Light source module and lighting device

Abstract

The embodiment of the utility model provides a light source module and a lighting device, a plurality of ceramic substrates of the light source module are tiled and connected to a copper substrate at intervals through heat conduction bonding pads, and the surface, away from the copper substrate, of each ceramic substrate is provided with a positive electrode and a negative electrode. In any two adjacent ceramic substrates, the positive electrode of one ceramic substrate is connected with the negative electrode of the other ceramic substrate through a gold wire, the surface, deviating from the copper substrate, of each ceramic substrate is connected with one or more LED light-emitting chips, heat of the LED light-emitting chips can be transmitted to the copper substrate through the ceramic substrates, the heat conductivity of the copper substrate is high, and the heat conductivity of the copper substrate is high. Heat generated by the LED light-emitting chip can be quickly dissipated to surrounding air or other structures, the working temperature is effectively reduced, and the service life of the LED light-emitting chip is prolonged. In addition, electrical connection is optimized, complex wiring design is avoided, the assembling process is simplified, the stability and reliability of electrical connection are improved, and the ceramic substrate and the LED light-emitting chips on the ceramic substrate can conveniently form a small module light source.

Description

Technical Field

[0001] The present application relates to the field of lighting technology, and in particular to a light source module and a lighting device. Background Art

[0002] With the development of LED technology, its high energy efficiency and long life have made it widely used in photography, stage lighting, and general lighting. However, if the heat generated by LEDs during operation cannot be dissipated promptly and effectively, it will seriously affect the lighting efficiency and life of the LEDs.

[0003] Currently, the common heat dissipation method used in high-power photography lights, stage lights, and general lighting is to mount the light source on a heat sink and equip it with a fan or water circulation system. To produce a higher-power light source, while maintaining the same thermal resistance, the heat sink area must be increased, a more powerful fan must be added, or a faster water circulation system must be used. This increases the cost and size of the light source. Therefore, designing an efficient heat dissipation solution is crucial to improving the performance of LED light sources. Utility Model Content

[0004] The embodiments of the present application provide a light source module and a lighting device to solve the above-mentioned technical problems.

[0005] The embodiments of the present application achieve the above-mentioned objectives through the following technical solutions.

[0006] An embodiment of the present application provides a light source module, which includes a copper substrate, multiple ceramic substrates and multiple LED light-emitting chips. The multiple ceramic substrates are flat and spaced apart and connected to the copper substrate through thermal conductive pads. A positive electrode and a negative electrode are provided on the surface of each ceramic substrate facing away from the copper substrate. The positive electrode of one of any two adjacent ceramic substrates and the negative electrode of the other ceramic substrate are connected by gold wire. One or more LED light-emitting chips are connected to the surface of each ceramic substrate facing away from the copper substrate.

[0007] In some embodiments, the positive electrode of one of at least two adjacent ceramic substrates is electrically connected to the negative electrode of the other ceramic substrate directly through a gold wire.

[0008] In some embodiments, the light source module also includes a conductive member, which is located between two adjacent ceramic substrates. A conductive member is arranged between at least two adjacent ceramic substrates, and the positive electrode of at least one of the two adjacent ceramic substrates and the negative electrode of the other ceramic substrate are electrically connected to the conductive member between the two adjacent ceramic substrates through a gold wire.

[0009] In some embodiments, the copper substrate is provided with a plurality of grooves, and a surface of each ceramic substrate facing away from the light-emitting chip is located in a corresponding groove.

[0010] In some embodiments, the light source module further includes a conductive member located between two adjacent ceramic substrates and outside the groove, and the electrode between the two adjacent ceramic substrates is electrically connected to the conductive member between the two adjacent ceramic substrates through a gold wire.

[0011] In some embodiments, the light source module further includes an insulating heat-conducting layer, which fills a gap between the ceramic substrate and the copper substrate.

[0012] In some embodiments, the copper substrate is provided with a plurality of bosses, and each ceramic substrate is disposed on a corresponding boss.

[0013] In some embodiments, the light source module further includes a conductive member located between two adjacent ceramic substrates and outside the boss, and the electrode between the two adjacent ceramic substrates is electrically connected to the conductive member between the two adjacent ceramic substrates through a gold wire.

