrated circuit components

[0020] 11: Chip

[0021] 111: Side 1

[0022] 12: Substrate

[0023] 121: Side 2

[0024] 2: Upper cover

[0025] 3: Thermal interface material

[0026] 4: Rubber material

[0027] A: Transport flow path

[0028] A1: Track

[0029] B: Feeding station

[0030] B1: Control unit

[0031] B2: Driving mechanism

[0032] B3: Feeding operation head

[0033] C: Thermal interface material application station

[0034] C1: Control Unit

[0035] C2: Driving mechanism

[0036] C3: Application head

[0037] C31: Supply pulley

[0038] C32: Take-up pulley

[0039] C33: offset parts

[0040] D: Thermal interface material inspection station

[0041] D1: Control unit

[0042] D2: driving mechanism

[0043] D3: Thermal interface material inspection head

[0044] E: Rubber coating station

[0045] E1: Control Unit

[0046] E2: Driving mechanism

[0047] E3: Gluing head

[0048] F: Rubber material inspection station

[0049] F1: Control unit

[0050] F2: Driving mechanism

[0051] F3: Rubber material inspection head

[0052] G: Cover planting station

[0053] G1: Control unit

[0054] G2: Driving mechanism

[0055] G3: Planting head

[0056] H: Cover checkpoint

[0057] H1: Control Unit

[0058] H2: Driving mechanism

[0059] H3: Cover inspection head

[0060] I: Cover pressing station

[0061] I1: Control unit

[0062] I2: Pressing mechanism

[0063] I21: Lower mold fixture

[0064] I22: Upper mold fixture

[0065] I3: Transfer mechanism

[0066] J: Lamination Inspection Station

[0067] J1: Control unit

[0068] J2: driving mechanism

[0069] J3: Press-fit inspection head

[0070] K: Material receiving station

[0071] K1: Control unit

[0072] K2: driving mechanism

[0073] K3: Receiving head

[0074] L: Overhead Crane System

[0075] T: Release tape

[0076] S1: Loading plate

[0077] S2: Feeding tray

[0078] W1: Material box

[0079] W2: Material box

[0080] W3: Material box DETAILED DESCRIPTION

[0081] See also Figure 1 The packaging device of the embodiment of the present invention is suitable for packaging an integrated circuit element 1 as shown in the figure. The integrated circuit element 1 has a chip 11 on a substrate 12; the integrated circuit element 1 has a first surface 111 on the other side of the chip 11 opposite to the substrate 12, and has a second surface 121 on the side of the substrate 12 opposite to the chip 11; the definition of the chip 11 in the embodiment of the present invention refers to a broad range of chip stacking structures (such as Cow, Chip on Wafer) consisting of, for example, a simple one or more dies, or one or more dies (or chips) combined with a wire carrier (interposer), and the substrate 12 can be, for example, a printed circuit board (PCB substrate).

[0082] See also Figure 1 、 2 During the packaging process of the integrated circuit element 1, a lid 2 (Lid, Heatsink, or Heat Slug) will be placed on the integrated circuit element 1; before the lid 2 is placed on the integrated circuit element 1, a thermal interface material 3 (Thermal Interface Material, TIM) will be formed on the first surface 111 of the integrated circuit element 1, such as a thermal interface film (Film Tim), a metal thermal interface material (Metal Tim) or a liquid metal thermal interface material (Liquid Metal Tim), which can be a combination of materials such as indium, graphite, silicon, gold, silver, copper, tin, lead, etc., to serve as heat transfer between the chip 11 and the upper cover 2. An adhesive 4 will be coated on the periphery of the second surface 121 of the integrated circuit element 1 to serve as a bond between the substrate 12 and the upper cover 2; the adhesive 4 can be, for example, a thermosetting adhesive. The embodiment of the present invention is also suitable for packaging processes in which optical communication components such as silicon photonics are integrated into the upper cover 2 during packaging.

