Heat dissipation substrate, power module and water cooling structure for power module

Abstract

The utility model belongs to the technical field of power modules, and particularly relates to a heat dissipation substrate, a power module and a water cooling structure for the power module, the heat dissipation substrate comprises a substrate body, a pin-fin structure and a fence, the pin-fin structure and the fence are arranged on the same surface of the substrate body, and the pin-fin structure is located in the fence. Two water passing gaps are correspondingly formed between the inner walls of the two opposite sides of the fence and the edge of the pin fin structure, one water passing gap is used for corresponding to the water inlet side of a cooling cavity of the water cooling unit, and the other water passing gap is used for corresponding to the water outlet side of the cooling cavity of the water cooling unit. The width of the upstream ends of the two water passing gaps is larger than that of the downstream ends of the two water passing gaps. According to the utility model, the overall heat dissipation uniformity is improved, the junction temperature consistency of each chip on the power module is ensured, and the problem that the function of the power module is limited by a local high-temperature point due to the poor heat dissipation effect of a local area is effectively avoided, so that the performance of the whole power module can be fully exerted.

Description

Technical Field

[0001] The utility model belongs to the technical field of power modules, and in particular relates to a heat dissipation substrate, a power module and a water cooling structure for the power module. Background Art

[0002] Existing power module cooling methods primarily include air cooling and water cooling. Air cooling typically uses fans to enhance air flow, dissipating heat from the heat sink through forced convection. However, its cooling effect is limited and cannot meet the cooling requirements of high-power modules. Water cooling, on the other hand, utilizes cooling water flowing through the heat sink to remove heat. It offers greater heat dissipation efficiency and effectiveness, and is therefore more commonly used in high-power module cooling.

[0003] For SiC power modules with multiple chips connected in parallel, heat dissipation capacity and uniformity across the heat sink substrate, especially at the chip locations, are crucial. After the power module is assembled with the water-cooling unit, the pin-fin side of the heat sink substrate lies within the upper chamber of the water-cooling unit. Cooling water flows in through the slots on one side of the upper chamber, flows between the pin-fins, and exits through the slots on the other side. The corners of the substrate, close to the upstream edge of the cooling water source, are prone to low cooling water flow and uneven cooling. This limits the power module's performance to the chip temperature at these locations.

[0004] For the heat dissipation structure of three-phase power module with parallel water channels, for example, the utility model application with publication number CN118946107A. The water cooling unit of this structure is as shown in the attached manual. Figure 1 As shown, the cooling water flows continuously downstream from the water inlet along the water inlet channel of the water cooling unit and flows into the cooling cavity through the notch on one side of each cooling cavity. The cooling water entering the cooling cavity flows through the pin fin area and then flows from the notch on the other side of the cooling cavity along the water outlet channel to the downstream water outlet. The flow direction of the coolant in the water cooling unit is shown in the appendix of this manual. Figure 1 In the direction of the arrow in this manual. Figure 2 For example, the existing heat dissipation substrate, the cooling water along the projection direction of the heat dissipation substrate is as follows Figure 2 As shown by the arrow from right to left, the general direction of the cooling water flow is along Figure 2 In the downward direction, the flow rate of the upper part of the heat dissipation substrate, especially the one close to the water inlet of the water cooling unit, will be less than the flow rate of the lower part, especially Figure 2 The flow rate at the upper left corner is the least, and the temperature of the chip corresponding to this position will be relatively high, resulting in the overall performance of the power module being limited by the chip temperature at this position and unable to be fully utilized.

[0005] In order to further enhance heat dissipation, improvements are currently being made in the pin-fin structure and water flow path. The former mainly considers setting up special-shaped pin-fins to increase turbulence and improve heat dissipation capacity, but cannot effectively solve the problem of cooling uniformity; the latter mainly sets up corresponding structural settings to make the cooling water flow along a fixed path between the pin-fins, which can better improve the temperature uniformity performance of each chip, but the layout of the chip in this way will be limited by the heat dissipation path. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide a heat dissipation substrate, a power module and a water cooling structure for the power module which have higher heat dissipation uniformity and do not restrict chip layout.