[0014] In some embodiments, the light source module further includes a thermal pad, which is disposed on the surface of the ceramic substrate facing the copper substrate, and covers more than 90% of the area of ​​the surface of the ceramic substrate facing the copper substrate.

[0015] An embodiment of the present application provides a lighting device, which includes a housing and a light source module according to any one of the above embodiments, wherein the light source module is assembled in the housing.

[0016] In the light source module and lighting device provided in any of the above embodiments of the present application, multiple ceramic substrates of the light source module are flatly and spaced apart and connected to the copper substrate through thermal conductive pads. A positive electrode and a negative electrode are provided on the surface of each ceramic substrate facing away from the copper substrate. The positive electrode of one of any two adjacent ceramic substrates and the negative electrode of the other ceramic substrate are connected by gold wire. One or more LED light-emitting chips are connected to the surface of each ceramic substrate facing away from the copper substrate. The heat of the LED light-emitting chip can be transferred to the copper substrate through the ceramic substrate. The thermal conductivity of the copper substrate is relatively high, and it can quickly dissipate the heat generated by the LED light-emitting chip to the surrounding air or other structures, effectively reducing the operating temperature, extending the service life of the LED light-emitting chip, and helping to maintain the stability and reliability of the light source module. Moreover, since the positive electrode and the negative electrode are located on the same surface of the ceramic substrate, the contact area between the ceramic substrate and the copper substrate can be increased compared to the double-sided electrode solution in the prior art, thereby helping to improve the heat dissipation effect of the LED light-emitting chip. Since the electrodes between any two adjacent ceramic substrates are connected by gold wires, it helps to optimize the electrical connection, avoid complex routing design, simplify the assembly process, and improve the stability and reliability of the electrical connection. It also makes it easier for the ceramic substrate and the LED light-emitting chip thereon to form a small module light source, so that the number of ceramic substrates and LED light-emitting chips can be flexibly increased or decreased according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A partial structural schematic diagram of a light source module provided in some embodiments of the present application is illustrated.

[0019] Figure 2 Example Figure 1 A schematic cross-sectional structural diagram of a light source module of an embodiment.

[0020] Figure 3 Schematic diagrams illustrating some structures of light source modules provided in other embodiments of the present application.

[0021] Figure 4 Example Figure 3 A schematic cross-sectional structural diagram of a light source module of an embodiment.

[0022] Figure 5 Schematic diagrams of partial structures of light source modules provided in some further embodiments of the present application are illustrated.

[0023] Figure 6 A partial structural schematic diagram of a copper substrate of a light source module provided in some embodiments of the present application is illustrated.

[0024] Figure 7 Schematic diagrams of the cross-sectional structures of light source modules provided in other embodiments of the present application are illustrated.

[0025] Figure 8 Schematic diagrams of the cross-sectional structures of light source modules provided in some further embodiments of the present application are illustrated.

[0026] Figure 9 Example Figure 1 A partial structural diagram of a light source module provided in an embodiment.

[0027] Figure 10 Example Figure 9 A structural schematic diagram of a light source module from another perspective provided in an embodiment. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0029] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0030] See Figures 1 to 2 The embodiment of the present application provides a light source module 100, which includes a copper substrate 10, multiple ceramic substrates 20, and multiple LED light-emitting chips 30. The ceramic substrate 20 is connected to the copper substrate 10, and the LED light-emitting chips 30 are connected to the ceramic substrate 20. In this way, the heat of the LED light-emitting chips 30 can be transferred to the copper substrate 10 through the ceramic substrate 20. The copper substrate 10 has a high thermal conductivity and can quickly dissipate the heat generated by the LED light-emitting chips 30 to the surrounding air or other structures, effectively reducing the operating temperature of the LED light-emitting chips 30, extending the service life of the LED light-emitting chips 30, and helping to maintain the stability and reliability of the operation of the light source module 100.

[0031] In the present invention, the term "plurality" means greater than or equal to two. For example, the number of ceramic substrates 20 can be two, three, four, five, or other numbers. For example, the number of LED chips 30 can be two, three, four, five, or other numbers.