[0083] See also Figure 3 、 4The integrated circuit element 1 can be carried on a carrier (Boat) S1, which has a rectangular appearance and is provided with a plurality of the integrated circuit elements 1 arranged in a matrix thereon; the upper cover 2 can be carried on a tray (Tray) S2, which has a rectangular appearance and is provided with a plurality of the upper covers 2 arranged in a matrix thereon.

[0084] See also Figure 5 、 6 The embodiment of the present invention can be described by taking the packaging device shown in the figure as an example, the device is provided with:

[0085] A conveying path A, formed by a plurality of rails A1 and capable of conveying the carrier S1 carrying the integrated circuit element 1 along the conveying path A;

[0086] A plurality of workstations are sequentially provided along the conveying flow path A: a feeding station B for providing the carrier S1 carrying the integrated circuit element 1, a thermal interface material applying station C for applying the thermal interface material 3 to form the integrated circuit element 1, a thermal interface material inspection station D for visually inspecting the thermal interface material 3 applied to the integrated circuit element 1, a glue coating station E for coating the glue 4 on the integrated circuit element 1, and a glue coating station E for visually inspecting the glue 4 applied to the integrated circuit element 1. 1, a plastic material inspection station F for visually inspecting the plastic material 4, a cover planting station G for planting the upper cover 2 on the integrated circuit component 1, a cover inspection station H for visually inspecting the upper cover 2 planted on the integrated circuit component 1, a cover pressing station I for pressing the upper cover 2 onto the integrated circuit component 1, a pressing inspection station J for visually inspecting the pressed upper cover 2, and a receiving station K for collecting the carrier S1 carrying the integrated circuit component 1;

[0087] The thermal interface material inspection station D is located between the thermal interface material application station C and the adhesive coating station E. The adhesive inspection station F is located between the adhesive coating station E and the cap placement station G. The cap inspection station H is located between the cap placement station G and the cap pressing station I. The pressing inspection station J is located between the cap pressing station I and the material receiving station K.

[0088] Each workstation is an independent machine and is connected to each other along the conveying flow path A. Each workstation is equipped with a control unit B1, C1, D1, E1, F1, G1, H1, I1, J1, and K1, which includes a display and operation interface. The control units of the previous and next workstations are connected to each other by a signal handshake line for electrical communication.

[0089] The rails A1 are distributed at each work station and can be connected in series or in parallel as needed. Some of the rails A1 can be installed on a rail base A2 as needed, so that the rails A1 installed on the rail base A2 can move horizontally or rotate relative to the rail base A2 to selectively connect with other rails A1. The rails A1 can be, for example, a combination of a rail frame, a belt, and a drive. Since the manner in which the rails A1 are connected in series, in parallel, horizontally move, or rotate is not the focus of the present invention, it will not be elaborated here.

[0090] See also Figure 3 、 4 5, 6. The packaging device can be used in conjunction with an overhead crane system (e.g., an overhead hoist transfer (OHT)) L. The overhead crane system L passes over the packaging device and is vertically parallel to the conveying flow path A. The overhead crane system L is used to move the material box W1 vertically into or out of the feeding station B, or to move the material box W2 vertically into or out of the receiving station K, or to move the material box W3 vertically into or out of the cap placement station G.

[0091] The material box W1 corresponding to the feeding station B stores the carrier S1 carrying the integrated circuit components 1 and is moved into the feeding station B by the overhead crane system L. After the carrier S1 carrying the integrated circuit components 1 outputs the material box W1 and supplies it to the conveying flow path A, the empty material box W1 is then moved out of the feeding station B by the overhead crane system L.

[0092] The empty box W2 corresponding to the receiving station K is moved into the receiving station K by the overhead crane system L. After the carrier S1 carrying the integrated circuit components 1 is input into the box W2 through the conveying channel A, the box W2 carrying the carrier S1 is then moved out of the receiving station K by the overhead crane system L.

[0093] The material box W3 corresponding to the cap planting station G stores the material tray S2 carrying the upper cap 2 and is moved into the cap planting station G by the overhead crane system L. After the material tray S2 carrying the upper cap 2 outputs the material box W3, the empty material box W3 is moved out of the cap planting station G by the overhead crane system L.

