Cutting equipment based on semiconductor laser

Abstract

The utility model relates to the technical field of cutting equipment, in particular to cutting equipment based on a semiconductor laser, which comprises a main box, a numerical control plate arranged on the surface of the main box, and a trundle support arranged at the bottom of the main box. A sliding frame is arranged in the machining groove, a fixed frame is arranged on the surface of the machining groove, and a leakage plate is arranged below the fixed frame; the cutting device has the beneficial effects that an object needing to be cut is placed on the surface of an object placing plate in a machining groove, clamped between a positioning plate and a sliding plate and fixed between the sliding plate and the positioning plate, then cutting operation is adjusted by adjusting a numerical control plate on the surface of a main body box, and waste generated in the object cutting process is discharged through the numerical control plate; according to the cutting equipment for the semiconductor laser, the waste can enter the storage frame through the leakage plate, after cutting is completed, an operator can pull out the storage frame, and therefore the waste in the storage frame is cleaned, cleaning and collecting of the waste in the cutting process of the cutting equipment for the semiconductor laser are achieved, and the continuous operation capacity of the cutting equipment is guaranteed.

Description

Technical Field

[0001] The utility model relates to the field of cutting equipment, in particular to a cutting equipment based on a semiconductor laser. Background Art

[0002] Semiconductor laser cutting equipment uses high-energy-density laser beams to achieve fast and precise cutting of a variety of materials, especially metal materials. Compared with traditional cutting methods, semiconductor laser cutting machines have significant advantages: first, the cutting speed is fast and the efficiency is high, which can greatly shorten the production cycle; second, the cutting accuracy is high, the heat-affected zone is small, and the cutting seam is narrow and smooth, which improves the quality of the finished product; third, the cutting process is non-contact, which avoids tool wear and reduces maintenance costs; in addition, it has strong flexibility and can easily complete the cutting of complex patterns under software control to adapt to diversified production needs. In terms of environmental protection, laser cutting produces less waste and low noise, which is more in line with the concept of sustainable development. In summary, semiconductor laser cutting equipment, with its high efficiency, precision and environmental protection characteristics, is gradually becoming an indispensable advanced manufacturing tool in metal processing and other industrial fields.

[0003] In the existing technology, traditional semiconductor laser cutting equipment is mainly composed of a laser module, an optical focusing system, a control system and a work platform. The laser module generates a high-energy laser beam, the optical focusing system ensures that the laser is precisely focused on the material surface, the control system is responsible for the operation and precision control of the entire equipment, and the work platform carries and fixes the material. These components work together to achieve efficient and precise cutting of materials.

[0004] However, traditional semiconductor laser cutting equipment will produce some waste during cutting. These wastes will fall on the working platform and accumulate, which causes a decrease in production efficiency and damages the working environment. The accumulated waste will increase the cleaning time and affect the ability of the equipment to operate continuously. For this reason, the utility model proposes a cutting equipment based on semiconductor laser to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of the present invention is to provide a cutting device based on a semiconductor laser to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor laser-based cutting device, the semiconductor laser-based cutting device comprising: a main body box, a CNC board is provided on the surface of the main body box, and a caster bracket is provided on the bottom of the main body box;

[0007] A processing groove is provided with a sliding frame in the processing groove, a fixed frame is provided on the surface of the processing groove, and a leaking plate is provided below the fixed frame.

[0008] Preferably, the main body box is in a rectangular parallelepiped structure as a whole, a heat dissipation groove is provided on the side of the main body box, a fixing plate is provided at the bottom of the main body box, and a fixed bearing is provided on the surface of the fixing plate.

[0009] Preferably, a roller is embedded in the caster bracket, a hole is opened on the surface of the caster bracket, a fastening rod is provided in the hole, a roller is provided on the surface of the fastening rod, a fixing nut is provided on the surface of the caster bracket, the inner thread of the fixing nut is connected to one end of the fastening rod, a baffle is provided at the other end of the fastening rod, the baffle is fitted with the surface of the caster bracket, a connecting rod is provided at one section of the caster bracket, and one end of the connecting rod is fixedly connected to the inner ring surface of the fixed bearing.

[0010] Preferably, a pulley is inserted into the sliding frame, a rotating motor is provided on the surface of the pulley, a slider is provided at one end of the rotating motor, fixed frames are provided at both ends of the slider, a linear optical axis is inserted into the fixed frame, a linear bearing is provided on the surface of the linear optical axis, a fixed block is fixedly connected to the surface of the linear bearing, a telescopic rod is provided on the surface of the fixed block, and a laser cutter is provided on the surface of the telescopic rod.

[0011] Preferably, the fixed frame as a whole is in a "concave" shape, a skateboard is inserted into the fixed frame, a fixed plate is provided at one end of the fixed frame, a fixed spring is provided on the surface of the fixed plate, one end of the fixed spring is fixedly connected to the surface of the skateboard, a telescopic rod is provided on the surface of the fixed plate, and a positioning plate is provided at one end of the telescopic rod.