[0032] In some embodiments, multiple ceramic substrates 20 are laid flat and spaced apart and connected to a copper substrate 10 via thermally conductive pads 60. Each ceramic substrate 20 has an electrode 21 (e.g., a positive electrode 211 and a negative electrode 212) on its surface facing away from the copper substrate 10. The positive electrode 211 of one of any two adjacent ceramic substrates 20 is connected to the negative electrode 212 of the other ceramic substrate 20 via a gold wire 40. Each ceramic substrate 20 has one or more LED light-emitting chips 30 connected to its surface facing away from the copper substrate 10. Thus, because the positive electrode 211 and the negative electrode 212 are located on the same surface of the ceramic substrate 20, the contact area between the ceramic substrate 20 and the copper substrate 10 can be increased compared to the double-sided electrode solution in the prior art, thereby helping to improve the heat dissipation effect on the LED light-emitting chip 30 and facilitate more uniform heat dissipation of the LED light-emitting chip 30.

[0033] In addition, due to the small heat dissipation area of ​​a single LED light-emitting chip in the prior art, the operating power cannot be set too high, and in order to improve the heat dissipation effect, the LED light-emitting chips in the prior art are also arranged densely. However, the embodiment of the present application significantly improves the operating power of a single LED light-emitting chip 30 by optimizing the heat dissipation design of the LED light-emitting chip 30. This makes it possible to arrange the LED light-emitting chips 30 more closely without sacrificing reliability and lifespan, and to safely drive them to a higher power level. Due to the improved heat dissipation performance, each LED light-emitting chip 30 can operate at a higher power while remaining within a suitable temperature range. Therefore, more LED light-emitting chips 30 can be installed on the same area of ​​the copper substrate 10, thereby significantly improving the total light output power of the entire light source module 100.

[0034] Furthermore, since the electrodes 21 between any two adjacent ceramic substrates 20 are connected by gold wire, this helps optimize electrical connections, avoids complex wiring designs, simplifies the assembly process, and improves the stability and reliability of the electrical connections. It also facilitates the formation of a small modular light source with each ceramic substrate 20 and the LED light-emitting chip 30 thereon. The small modular light source has better heat dissipation and structural stability, and is not prone to overheating or deformation as is the case with a single, large-sized ceramic substrate in the prior art. This allows the small modular light source to operate continuously and reliably at high power. Furthermore, the multiple ceramic substrates 20 can disperse the thermal expansion effects of the copper substrate 10, thereby releasing the internal stress generated by the copper substrate 10 during thermal expansion and contraction. This helps avoid severe warping, deformation, or even cracking that can occur with a single, large-sized ceramic substrate, thereby effectively reducing the warping of the light source module 100, improving its mechanical stability, and reducing the potential risk of damage caused by concentrated thermal stress.

[0035] In addition, the low-warping light source module 100 has a higher flatness, and the thermal interface material (such as thermal grease) can fully contact and fit tightly to all contact surfaces, so that the thermal interface material applied by the user at the application end can be thinner and evenly distributed, which helps to reduce thermal resistance and allows heat to be transferred more quickly from the light source module 100 to other heat dissipation systems. It also helps to prevent the filled thermal interface material from being unable to fill the warping depressions of the module and forming voids, thereby helping to avoid heat accumulation and the formation of hot spots, and helping to reduce the risk of increased warping during thermal cycling, thereby improving the thermal stability and long-term working reliability of the light source module 100, helping to improve the overall heat dissipation efficiency, and extending the life of the light source module 100.

[0036] In some embodiments, the positive electrode 211 and the negative electrode 212 in each ceramic substrate 20 may surround the LED light emitting chip 30. The positive electrode 211, the negative electrode 212, etc. of the ceramic substrate 20 may be located on the same side as the light emitting surface of the LED light emitting chip 30.

[0037] In some embodiments, the electrodes 21 between two ceramic substrates 20 can be directly electrically connected via gold wires 40. For example, the electrodes 21 between at least two adjacent ceramic substrates 20 can be directly electrically connected via gold wires 40. This helps reduce wiring connection points and shorten electrical paths, thereby helping to reduce resistance in the circuit, reducing assembly difficulty and potential failure points, simplifying the electrical layout within the light source module 100, and improving the reliability and compactness of the overall structure.