[0007] The content of the present utility model provides a heat dissipation substrate, including a substrate body, a pin-fin structure and an enclosure, the pin-fin structure and the enclosure are arranged on the same surface of the substrate body, and the pin-fin structure is located inside the enclosure, and two water gaps are formed between the inner walls on both sides opposite to each other and the edges of the pin-fin structure, one of which is used to correspond to the water inlet side of the cooling chamber of the water cooling unit, and the other is used to correspond to the water outlet side of the cooling chamber of the water cooling unit, and the width of the upstream end of the two water gaps is greater than the width of the downstream end.

[0008] Furthermore, the widths of the two water-passing gaps gradually decrease from the end portion at the upstream end to the end portion at the downstream end.

[0009] Furthermore, the pin-fin structures are distributed in a rectangular shape, and the inner walls on both sides of the enclosure forming two water-passing gaps are inclined surfaces.

[0010] Furthermore, the pin-fin structures are distributed in a rectangular shape, and the inner walls on both sides of the enclosure forming two water-passing gaps are curved surfaces.

[0011] Furthermore, the thickness of the two sides of the two water-passing gaps formed by the enclosure gradually increases from the end portion at the upstream end to the end portion at the downstream end of the corresponding water-passing gap.

[0012] Furthermore, the pin-fin structure includes a plurality of heat dissipation pin-fins distributed at intervals, and the cross-sections of the plurality of heat dissipation pin-fins are one of circular, elliptical, and polygonal shapes, or a combination of two or more of the circular, elliptical, and polygonal shapes.

[0013] Furthermore, protrusions are provided on the inner walls of the remaining sides of the enclosure where no water gap is formed, and the positions of the protrusions correspond to the intervals between adjacent heat dissipating pin fins at the edge of the pin fin structure.

[0014] Furthermore, the height of the pin-fin structure is smaller than the height of the enclosure.

[0015] The utility model also provides a power module provided with the heat dissipation substrate as described above.

[0016] The utility model also provides a water cooling structure for the above-mentioned power module, comprising a water cooling unit and a heat dissipation substrate arranged on the power module, wherein a water inlet channel and a water outlet channel are arranged inside the water cooling unit, and a cooling cavity is arranged on the surface of the water cooling unit, and slots are opened on both sides of the bottom of the cooling cavity, and the cooling cavity is connected to the water inlet channel and the water outlet channel through the slots on both sides of the bottom;

[0017] The substrate body is sealed and fixed to the water cooling unit, the enclosure and pin-fin structure are located in the cooling chamber, the positions of the two water gaps correspond to the positions of the notches on both sides of the bottom of the cooling chamber, and the direction of cooling water flowing along the water inlet channel and the water outlet channel is in the same direction as the length of the two water gaps.

[0018] The beneficial effect of the present invention is that since the width of the upstream end of the water gap is greater than the width of the downstream end, the flow resistance upstream of the water gap is smaller than that downstream, and the cooling water circulation capacity is stronger, which can increase the flow rate of the cooling water flowing through the upstream of the water gap when the cooling water flows in the general direction of the water cooling unit as a whole, thereby increasing the cooling water flow rate in the upstream part area corresponding to the pin-fin structure, ensuring the heat dissipation effect of the upstream part area corresponding to the pin-fin structure, improving the overall heat dissipation uniformity, ensuring the junction temperature consistency of each chip on the power module, and effectively avoiding the problem of poor heat dissipation effect in local areas and the power module function being limited by local high temperature points, thereby ensuring that the power module as a whole can give full play to its performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the water cooling unit.

[0020] Figure 2 Schematic diagram of the structure of an existing heat dissipation substrate.

[0021] Figure 3 This is a schematic structural diagram of the heat dissipation substrate of the present utility model.

[0022] Figure 4 This is a schematic diagram of chip distribution in a power module of the present invention.

[0023] In the figure: 1. Base plate body; 2. Pin-fin structure; 3. Baffle; 31. Protrusion; 4. Water gap; 5. Liner; 6. Chip; 7. Water cooling unit; 71. Cooling cavity; 72. Notch; 73. Water inlet; 74. Water outlet. DETAILED DESCRIPTION

