Switch backboard heat dissipation structure

Abstract

The utility model relates to the technical field of switch heat dissipation structures, in particular to a switch backboard heat dissipation structure which comprises a heat dissipation shell, a shell upper cover, a heat dissipation fan, an accelerator board, a dustproof net board and a sliding frame. A shell upper cover is arranged above the heat dissipation shell, heat dissipation fans are arranged on the two sides of the interior of the heat dissipation shell, an accelerator board is arranged in the heat dissipation shell, sliding frames are arranged on the two sides of the exterior of the heat dissipation shell, the sliding frames are in sliding connection with the heat dissipation shell, and dustproof net plates are arranged on the inner sides of the sliding frames; according to the utility model, the dustproof net plate can be separated from the heat dissipation housing through a manner of separately arranging the dustproof net, so that an operator can easily take out the dustproof net plate for water washing or cleaning in other manners, the normal use of the heat dissipation function of the switch is ensured, and meanwhile, an active heat dissipation structure is additionally arranged in the heat dissipation housing, so that the heat dissipation efficiency is improved. The heat dissipation capability of the device is enhanced, so that heat generated by the switch can be dissipated more quickly, and long-time normal operation of the switch is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures of switches, in particular to a heat dissipation structure of a backplane of a switch. Background Art

[0002] The backplane of a switch refers to the circuit board inside the switch, which connects all switching modules and interface cards and provides a channel for data transmission between these modules.

[0003] Most existing switches use passive cooling. The dust screen is fixed to the switch casing and is not easy to remove. When the dust screen is blocked, it is difficult to clean the dust screen. At the same time, the switch backplane and the motherboards of other switch functions are often stacked. The heat generated by multiple sets of motherboards is prone to accumulation, and the passive cooling effect is not good.

[0004] Therefore, to address the above problems, a switch backplane heat dissipation structure can be designed, which uses a detachable dust screen to facilitate cleaning by operators, and uses active heat dissipation to increase the heat dissipation capacity of the switch. Utility Model Content

[0005] In order to overcome the problem that most switches use passive cooling, the dust screen is fixed to the switch casing and is not easy to remove. When the dust screen is blocked, it is difficult to clean the dust screen. At the same time, the switch backplane and the motherboards of other functions of the switch are often stacked. The heat generated by multiple sets of motherboards is easy to accumulate, and the passive cooling effect is not good.

[0006] The technical solution of the utility model is: a switch backplane heat dissipation structure, including a heat dissipation shell, a shell upper cover, a heat dissipation fan, an acceleration plate, a dustproof screen and a sliding frame; the shell upper cover is arranged above the heat dissipation shell, the heat dissipation fans are arranged on both sides of the interior of the heat dissipation shell, the acceleration plate is arranged inside the heat dissipation shell, the sliding frames are arranged on both sides of the exterior of the heat dissipation shell, the sliding frames are slidably connected to the heat dissipation shell, and the dustproof screen is arranged on the inner side of the sliding frame.

[0007] Preferably, a cooling fan and a dustproof screen are installed by setting up a cooling shell, and the cooling shell is closed by using the shell cover after the circuit board is installed. The cooling fan creates an air duct in the cooling shell for heat dissipation, the accelerator plate is used to accelerate the flowing air, and the dustproof screen is installed by using the sliding frame to prevent dust from entering the air.

[0008] Preferably, an interface jack is provided on one side of the heat dissipation shell, and a fixing seat is provided on the upper inner side of the heat dissipation shell, with two groups of fixing seats provided; the interface jack facilitates the connection of the switch backplane to the external wires, and the fixing seat facilitates the fixing of the shell cover.

[0009] Preferably, two sets of fixing holes are opened on one side of the upper cover of the shell, and fixing screws are set in the fixing holes, and the fixing screws are threadedly connected to the fixing seat; the fixing screws are conveniently passed through the upper cover of the shell through the fixing holes to fix the upper cover of the shell to the heat dissipation shell.

[0010] Preferably, the cooling fan is divided into two parts: one for intake and the other for exhaust. The intake fan is located on one side of the cooling shell, and the other for exhaust. An air flow duct is created in the cooling shell through the intake and exhaust fans, allowing air to flow quickly.

[0011] Preferably, the acceleration plate is located at the outlet side of the cooling fan for air intake, and a plurality of acceleration rings are provided on the inner side of the acceleration plate; the circulating air can be further accelerated by the acceleration rings to increase the heat dissipation capacity.

[0012] Preferably, sliding grooves are provided on both sides of the heat dissipation housing, and the width of the sliding grooves is consistent with the width of the sliding frame; the sliding frame is installed through the sliding grooves, and the sliding of the sliding frame is limited.

[0013] Preferably, the sliding frame is located inside the sliding groove, and pulling plates are provided at both ends of the sliding frame, which extend beyond one end of the heat dissipation housing. The pulling plates facilitate the operator to exert force to pull out the sliding frame.

