Heat dissipation structure of battery pack and battery pack

Abstract

The utility model relates to a heat dissipation structure of a battery pack. The utility model relates to a heat dissipation structure of a battery pack. The heat dissipation structure comprises a shell, the battery core assembly and the power converter are arranged in the shell; the heat dissipation module is provided with a semiconductor refrigeration part, at least part of the semiconductor refrigeration part is arranged in the shell, and the cold end of the semiconductor refrigeration part is in heat conduction connection with the power converter. According to the heat dissipation structure of the battery pack provided by the utility model, the heat dissipation module with the semiconductor refrigeration piece is arranged aiming at the power converter with high temperature rise of part of electronic components, so that heat can be effectively conducted out of the battery pack, and the discharge capacity of the battery pack is ensured; the heat dissipation structure is high in heat dissipation capacity and easy to control and adjust, and the weight and the cost are reduced while the heat dissipation capacity is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, in particular to a heat dissipation structure of a battery pack and the battery pack. Background Art

[0002] With the rapid development of the home energy storage industry, the widespread use of energy storage batteries has become increasingly common. In energy storage batteries, heat dissipation design is typically focused on the battery pack to ensure stable and efficient operation. Traditional battery packs utilize a water-cooled heat dissipation structure to dissipate heat from the battery cells. However, for home energy storage battery packs, due to the low discharge rate during operation, the primary heat dissipation risk does not come from overheating of the battery cells, but rather from the electronic components of converters such as inverters or DC modules. These electronic components are small in size and do not dissipate much heat overall, so they are often overlooked in heat dissipation design. However, these electronic components generate a high power density of heat, leading to localized temperature rises and overheating, which can cause premature termination of battery discharge, limiting discharge depth and affecting discharge capacity. Utility Model Content

[0003] Based on this, the purpose of the present invention is to provide a heat dissipation structure for a battery pack. A heat dissipation module with a semiconductor refrigeration element is set for the power converter where the temperature of some electronic components rises, which can effectively conduct heat out of the battery pack to ensure the discharge capacity of the battery pack.

[0004] A heat dissipation structure for a battery pack, comprising:

[0005] case;

[0006] The battery core assembly and the power converter are arranged in the housing;

[0007] At least one heat dissipation module is provided with a semiconductor refrigeration component, the semiconductor refrigeration component is at least partially provided in the shell, and the cold end thereof is thermally connected to the power converter.

[0008] Furthermore, the heat dissipation module is further provided with a heat dissipation element, which is thermally connected to the hot end of the semiconductor refrigeration element; the heat dissipation element is at least partially provided outside the shell.

[0009] Furthermore, the heat sink is fixedly mounted outside the shell and is thermally connected to the semiconductor refrigeration element through the shell.

[0010] Furthermore, the shell has at least one cutout, which is provided on the top and / or side wall of the shell, the cold end of the semiconductor refrigeration element is provided inside the shell, and the hot end sealing card of the semiconductor refrigeration element is provided at the cutout.

[0011] Furthermore, the heat sink is provided with a plurality of heat dissipation channels, and the air outlet openings of the heat dissipation channels are arranged to face upward.

[0012] Furthermore, the heat dissipation module is further provided with a fan, which is directly opposite to the heat dissipation channel, and the air flow direction of the fan is parallel to the heat dissipation channel.

[0013] Furthermore, the heat dissipation module further includes a heat conducting element provided between the semiconductor refrigeration element and the power converter.

[0014] Furthermore, the semiconductor refrigeration element is connected to the battery core assembly via a wire.

[0015] Furthermore, the heat dissipation structure of the battery pack further includes:

[0016] a control module, disposed in the housing;

[0017] The control module is provided with a main control board and a detection component, wherein the detection component is connected to the main control board by signal so as to transmit a detection signal to the main control board; the main control board is used to generate a control strategy and is connected to the battery cell component by signal so as to control the output current of the battery cell component to the semiconductor refrigeration component;

[0018] The detection component includes a current sensor and a first temperature sensor; the current sensor is used to detect the working current of the semiconductor refrigeration component; the first temperature sensor is used to detect the temperature of the power converter.

[0019] A battery pack includes: a heat dissipation structure of the above-mentioned battery pack, which dissipates heat from a power converter, can achieve efficient heat dissipation while maintaining good sealing performance of the battery pack, and is easy to implement.

