Ultrasonic probe and ultrasonic apparatus

Abstract

The utility model relates to an ultrasonic probe and ultrasonic equipment, the ultrasonic probe comprises a shell, a sound head assembly and a cooling unit, the sound head assembly and the cooling unit are arranged in the shell, and the sound head assembly is mainly used for transmitting ultrasonic signals to a detected person and receiving reflected ultrasonic signals; the cooling unit comprises a refrigeration part and a first heat conduction part; the refrigeration part is connected to the sound head assembly, and the first heat conduction part is connected to the side, away from the sound head assembly, of the refrigeration part. The heat of the sound head assembly is absorbed through the refrigeration part, so that the sound head assembly is cooled, the situation that the service life of the piezoelectric layer is affected by too high temperature is prevented, and discomfort brought to a patient due to the too high temperature of the sound head assembly can be reduced; meanwhile, the heat transferred to the refrigeration part by the sound head assembly can be conducted out through the first heat conduction part, for example, the heat is transferred to the shell through the first heat conduction part, and the heat is dissipated through external air, so that the temperature of the holding part is effectively reduced, and the use experience of a doctor is improved.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular to ultrasound probes and ultrasound equipment. Background Art

[0002] The ultrasonic probe is an important component of ultrasonic equipment (such as ultrasonic diagnostic imaging equipment). Its working principle is to use the piezoelectric effect to convert the excitation electrical pulse signal of the ultrasonic device into an ultrasonic signal that enters the patient's body, and then convert the ultrasonic echo signal reflected by the tissue into an electrical signal, thereby realizing tissue detection.

[0003] After the ultrasound probe has been working for a period of time, the surface temperature will increase. Excessively high temperature will not only affect the life of the piezoelectric layer inside the ultrasound probe, but also affect the patient's experience. Utility Model Content

[0004] Based on this, it is necessary to provide an ultrasonic probe to address the problem of excessive temperature in existing ultrasonic probes.

[0005] An ultrasound probe, comprising:

[0006] case;

[0007] an acoustic head assembly, disposed in the housing;

[0008] A cooling unit is provided in the housing, and includes a refrigeration part and a first heat conducting part; the refrigeration part is connected to the acoustic head assembly, and the first heat conducting part is connected to a side of the refrigeration part away from the acoustic head assembly.

[0009] In one embodiment, the ultrasonic probe further includes a heat sink connected to the acoustic head assembly, and the cooling portion is connected between the heat sink and the first heat conducting portion.

[0010] In one embodiment, the first heat-conducting portion includes a first heat-conducting member and a support block connected to the first heat-conducting member, and the cooling portion is connected to the support block; a metal mesh is provided in the first heat-conducting member.

[0011] In one embodiment, the ultrasound probe further comprises a fastener, wherein the fastener connects the support block and the heat dissipation block to press the refrigeration part between the support block and the heat dissipation block; and / or,

[0012] The acoustic head assembly includes a backing layer, the backing layer and the heat dissipation block are respectively provided with concave-convex matching parts, and the backing layer and the heat dissipation block are engaged with each other through the concave-convex matching parts; and / or,

[0013] One of the support block and the housing is provided with a positioning protrusion, and the other is provided with a positioning groove for engaging with the positioning protrusion; and / or,

[0014] A phase change medium and / or a metal mesh is arranged in the first heat conducting member.

[0015] In one embodiment, a heat conducting layer is provided between at least one of the heat dissipation block and the first heat conducting portion and the refrigeration portion; and / or,

[0016] The inner wall of the shell is provided with a metal plating layer.

[0017] In one embodiment, a second heat conducting portion is provided between the first heat conducting portion and the housing.

[0018] In one embodiment, the first heat conducting portion is provided with a flexible heat conducting member, and the flexible heat conducting member is provided on the outer surface of the first heat conducting portion and abuts against the second heat conducting portion.

[0019] In one embodiment, the ultrasound probe further includes a main board disposed in the housing, and the flexible heat conductive member bypasses the main board and abuts against the second heat conductive portion.