[0014] Beneficial effects of the utility model:

[0015] 1. Compared with traditional switches that mostly use passive cooling, the dust screen is fixed to the switch casing and is not easy to remove. When the dust screen is blocked, it is difficult to clean the dust screen. At the same time, the switch backplane and the motherboards of other functions of the switch are often stacked. The heat generated by multiple sets of motherboards is easy to accumulate, and the passive cooling effect is not good. This device separates the dust screen by setting it separately, so that the dust screen plate can be separated from the heat dissipation casing, so that the operator can easily remove the dust screen plate for water washing or other cleaning methods, ensuring the normal use of the switch's heat dissipation function. At the same time, an active heat dissipation structure is added inside the heat dissipation casing to enhance the heat dissipation capacity of the device, so that the heat generated by the switch can be dissipated more quickly, ensuring the long-term normal operation of the switch;

[0016] 2. When cleaning is required, grab the pull plate and pull it to pull the sliding frame out of the heat sink housing, thereby separating the dust screen from the heat sink housing. After washing the dust screen with water or other cleaning methods, align the sliding frame with the sliding slot and insert the sliding frame into the heat sink housing to complete the cleaning of the dust screen. This solves the problem that most switches use passive cooling, the dust screen is fixed to the switch housing and is not easy to remove. When the dust screen is blocked, it is difficult to clean the dust screen. At the same time, the switch backplane and the motherboards of other functions of the switch are often stacked. The heat generated by multiple sets of motherboards is easy to accumulate, and the passive cooling effect is poor.

[0017] 3. When the switch is in use, the fixing screws in the fixing holes are threadedly connected to the fixing base to fix the upper cover of the shell to the heat dissipation shell, making the heat dissipation shell closed. The interface jack facilitates the connection of external wires to the back panel of the switch. The cooling fans on both sides rotate, driving air to flow in the heat dissipation shell. When the air flows through the accelerator board, it enters the acceleration ring through the reserved holes of the accelerator board. The acceleration ring is hollow, and the diameters on both sides of the acceleration ring are inconsistent. The air enters the acceleration ring from the side with a larger diameter and flows out from the side with a smaller diameter. In this process, the air flow rate will be increased, forming a high-speed air duct in the heat dissipation shell, quickly taking away the heat generated by the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic diagram of the three-dimensional structure of a switch backplane heat dissipation structure of the present invention;

[0019] Figure 2 Shown is a schematic diagram of the three-dimensional structure of the heat dissipation shell of a switch backplane heat dissipation structure of the present invention;

[0020] Figure 3 Shown is a schematic diagram of the three-dimensional structure of a heat dissipation fan of a switch backplane heat dissipation structure of the present invention;

[0021] Figure 4 Shown is a schematic diagram of the three-dimensional structure of a sliding frame of a switch backplane heat dissipation structure of the present invention.

[0022] Explanation of the accompanying drawings: 1. Heat dissipation housing; 101. Interface jack; 102. Fixing seat; 103. Sliding slot; 2. Housing cover; 201. Fixing hole; 202. Fixing screw; 3. Cooling fan; 4. Acceleration plate; 401. Acceleration ring; 5. Dustproof screen; 6. Sliding frame; 601. Pulling plate. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] See also Figure 1The utility model provides an embodiment: a switch backplane heat dissipation structure, including a heat dissipation shell 1, a shell upper cover 2, a heat dissipation fan 3, an acceleration plate 4, a dustproof screen plate 5 and a sliding frame 6; the shell upper cover 2 is provided above the heat dissipation shell 1, the heat dissipation shell 1 is provided with heat dissipation fans 3 on both sides, the heat dissipation shell 1 is provided with an acceleration plate 4, the heat dissipation shell 1 is provided with sliding frames 6 on both sides of the outside, the sliding frame 6 is slidably connected to the heat dissipation shell 1, and the inner side of the sliding frame 6 is provided with a dustproof screen plate 5.

[0025] See also Figure 2 In this embodiment, an interface jack 101 is provided on one side of the heat dissipation housing 1, and a fixing seat 102 is provided on the upper inner side of the heat dissipation housing 1. Two groups of fixing seats 102 are provided. The interface jack 101 facilitates the connection of the switch backplane to the external wire, and the fixing seat 102 facilitates the fixing of the housing cover 2. Two groups of fixing holes 201 are opened on one side of the housing cover 2. Fixing screws 202 are provided in the fixing holes 201. The fixing screws 202 are threadedly connected to the fixing seat 102. The fixing screws 202 pass through the fixing holes 201 to fix the housing cover 2 to the heat dissipation housing 1.

[0026] See also Figure 3 In this embodiment, the cooling fan 3 is divided into air intake and air discharge to the cooling shell 1. The cooling fan 3 for air intake is located on one side of the cooling shell 1, and the cooling fan 3 for air discharge is located on the other side of the cooling shell 1. The cooling fans 3 for air intake and air discharge create an air flow duct in the cooling shell 1 to allow air to flow quickly. The acceleration plate 4 is located on the air outlet side of the cooling fan 3 for air intake. A plurality of acceleration rings 401 are provided on the inner side of the acceleration plate 4. The circulating air can be further accelerated by the acceleration rings 401 to increase the heat dissipation capacity. Sliding grooves 103 are provided on both sides of the cooling shell 1. The width of the sliding grooves 103 is consistent with the width of the sliding frame 6. The sliding frame 6 is installed through the sliding grooves 103, and the sliding of the sliding frame 6 is limited.