[0012] Preferably, a storage plate is provided on the surface of the leakage plate, a square groove is opened on the surface of the main box, a storage frame is provided in the square groove, and a leakage plate is provided on the surface of the storage frame.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The semiconductor laser-based cutting device proposed by the present invention, when in use, places the object to be cut on the surface of the placement plate in the processing groove, and clamps it between the positioning plate and the slide plate, and fixes it between the slide plate and the positioning plate, and then adjusts the cutting operation by adjusting the numerical control board on the surface of the main box. The waste generated in the process of cutting the object will enter the storage frame through the leakage plate. After the cutting is completed, the operator can draw out the storage frame to clean up the waste in the storage frame, thereby realizing the cleaning and collection of waste during the cutting process of the semiconductor laser cutting device, and ensuring the continuous operation capability of the cutting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a cross-sectional view of the internal structure of the utility model;

[0017] Figure 3This is a schematic diagram of the overall structure of the structural cutting device of the utility model;

[0018] Figure 4 This is a schematic diagram of the moving parts of the structure of the utility model.

[0019] In the figure: 1. Main box; 2. CNC board; 3. Caster bracket; 4. Processing groove; 5. Sliding frame; 6. Fixed frame; 7. Leakage plate; 8. Heat dissipation groove; 9. Fixed bearing; 10. Fastening rod; 11. Roller; 12. Pulley; 13. Slider; 14. Linear optical axis; 15. Linear bearing; 16. Telescopic rod; 17. Laser cutter; 18. Slide plate; 19. Fixed spring; 20. Storage board; 21. Storage frame; 22. Positioning plate. DETAILED DESCRIPTION

[0020] In order to clearly and completely describe the purpose and technical solution of the present invention and make its advantages more clearly understood, the following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention and are not intended to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-4 The utility model provides a technical solution: a cutting device based on a semiconductor laser, the cutting device based on a semiconductor laser comprises: a main body box 1, a numerical control board 2 is provided on the surface of the main body box 1, and a caster bracket 3 is provided on the bottom of the main body box 1;

[0022] A processing groove 4, a sliding frame 5 is provided in the processing groove 4, a fixed frame 6 is provided on the surface of the processing groove 4, and a leaking plate 7 is provided below the fixed frame 6;

[0023] During use, the object to be cut is placed on the surface of the placement plate 20 in the processing groove 4, and is clamped between the positioning plate 22 and the slide plate 18, and fixed between the slide plate 18 and the positioning plate 22. The cutting operation is then adjusted by adjusting the numerical control board 2 on the surface of the main box 1. The waste generated during the cutting process of the object will enter the storage frame 21 through the leakage plate 7. After the cutting is completed, the operator can pull out the storage frame 21 to clean up the waste in the storage frame 21, thereby realizing the cleaning and collection of waste by the semiconductor laser cutting equipment during the cutting process, and ensuring the continuous operation capability of the cutting equipment.

[0024] Example 2: Based on Example 1, a drain plate 7 is provided to prevent the accumulation of waste during the cutting process of the equipment. A storage plate 20 is provided on the surface of the drain plate 7. A square groove is provided on the surface of the main box 1. A storage frame 21 is provided in the square groove. The surface of the storage frame 21 is provided with a drain plate 7.

[0025] The main box 1 is a rectangular parallelepiped structure. A heat dissipation slot 8 is provided on the side of the main box 1. A fixing plate is provided at the bottom of the main box 1. A fixed bearing 9 is provided on the surface of the fixing plate.

[0026] In order to avoid the accumulation of waste during the cutting process and affect the continuous operation of the equipment, the waste generated during cutting will fall into the storage frame 21 through the holes opened on the surface of the leak plate 7. After the cutting is completed, the operator will clean the waste inside the storage frame 21.

[0027] Example 3: On the basis of Example 2, in order to facilitate the cutting of the product, a sliding frame 5 is provided, a pulley 12 is clamped in the sliding frame 5, a rotating motor is provided on the surface of the pulley 12, a slider 13 is provided at one end of the rotating motor, a fixing frame is provided at both ends of the slider 13, a linear optical axis 14 is clamped in the fixing frame, a linear bearing 15 is matched on the surface of the linear optical axis 14, a fixing block is fixedly connected to the surface of the linear bearing 15, a telescopic rod 16 is provided on the surface of the fixing block, and a laser cutter 17 is provided on the surface of the telescopic rod 16;

[0028] The fixed frame 6 is in a concave shape as a whole. A slide 18 is inserted into the fixed frame 6. A fixed plate is provided at one end of the fixed frame 6. A fixed spring 19 is provided on the surface of the fixed plate. One end of the fixed spring 19 is fixedly connected to the surface of the slide 18. A telescopic rod 16 is provided on the surface of the fixed plate. A positioning plate 22 is provided at one end of the telescopic rod 16.