[0020] In one embodiment, a heat dissipation portion is provided at one end of the first heat conducting portion facing away from the acoustic head assembly.

[0021] In one embodiment, the heat dissipation portion is provided on the outer surface of the flexible heat conductive member; or,

[0022] The heat dissipation portion is arranged between the first heat conduction portion and the flexible heat conduction member.

[0023] In one embodiment, the ultrasound probe further includes a wire sheath connected to the housing; the heat dissipation portion includes a metal wire, the metal wire is passed through the wire sheath and extends along the wire sheath; or,

[0024] The ultrasonic probe further comprises a wire sheath connected to the housing; the heat dissipation portion comprises a metal wire, and the metal wire is a metal shielding mesh arranged in the wire sheath; or,

[0025] The heat dissipation portion includes a liquid cooling channel; or,

[0026] The heat dissipation part includes a micro pump liquid cooling tube.

[0027] An ultrasound device comprises a host, a display, and the ultrasound probe as described above; the ultrasound probe is used to collect ultrasound imaging data;

[0028] The host is in communication with the ultrasound probe, and is configured to receive and process the ultrasound imaging data and generate an ultrasound image;

[0029] The display is connected to the host and is used to display the ultrasound image.

[0030] The above-mentioned ultrasound probe absorbs the heat of the acoustic head assembly through the refrigeration part to cool the acoustic head assembly, prevent the excessive temperature from affecting the service life of the piezoelectric layer in the acoustic head assembly, and reduce the discomfort caused to the patient by excessive temperature; at the same time, the heat transferred from the acoustic head assembly to the refrigeration part can be discharged through the first heat conduction part. For example, the heat is transferred to the shell through the first heat conduction part, and the heat is dissipated by the external air, thereby effectively reducing the temperature of the holding part and improving the doctor's user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of the ultrasound probe provided in the first embodiment of the present application.

[0032] Figure 2 for Figure 1 Exploded diagram of the ultrasound probe shown.

[0033] Figure 3 for Figure 2 A partial schematic diagram of the ultrasound probe shown.

[0034] Figure 4 for Figure 3 Schematic diagram of the interface between the backing layer and the heat sink in the ultrasound probe shown.

[0035] Figure 5 for Figure 1 A cross-sectional view of the ultrasound probe is shown.

[0036] Figure 6 A partial schematic diagram of the ultrasound probe provided in the second embodiment of the present application.

[0037] Figure 7 A partial schematic diagram of the ultrasound probe provided in the third embodiment of the present application.

[0038] Figure 8 A partial schematic diagram of the ultrasound probe provided in the fourth embodiment of the present application.

[0039] Figure numbers: 100, shell; 200, acoustic head assembly; 210, matching layer; 220, backing layer; 221, concave-convex matching part; 230, piezoelectric layer; 310, heat sink; 320, refrigeration part; 330, first heat conduction part; 331, support block; 3311, positioning groove; 332, first heat conduction part; 340, heat conduction layer; 350, second heat conduction part; 360, flexible heat conduction part; 370, metal wire; 371, liquid cooling channel; 372, micro pump liquid cooling tube; 400, wire sheath; 500, mainboard; 600, fastener. DETAILED DESCRIPTION

[0040] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0041] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0042] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0043] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0044] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0045] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0046] See Figure 2 As shown, an ultrasound probe provided in one embodiment of the present application includes a housing 100, an acoustic head assembly 200 disposed within the housing 100, and a cooling unit. The acoustic head assembly 200 is primarily used to transmit ultrasonic signals to a subject and receive reflected ultrasonic signals. The cooling unit includes a cooling portion 320 and a first heat-conducting portion 330. The cooling portion 320 is connected to the acoustic head assembly 200, and the first heat-conducting portion 330 is connected to a side of the cooling portion 320 facing away from the acoustic head assembly 200. For example, snap-fit ​​structures are provided on the outer sides of the acoustic head assembly 200 and the first heat-conducting portion 330, respectively, to secure the cooling portion 320 between the acoustic head assembly 200 and the first heat-conducting portion 330.