[0024] like Figure 3As shown, the utility model provides a heat dissipation substrate, which includes a substrate body 1, a pin-fin structure 2 and an enclosure 3. The pin-fin structure 2 includes a number of heat dissipation pin-fins distributed at intervals. The pin-fin structure 2 and the enclosure 3 are arranged on the same surface of the substrate body 1, and the pin-fin structure 2 is located inside the enclosure 3. The inner wall of one side of the enclosure 3 and the edge position of the pin-fin structure 2 corresponding to the side of the enclosure 3 form a water-passing gap 4, and the inner wall of the other side of the enclosure 3 and the edge position of the pin-fin structure 2 corresponding to the side of the enclosure 3 form another water-passing gap 4, and the two sides of the enclosure 3 are opposite to each other. Among the two water-passing gaps 4, one water-passing gap 4 is used to correspond to the water inlet side of the cooling chamber 71 of the water-cooling unit 7, and the other water-passing gap 4 is used to correspond to the water outlet side of the cooling chamber 71 of the water-cooling unit 7, and the width of the upstream end of the two water-passing gaps 4 is greater than the width of the downstream end. Among them, the water inlet side of the cooling cavity 71 is the slot 72 that connects the cooling cavity 71 with the water inlet channel of the water cooling unit 7, and the water outlet side of the cooling cavity 71 is the slot 72 that connects the cooling cavity 71 with the water outlet channel of the water cooling unit 7.

[0025] When the heat dissipation substrate is applied to the power module and combined with the water cooling unit 7 for water cooling and heat dissipation, Figure 1 Taking the cooling water flow direction of the water-cooling unit 7 shown as an example, a water inlet channel and a water outlet channel are provided inside the water-cooling unit 7. A water inlet 73 connected to the water inlet channel is provided at one end of the water-cooling unit 7, and a water outlet 74 connected to the water outlet channel is provided at the other end. The length direction of the water inlet channel is set along the axial extension of the water inlet 73, and the length direction of the water outlet channel is set along the axial extension of the water outlet 74. After the cooling water flows into the corresponding water gap 4 along the water inlet side of the cooling cavity 71, it passes through the pin-fin structure 2 and flows along the other water gap 4 to the water outlet side of the cooling cavity 71. That is, the cooling water on the heat dissipation substrate flows from one water gap 4 through the pin-fin structure 2 to the other water gap 4, projected to Figure 3 The direction of the cooling water flowing from the right side of the pin-fin structure 2 to the left side is shown in the heat dissipation substrate perspective. The general direction of the cooling water flowing in the water inlet side of the cooling cavity 71 of the water cooling unit 7 and the water outlet side of the cooling cavity 71 is along Figure 3 The downward direction from the perspective of the heat dissipation substrate, that is, the overall flow trend of the cooling water is downward, Figure 3 From the perspective of the heat dissipation substrate, the upper ends of the two water gaps 4 are their upstream ends, and the lower ends are their downstream ends.

[0026] Based on the setting of the heat dissipation substrate of the present invention, since the width of the upstream end of the water gap 4 is greater than the width of the downstream end, the flow resistance upstream of the water gap 4 is smaller than that downstream, and the cooling water circulation capacity is stronger, which can increase the flow rate of the cooling water flowing through the upstream of the water gap 4 when the cooling water flows in the general direction of the water cooling unit 7 as a whole, thereby increasing the cooling water flow rate in the upstream part area corresponding to the pin-fin structure 2, ensuring the heat dissipation effect of the upstream part area corresponding to the pin-fin structure 2, improving the overall heat dissipation uniformity, ensuring the junction temperature consistency of each chip 6 on the power module, and effectively avoiding the problem of poor heat dissipation effect in local areas and the power module function being limited by local high temperature points, thereby ensuring that the power module as a whole can give full play to its performance.

[0027] Since the present invention achieves overall temperature uniformity by optimizing the upstream and downstream flow distribution, compared with the method of setting a fixed path for cooling water flow in the pin-fin structure 2, the temperature uniformity of the present invention does not depend on this fixed path. Therefore, when applied to the power module, it will not limit the layout and position of the chip 6. It has higher versatility and can be applied to more models of power modules.

