Internet of Things switch with efficient heat dissipation

Abstract

The utility model discloses an Internet of Things switch with efficient heat dissipation, and belongs to the technical field of switches. The switch mainly comprises a switch shell, a ventilation mechanism and a cooling mechanism, a plurality of line interfaces are formed in one side of the switch shell, heat dissipation holes and air inlet holes are formed in the two sides of the switch shell respectively, the ventilation mechanism is installed on one side of the air inlet holes, and the ventilation mechanism comprises a ventilation shell installed on one side of the switch shell. According to the Internet of Things switch with the efficient heat dissipation function, the cooling mechanism is arranged on one side of the ventilation mechanism, cooling water in the refrigeration box can circularly flow in the heat exchange pipe through the water pump, and the heat exchange pipe is located on the ventilation path, so that external hot air can make full contact with the heat exchange pipe; the heat in the hot air is transferred to the cooling water through heat exchange, so that the hot air is cooled, the low-temperature air flows in the exchanger shell, the efficient heat dissipation effect is achieved, and the stability and reliability of equipment operation are ensured.

Description

Technical Field

[0001] The present application relates to the field of switch technology, and in particular to an Internet of Things switch with efficient heat dissipation. Background Art

[0002] An IoT switch is a form of switch used in the IoT field. It is specifically designed to connect IoT devices, enabling interoperability and fast, accurate data transmission. IoT switches offer robust device access capabilities and support multiple interfaces and protocols, enabling access to a wide range of IoT devices, such as sensors, actuators, and controllers. These devices form a unified network through the IoT switch, enabling data sharing and collaborative operation. Switches generate heat during use. Failure to dissipate this heat can damage the switch's internal components, impacting the switch's proper operation.

[0003] Chinese patent authorization announcement number: CN221709880U discloses an IoT switch with efficient heat dissipation. This solution is achieved by opening a dustproof plate on one side of the shell, and installing a micro fan at a place on the dustproof plate to blow external air into the shell, and providing an air outlet on the side away from the dustproof plate, so that air convection is formed between the inside and outside of the shell, and a spoiler is provided in the shell to disperse the air, which is conducive to uniform air flow in the shell.

[0004] In the above solution, a micro fan is provided to blow external air into the switch housing, so that air convection is formed between the inside and outside of the housing to achieve the purpose of heat dissipation of the switch. However, when the ambient temperature of the switch is too high, especially in the hot summer, the hot air from the outside is blown into the switch housing. The hot air itself carries a lot of heat and cannot effectively remove the heat generated inside the switch. Instead, it may aggravate the increase in internal temperature, resulting in unsatisfactory heat dissipation effect.

[0005] Therefore, it is necessary to provide an IoT switch with efficient heat dissipation to solve the above problems.

[0006] It should be noted that the above information disclosed in this Background section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute prior art. Utility Model Content

[0007] Based on the above-mentioned problems existing in the prior art, the problem to be solved by this application is: to provide an Internet of Things switch with efficient heat dissipation. By arranging a cooling mechanism on one side of the ventilation mechanism, a water pump can be used to circulate the cooling water in the refrigeration box in the heat exchange tube. The heat exchange tube is located on the ventilation path, so that the external hot air can fully contact the heat exchange tube. The heat in the hot air is transferred to the cooling water through heat exchange, thereby realizing the cooling of the hot air and making the air with lower temperature flow in the switch casing, which has the effect of efficient heat dissipation and ensures the stability and reliability of the equipment operation.

[0008] The technical solution adopted by the present application to solve its technical problems is: an Internet of Things switch with efficient heat dissipation, comprising: a switch housing, a ventilation mechanism and a cooling mechanism, a plurality of line interfaces being provided on one side of the switch housing, and heat dissipation holes and air inlet holes being provided on both sides of the switch housing, the ventilation mechanism being installed on one side of the air inlet hole, the ventilation mechanism comprising a ventilation housing installed on one side of the switch housing, a plurality of fan slots being provided on one side of the ventilation housing, a first fan being installed in each of the plurality of fan slots, the cooling mechanism comprising a refrigeration box and a heat exchange pipe, the refrigeration box being installed on one side of the ventilation housing, the heat exchange pipe being located in the ventilation housing, and both ends of the heat exchange pipe being connected to the refrigeration box, a semiconductor refrigeration plate being installed on one side of the refrigeration box; wherein a water pump connected to the heat exchange pipe is also installed in the refrigeration box.

