Intelligent fire extinguishing early warning device
The design of combining the thermoelectric power generation module and the fire extinguishing microcapsule solves the structural complexity and sensor dependence problems of the existing intelligent fire extinguishing warning device, and realizes automatic fire extinguishing and efficient response without external power supply.
Patent Information
- Application Number
- CN202422726210.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-11-08
AI Technical Summary
Existing intelligent fire extinguishing warning devices have complex structures, occupy a large area, rely on sensors that are prone to errors and cannot work when the power is out. In addition, the risk of false alarms and missed alarms is high.
The design combines a thermoelectric power generation module with fire-extinguishing microcapsules. The thermoelectric power generation module generates current to drive the control components when a fire occurs. No external power supply is required. The fire-extinguishing microcapsules are automatically activated to extinguish the fire at high temperatures, and the release of the fire-extinguishing microcapsules is monitored by the detection module.
It realizes automatic fire extinguishing without external power supply, reduces sensor dependence, improves response speed and reliability, and reduces the risk of false alarms and missed alarms.
Smart Images

Figure CN223366149U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of fire-fighting devices, in particular to an intelligent fire-extinguishing early warning device. Background Art
[0002] Existing intelligent fire extinguishing warning devices use tanks to store liquid or gaseous fire extinguishing agents, which are then piped into the protected space. Temperature and smoke sensors, for example, are then installed within the space to monitor fires and extinguish them using a control chip. These devices are not only complex and require a large footprint, but also rely heavily on electronic devices like sensors. A power outage renders the device inoperable. Furthermore, sensors are prone to false alarms and missed alarms, preventing timely fire extinguishing. Utility Model Content
[0003] The utility model provides an intelligent fire extinguishing early warning device, which solves the above defects.
[0004] The technical solution of the present utility model is achieved as follows:
[0005] An intelligent fire extinguishing warning device includes a shell with a vertical through-hole, wherein the shell is provided with a fire extinguishing microcapsule, a control component and a thermoelectric power generation module; the thermoelectric power generation module includes a P-type semiconductor arranged at the top of the shell through-hole and an N-type semiconductor at the bottom, and the shell, the P-type semiconductor and the N-type semiconductor at the bottom form a cavity for accommodating the fire extinguishing microcapsule and the control component; the N-type semiconductor is provided with a through-hole for allowing the fire extinguishing microcapsule to pass through, and the through-hole is sealed with hot-melt adhesive. The P-type semiconductor, the N-type semiconductor and the control component form an electrical circuit, and the control component is provided with a communication module.
[0006] Furthermore, a detection module electrically connected to the control component is provided in the cavity of the intelligent fire extinguishing warning device, the fire extinguishing microcapsules are fixed on the detection module and the fire extinguishing microcapsules face the N-type semiconductor side, and the control component is arranged between the detection module and the P-type semiconductor.
[0007] Furthermore, the detection module is a gravity sensing module.
[0008] Furthermore, a conductive sheet is provided inside the shell, and contact joints are provided at both ends of the conductive sheet, which penetrate the shell and conduct with the P-type semiconductor and the N-type semiconductor; the control component is electrically connected to the P-type semiconductor and the N-type semiconductor through a wire.
[0009] Furthermore, the conductive sheet covers the entire interior of the housing, and the contact connector is ring-shaped and is fully conductively connected to the P-type semiconductor and the N-type semiconductor.
[0010] Furthermore, the longitudinal cross-section of the shell is arc-shaped.
[0011] Furthermore, the shape of the N-type semiconductor is a hollow ring.
[0012] Furthermore, the surface of the N-type semiconductor is coated with a heat absorption layer, and the surface of the P-type semiconductor is coated with a heat insulation layer.
[0013] Furthermore, the fire extinguishing microcapsules are fixed to the shell and the space enclosed by the P-type semiconductor and the N-type semiconductor by hot melt adhesive.
[0014] Beneficial effects of the utility model:
[0015] 1. The temperature difference power generation module can generate current through temperature difference when a fire occurs to drive the control components to operate and transmit signals. There is no need to set up an additional power supply, which effectively solves the problem of the intelligent fire extinguishing warning device stopping working due to power failure.
[0016] 2. The activation of the fire-extinguishing microcapsules does not require control components, eliminating the dependence on sensors. It can actively extinguish fires under high temperatures (greater than 90°C), effectively reducing the losses caused by fire.