[0020] The beneficial effects of the present invention are:

[0021] (1) A heat dissipation structure is provided for the power converter with increased temperature, which can effectively conduct heat out of the battery pack to ensure the discharge capacity of the battery pack;

[0022] (2) For home battery packs with low discharge rates, only the power converter with local temperature rise has heat dissipation requirements. Instead, a simple and lightweight semiconductor refrigeration component is used. It has strong cooling capacity and is easy to control and adjust. While ensuring heat dissipation capacity, it reduces weight and cost. It can effectively avoid the risk of performance redundancy of traditional air-cooled or water-cooled models, and also reduce the risk of coolant overflow due to damage to the water-cooled plate.

[0023] (3) By adopting semiconductor refrigeration components, there is no need to install a fan inside the shell, nor is there any need to increase grille openings, which can meet the requirements of sealing and waterproofing of the battery pack;

[0024] (4) Directly adjusting the cooling capacity by adjusting the current can achieve more precise and effective control, which not only improves the response speed of the refrigeration circuit, but also reduces the energy waste caused by excess cooling capacity.

[0025] In order to better understand and implement the present invention, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 An exploded schematic diagram of a battery pack heat dissipation structure provided in an embodiment of the present application;

[0027] Figure 2 It is a structural diagram of the heat dissipation structure of the battery pack;

[0028] Figure 3 A cross-sectional view of the heat dissipation structure of the battery pack;

[0029] Figure 4 This is a flow chart of the heat dissipation control strategy for the battery pack heat dissipation structure provided in an embodiment of the present application.

[0030] In the figure: 10-housing; 11-cutout; 20-cell assembly; 30-power converter; 40-heat dissipation module; 41-semiconductor refrigeration component; 42-heat conducting component; 43-heat dissipation component; 431-heat dissipation channel; 432-heat sink; 50-control module; 51-main control board; 52-detection assembly; 521-first temperature sensor; 522-second temperature sensor; 523-current sensor. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] In the description of this utility model, it should be noted that the terms "vertical," "upper," "lower," and "horizontal," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] It should also be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, direct connections, connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0034] With the rapid development of the home energy storage industry, the widespread use of energy storage batteries has become increasingly common. In energy storage batteries, heat dissipation is typically designed specifically for the battery pack to ensure stable and efficient operation. Traditional battery packs utilize a water-cooled structure to dissipate heat from the battery cells. However, for home energy storage battery packs, due to the low discharge rate during operation, the primary heat dissipation risk stems not from overheating of the battery cells but from electronic components in power converters such as inverters or DC modules. Localized temperature rise in these electronic components can easily lead to overheating, causing premature termination of battery discharge, thereby limiting discharge depth and affecting discharge capacity.

[0035] In home energy storage systems, factors such as cost, weight, and waterproofing must be strictly controlled. Traditional water-cooling systems are less feasible for these electronic components. An existing, relatively easy-to-implement approach is to use air cooling for the energy storage battery pack, with fans blowing directly onto the power converter. However, this air-cooling method requires the addition of grilles to the battery pack casing to admit fresh air, making it unsuitable for battery packs that require sealing and waterproofing.

[0036] Based on this, an embodiment of the present application provides a heat dissipation structure for a battery pack. A heat dissipation module with a semiconductor refrigeration element is provided for a power converter with a high temperature, which can effectively conduct heat out of the battery pack to ensure the discharge capacity of the battery pack.

[0037] See also Figure 1-3 An embodiment of the present application provides a heat dissipation structure of a battery pack, including: a shell 10, a battery cell assembly 20, a power converter 30, and at least one heat dissipation module 40. The battery cell assembly 20 and the power converter 30 are arranged in the shell 10. The heat dissipation module 40 is used to dissipate heat and cool the power converter 30 to ensure the normal and stable operation of the electronic components in the power converter 30, thereby ensuring the discharge capacitance of the battery pack.

[0038] It is understandable that the power converter 30 may be an inverter or a DC module, and the number of the heat dissipation modules 40 may be determined according to the actual configuration of the power converter 30 and is not further limited here.

[0039] In an embodiment of the present application, the heat dissipation module 40 is provided with a semiconductor refrigeration component 41, which is at least partially arranged in the shell 10, and its cold end is thermally connected to the power converter 30, and directly exchanges heat with the power converter 30. The overall structure is simple, can quickly reduce the temperature of the power converter 30, has strong applicability, and is easy to implement.