[0028] by Figure 4 The temperature uniformity effect of the heat dissipation substrate is described by taking the layout of the chip 6 in the single-phase power module as an example. Figure 4 The left side of the middle liner 5 is the AC end, and the right side is the DC end. The 8 chips 6 near the AC end on the liner 5 are the upper tube area, and the 8 chips 6 near the DC end are the lower tube area. In order to reduce thermal coupling, the positions of the 8 chips 6 are relatively dispersed. Figure 1 The cooling water flow direction of the water cooling unit 7 is shown as an example, and the projection to Figure 4 When the chip 6 is arranged as shown, the cooling water flows from left to right, and the overall direction of the cooling water is downward. Figure 2 The existing heat dissipation substrate shown in FIG. Figure 4 The flow rate of cooling water in the upper part will be significantly smaller than that in the lower part, especially Figure 4 The chip 6 in the upper right corner has the least amount of cooling water. The 8 chips 6 in the lower tube are connected in parallel. Under the condition of the same loss, the temperature of the chip 6 in the upper right corner is the highest, and the temperature of the chip 6 in the lower right corner is the lowest. The junction temperature difference between the two can even be more than 10°C. The junction temperature of the entire lower tube is limited by the chip 6 in the upper right corner, which makes the performance of the other 7 chips 6 not fully utilized. When using Figure 3 The heat dissipation substrate provided by the utility model, Figure 4 The cooling water flow in the chip 6 area in the upper right corner is larger, the heat dissipation effect is better, and the heat dissipation is more uniform than that in other chip 6 positions, so that the junction temperature of the 8 chips 6 on the lower tube is consistent, the temperature uniformity is better, and the performance of the power module can be more fully exerted.

[0029] On the basis that the width of the water gap 4 upstream is greater than the width downstream of the present invention, in one embodiment of the present invention, the width of the water gap 4 upstream is consistent, the width of the water gap 4 downstream is consistent, and the inner wall of the water gap 4 formed by the enclosure 3 has a step-like structure.

[0030] In a preferred embodiment of the present invention, the widths of the two water gaps 4 gradually decrease from the upstream end to the downstream end, that is, Figure 3 As shown, the width of the water gap 4 is gradually changed from one end to the other. In this preferred embodiment, it is more conducive to improving the uniformity of the flow distribution between the pin-fin structures 2 when the cooling water flows, and achieving better heat dissipation uniformity.

[0031] Based on the above preferred embodiment, the pin-fin structures 2 are specifically distributed in a rectangular shape, and the inner walls on both sides of the two water-passing gaps 4 formed by the enclosure 3 are inclined or curved surfaces, that is, they follow a linear or quadratic function distribution pattern. Furthermore, the thickness of the two sides of the two water-passing gaps 4 formed by the enclosure 3 gradually increases from the upstream end of the corresponding water-passing gap 4 to the downstream end. In other words, the outer walls of the two sides of the enclosure 3 forming the water-passing gap 4 remain vertical surfaces and do not change with the shape of the inner wall of the enclosure 3. This ensures that the outer side of the enclosure 3 fits perfectly with the inner side of the cooling chamber 71 of the water-cooling unit 7, eliminating the need to change the shape of the cooling chamber 71 of the water-cooling unit 7.

[0032] In the present invention, the plurality of heat dissipation pin fins in the pin-fin structure 2 can be evenly spaced or unevenly spaced, depending on the actual needs. The cross-sections of the plurality of heat dissipation pin fins are all one of circular, elliptical, and polygonal, or can be a combination of two or more of circular, elliptical, and polygonal, that is, some heat dissipation pin fins are circular in cross-section, and some heat dissipation pin fins are polygonal, etc. The specific shape is determined according to the actual needs. For example, the cross-sections of the heat dissipation pin fins of the present invention are all circular, and some heat dissipation pin fins are polygonal, etc. Figure 3 As shown, a heat dissipation pin fin with a square cross section is used.

[0033] In the present invention, the enclosure 3 and the pin-fin structure 2 are integrally formed with the base body 1 and are all made of a material with good thermal conductivity, such as aluminum. The inner wall of the enclosure 3, which does not form the water-passing gap 4, is provided with a protrusion 31. The position of the protrusion 31 corresponds to the spacing between adjacent heat-dissipating pin-fins at the edge of the pin-fin structure 2. This arrangement increases the surface area of ​​the inner wall of the enclosure 3 on this side without affecting the distribution of the pin-fin structure 2, thereby increasing the contact area with the cooling water and improving the heat dissipation effect.

[0034] The height of the pin-fin structure 2 is less than that of the enclosure 3, meaning that the top of the pin-fin structure 2 is slightly lower than the top of the enclosure 3. This facilitates assembly with the water-cooling unit 7 and allows for a gap between the top of the pin-fin structure 2 and the bottom of the cooling chamber 71 for cooling water to flow. The area of ​​the substrate body 1 outside the enclosure 3 and at the edge of the substrate body 1 is the area used for sealing with the water-cooling unit 7.