[0094] The use of the overhead crane system L is to facilitate the conveying of material boxes W1, W2, and W3, but is not limited to this. The packaging device can also be used with an unmanned carrier with a robotic arm or manually convey the material boxes W1, W2, and W3. Since the way in which the carrier S1 outputs the material box W1 at the feeding station B, the way in which the carrier S1 inputs the material box W2 at the receiving station K, and the way in which the material tray S2 outputs the material box W3 at the cap planting station G are not the focus of the present invention, they will not be elaborated here.

[0095] See also Figure 7 、 89. Each operation station is provided with an operation head for performing a preset operation on the integrated circuit element 1 on the carrier S1;

[0096] The feeding station B is equipped with a feeding operation head B3 that can be driven by a driving mechanism B2 to move above the conveying channel A. The feeding operation head B3 can photograph the integrated circuit components 1 on the carrier S1 and calculate the number of the integrated circuit components 1 on the carrier S1 through the control unit B1. The driving mechanism B2 can be, for example, a single-axis or multi-axis gantry slide; the feeding operation head B3 can be, for example, a CCD lens.

[0097] The thermal interface material application station C is provided with two sets of application heads C3, each driven by a driving mechanism C2 and displaced above the conveying flow path A. The application heads C3 can apply the thermal interface material 3 to the first surface 111 (i.e., the chip 11) of the integrated circuit element 1. In the embodiment of the present invention, the thermal interface material 3 is, for example, a thermal interface film; the application head C3 is provided with a supply reel C31, a take-up reel C32, and a contact member C33 disposed between the supply reel C31 and the take-up reel C32. The thermal interface material 3 is attached to a release tape T. After being delivered from the supply reel C31, the release tape T with the thermal interface material 3 attached thereto is wound around the abutment C33 and taken up by the take-up reel C32. The thermal interface material 3 is attached to the side of the release tape T opposite the abutment C33. When the release tape T with the thermal interface material 3 attached thereto is wound around the abutment C33, the abutment C33 can adhere the thermal interface material 3 to the wafer 11. The drive mechanism C2 can be, for example, a single-axis or multi-axis gantry slide.

[0098] The thermal interface material inspection station D is equipped with a thermal interface material inspection head D3 that can be driven by a drive mechanism D2 to move above the conveying channel A. The thermal interface material inspection head D3 can perform a visual inspection of the thermal interface material 3 applied to the wafer 11. The drive mechanism D2 can be, for example, a single-axis or multi-axis gantry slide. The thermal interface material inspection head D3 can be, for example, a CCD lens. Visual inspection items include whether the thermal interface material 3 is correctly applied and whether the thermal interface material 3 has any defects on its appearance.

[0099] The adhesive coating station E is equipped with two adhesive coating heads E3, each driven by a driving mechanism E2 and displaced above the conveying channel A. The adhesive coating heads E3 can apply the adhesive 4 to the periphery of the second surface 121 (i.e., the substrate 12) of the integrated circuit component 1. The driving mechanism E2 can be, for example, a single-axis or multi-axis gantry slide; the adhesive coating heads E3 can be, for example, a screw valve, a piezoelectric valve, or a pneumatic valve.

[0100] The adhesive material inspection station F is equipped with an adhesive material inspection head F3 that can be driven by a drive mechanism F2 to move above the conveying channel A. The adhesive material inspection head F3 can visually inspect the adhesive material 4 applied to the substrate 12. The drive mechanism F2 can be, for example, a single-axis or multi-axis gantry slide. The adhesive material inspection head F3 can be, for example, a CCD lens. Visual inspection items include whether the adhesive material 4 is correctly applied and whether the adhesive material 4 has any defects on its appearance.

[0101] The cap placement station G is equipped with two sets of placement heads G3, each driven by a driving mechanism G2 and displaced above the conveying channel A. The placement heads G3 can pick up the upper cap 2 and place the upper cap 2 on the second surface 121 (i.e., the substrate 12) of the integrated circuit element 1 so that the upper cap 2 can cover the wafer 11. The driving mechanism G2 can be, for example, a single-axis or multi-axis gantry slide; the placement head G3 can be, for example, a negative pressure suction cup.