[0027] See also Figure 4 In this embodiment, the sliding frame 6 is located inside the sliding groove 103, and pulling plates 601 are provided at both ends of the sliding frame 6. The pulling plates 601 extend beyond one end of the heat dissipation housing 1; the pulling plates 601 facilitate the operator to pull out the sliding frame 6.

[0028] When the switch is in use, the fixing screws 202 in the fixing holes 201 are threadedly connected to the fixing bases 102, fixing the housing cover 2 to the heat dissipation housing 1 so that the heat dissipation housing 1 is closed. The interface jacks 101 facilitate connection of external wires to the switch backplane. The heat dissipation fans 3 on both sides rotate, driving air to flow in the heat dissipation housing 1. When the air flows through the accelerator plate 4, it enters the acceleration ring 401 through the reserved holes of the accelerator plate 4. The acceleration ring 401 is hollow, and the diameters of the two sides of the acceleration ring 401 are inconsistent. The air enters the acceleration ring 401 from the side with the larger diameter and flows out from the side with the smaller diameter. In this process, the air flow rate is increased, so that a high-speed air duct is formed in the heat dissipation housing 1, which quickly removes the heat generated by the motherboard.

[0029] When cleaning is required, grab the pulling plate 601 by hand and pull it to pull the sliding frame 6 out of the heat dissipation housing 1, thereby separating the dustproof screen plate 5 from the heat dissipation housing 1. After washing the dustproof screen plate 5 with water or other cleaning methods, align the sliding frame 6 with the sliding groove 103 and insert the sliding frame 6 into the heat dissipation housing 1 to complete the cleaning of the dustproof screen plate 5.

[0030] Through the above steps, the heat dissipation shell 1 is set up to install the heat dissipation fan 3 and the dustproof screen 5, the heat dissipation shell 1 is closed by using the shell cover 2 after the circuit board is installed, the heat dissipation fan 3 is used to create an air duct in the heat dissipation shell 1 for heat dissipation, the acceleration plate 4 is used to accelerate the flowing air, and the dustproof screen 5 is installed using the sliding frame 6 to prevent dust from entering the air.

[0031] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the purpose of the present invention.

Claims

1. A switch backplane heat dissipation structure, comprising a heat dissipation housing (1); characterized in that: The invention also comprises an outer shell cover (2), a heat dissipation fan (3), an acceleration plate (4), a dustproof screen plate (5) and a sliding frame (6); the outer shell cover (2) is arranged above the heat dissipation outer shell (1), the heat dissipation fan (3) is arranged on both sides of the inner part of the heat dissipation outer shell (1), the acceleration plate (4) is arranged on the inner part of the heat dissipation outer shell (1), the sliding frame (6) is arranged on both sides of the outer part of the heat dissipation outer shell (1), the sliding frame (6) is slidably connected to the heat dissipation outer shell (1), and the dustproof screen plate (5) is arranged on the inner side of the sliding frame (6).

2. The switch backplane heat dissipation structure according to claim 1, characterized in that: An interface jack (101) is provided on one side of the heat dissipation housing (1), and a fixing seat (102) is provided on the upper inner side of the heat dissipation housing (1), wherein two groups of the fixing seats (102) are provided.

3. The switch backplane heat dissipation structure according to claim 2, characterized in that: Two groups of fixing holes (201) are provided on one side of the housing upper cover (2), fixing screws (202) are provided in the fixing holes (201), and the fixing screws (202) are threadedly connected to the fixing seat (102).

4. The switch backplane heat dissipation structure according to claim 2, characterized in that: The cooling fan (3) is divided into a cooling fan (3) for taking air into the cooling housing (1) and a cooling fan (3) for discharging air into the cooling housing (1). The cooling fan (3) for taking air in is located on one side of the cooling housing (1), and the cooling fan (3) for discharging air is located on the other side of the cooling housing (1).

5. The switch backplane heat dissipation structure according to claim 2, characterized in that: The acceleration plate (4) is located at the air outlet side of the air inlet cooling fan (3), and a plurality of acceleration rings (401) are provided on the inner side of the acceleration plate (4).

6. The switch backplane heat dissipation structure according to claim 2, characterized in that: Sliding grooves (103) are provided on both sides of the heat dissipation housing (1), and the width of the sliding grooves (103) is consistent with the width of the sliding frame (6).

7. The switch backplane heat dissipation structure according to claim 6, characterized in that: The sliding frame (6) is located inside the sliding groove (103), and pulling plates (601) are provided at both ends of the sliding frame (6), and the pulling plates (601) extend out of the heat dissipation housing (1) by a certain distance.

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