[0035] The present invention also provides a power module equipped with the aforementioned heat dissipation substrate, which is disposed on the side of the backing plate 5 facing away from the chip 6. If the power module is a three-phase power module, a heat dissipation substrate is disposed on the back of each backing plate 5 for the U, V, and W phases. The backing plate 5 and the heat dissipation substrate may be welded, sintered, or bonded using transient liquid phase diffusion bonding.

[0036] In this power module, chip 6 can be a MOSFET or SBD made of materials such as SiC and GaN, a reverse-conducting RC chip, or other high-power chips. The number of chips 6 in the upper and lower modules can range from 1 to 8, with the specific number connected in parallel determined by operating conditions, and a higher number is also possible. The upper and lower surfaces of the liner 5 are clad with copper for circuit interconnection. The copper cladding of the liner 5 can be bare copper or plated with gold, nickel, silver, or other coatings. The liner 5 can be manufactured using ZTA or AMB processes, and its ceramic insulating layer can be made of ceramic materials such as Al2O3 (the ceramic can be doped with oxides such as ZrO2 to enhance the thermal conductivity and structural strength of the insulating layer), Si3N4, AlN, or other insulating materials. Chips 6 can be interconnected with each other, and with the liner 5, using copper wire, aluminum wire, copper ribbon, or aluminum ribbon.

[0037] The power module provided by the present invention, due to the provision of the aforementioned heat dissipation substrate, improves overall heat dissipation uniformity, ensures consistent junction temperatures across all chips 6 within the power module, and effectively avoids issues such as poor heat dissipation in localized areas, which could limit the power module's functionality due to localized high temperatures. This ensures that the overall power module can fully realize its performance without restricting the layout and location of the chips 6, thereby improving the designability of the power module chip layout. In the case of a three-phase power module, this can prevent high temperatures at a localized point on one phase near the water inlet 73 of the water cooling unit, which could affect the overall performance of the three phases.

[0038] The present invention also provides a water-cooling structure for the power module described above, comprising a water-cooling unit 7 and a heat dissipation substrate disposed on the power module. The water-cooling unit 7 is internally provided with a water inlet channel and a water outlet channel. A water inlet 73 communicating with the water inlet channel is disposed at one end of the water-cooling unit 7, and a water outlet 74 communicating with the water outlet channel is disposed at the other end. A cooling cavity 71 is disposed on the surface of the water-cooling unit 7, with notches 72 formed on both sides of the bottom of the cooling cavity 71. The cooling cavity 71 communicates with the water inlet channel through the notch 72 on one side of the bottom, and with the water outlet channel through the notch 72 on the other side of the bottom.

[0039] The base plate body 1 is sealed and fixed to the water-cooling unit 7, the enclosure 3 and the pin-fin structure 2 are located in the cooling cavity 71, the positions of the two water gaps 4 correspond to the positions of the notches 72 on both sides of the bottom of the cooling cavity 71, and the direction of the cooling water flowing along the water inlet channel and the water outlet channel is in the same direction as the length of the two water gaps 4, and the length direction of the notches 72 is also preferably in the same direction as the length of the two water gaps 4. Among them, the water inlet channel and the water outlet channel are both arranged inside the water-cooling unit 7, the direction of the cooling water flowing along the water inlet channel is the length direction of the water inlet channel, and the direction of the cooling water flowing along the water outlet channel is the length direction of the water outlet channel. The length direction of the water inlet channel is set along the axial extension of the water inlet 73, and the length direction of the water outlet channel is set along the axial extension of the water outlet 74.

[0040] When the power module is a unidirectional power module, the number of cooling chambers 71 is one. Figure 1 As shown, when the power module is a three-phase power module, the number of cooling cavities 71 is three, and the three cooling cavities 71 are all connected to the water inlet channel through the slot 72 on one side of the bottom thereof, and are all connected to the water outlet channel through the slot 72 on the other side of the bottom thereof. The enclosure 3 and the pin-fin structure 2 of the three-phase heat dissipation substrate are correspondingly arranged in the three cooling cavities 71.