[0009] Furthermore, the heat exchange tube passes through the ventilation shell and is arranged in a snake shape inside the ventilation shell.

[0010] Furthermore, a plurality of mounting rings are installed on the inner side wall of the ventilation shell, and the heat exchange tubes are fixed to the interior of the ventilation shell through the mounting rings.

[0011] Furthermore, a moisture absorbing net is installed in the ventilation shell and on one side of the heat exchange tube.

[0012] Furthermore, a dustproof net is installed on the inner side wall of the ventilation housing, and the dustproof net covers one side of the plurality of fan slots.

[0013] Furthermore, the cooling mechanism also includes an L-shaped plate, the L-shaped plate is installed on one side of the ventilation shell, and the refrigeration box is installed on the top of the L-shaped plate.

[0014] Furthermore, a mounting hole is provided on one side of the L-shaped plate, and the mounting hole is located on one side of the semiconductor refrigeration plate.

[0015] Furthermore, a second fan is installed in the installation hole.

[0016] The beneficial effects of the present application are as follows: the present application provides an Internet of Things switch with efficient heat dissipation, in which a cooling mechanism is provided on one side of the ventilation mechanism, and a water pump is used to circulate the cooling water in the refrigeration box in the heat exchange tube. The heat exchange tube is located on the ventilation path, so that the external hot air can fully contact the heat exchange tube, and the heat in the hot air is transferred to the cooling water through heat exchange, thereby realizing the cooling of the hot air, and allowing the air with lower temperature to flow in the switch casing, which has the effect of efficient heat dissipation and ensures the stability and reliability of the equipment operation.

[0017] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail below with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings in the specification, which constitute a part of this application, are used to provide further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute improper limitations on this application.

[0019] In the attached figure:

[0020] Figure 1 Schematic diagram of the first overall structure;

[0021] Figure 2 is a schematic diagram of the second overall structure;

[0022] Figure 3 is a schematic diagram of the third overall structure;

[0023] Figure 4 It is a structural diagram of the ventilation mechanism;

[0024] Figure 5 Schematic diagram of the cooling mechanism.

[0025] Among them, the reference numerals in the figures are:

[0026] 1. Switch housing; 2. Line interface; 3. Ventilation mechanism; 31. Ventilation housing; 32. Fan slot; 33. First fan; 34. Mounting ring; 35. Moisture-absorbing net; 36. Dust-proof net; 4. Cooling mechanism; 41. L-shaped plate; 42. Refrigeration box; 43. Semiconductor refrigeration plate; 44. Second fan; 45. Heat exchange tube; 5. Heat dissipation hole; 6. Air inlet. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0029] like Figure 1-5 As shown, the present application provides an Internet of Things switch with efficient heat dissipation, including: a switch housing 1, a ventilation mechanism 3 and a cooling mechanism 4. Multiple line interfaces 2 are opened on one side of the switch housing 1, which are mainly used to connect various Internet of Things devices, such as sensors, actuators, controllers, etc. These devices form a unified network through the Internet of Things switch to achieve data sharing and collaborative work, and heat dissipation holes 5 and air inlet holes 6 are respectively provided on both sides of the switch housing 1. The ventilation mechanism 3 is installed on one side of the air inlet hole 6. The ventilation mechanism 3 includes a ventilation housing 31 installed on one side of the switch housing 1. The ventilation housing 31 is fixed to one side of the switch housing 1 by bolts. A plurality of fan slots 32 are provided on one side of the ventilation housing 31, and a first fan 33 is installed in each of the plurality of fan slots 32. The cooling mechanism 4 includes a refrigeration box 42 and a heat exchange pipe 45. The refrigeration box 42 is installed on one side of the ventilation housing 31. The heat exchange pipe 45 is located in the ventilation housing 31, and both ends of the heat exchange pipe 45 are connected to the refrigeration box 42. A semiconductor refrigeration plate 43 is installed on one side of the refrigeration box 42. The cooling end of the semiconductor refrigeration plate 43 is located in the refrigeration box 42, and the cooling end of the semiconductor refrigeration plate 43 is located outside the refrigeration box 42. A water pump connected to the heat exchange pipe 45 is also installed in the refrigeration box 42 to achieve the purpose of circulating cooling water in the heat exchange pipe 45.