[0017] 3. The detection module can timely detect the content of fire extinguishing microcapsules and determine whether the flame is released and extinguished.
[0018] 4. The conductive sheet covers the entire interior of the shell, effectively increasing the conduction efficiency of electrons between the P-type semiconductor and the N-type semiconductor, improving the electrical conduction and power of the thermoelectric power generation module, and providing further stability for the response operation of the intelligent fire extinguishing warning device. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0020] Figure 1 This is a cross-sectional view of the first structure of the utility model;
[0021] Figure 2 This is an exploded view of the second structure of the present utility model;
[0022] Figure 3 This is a cross-sectional view of the second structure of the present utility model;
[0023] Figure 4 for Figure 3 A magnified view of .
[0024] In the figure: 1-shell, 11-conductive sheet, 12-contact connector, 2-fire extinguishing microcapsule, 3-control component, 31-control chip, 32-communication module, 4-thermoelectric power generation module, 41-P-type semiconductor, 42-N-type semiconductor, 43-through hole, 44-hot melt adhesive, 5-detection module. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] Example 1:
[0027] Reference Figure 1 An intelligent fire extinguishing warning device includes a housing 1 with a vertical through hole, that is, the horizontal cross-section of the housing 1 is circular or rectangular. The housing 1 is provided with fire extinguishing microcapsules 2, a control component 3 and a thermoelectric power generation module 4.
[0028] Thermoelectric power generation module 4 includes a P-type semiconductor 41 at the top of housing 1 and an N-type semiconductor 42 at the bottom. Together, these two components, along with housing 3, form a cavity. N-type semiconductor 42 is provided with a plurality of through-holes 43, which contain heat-dissolving hot-melt adhesive 44. The hot-melt adhesive 44 has a melting point of 95°C. Fire-extinguishing microcapsules 2 and control assembly 3 are located within the cavity.
[0029] The fire-extinguishing microcapsule 2 consists of a shell and a fire extinguishing agent disposed within the shell. The shell is made of a polymer or composite material, and the fire extinguishing agent is perfluorohexanone or another fluorine-based fire extinguishing agent. When heated, the perfluorohexanone fire extinguishing agent vaporizes and expands, bursting the shell and releasing the perfluorohexanone fire extinguishing agent into the fire space, thereby extinguishing the flames. The shell of the fire-extinguishing microcapsule has a rupture temperature of 100°C.
[0030] The control component 3 is provided with a control chip 31 and a communication module 32. The P-type semiconductor 41 and the N-type semiconductor 42 form a loop with the control component 3 via wires. The control chip 31 is used to control the conversion of electrical parameters and the transmission of data. The communication module 52 is a WiFi communication module or a 4G or 5G communication module.
[0031] When a fire occurs, the N-type semiconductor 42 of the thermoelectric power generation module 4 is heated. When the temperature difference between the N-type semiconductor 42 and the P-type semiconductor 41 exceeds 40°C, a current is generated to supply power to the control component 3. After powering on, the control component 3 converts and stores the electrical parameters generated by the thermoelectric power generation module 4 and transmits them to the backend terminal via the communication module 31. Simultaneously, when the fire temperature reaches the excitation temperature of the fire-extinguishing microcapsules 2, the microcapsules rupture and release the fire extinguishing agent.
[0032] Furthermore, the longitudinal cross-section of the housing 3 is arc-shaped. The arc-shaped structure can accommodate more fire-extinguishing microcapsules 2 under the housing 3 with a shorter width.
[0033] Furthermore, the fire extinguishing microcapsules 2 are fixed in the space enclosed by the housing 3 and the P-type semiconductor 41 and the N-type semiconductor 42 by means of a flame retardant hot melt adhesive, the melting temperature of which is 95°C.
[0034] Furthermore, a heat-absorbing layer is applied to the surface of the N-type semiconductor to accelerate its temperature rise, while a heat-insulating layer is applied to the surface of the P-type semiconductor to maintain its low temperature. The provision of these layers further accelerates the power-on time of control component 3, providing further assurance for the detection and handling of fire incidents.
[0035] Example 2:
[0036] This embodiment is a further improvement of the first embodiment, the difference is that Figure 2-4 , also includes a detection module 5.