[0038] In some embodiments, the electrodes 21 between any two adjacent ceramic substrates 20 can be directly electrically connected through the gold wire 40 , thereby simplifying the electrical layout inside the light source module 100 .

[0039] In some embodiments, among the two ceramic substrates 20 electrically connected directly by the gold wire 40 , one end of the gold wire 40 can be electrically connected to the positive electrode of one of the ceramic substrates 20 , and the other end of the gold wire 40 can be electrically connected to the negative electrode of the other ceramic substrate 20 .

[0040] In some embodiments, the number of gold wires 40 may be one or more. In the case where there are multiple gold wires 40, the positive electrode of one ceramic substrate 20 and the negative electrode of another ceramic substrate 20 can be electrically connected via multiple gold wires 40. The number of gold wires can be selected based on the threshold power of the LED light-emitting chip 30.

[0041] In some embodiments, the electrodes 21 between the two ceramic substrates 20 can be electrically connected to the same conductive structure through a gold wire 40 to achieve indirect electrical connection. Figures 3 and 4 The light source module 100 may further include a conductive member 50, which is disposed between at least two adjacent ceramic substrates 20. The positive electrode 211 of at least one of the two adjacent ceramic substrates 20 and the negative electrode 212 of the other ceramic substrate 20 may be electrically connected to the conductive member 50 between the two adjacent ceramic substrates 20 via a gold wire 40. In this way, the conductive member 50, as an intermediate connection medium, helps adapt to situations where the large spacing between the two adjacent ceramic substrates 20 makes it difficult to arrange the gold wire 40 over a long distance, helps improve the firmness and stability of the electrical connection between the electrodes 21, and enhances the overall reliability and durability of the light source module 100.

[0042] In some embodiments, the number of the conductive members 50 may be one or more. When the number of the conductive member 50 is one, the conductive member 50 may be located between two adjacent ceramic substrates 20, and the positive electrode 211 of one of the two adjacent ceramic substrates 20 and the negative electrode 212 of the other ceramic substrate 20 may be electrically connected to the conductive member 50 via a gold wire 40. When the number of the conductive members 50 is multiple, a conductive member 50 is arranged between any two adjacent ceramic substrates 20, and the positive electrode 211 of one of the two adjacent ceramic substrates 20 and the negative electrode 212 of the other ceramic substrate 20 may be electrically connected to the conductive member 50 between the two adjacent ceramic substrates 20 via a gold wire 40.

[0043] In some embodiments, there may be one or more gold wires 40 . When there are multiple gold wires 40 , the positive electrode of one ceramic substrate 20 and the negative electrode of another ceramic substrate 20 may be electrically connected to the conductive member 50 through the multiple gold wires 40 .

[0044] See Figure 5 In some embodiments, the positive electrode 211 of at least one of two adjacent ceramic substrates 20 and the negative electrode 212 of the other ceramic substrate 20 are directly electrically connected via a gold wire 40, and the positive electrode 211 of at least one of two adjacent ceramic substrates 20 and the negative electrode 212 of the other ceramic substrate 20 can be electrically connected to the conductive member 50 between the two adjacent ceramic substrates 20 via a gold wire 40. This facilitates the electrical layout of the light source module 100 according to actual needs.

[0045] See Figure 4 and Figure 6 In some embodiments, the copper substrate 10 may be provided with a plurality of grooves 11, and the surface of each ceramic substrate 20 facing away from the light-emitting chip may be located in a corresponding groove 11. In this way, the groove 11 helps to provide positioning for the installation of the ceramic substrate 20, making the assembly process of the ceramic substrate 20 and the copper substrate 10 simpler and faster, and helping to improve production efficiency and assembly accuracy. In addition, the sunken design of the ceramic substrate 20 helps to enhance the stability of the overall structure of the light source module 100, helps to increase the contact area between the ceramic substrate 20 and the copper substrate 10, and improves the heat conduction efficiency, so that the heat generated by the LED light-emitting chip 30 during operation can be transferred to the copper substrate 10 more quickly through the ceramic substrate 20, effectively reducing the operating temperature of the LED light-emitting chip 30, and helping to extend the service life of the light source module 100.