[0030] In this embodiment, this solution is a device for connecting IoT devices, which can achieve interconnection between devices and fast and accurate data transmission. By providing a ventilation mechanism 3, a first fan 33 is used to blow external air into the switch housing 1 through the air inlet 6, and the air is then discharged through the heat dissipation holes 5, thereby forming air convection between the inside and outside of the switch housing 1, achieving a heat dissipation effect;

[0031] Among them, by arranging a cooling mechanism 4 on one side of the ventilation mechanism 3, the cooling water in the refrigeration box 42 can be circulated in the heat exchange tube 45 by using a water pump. The heat exchange tube 45 is located on the ventilation path, so that the external hot air can fully contact the heat exchange tube 45. The heat in the hot air is transferred to the cooling water through heat exchange, thereby realizing the cooling of the hot air, and making the air with lower temperature flow in the switch housing 1, which has the effect of efficient heat dissipation and ensures the stability and reliability of the equipment operation.

[0032] It should be noted that the cooling water gradually heats up during the circulation process and eventually flows back into the refrigeration box 42 , where it is re-cooled by the semiconductor refrigeration sheet 43 in preparation for the next circulation.

[0033] like Figure 4 As shown, the heat exchange pipe 45 passes through the ventilation shell 31 and is arranged in a snake shape inside the ventilation shell 31.

[0034] In this embodiment, the heat exchange tube 45 is arranged in a serpentine shape, so that the contact area between the external air and the heat exchange tube 45 is increased, thereby improving the heat dissipation effect.

[0035] like Figure 4 As shown, a plurality of mounting rings 34 are further installed on the inner side wall of the ventilation shell 31 , and the heat exchange tubes 45 are fixed to the interior of the ventilation shell 31 through the mounting rings 34 .

[0036] like Figure 4 As shown, a moisture absorbing net 35 is installed in the ventilation shell 31 and on one side of the heat exchange tube 45.

[0037] In this embodiment, the moisture-absorbing net 35 can dry the air introduced into the switch housing 1, reducing the probability of moisture damaging the electronic components inside the switch housing 1.

[0038] The moisture absorbing net 35 may use a desiccant as the moisture absorbing material.

[0039] like Figure 5 As shown, a dustproof net 36 is installed on the inner wall of the ventilation housing 31 , and the dustproof net 36 covers one side of the plurality of fan slots 32 .

[0040] In this embodiment, the dustproof net 36 can filter the air introduced into the switch housing 1 to remove impurities such as dust.

[0041] It should be noted that the air introduced into the switch housing 1 is first filtered through the dustproof net 36, and then exchanges heat with the heat exchange tube 45. After the hot air is cooled, it is dried by the moisture-absorbing net 35 and discharged into the switch housing 1, and finally discharged through the heat dissipation hole 5.

[0042] like Figure 1-5 As shown, the cooling mechanism 4 also includes an L-shaped plate 41, which is installed on one side of the ventilation shell 31. The L-shaped plate 41 is fixed to one side of the ventilation shell 31 by means of bolts. The refrigeration box 42 is installed on the top of the L-shaped plate 41. A mounting hole is opened on one side of the L-shaped plate 41. The mounting hole is located on one side of the semiconductor refrigeration plate 43, and a second fan 44 is installed in the mounting hole.