[0047] Among them, the sound head assembly 200 includes a piezoelectric layer 230. The heat of the ultrasonic probe mainly comes from the piezoelectric layer 230. The heat of the sound head assembly 200 is absorbed by the refrigeration part 320 to cool the sound head assembly 200, prevent the high temperature from affecting the service life of the piezoelectric layer 230, and reduce the discomfort caused to the patient by the high temperature of the sound head assembly 200; at the same time, the refrigeration part 320 will absorb the heat of the sound head assembly 200 through the first heat conduction part 330. For example, the heat is transferred to the shell 100 through the first heat conduction part 330, and the heat is dissipated by the external air, thereby effectively reducing the temperature of the holding part, thereby improving the doctor's usage experience.

[0048] Understandably, if Figure 2 As shown, the acoustic head assembly 200 also includes a stacked lens layer (not shown), a matching layer 210, and a backing layer 220. The piezoelectric layer 230 is typically positioned between the matching layer 210 and the backing layer 220. The lens layer focuses the ultrasonic beam emitted by the piezoelectric layer 230. The matching layer 210 matches the acoustic characteristic impedance between the piezoelectric layer 230 and the sound transmission medium, ensuring good sound energy transmission. The backing layer 220 absorbs unwanted sound waves radiated from the back of the piezoelectric layer 230 and also serves as a support structure for the acoustic head assembly 200.

[0049] like Figure 2 As shown, in some embodiments, the ultrasound probe further includes a heat sink 310 connected to the acoustic head assembly 200, with a cooling unit 320 connected between the heat sink and the first heat conducting portion. The provision of the heat sink 310 allows the cooling unit 320 to better absorb heat from the acoustic head assembly 200, thereby cooling the acoustic head assembly 200 and preventing excessive temperatures from affecting the service life of the piezoelectric layer. This also reduces discomfort to the patient caused by excessive temperatures in the acoustic head assembly 200.

[0050] In one embodiment, the matching layer 210 can be a metal or epoxy composite material with a thermal conductivity greater than 1 W / (m·K), and the backing layer 220 can be an epoxy composite material with a thermal conductivity greater than 1 W / (m·K). This ensures that both the matching layer 210 and the backing layer 220 have excellent thermal conductivity, effectively and quickly transferring heat generated by the piezoelectric layer to the surface of the housing 100 and the cooling unit 320. In this embodiment, the cooling unit 320 is connected to the backing layer 220 via a heat sink 310, dissipating heat from the backing layer 220. In other embodiments, the cooling unit 320 can also be directly bonded to or indirectly contacted with the side of at least one of the lens layer, the matching layer 210, and the transducer, thereby reducing the temperature of these components to achieve heat dissipation and cooling of the entire acoustic head assembly 200.

[0051] See Figure 2As shown, in one embodiment, the cooling unit 320 can be a semiconductor cooling chip, including a cold end and a hot end, which transfers heat from the cold end to the hot end during operation. In this embodiment, the end of the cooling unit 320 close to the heat sink 310 is the cold end, and the end close to the first heat conducting portion 330 is the hot end.

[0052] See Figure 2 As shown, in one embodiment, the first heat conducting part 330 includes a first heat conducting member 332 and a support block 331 connected to the first heat conducting member 332. The first heat conducting member 332 and the support block 331 can be made of a metal heat conducting material such as copper or aluminum. Of course, the support block 331 can also be made of a non-metallic material. The first heat conducting member 332 passes through the support block 331 and directly contacts the heat dissipation block 310. The support block 331 and the first heat conducting member 332 can be welded together, and the cooling part 320 is connected to the support block 331. For example, the cooling part 320 is arranged on the upper end surface of the support block 331. Of course, at least a portion of the support block 331 can also be arranged to extend toward the cooling part 320 to wrap around the side of the cooling part 320, thereby increasing the contact area between the cooling part 320 and the support block 331 and improving the heat dissipation effect. The support block 331 positions and mounts the cooling unit 320 and the first heat conductor 332. Heat dissipated from the hot end of the cooling unit 320 is quickly transferred to the first heat conductor 332. The heat is then transferred to different areas of the housing 100 via the first heat conductor 332, increasing the heat dissipation area and enabling rapid heat dissipation through the external air. In other embodiments, the support block 331 and the first heat conductor 332 may be integrally formed. The first heat conductor 332 may be a long, rectangular heat pipe containing a phase change medium. The heat pipe is vacuumed to ensure a low boiling point. The phase change medium is a liquid that readily changes from liquid to gas and readily evaporates to form liquid vapor, achieving good heat conduction. The phase change medium may be water, methanol, ethanol, oil, or the like. The end of the first heat conductor 332 facing away from the acoustic head assembly 200 may be configured as a tapered structure, saving space at the rear end of the ultrasound probe (the end facing away from the acoustic head assembly 200).