[0046] In some embodiments, when the light source module 100 includes a conductive member 50, the conductive member 50 can be located between two adjacent ceramic substrates 20 and outside the groove 11. This helps provide a more direct electrical contact path for the electrical connection between the electrodes 21 of the ceramic substrate 20 and the conductive member 50, thereby reducing the amount of electrical connections (such as gold wires 40), reducing signal attenuation, and facilitating wiring. It also helps reduce the curvature of the electrical connections (such as gold wires 40), reducing the risk of damage to the gold wires 40 due to excessive bending, thereby helping to improve overall electrical performance.

[0047] In some embodiments, the light source module 100 may further include an insulating heat-conducting layer, which may fill the gap between the ceramic substrate 20 and the copper substrate 10. For example, the side surface of the ceramic substrate 20 and the surface facing the copper substrate 10 are both provided with an insulating heat-conducting layer. In this way, the insulating heat-conducting layer helps to stabilize the connection between the ceramic substrate 20 and the copper substrate 10, helps to reduce displacement or vibration caused by thermal expansion and contraction, and under different temperature differences or in harsh environments, the insulating heat-conducting layer can effectively buffer the thermal stress between the materials, thereby helping to improve the physical stability and long-term working reliability of the light source module 100. In addition, the insulating heat-conducting layer helps to enhance the heat transfer effect between the ceramic substrate 20 and the copper substrate 10, so that heat can be conducted more quickly and evenly from the LED light-emitting chip 30 to the copper substrate 10, effectively reducing the temperature of the LED light-emitting chip 30 during operation and improving the overall heat dissipation efficiency.

[0048] In some embodiments, the insulating thermally conductive layer may be an insulating thermally conductive adhesive.

[0049] See Figures 7 and 8 In some embodiments, the copper substrate 10 may be provided with a plurality of bosses 12, with each ceramic substrate 20 being disposed on a corresponding boss 12. Thus, the bosses 12 facilitate precise alignment of the ceramic substrates 20 during assembly of the light source module 100, ensuring that the ceramic substrates 20 are precisely aligned according to design requirements, thereby improving the standardization of production. Furthermore, the bosses 12 facilitate a simpler and more efficient soldering process for the gold wire 40. For example, the gold wire 40 can be soldered directly to the outside without the need to use tools such as tweezers to penetrate into a narrow space. This significantly reduces the possibility of errors during production and improves product yield.

[0050] See Figure 8 In some embodiments, when the light source module 100 includes a conductive member 50, the conductive member 50 can be located between two adjacent ceramic substrates 20 and outside the boss 12, so that the conductive member 50 does not occupy the position of the boss 12, making it easier for the ceramic substrate 20 to be arranged on the boss 12.

[0051] In some embodiments, the thermal pad 60 is disposed on the surface of the ceramic substrate 20 facing the copper substrate 10, which can also be understood as follows. Figures 9 and 10 As shown, the thermal pad 60 is provided on the surface of the ceramic substrate 20 facing away from the electrode 21. The thermal pad 60 covers more than 90% of the area of ​​the surface of the ceramic substrate 20 facing the copper substrate 10. Thus, since the electrode 21 is provided on the surface of the ceramic substrate 20 facing away from the copper substrate 10, there is no need to reserve a location for the electrode 21 on the surface of the ceramic substrate 20 facing the copper substrate 10, so that the area of ​​the thermal pad 60 can be designed to be larger. The large area design of the thermal pad 60 helps to increase the amount of heat transferred from the ceramic substrate 20 to the copper substrate 10, and helps to transfer heat from the surface of the ceramic substrate 20 facing the copper substrate 10 to the copper substrate 10 more evenly, reducing the formation of local hot spots, thereby avoiding material fatigue or performance degradation caused by thermal stress concentration, improving the thermal stability of the light source module 100, and due to the better heat dissipation effect, the operating power of a single LED light-emitting chip 30 can be higher.

[0052] In the present invention, the term "above" includes the number itself, for example, above 90% may refer to greater than or equal to 90%.

[0053] In some embodiments, the thermal pad 60 may cover 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98% or more of the area of ​​the surface of the ceramic substrate 20 facing the copper substrate 10 .