[0043] In this embodiment, when the semiconductor refrigeration plate 43 cools the liquid in the refrigeration box 42, a large amount of heat is generated at its hot end. The second fan 44 is provided to quickly dissipate the generated heat, thereby improving the cooling effect of the semiconductor refrigeration plate 43 and thus improving the overall heat dissipation effect of the switch housing 1.

[0044] Working principle:

[0045] By utilizing the first fan 33 to blow external air into the switch housing 1 through the air inlet 6, the gas is then discharged through the heat dissipation holes 5, thereby forming air convection between the inside and outside of the switch housing 1 to achieve a heat dissipation effect. In addition, a cooling mechanism 4 is provided on one side of the ventilation mechanism 3. The cooling water in the refrigeration box 42 can be circulated in the heat exchange tube 45 by utilizing a water pump. The heat exchange tube 45 is located on the ventilation path, so that the external hot air can fully contact the heat exchange tube 45. The heat in the hot air is transferred to the cooling water through heat exchange, thereby achieving cooling of the hot air and allowing air with a lower temperature to flow in the switch housing 1, which has an efficient heat dissipation effect and ensures the stability and reliability of the equipment operation.

[0046] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. An IoT switch with efficient heat dissipation, characterized by: include: A switch housing (1), wherein a plurality of line interfaces (2) are provided on one side of the switch housing (1), and heat dissipation holes (5) and air inlet holes (6) are respectively provided on two sides of the switch housing (1); A ventilation mechanism (3), the ventilation mechanism (3) being mounted on one side of the air inlet hole (6), the ventilation mechanism (3) comprising a ventilation housing (31) mounted on one side of the switch housing (1), the ventilation housing (31) being provided with a plurality of fan slots (32) on one side, and a first fan (33) being mounted in each of the plurality of fan slots (32); A cooling mechanism (4), the cooling mechanism (4) comprising a refrigeration box (42) and a heat exchange tube (45), the refrigeration box (42) being mounted on one side of the ventilation housing (31), the heat exchange tube (45) being located inside the ventilation housing (31), and both ends of the heat exchange tube (45) being connected to the refrigeration box (42), and a semiconductor refrigeration plate (43) being mounted on one side of the refrigeration box (42); Wherein, a water pump connected to the heat exchange pipe (45) is also installed in the refrigeration box (42).

2. The IoT switch with efficient heat dissipation according to claim 1, characterized in that: The heat exchange tube (45) passes through the ventilation shell (31) and is arranged in a snake shape inside the ventilation shell (31).

3. The IoT switch with efficient heat dissipation according to claim 1, characterized in that: The inner side wall of the ventilation shell (31) is further provided with a plurality of mounting rings (34), and the heat exchange tube (45) is fixed to the interior of the ventilation shell (31) via the mounting rings (34).

4. The IoT switch with efficient heat dissipation according to claim 1, characterized in that: A moisture absorbing net (35) is installed in the ventilation shell (31) and on one side of the heat exchange tube (45).

5. The IoT switch with efficient heat dissipation according to claim 1, characterized in that: A dustproof net (36) is installed on the inner side wall of the ventilation housing (31), and the dustproof net (36) covers one side of the plurality of fan slots (32).

6. The IoT switch with efficient heat dissipation according to claim 1, characterized in that: The cooling mechanism (4) further comprises an L-shaped plate (41), wherein the L-shaped plate (41) is mounted on one side of the ventilation housing (31), and the refrigeration box (42) is mounted on the top of the L-shaped plate (41).

7. The IoT switch with efficient heat dissipation according to claim 6, characterized in that: A mounting hole is provided on one side of the L-shaped plate (41), and the mounting hole is located on one side of the semiconductor refrigeration plate (43).

8. The IoT switch with efficient heat dissipation according to claim 7, characterized in that: A second fan (44) is installed in the installation hole.

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