[0053] The thermal conductivity of the heat pipe is 20 to 50 times that of copper, and the temperature difference across the surface of the heat pipe is small, resulting in excellent heat distribution and heat conduction. Furthermore, a metal mesh can be installed inside the heat pipe. The metal mesh can be attached to the inner wall of the heat pipe. Alternatively, the two ends of the metal mesh can be connected to the two ends of the heat pipe, while the remaining area of ​​the metal mesh is suspended in the heat pipe, creating a gap between the heat pipe wall and the heat pipe, thereby increasing the heat dissipation area. The metal mesh can be a copper mesh.

[0054] Furthermore, if Figure 2As shown, one of the support block and the shell is provided with a positioning protrusion (not shown), and the other is provided with a positioning groove 3311 for engaging with the positioning protrusion. For example, in this embodiment, a positioning groove 3311 is provided on the support block 331, and a positioning protrusion such as a positioning buckle is provided on the shell 100. The positioning buckle is engaged in the positioning groove 3311, thereby fixing the support block 331 on the shell 100.

[0055] See Figure 3 As shown, in one embodiment, the ultrasound probe further includes a fastener 600, which connects the support block 311 and the heat sink 310 to press the cooling unit 320 between the support block 311 and the heat sink 310. Specifically, the fastener 600 is sequentially inserted through the support block 331 and the heat sink 310. Specifically, the heat sink 310 and the support block 331 are provided with connection holes, such as threaded holes, for positioning and installation. The fastener 600, such as a bolt, is inserted through the connection holes provided in the support block 331 and the heat sink 310 to firmly secure the cooling unit 320 between the support block 331 and the heat sink 310. In other embodiments, the fastener 600 may be connected to the side surfaces of the support block 311 and the heat sink 310 to securely connect the two. Of course, in other embodiments, positioning posts and positioning holes may be provided between the support block 331 and the heat sink 310 to achieve connection between the two.

[0056] See Figure 2 As shown in one embodiment, the backing layer 220 and the heat dissipation block 310 are respectively provided with concave-convex matching parts 221, and the backing layer 220 and the heat dissipation block 310 are engaged with each other through the concave-convex matching parts. Figure 4 As shown, the concave-convex matching portion 221 is specifically a concave-convex structure. The contact surfaces of the backing layer 220 and the heat sink 310 are both provided with the concave-convex structure. By engaging the concave-convex structures, the contact area between the heat sink 310 and the backing layer 220 can be increased, thereby increasing the connection reliability between the two and further enhancing the heat dissipation capability. At the same time, the concave-convex matching portion 221 forms an irregular interface at the contact surface between the backing layer 220 and the heat sink 310. The irregular interface allows sound waves to be diffusely reflected there, increasing the attenuation of sound waves within the backing layer 220 and reducing the noise interference caused by sound waves vertically reflected from the surface of the backing layer 220. The concave-convex matching portion 221 includes protrusions and grooves arranged alternately in sequence. The shapes of the protrusions and grooves can be rectangular, wavy, triangular, hemispherical, or other irregular shapes.