[0054] In some embodiments, two opposite surfaces of the ceramic substrate 20 may be plated with nickel-palladium-gold layers.

[0055] In some embodiments, the copper substrate 10 may be a red copper substrate, which helps the copper substrate 10 have good thermal conductivity and corrosion resistance.

[0056] In some embodiments, the LED light-emitting chip 30 can be soldered to the ceramic substrate 20. For example, the LED light-emitting chip 30 can be soldered to the ceramic substrate 20 using thermally conductive silver paste. The high thermal conductivity of the silver paste helps ensure that the heat generated by the LED light-emitting chip 30 can be quickly transferred to the ceramic substrate 20. In other embodiments, the LED light-emitting chip 30 can also be soldered to the ceramic substrate 20 using solder paste or eutectic soldering.

[0057] In some embodiments, the LED light emitting chip 30 and the electrode 21 of the ceramic substrate 20 can be electrically connected through other gold wires.

[0058] An embodiment of the present application provides a lighting device, which may be a photographic light, a stage light, or other lighting fixture. The lighting device includes a housing and a light source module 100 according to any of the above embodiments. The light source module 100 is assembled in the housing, and the housing provides a certain degree of protection for the light source module 100.

[0059] In this application, unless otherwise expressly specified or limited, terms such as "mounted" and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral connections; mechanical connections; direct connections, indirect connections through an intermediary, internal communication between two components, surface contact only, or surface contact through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0060] In addition, the terms "first", "second", etc. are only used to distinguish descriptions and should not be understood as specific or special structures. The description of the term "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this application and the features of different embodiments or examples, unless they are contradictory.

[0061] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate from the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A light source module, characterized in that: include: Copper substrate; A plurality of ceramic substrates, each of which is flat and spaced apart and connected to the copper substrate via thermally conductive pads, a positive electrode and a negative electrode being provided on a surface of each ceramic substrate facing away from the copper substrate, and the positive electrode of one of any two adjacent ceramic substrates being connected to the negative electrode of the other ceramic substrate via gold wire; and A plurality of LED light-emitting chips are provided, and one or more LED light-emitting chips are connected to the surface of each ceramic substrate facing away from the copper substrate.

2. The light source module according to claim 1, wherein: The positive electrode of one of at least two adjacent ceramic substrates is electrically connected to the negative electrode of the other ceramic substrate directly through a gold wire.

3. The light source module according to claim 1 or 2, characterized in that: The light source module also includes a conductive member, which is arranged between at least two adjacent ceramic substrates, and the positive electrode of at least one of the two adjacent ceramic substrates and the negative electrode of the other ceramic substrate are electrically connected to the conductive member between the two adjacent ceramic substrates through a gold wire.

4. The light source module according to claim 1, wherein: The copper substrate is provided with a plurality of grooves, and a surface of each ceramic substrate facing away from the light-emitting chip is located in a corresponding one of the grooves.

5. The light source module according to claim 4, wherein: The light source module further includes a conductive member located between two adjacent ceramic substrates and outside the groove. The electrode between the two adjacent ceramic substrates is electrically connected to the conductive member between the two adjacent ceramic substrates through a gold wire.

6. The light source module according to claim 4, wherein: The light source module further includes an insulating heat-conducting layer, and the insulating heat-conducting layer fills a gap between the ceramic substrate and the copper substrate.

7. The light source module according to claim 1, wherein: The copper substrate is provided with a plurality of bosses, and each of the ceramic substrates is arranged on a corresponding one of the bosses.

8. The light source module according to claim 7, wherein: The light source module further includes a conductive member located between two adjacent ceramic substrates and outside the boss. The electrode between the two adjacent ceramic substrates is electrically connected to the conductive member between the two adjacent ceramic substrates via a gold wire.

9. The light source module according to claim 1, wherein: The thermally conductive pad is provided on the surface of the ceramic substrate facing the copper substrate, and the thermally conductive pad covers more than 90% of the area of ​​the surface of the ceramic substrate facing the copper substrate.

10. A lighting device, characterized in that: include: case; as well as The light source module according to any one of claims 1 to 9, wherein the light source module is assembled to the housing.

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