[0040] It can be understood that the semiconductor refrigeration element 41, as an NP-type semiconductor refrigeration material, can generate energy transfer after the current is turned on. The current flows from the N-type element to the joint of the P-type element to absorb heat and become the cold end; the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end. It can be conveniently applied to the heat dissipation structure of the battery pack with large space constraints and high reliability requirements.

[0041] In an embodiment of the present application, the semiconductor refrigeration component 41 and the battery cell assembly 20 are connected inside the shell 10 through a wire, so that the battery cell assembly 20 provides working current to the semiconductor refrigeration component 41 to form a refrigeration circuit. This setting can further ensure the sealing performance of the battery pack.

[0042] It should be noted that the heat-conducting connection between the semiconductor refrigeration element 41 and the power converter 30 can be direct contact heat conduction, or a heat conductor 42 can be provided between the semiconductor refrigeration element 41 and the power converter 30, and the heat of the power converter 30 is transferred to the semiconductor refrigeration element 41 through the heat conductor 42, thereby realizing heat exchange between the power converter 30 and the semiconductor refrigeration element 41. Specifically, in some embodiments, the heat conductor 42 can be a heat-conducting polymer material such as a thermal silicone pad or thermal grease, and is provided between the power converter 30 and the semiconductor refrigeration element 41 to increase the heat exchange area between the two. In other embodiments, the heat conductor 42 can also be a high-thermal-conductivity metal that is adapted to the shape of the heat exchange surface of the power converter 30 and the semiconductor refrigeration element 41, such as a heat-dissipating aluminum part, etc., which is not limited here.

[0043] Furthermore, in some embodiments, the heat dissipation module 40 is further provided with a heat sink 43. This heat sink 43 is at least partially located outside the housing 10 and is positioned directly opposite the semiconductor cooling element 41. Heat from the hot end of the semiconductor cooling element 41 is transferred to the heat sink 43 through the housing 10. Heat is then dissipated through the heat sink 43 through heat exchange with the cold air outside the housing 10. In this arrangement, the heat transfer path of the heat dissipation structure is: power converter 30 - heat conductor 42 - semiconductor cooling element 41 (cold end - hot end) - housing 10 - heat sink 43.

[0044] Furthermore, in some embodiments, the hot end of the semiconductor refrigeration element 41 is connected to the inner wall of the shell 10, and the heat sink 43 is fixed to the outer wall of the shell 10, and the heat is conducted to the heat sink 43 through the shell 10. In other embodiments, the semiconductor refrigeration element 41 is arranged inside the shell 10, and one end of the heat sink 43 is arranged inside the shell 10 and is thermally connected to the hot end of the semiconductor refrigeration element 41, and the other end protrudes from the shell 10 and is located outside the shell 10, dissipating heat to the outside of the shell 10. Preferably, the heat sink 43 and the shell 10 are integrated with the shell 10, and the battery pack has a stronger integrity and is also easier to assemble. Furthermore, the heat sink 43 is arranged on the top or side of the shell 10. As the external air heats up and its density decreases, it floats up due to the heat, which is more conducive to the upward flow of hot air and can improve the heat dissipation efficiency of the heat sink 43.

[0045] In other embodiments, the housing 10 defines at least one cutout 11, and a semiconductor cooling element 41 is sealed and secured within the cutout 11. Its cold end is thermally connected to the power converter 30 within the housing 10, and its hot end is thermally connected to a heat sink 43 outside the housing 10 to accelerate heat dissipation. Preferably, the cutout 11 is provided in the top and / or sidewall of the housing 10. In this arrangement, the heat sink 43 is secured to the sidewall or top of the housing 10, further facilitating heat dissipation.

[0046] Furthermore, as an example, in this embodiment, the cutout 11 is provided at the top of the shell 10, and the hot end sealing card of the semiconductor refrigeration component 41 is provided at the cutout 11, so that the heat at its hot end can be further dissipated through the shell 10 to further improve the heat dissipation efficiency.

[0047] Furthermore, in some embodiments, the heat sink 43 is provided with a plurality of heat dissipation channels 431, which increase the heat dissipation area while facilitating the exhaust of hot air. These heat dissipation channels 431 are provided with upward-facing air outlets to facilitate the rapid upward escape of hot air. Positioning the air outlets upward can increase the flow rate of hot air to a certain extent, thereby improving heat dissipation efficiency.