[0057] See Figure 2As shown, in one embodiment, a heat-conducting layer 340 is provided between at least one of the heat sink 310 and the first heat-conducting portion 330 and the cooling portion 320. Specifically, in this embodiment, a heat-conducting layer 340 is provided between the heat sink 310 and the cooling portion 320, and between the first heat-conducting portion 330 and the cooling portion 320. On the one hand, the heat-conducting layer 340 can achieve heat transfer, allowing the cooling portion 320 to better absorb heat from the acoustic head assembly 200. On the other hand, it can fill the working gaps between the cooling portion 320 and the heat sink 310, and between the cooling portion 320 and the first heat-conducting portion 330, so that the cooling portion 320 and the heat sink 310 are in closer contact, and at the same time, the cooling portion 320 and the first heat-conducting portion 330 are in closer contact, thereby enhancing the thermal conductivity. The heat-conducting layer 340 can generally be a thermally conductive adhesive or a thermally conductive pad, etc., with a thermal conductivity coefficient greater than 10W / (m·K).

[0058] In one embodiment, the inner wall of the housing 100 is provided with a metal coating (not shown), which serves to quickly diffuse heat to the outer surface of the housing 100 and effectively reduce electromagnetic interference, thus serving as an electromagnetic shield. Figure 2 As shown, the housing 100 is a split structure, comprising two half shells, which cooperate to enclose a housing cavity for accommodating the cooling unit and acoustic head assembly 200. A snap-fit ​​structure, such as a clip and a slot, is provided between the two half shells to secure the two half shells together.

[0059] See Figure 2 As shown, in one embodiment, a second heat conducting portion 350 is provided between the first heat conducting portion 330 and the housing 100. The shape of the second heat conducting portion 350 matches the shape of the housing 100, so that the two can fit well together and improve the heat conduction capability.

[0060] In one embodiment, the second heat-conducting portion 350 is made of a combination of thermally conductive foam and phase-change thermally conductive material. For example, the phase-change thermally conductive material can be bonded to the thermally conductive foam. The thermally conductive foam has excellent compression deformation properties and can effectively fill the gap between the first heat-conducting portion 330 and the housing 100. The thermally conductive foam is also easy to cut, making installation more convenient. The phase-change thermally conductive material has the effect of maintaining a constant temperature when a phase change occurs at a critical temperature. Therefore, it can slow down the temperature rise and prevent the housing 100 from overheating and affecting the doctor's grip. In other words, because the second heat-conducting portion 350 has excellent heat absorption and thermal conductivity, it can quickly transfer heat to the surface of the housing 100 while slowing down the temperature rise of the housing 100, preventing the grip portion of the housing 100 from overheating and affecting the doctor's user experience. At the same time, the second heat-conducting portion 350 is easy to install, facilitating production. The phase-change thermally conductive material can include metal oxides, such as aluminum oxide and iron oxide. The thermally conductive foam may be a thermally conductive foam such as silicone foam or graphite foam, with a thermal conductivity greater than 10W / (m·K).

[0061] See Figure 5 As shown, in one embodiment, the first heat-conducting portion 330 is provided with a flexible heat-conducting member 360. In this embodiment, the flexible heat-conducting member 360 is located on the outer surface of the first heat-conducting portion 330, and the flexible heat-conducting member 360 is in contact with the second heat-conducting portion 350. The flexible heat-conducting member 360 quickly transfers the heat emitted from the hot end of the refrigeration portion 320 to the first heat-conducting portion 330, and then the first heat-conducting portion 330 transfers the heat to the second heat-conducting portion 350 through the flexible heat-conducting member 360, thereby achieving the purpose of rapid heat dissipation. Specifically, the flexible heat-conducting member 360 can also be provided on the outer surface of the support block 331 or the first heat-conducting member 332, preferably, provided on the outer surface of the first heat-conducting member 332.

[0062] Understandably, see Figure 2 and Figure 5 As shown, the ultrasound probe also includes a mainboard 500 disposed within the housing 100. The flexible thermal conductor 360 is wound not only around the first heat-conducting portion 330 but also around the outside of the mainboard 500 and in contact with the second heat-conducting portion 350. In other words, the flexible thermal conductor 360 covers at least a portion of the surface of the first heat-conducting portion 330 and the mainboard 500, achieving heat conduction. The flexible thermal conductor 360 can be a graphite sheet or copper foil. Copper foil provides electromagnetic shielding and is also a good thermal conductor, quickly transferring heat from the first heat-conducting portion 330 and the mainboard 500 to the second heat-conducting portion 350.