[0029] In order to facilitate the cutting of products, the operator can use the CNC board 2 to start the telescopic rod 16 on the surface of the laser cutter 17, adjust the laser cutter 17 to a suitable position, and then start the rotary motor. The start of the rotary motor causes the pulley 12 in the slide frame 5 to rotate, thereby driving the lateral movement of the entire slider 13, and through the linear optical axis 14 and linear bearing 15 equipped on the surface of the slider 13, the laser cutter 17 is moved longitudinally, so that the laser cutter 17 can smoothly cut according to the route specified by the CNC board 2.

[0030] A roller 11 is inserted into the caster bracket 3, a hole is provided on the surface of the caster bracket 3, a fastening rod 10 is provided in the hole, a roller 11 is provided on the surface of the fastening rod 10, a fixing nut is provided on the surface of the caster bracket 3, the inner thread of the fixing nut is connected to one end of the fastening rod 10, a baffle is provided on the other end of the fastening rod 10, the baffle is in contact with the surface of the caster bracket 3, a connecting rod is provided on one section of the caster bracket 3, one end of the connecting rod is fixedly connected to the inner ring surface of the fixed bearing 9;

[0031] In order to cut the product, when the equipment needs to be moved, the operator can rotate the fastening rod 10 to increase the distance between the caster brackets 3 so that the roller 11 can rotate freely, and then move the equipment to a suitable position, and rotate the fastening rod 10 again to fix the roller 11 inside the caster bracket 3, thereby fixing the equipment at the current position.

[0032] During actual use, the object to be cut is placed on the surface of the placement plate 20 in the processing groove 4, and is clamped between the positioning plate 22 and the slide 18, and fixed between the slide 18 and the positioning plate 22. The cutting operation is then adjusted by adjusting the CNC board 2 on the surface of the main box 1. The waste generated during the cutting process of the object will enter the storage frame 21 through the leak plate 7. After the cutting is completed, the operator can pull out the storage frame 21 to clean up the waste in the storage frame 21, thereby avoiding the accumulation of waste during the cutting process of the semiconductor laser cutting equipment and ensuring the continuous operation capability of the cutting equipment.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cutting device based on a semiconductor laser, characterized in that: The semiconductor laser-based cutting device comprises: a main body box (1), a numerical control board (2) is provided on the surface of the main body box (1), and a caster bracket (3) is provided on the bottom of the main body box (1); A processing groove (4) is provided with a sliding frame (5) in the processing groove (4), a fixing frame (6) is provided on the surface of the processing groove (4), and a leaking plate (7) is provided below the fixing frame (6).

2. The semiconductor laser cutting device according to claim 1, characterized in that: The main box (1) is in a rectangular parallelepiped structure as a whole. A heat dissipation slot (8) is provided on the side of the main box (1). A fixing plate is provided on the bottom of the main box (1). A fixing bearing (9) is provided on the surface of the fixing plate.

3. The semiconductor laser cutting device according to claim 1, characterized in that: A roller (11) is inserted into the caster bracket (3), a hole is provided on the surface of the caster bracket (3), a fastening rod (10) is provided in the hole, a roller (11) is provided on the surface of the fastening rod (10), a fixing nut is provided on the surface of the caster bracket (3), an inner thread of the fixing nut is connected to one end of the fastening rod (10), a baffle is provided at the other end of the fastening rod (10), the baffle is fitted with the surface of the caster bracket (3), a connecting rod is provided at one section of the caster bracket (3), one end of the connecting rod is fixedly connected to the inner ring surface of the fixed bearing (9).

4. The semiconductor laser cutting device according to claim 1, characterized in that: A pulley (12) is inserted into the sliding frame (5), a rotating motor is provided on the surface of the pulley (12), a slider (13) is provided at one end of the rotating motor, a fixing frame is provided at both ends of the slider (13), a linear optical axis (14) is inserted into the fixing frame, a linear bearing (15) is matched on the surface of the linear optical axis (14), a fixing block is fixedly connected to the surface of the linear bearing (15), a telescopic rod (16) is provided on the surface of the fixing block, and a laser cutter (17) is provided on the surface of the telescopic rod (16).

5. The semiconductor laser cutting device according to claim 1, characterized in that: The fixed frame (6) is in a concave shape as a whole. A slide plate (18) is inserted into the fixed frame (6). A fixed plate is provided at one end of the fixed frame (6). A fixed spring (19) is provided on the surface of the fixed plate. One end of the fixed spring (19) is fixedly connected to the surface of the slide plate (18). A telescopic rod (16) is provided on the surface of the fixed plate. A positioning plate (22) is provided at one end of the telescopic rod (16).

6. The semiconductor laser cutting device according to claim 1, characterized in that: The surface of the leakage plate (7) is provided with a storage plate (20), the surface of the main box (1) is provided with a square groove, a storage frame (21) is provided in the square groove, and the surface of the storage frame (21) is provided with the leakage plate (7).

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