[0037] The fire-extinguishing microcapsule 2 is secured to one side of the detection module 5 with glue. In this embodiment, the detection module 5 is a gravity sensing module, which is electrically connected to the control chip 31 of the control assembly 3. The gravity sensing module is secured below the P-type semiconductor, with the fire-extinguishing microcapsule 2 facing the N-type semiconductor 42. A fire-extinguishing microcapsule 2 of a certain weight is secured to the gravity sensing module, and its initial weight is recorded. When the fire-extinguishing microcapsule is released, the weight on the gravity sensing module decreases. The gravity sensing module transmits the reduced weight data to the control chip 31 and sends it via the communication module 32.
[0038] The control component 3 is positioned between the gravity sensing module and the P-type semiconductor 41. A conductive sheet 11 is embedded within the housing 3. Contacts 12 are located at both ends of the conductive sheet 11, penetrating the housing 3 and conducting between the P-type semiconductor 41 and the N-type semiconductor 42. These P-type semiconductor 41 and the N-type semiconductor 42 are connected to the control chip 31 of the control component 3 via wires, forming a closed circuit.
[0039] Furthermore, the conductive sheet 11 covers the entire interior of the housing 3, and the contact connector 32 is ring-shaped and fully conductively connected to the P-type semiconductor 41 and the N-type semiconductor 42. The provision of the fully contact conductive sheet 11 further ensures connectivity between the P-type semiconductor 41 and the N-type semiconductor 42, improving the electron transfer speed between the P-type semiconductor 41 and the N-type semiconductor 42, enabling the generation of a higher voltage current at a lower temperature, thereby better and more timely powering the control component 3.
[0040] Furthermore, the fire extinguishing microcapsules 2 are fixed on the gravity sensing module by flame retardant hot melt adhesive, and the melting temperature of the flame retardant hot melt adhesive is 100°C.
[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. An intelligent fire extinguishing early warning device, characterized by: It includes a shell with a vertical through-hole, in which fire-extinguishing microcapsules, a control component and a thermoelectric power generation module are arranged; the thermoelectric power generation module includes a P-type semiconductor arranged at the top of the shell through-hole and an N-type semiconductor at the bottom, and the shell, the P-type semiconductor and the N-type semiconductor at the bottom form a cavity for accommodating the fire-extinguishing microcapsules and the control component; the N-type semiconductor is provided with a through-hole for the fire-extinguishing microcapsules to pass through, and the through-hole is sealed with hot-melt adhesive. The P-type semiconductor, the N-type semiconductor and the control component form an electrical circuit, and the control component is provided with a communication module.
2. The intelligent fire extinguishing early warning device according to claim 1, characterized in that: A detection module electrically connected to the control component is also provided in the cavity of the intelligent fire extinguishing warning device. The fire extinguishing microcapsules are fixed on the detection module and face the N-type semiconductor side. The control component is arranged between the detection module and the P-type semiconductor.
3. The intelligent fire extinguishing early warning device according to claim 2, characterized in that: The detection module is a gravity sensing module.
4. The intelligent fire extinguishing early warning device according to claim 1, characterized in that: A conductive sheet is provided inside the shell, and contact joints are provided at both ends of the conductive sheet, which penetrate the shell and conduct with the P-type semiconductor and the N-type semiconductor; the control component is electrically connected to the P-type semiconductor and the N-type semiconductor through a wire.
5. The intelligent fire extinguishing early warning device according to claim 4, characterized in that: The conductive sheet covers the entire interior of the housing, and the contact joint is ring-shaped and is fully conductively connected to the P-type semiconductor and the N-type semiconductor.
6. The intelligent fire extinguishing early warning device according to claim 1, characterized in that: The longitudinal cross-section of the shell is arc-shaped.
7. The intelligent fire extinguishing early warning device according to claim 1, characterized in that: The N-type semiconductor is in the shape of a hollow ring.
8. The intelligent fire extinguishing early warning device according to claim 1, characterized in that: The surface of the N-type semiconductor is coated with a heat absorption layer, and the surface of the P-type semiconductor is coated with a heat insulation layer.
9. The intelligent fire extinguishing early warning device according to claim 1, characterized in that: The fire extinguishing microcapsules are fixed in the shell and the space enclosed by the P-type semiconductor and the N-type semiconductor by hot melt adhesive.