[0102] The cap inspection station H is equipped with a cap inspection head H3 that can be driven by a drive mechanism H2 to move above the conveying channel A. The cap inspection head H3 can perform a visual inspection on the upper cap 2 that has been placed on the substrate 12. The drive mechanism H2 can be, for example, a single-axis or multi-axis gantry slide. The cap inspection head H3 can be, for example, a CCD lens. The visual inspection items include whether the upper cap 2 is correctly placed and whether there are any defects on the appearance of the upper cap 2.

[0103] The cover pressing station I is equipped with four sets of pressing mechanisms I2, each of which is arranged on both sides of the conveying channel A in pairs, and two sets of transfer mechanisms I3 that can transfer the carrier S1 between the pressing mechanisms I2 and the conveying channel A; the pressing mechanism I2 is equipped with a lower mold fixture I21 and an upper mold fixture I22 that can be relatively displaced with the lower mold fixture I21. The transfer mechanism I3 can extract the carrier S1 from the conveying channel A to the pressing mechanism I2 and place the carrier S1 on the lower mold fixture I21, so that the upper mold fixture I22 can press down to apply pressure to the upper cover 2 toward the integrated circuit component 1, and heat the integrated circuit component 1 to solidify the adhesive 4 or heat the upper cover 2 to melt the thermal interface material 3;

[0104] The press-fit inspection station J is equipped with a press-fit inspection head J3 that can be driven by a drive mechanism J2 to move above the conveying channel A. The press-fit inspection head J3 can perform a visual inspection on the upper cover 2 after press-fitting. The drive mechanism J2 can be, for example, a single-axis or multi-axis gantry slide. The press-fit inspection head J3 can be, for example, a CCD lens. Visual inspection items include whether the upper cover 2 is deflected or whether there are any defects on the appearance of the upper cover 2.

[0105] The receiving station K is provided with a receiving operation head K3 which can be driven by a driving mechanism K2 and displaced above the conveying flow path A. The receiving operation head K3 can photograph the integrated circuit components 1 on the carrier S1 and calculate the number of the integrated circuit components 1 on the carrier S1 through the control unit K1; the driving mechanism K2 can be, for example, a single-axis or multi-axis gantry slide; the receiving operation head K3 can be, for example, a CCD lens.

[0106] In the embodiment of the present invention, the carrier S1 carrying the integrated circuit component 1 is stored in the magazine W1, and the overhead crane system L moves the magazine W1 into the feeding station B, so that the carrier S1 carrying the integrated circuit component 1 can be output from the magazine W1 and supplied to the conveying flow path A. In the conveying flow path A, the carrier S1 carrying the integrated circuit component 1 sequentially passes through the thermal interface material application station C, the thermal interface material inspection station D, the adhesive coating station E, the adhesive inspection station F, the cap placement station G, the cap inspection station H, the cap pressing station I, the pressing inspection station J, and finally arrives at the receiving station K, so that the carrier S1 carrying the integrated circuit component 1 can be input into the magazine W2 for collection, and the overhead crane system L moves the magazine W2 out of the receiving station K.

[0107] The process of packaging the integrated circuit element 1 includes:

[0108] The carrier S1 carrying the integrated circuit element 1 is sequentially operated at a plurality of different operation stations in the conveying flow path A to respectively perform the following operations: forming the thermal interface material 3 on the integrated circuit element 1, coating the adhesive 4 on the integrated circuit element 1, placing the upper cover 2 on the integrated circuit element 1, and applying pressure to the upper cover 2 toward the integrated circuit element 1;

[0109] After forming the thermal interface material 3 on the integrated circuit element 1 and before applying the adhesive 4 to the integrated circuit element 1, a visual inspection of the thermal interface material 3 formed on the wafer 11 is performed;

[0110] After applying the adhesive 4 to the integrated circuit element 1 and before placing the cover 2 on the integrated circuit element 1, a visual inspection of the adhesive 4 applied to the substrate 12 is performed;

[0111] After the upper cover 2 is placed on the integrated circuit element 1 and before the upper cover 2 is pressed against the integrated circuit element 1, a visual inspection of the upper cover 2 placed on the substrate 12 is performed.