[0063] See Figure 6As shown, in one embodiment, a heat dissipation portion is provided at one end of the first heat conducting portion 330 away from the acoustic head assembly 200 . The heat dissipation portion can be provided on the outer surface of the flexible heat conducting member 360 or between the first heat conducting portion 330 and the flexible heat conducting member 360 .

[0064] See Figure 6 As shown, in a specific embodiment, the heat dissipation portion may include multiple metal wires 370, wherein the metal wires 370 may be welded to the end of the first heat conducting portion 330, thereby transferring heat from the first heat conducting portion 330 to the connecting cable of the ultrasound probe (not shown), thereby increasing the heat transfer path of the first heat conducting portion 330 and further improving the heat dissipation capacity of the ultrasound probe. It is understood that multiple metal wires 370 are provided, and the multiple metal wires 370 can be arranged on the outer surface of the flexible heat conducting member 360, such as by welding, or can be arranged between the first heat conducting portion 330 and the flexible heat conducting member 360. The metal wires 370 can specifically be copper wires.

[0065] See Figure 6 As shown, in one embodiment, the ultrasound probe further includes a cable sheath 400 that interfaces with the housing 100. The connecting cable and the metal wire 370 are housed within the cable sheath 400. The cable sheath 400 can prevent the connecting cable from being pulled or broken during use, protecting the connecting cable from wear and external damage, and ensuring the integrity of the connecting cable and the reliability of signal transmission. The cable sheath 400 can be made of materials such as silicone or polyurethane, and has good flexibility and durability. The metal wire 370 can extend along the length of the cable sheath 400 along with other connecting cables. In other embodiments, the metal wire 370 can also be a metal shielding mesh disposed within the cable sheath 400.

[0066] See Figure 7 As shown, in one embodiment, the heat dissipation portion includes a liquid cooling channel 371. The liquid cooling channel 371 can be disposed on the outer surface of the flexible heat conductive member 360 or between the first heat conductive member 330 and the flexible heat conductive member 360. The liquid cooling channel 371 is used to flow coolant, which dissipates heat from the end of the first heat conductive member 330 through the coolant, further enhancing the heat dissipation capability of the ultrasound probe. In one embodiment, a drive pump for driving the coolant flow is disposed on the side of the cable sheath 400 facing away from the acoustic head assembly 200.

[0067] See Figure 8As shown, in another embodiment, the heat dissipation portion includes a micropump liquid cooling tube 372. The micropump liquid cooling tube 372 can be set on the outer surface of the flexible heat conductive member 360, or can be set between the first heat conductive member 330 and the flexible heat conductive member 360. The micropump liquid cooling tube 372 has its own drive pump, so the micropump liquid cooling tube 372 does not need to be passed through the protective sleeve 400, and the micropump liquid cooling tube 372 can be made into a conventional volume. Furthermore, the micropump liquid cooling tube 372 can also be combined with the aforementioned phase change thermal conductive material, for example, the phase change thermal conductive material is bonded to the micropump liquid cooling tube 372, which plays the role of heat distribution and delaying temperature rise, thereby preventing the housing 100 from being overheated and affecting the doctor's grip.

[0068] Furthermore, an embodiment of the present application also provides an ultrasound device (not shown), including a host (not shown), a display (not shown) and an ultrasound probe of any of the above embodiments; the ultrasound probe is used to collect ultrasound imaging data; the host is communicatively connected to the ultrasound probe, for receiving and processing ultrasound imaging data, and generating ultrasound images; the display is connected to the host, for displaying ultrasound images.

[0069] In addition to the ultrasound probe, host and display device mentioned above, the ultrasound device of the embodiment of the present application may also include other components, such as a trolley. These related components can refer to the existing technology.