[0048] Specifically, the heat sink 43 includes a plurality of heat sinks 432 arranged at intervals. Heat dissipation channels 431 are formed between adjacent heat sinks 432 , and hot air is discharged through the heat dissipation channels 431 .

[0049] Furthermore, in some embodiments, the heat dissipation module 40 is also provided with a fan to accelerate the heat exchange efficiency of the heat sink 43. Preferably, the fan is directly opposite the heat dissipation channel 431, and its airflow direction is parallel to the heat dissipation channel 431, so as to avoid airflow bypass and affect the airflow rate. It is understood that the fan is used to accelerate the heat exchange rate of the heat sink 43. In some embodiments, the operation of the fan can be controlled according to the ambient temperature. For example, when the ambient temperature is low or the ventilation is good, the fan can be turned off or the fan speed can be reduced.

[0050] See also Figure 1-4 Furthermore, in some embodiments, the heat dissipation structure of the battery pack also includes a control module 50, which is arranged in the shell 10 and is used to control the working state of the semiconductor refrigeration component 41. Specifically, the control module 50 is provided with a main control board 51 and a detection component 52. The detection component 52 is signal-connected to the main control board 51 and feeds back the detection signal to the main control board 51; the main control board 51 is signal-connected to the battery cell assembly 20. After receiving the detection signal, the main control board 51 generates a control strategy to control the output current of the battery cell assembly 20 to the semiconductor refrigeration component 41, thereby controlling the working current of the semiconductor refrigeration component 41 and realizing the control and regulation of the cooling capacity. It can be understood that the main control board 51 can be a BMS board or other control main board, which will not be described in detail here.

[0051] Specifically, detection assembly 52 includes a current sensor 523 and a first temperature sensor 521. First temperature sensor 521 is used to monitor the real-time temperature of heated electronic components in power converter 30, i.e., the monitored electronic components, and feeds this real-time temperature back to main control board 51. Current sensor 523 is used to detect the operating current of semiconductor cooling element 41 and feeds this back to main control board 51. Main control board 51 generates and outputs a control strategy based on the measured real-time temperature of the monitored electronic components, adjusting the operating current of semiconductor cooling element 41 in real time to adjust the cooling capacity.

[0052] Specifically, in this embodiment, the control module 50 adopts a step control strategy to control the working state of the semiconductor refrigeration element 41. The specific control strategy is as follows:

[0053] S1: When the temperature of the monitored electronic component is low, the semiconductor refrigeration element 41 is not started, that is, the working current of the semiconductor refrigeration element 41 is 0;

[0054] S2: When the temperature of the monitored electronic component rises to a certain threshold, the battery core assembly 20 applies current to the semiconductor refrigeration element 41, the refrigeration circuit is opened, and the semiconductor refrigeration element 41 starts cooling;

[0055] S3: When the temperature of the monitored electronic component continues to rise after exceeding the set threshold, the operating current of the semiconductor refrigeration element 41 is linearly increased according to the detected real-time temperature until the maximum power output is reached, thereby increasing the cooling capacity;

[0056] S4: When the temperature of the monitored electronic components is suppressed and dropped, the operating current of the semiconductor refrigeration element 41 is reduced, thereby reducing the refrigeration capacity;

[0057] S5: When the temperature of the monitored electronic component drops below the threshold, the current is disconnected, and the semiconductor refrigeration element 41 stops working.

[0058] Furthermore, in some embodiments, the detection assembly 52 is further provided with a second temperature sensor 522 for detecting the real-time temperature of the battery cell assembly 20. When the temperature of the monitored electronic component is low, the semiconductor cooler 41 is not activated, and the battery cell assembly 20 does not need to provide current to the semiconductor cooler 41. When the first temperature sensor 521 detects that the temperature of the monitored electronic component has risen to a threshold, the battery cell assembly 20 provides current to the semiconductor cooler 41, the refrigeration circuit is connected, and the semiconductor cooler 41 begins to operate. However, at this time, the current is relatively low, and the cooling capacity of the semiconductor cooler 41 is relatively low. As the temperature of the monitored electronic component rises further, the output current of the battery cell assembly 20 increases linearly until the real-time temperature of the battery cell assembly 20 detected by the second temperature sensor 522 reaches the maximum allowable temperature. At this point, the operating current of the semiconductor cooler 41 reaches its maximum, and the refrigeration circuit outputs full power.