[0112] After applying pressure to the upper cover 2 toward the integrated circuit element 1 and before the carrier S1 carrying the integrated circuit element 1 is transported to the receiving station K, a visual inspection of the pressed upper cover 2 is performed;

[0113] After the carrier S1 carrying the integrated circuit component 1 has been subjected to predetermined operations in the thermal interface material application station C, the adhesive coating station E, the cover placement station G, and the cover pressing station I, the thermal interface material inspection station D, the adhesive inspection station F, the cover inspection station H, and the pressing station J will subsequently perform inspection operations, respectively, to immediately detect defects in the integrated circuit component 1 that have occurred after the predetermined operations have been performed in the thermal interface material application station C, the adhesive coating station E, the cover placement station G, and the cover pressing station I.

[0114] During the process of executing the preset operation of the carrier S1 carrying the integrated circuit component 1, when a fault occurs or a defect is found during inspection, the work station executing the operation will enter a shutdown state and issue an alarm. Therefore, after the carrier S1 carrying the integrated circuit component 1 is output from the material box W1 corresponding to the feeding station B, and is transported to the material box W2 corresponding to the receiving station K for collection, before the carrier S1 carrying the integrated circuit component 1 is ready to be transported from the previous work station (such as the thermal interface material inspection station D) to the next work station (such as the adhesive coating station E), the previous work station will transmit telecommunications through the signal handshake line connecting the control unit D1 and the control unit E1 of the subsequent work station to confirm whether the control unit E1 of the subsequent work station allows the carrier S1 carrying the integrated circuit component 1 to be received, so as to prevent the defective integrated circuit component 1 from continuing to be transported to the next work station.

[0115] In the packaging device of the present invention, the operation of forming the thermal interface material 3 on the integrated circuit element 1 is not performed at the same operation station as the operation of applying the adhesive material 4 to the integrated circuit element 1 by using a glue valve and a glue needle, but is arranged in a sequential operation station in the conveying flow path A and is independently applied in the process operation station before the operation of applying the adhesive material 4. Therefore, it can independently apply thermal interface film (Film Tim), metal thermal interface material (Metal Tim) or liquid metal thermal interface material (Liquid Metal Tim). Tim) and other different thermal interface materials 3, and different application mechanisms are used according to the application of different thermal interface materials 3. For example, the application of thermal interface film can be carried out in a bonding manner, and is not affected by the operation station for coating the adhesive material 4 which can only apply thermosetting adhesive with adhesive valves and adhesive needles, so that the packaging efficiency is improved and the compatibility with the application of thermal interface material 3 is improved; in addition, the thermal interface material inspection station D is provided after the thermal interface material application station C along the conveying flow path A, and the cover inspection station H is provided after the cover planting station G along the conveying flow path A, so that the defects of the integrated circuit element 1 after the thermal interface material 3 is applied at the thermal interface material application station C or the upper cover 2 is planted at the cover planting station G can be discovered immediately.

[0116] The above description is only a preferred embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. In other words, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the utility model description are still within the scope of the present utility model patent.

Claims

1. A packaging device comprising: A conveying flow path, composed of a plurality of tracks and capable of conveying a carrier carrying an integrated circuit element along the conveying flow path; Multiple work stations are sequentially provided along the conveying flow path, including a feeding station for providing the carrier carrying the integrated circuit element, a thermal interface material applying station for applying a thermal interface material to form the integrated circuit element, a glue coating station for coating a glue on the integrated circuit element, a cover implanting station for implanting a top cover on the integrated circuit element, a cover pressing station for pressing the top cover onto the integrated circuit element, and a material receiving station for collecting the carrier carrying the integrated circuit element.

2. The packaging device according to claim 1, wherein: The carrier carrying the integrated circuit components is stored in a material box corresponding to the feeding station. The material box corresponding to the feeding station can be vertically moved into the feeding station by a crane system.