[0070] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An ultrasonic probe, characterized in that: The ultrasonic probe comprises: Housing (100); An acoustic head assembly (200) is disposed in the housing (100); A cooling unit is arranged in the housing (100), and the cooling unit includes a refrigeration part (320) and a first heat-conducting part (330); the refrigeration part (320) is connected to the sound head assembly (200), and the first heat-conducting part (330) is connected to a side of the refrigeration part (320) facing away from the sound head assembly (200).

2. The ultrasonic probe according to claim 1, wherein: The ultrasonic probe further comprises a heat dissipation block (310) connected to the acoustic head assembly (200), and the refrigeration part (320) is connected between the heat dissipation block (310) and the first heat conducting part (330).

3. The ultrasonic probe according to claim 2, characterized in that The first heat-conducting portion (330) comprises a first heat-conducting member (332) and a support block (331) connected to the first heat-conducting member (332), and the refrigeration portion (320) is connected to the support block (331).

4. The ultrasonic probe according to claim 3, characterized in that The ultrasonic probe further comprises a fastener (600), wherein the fastener (600) connects the support block (331) and the heat dissipation block (310) to press the refrigeration portion (320) between the support block (331) and the heat dissipation block (310); and / or, The acoustic head assembly (200) comprises a backing layer (220), the backing layer (220) and the heat dissipation block (310) are respectively provided with concave-convex fitting portions (221), and the backing layer (220) and the heat dissipation block (310) are engaged via the concave-convex fitting portions (221); and / or, One of the support block (331) and the housing (100) is provided with a positioning protrusion, and the other is provided with a positioning groove (3311) for engaging with the positioning protrusion; and / or, A phase change medium and / or a metal mesh is provided in the first heat conducting member (332).

5. The ultrasonic probe according to claim 2, characterized in that A heat-conducting layer (340) is provided between at least one of the heat dissipation block (310) and the first heat-conducting portion (330) and the refrigeration portion (320); and / or, The inner wall of the housing (100) is provided with a metal coating.

6. The ultrasonic probe according to claim 1, characterized in that A second heat conducting portion (350) is provided between the first heat conducting portion (330) and the housing (100).

7. The ultrasonic probe according to claim 6, characterized in that The first heat-conducting portion (330) is provided with a flexible heat-conducting component (360), and the flexible heat-conducting component (360) is provided on the outer surface of the first heat-conducting portion (330) and abuts against the second heat-conducting portion (350).

8. The ultrasonic probe according to claim 7, characterized in that: The ultrasonic probe further comprises a main board (500) arranged in the housing (100), and the flexible heat-conducting member (360) bypasses the main board (500) and abuts against the second heat-conducting portion (350).

9. The ultrasonic probe according to claim 8, characterized in that: A heat dissipation portion is provided at one end of the first heat conducting portion (330) facing away from the acoustic head assembly (200).

10. The ultrasonic probe according to claim 9, characterized in that: The heat dissipation portion is provided on the outer surface of the flexible heat-conducting member (360); or, The heat dissipation portion is arranged between the first heat conduction portion (330) and the flexible heat conduction member (360).

11. The ultrasonic probe according to claim 10, characterized in that: The ultrasonic probe further comprises a wire sheath (400) docked with the housing (100), the heat dissipation portion comprises a metal wire, the metal wire (370) is passed through the wire sheath (400) and extends along the wire sheath (400); or, The ultrasonic probe further comprises a wire sheath (400) docked with the housing (100), the heat dissipation portion comprises a metal wire, and the metal wire (370) is a metal shielding mesh disposed within the wire sheath (400); or, The heat dissipation portion includes a liquid cooling channel (371); or, The heat dissipation portion includes a micropump liquid cooling tube (372).

12. An ultrasonic device, characterized in that: It comprises a host, a display and an ultrasound probe according to any one of claims 1 to 11; the ultrasound probe is used to collect ultrasound imaging data; The host is in communication with the ultrasound probe, and is configured to receive and process the ultrasound imaging data and generate an ultrasound image; The display is connected to the host and is used to display the ultrasound image.

Images