[0041] Since the water-cooling structure uses the above-mentioned heat dissipation substrate, it is blocked by the enclosure 3. When the cooling water flows between the slot 72 and the water gap 4, the flow resistance upstream of the water gap 4 is smaller than that downstream, and the cooling water circulation capacity is stronger, which increases the flow rate of the cooling water flowing through the upstream of the water gap 4 when the cooling water flows in the general direction of the water-cooling unit 7 as a whole, thereby increasing the cooling water flow rate in the upstream part area corresponding to the pin-fin structure 2, ensuring the heat dissipation effect of the upstream part area corresponding to the pin-fin structure 2, improving the overall heat dissipation uniformity, ensuring the junction temperature consistency of each chip 6 on the power module, and effectively avoiding the problem that the heat dissipation effect in local areas is poor and the power module function is limited by local high temperature points, thereby ensuring that the power module as a whole can give full play to its performance.

[0042] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of protection of the present application is limited to these examples. In line with the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of different aspects of one or more embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0043] The one or more embodiments of this application are intended to encompass all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this application should be included in the scope of protection of this application.

Claims

1. A heat dissipation substrate, characterized in that: The invention comprises a base body (1), a pin-fin structure (2) and a baffle (3), wherein the pin-fin structure (2) and the baffle (3) are arranged on the same surface of the base body (1), and the pin-fin structure (2) is located inside the baffle (3), and two water gaps (4) are formed between the inner walls of the baffle (3) and the edges of the pin-fin structure (2) on both sides opposite to each other, wherein one water gap (4) is used to correspond to the water inlet side of the cooling cavity (71) of the water cooling unit (7), and the other water gap (4) is used to correspond to the water outlet side of the cooling cavity (71) of the water cooling unit (7), and the width of the upstream end of the two water gaps (4) is greater than the width of the downstream end.

2. The heat dissipation substrate according to claim 1, wherein: The widths of the two water-passing gaps (4) gradually decrease from the end at the upstream end to the end at the downstream end.

3. The heat dissipation substrate according to claim 2, wherein: The pin-fin structures (2) are distributed in a rectangular shape, and the inner walls on both sides of the two water-passing gaps (4) formed by the enclosure (3) are inclined surfaces.

4. The heat dissipation substrate according to claim 2, wherein: The pin-fin structures (2) are distributed in a rectangular shape, and the inner walls on both sides of the two water-passing gaps (4) formed by the enclosure (3) are curved surfaces.

5. The heat dissipation substrate according to claim 3 or 4, wherein: The enclosure (3) forms two water-passing gaps (4) on both sides, and the thickness thereof gradually increases from the end portion at the upstream end to the end portion at the downstream end of the corresponding water-passing gap (4).

6. The heat dissipation substrate according to any one of claims 1 to 4, wherein: The pin-fin structure (2) comprises a plurality of heat dissipation pin-fins distributed at intervals, and the cross-sections of the plurality of heat dissipation pin-fins are all one of circular, elliptical, and polygonal, or a combination of two or more of the circular, elliptical, and polygonal shapes.

7. The heat dissipation substrate according to claim 6, wherein: A protrusion (31) is provided on the inner wall of the remaining side of the enclosure (3) where the water gap (4) is not formed. The position of the protrusion (31) corresponds to the interval between adjacent heat dissipating pin fins at the edge of the pin fin structure (2).

8. The heat dissipation substrate according to any one of claims 1 to 4 and 7, wherein: The height of the pin-fin structure (2) is smaller than the height of the enclosure (3).

9. A power module, characterized in that: A heat dissipation substrate according to any one of claims 1 to 8 is provided.

10. A water cooling structure for the power module according to claim 9, characterized in that: The invention comprises a water cooling unit (7) and a heat dissipation substrate arranged on a power module, wherein a water inlet channel and a water outlet channel are arranged inside the water cooling unit (7), and a cooling cavity (71) is arranged on the surface of the water cooling unit (7), and slots (72) are provided on both sides of the bottom of the cooling cavity (71), and the cooling cavity (71) is connected to the water inlet channel and the water outlet channel through the slots (72) on both sides of the bottom; The base plate body (1) is sealed and fixed to the water cooling unit (7), the enclosure (3) and the pin-fin structure (2) are located in the cooling cavity (71), the positions of the two water gaps (4) correspond to the positions of the notches (72) on both sides of the bottom of the cooling cavity (71), and the direction in which the cooling water flows along the water inlet channel and the water outlet channel is in the same direction as the length of the two water gaps (4).

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