3. The packaging device according to claim 1, wherein: The carrier carrying the integrated circuit components is collected in a material box corresponding to the receiving station. The material box corresponding to the receiving station can be vertically moved out of the receiving station by a crane system.

4. The packaging device according to claim 1, wherein: The plurality of working stations are further provided with a thermal interface material inspection station for visually inspecting the thermal interface material applied to the integrated circuit element. The thermal interface material inspection station is arranged between the thermal interface material application station and the adhesive coating station along the conveying flow path.

5. The packaging device according to claim 1, wherein: The plurality of operation stations are further provided with a glue material inspection station for visually inspecting the glue material coated on the integrated circuit element. The glue material inspection station is arranged between the glue material coating station and the cap planting station along the conveying flow path. The packaging device according to claim 1 , wherein: The plurality of operation stations are further provided with a cover inspection station for visually inspecting the upper cover placed on the integrated circuit element, and the cover inspection station is arranged between the cover planting station and the cover pressing station along the conveying flow path.

7. The packaging device according to claim 1, wherein: The plurality of operation stations are further provided with a pressing inspection station for visually inspecting the pressed upper cover, which is arranged between the cover pressing station and the material receiving station along the conveying flow path.

8. A packaging device comprising: A conveying flow path, composed of a plurality of tracks and capable of conveying a carrier carrying an integrated circuit element along the conveying flow path; A plurality of working stations are sequentially provided along the conveying flow path, including a thermal interface material applying station for applying a thermal interface material to form the integrated circuit element, and a thermal interface material inspection station for visually inspecting the thermal interface material applied to the integrated circuit element.

9. The packaging device according to claim 8, wherein: The plurality of operation stations are further provided with a feeding station for providing the carrier carrying the integrated circuit element, and the feeding station is arranged before the thermal interface material applying station along the conveying flow path.

10. The packaging device according to claim 9, wherein: The carrier carrying the integrated circuit components is stored in a material box corresponding to the feeding station. The material box corresponding to the feeding station can be vertically moved into the feeding station by a crane system.

11. The packaging device according to claim 8, wherein: The plurality of operation stations are further provided with a glue coating station for coating a glue on the integrated circuit element, and the glue coating station is arranged after the thermal interface material inspection station along the conveying flow path.

12. The packaging device according to claim 11, wherein The plurality of operation stations are further provided with a glue material inspection station for visually inspecting the glue material coated on the integrated circuit element. The glue material inspection station is arranged after the glue material coating station along the conveying flow path.

13. A packaging device comprising: A conveying flow path, composed of a plurality of tracks and capable of conveying a carrier carrying an integrated circuit element along the conveying flow path; A plurality of operation stations are sequentially provided along the conveying flow path, including a cover placement station for placing a cover on the integrated circuit element, and a cover inspection station for visually inspecting the cover placed on the integrated circuit element.

14. The packaging device according to claim 13, wherein: The plurality of operation stations are further provided with a glue coating station for coating a glue on the integrated circuit element, which is arranged before the cap planting station along the conveying flow path.

15. The packaging device according to claim 14, wherein: The plurality of operation stations are further provided with a glue material inspection station for visually inspecting the glue material coated on the integrated circuit element. The glue material inspection station is arranged between the glue material coating station and the cap planting station along the conveying flow path.

16. The packaging device according to claim 13, wherein: The plurality of operation stations are further provided with a cover pressing station for pressing the upper cover onto the integrated circuit element, and the cover pressing station is arranged after the cover inspection station along the conveying flow path.

17. The packaging device according to claim 16, wherein: The plurality of operation stations are further provided with a receiving station for collecting the carrier tray carrying the integrated circuit components, and the receiving station is arranged behind the cover pressing station along the conveying flow path.

18. The packaging device of claim 17, wherein: The plurality of operation stations are further provided with a pressing inspection station for visually inspecting the pressed upper cover, which is arranged between the cover pressing station and the material receiving station along the conveying flow path.

19. The packaging device of claim 17, wherein: The carrier carrying the integrated circuit components is collected in a material box corresponding to the receiving station. The material box corresponding to the receiving station can be vertically moved out of the receiving station by a crane system.

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