[0059] An embodiment of the present application also provides a battery pack that uses the above-mentioned heat dissipation structure to dissipate heat from the power converter, which can achieve efficient heat dissipation while maintaining good sealing performance of the battery pack and is easy to implement.

[0060] Compared with the prior art, the embodiments of the present application have the following advantages:

[0061] (1) A heat dissipation structure is provided for the power converter with increased temperature, which can effectively conduct heat out of the battery pack to ensure the discharge capacity of the battery pack;

[0062] (2) For home battery packs with low discharge rates, only the power converter with local temperature rise has heat dissipation requirements. Instead, a simple and lightweight semiconductor refrigeration component is used. It has strong cooling capacity and is easy to control and adjust. While ensuring heat dissipation capacity, it reduces weight and cost. It can effectively avoid the risk of performance redundancy of traditional air-cooled or water-cooled models, and also reduce the risk of coolant overflow due to damage to the water-cooled plate.

[0063] (3) By adopting semiconductor refrigeration components, there is no need to install a fan inside the shell, nor is there any need to increase grille openings, which can meet the requirements of sealing and waterproofing of the battery pack;

[0064] (4) Directly adjusting the cooling capacity by adjusting the current can achieve more precise and effective control, which not only improves the response speed of the refrigeration circuit, but also reduces the energy waste caused by excess cooling capacity.

[0065] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the concept of the present invention, and the present invention is intended to encompass such modifications and variations.

Claims

1. A heat dissipation structure of a battery pack, characterized in that: include: Housing (10); A battery core assembly (20) and a power converter (30) are arranged in the housing (10); At least one heat dissipation module (40), wherein the heat dissipation module (40) is provided with a semiconductor refrigeration element (41) and a heat dissipation element (43); The semiconductor refrigeration element (41) is at least partially disposed in the housing (10), and its cold end is thermally connected to the power converter (30); The heat sink (43) is thermally connected to the hot end of the semiconductor refrigeration element (41); the heat sink (43) is at least partially disposed outside the shell (10) and is thermally connected to the semiconductor refrigeration element (41) through the shell (10); The shell (10) is provided with at least one cutout (11), the cold end of the semiconductor refrigeration element (41) is arranged inside the shell (10), and the hot end of the semiconductor refrigeration element (41) is sealed and clamped at the cutout (11) and fixedly connected to the heat dissipation element (43).

2. The heat dissipation structure of a battery pack according to claim 1, characterized in that: The heat sink (43) is fixedly arranged outside the housing (10).

3. The heat dissipation structure of a battery pack according to claim 1, characterized in that: The cutout (11) is provided on the top and / or side wall of the housing (10).

4. The heat dissipation structure of a battery pack according to claim 1, characterized in that: The heat dissipation element (43) is provided with a plurality of heat dissipation channels (431), and the air outlet openings of the heat dissipation channels (431) are arranged to face upward.

5. The heat dissipation structure of a battery pack according to claim 4, characterized in that: The heat dissipation module (40) is further provided with a fan, which is directly opposite to the heat dissipation channel (431), and the air flow direction of the fan is parallel to the heat dissipation channel (431).

6. A heat dissipation structure for a battery pack according to any one of claims 1 to 5, characterized in that: The heat dissipation module (40) further includes a heat conducting element (42) provided between the semiconductor refrigeration element (41) and the power converter (30).

7. The heat dissipation structure of a battery pack according to claim 1, characterized in that: The semiconductor refrigeration element (41) is connected to the battery core assembly (20) via a wire.

8. The heat dissipation structure of a battery pack according to claim 7, characterized in that: Also includes: A control module (50) is disposed in the housing (10); The control module (50) is provided with a main control board (51) and a detection component (52), wherein the detection component (52) is signal-connected to the main control board (51) to transmit a detection signal to the main control board (51); the main control board (51) is used to generate a control strategy and is signal-connected to the battery core component (20) to control the output current of the battery core component (20) to the semiconductor refrigeration element (41); The detection component (52) comprises a current sensor (523) and a first temperature sensor (521); the current sensor (523) is used to detect the operating current of the semiconductor refrigeration element (41); and the first temperature sensor (521) is used to detect the temperature of the power converter (30).

9. A battery pack, characterized in that: include: A heat dissipation structure for a battery pack according to any one of claims 1 to 8.

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