Semiconductor processing silicon wafer cutting equipment

Abstract

The utility model discloses a silicon wafer cutting device for semiconductor processing, which belongs to the technical field of silicon wafers and comprises a processing bin serving as a mounting carrier, and a cutting mechanism used for cutting silicon wafers is arranged at the top end in the processing bin. A reciprocating motion mechanism is arranged at the bottom end of the interior of the processing bin, a rotating disc mechanism used for containing silicon wafers is arranged at the top of the reciprocating motion mechanism, a flushing mechanism used for flushing the silicon wafers on the rotating disc mechanism is arranged on one side of the interior of the processing bin, and a bin door is hinged to the end, away from one side of the flushing mechanism, of the processing bin; an observation window is arranged on the outer side of the bin door, and a drainage pipe is arranged at the bottom of the processing bin. According to the utility model, the two groups of cutting assemblies are arranged to cut and process the silicon wafer, and the distance that the two groups of cutting assemblies are far away from each other or close to each other is always the same, so that the cutting efficiency of the cutting equipment is further improved on the premise of ensuring the cutting precision.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafers, in particular to a semiconductor processing silicon wafer cutting device. Background Art

[0002] A wafer refers to a silicon chip used in the production of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. A round crystal refers to a silicon chip used in the production of silicon semiconductor integrated circuits. Due to its round shape, it is called a round crystal. A round crystal is a carrier used in the production of integrated circuits. In general, wafers refer to single-crystal silicon wafers. Single-crystal silicon wafers are pulled and refined from ordinary silicon sand, and then made into single-crystal silicon rods through a series of measures such as dissolution, purification, and distillation. After polishing and slicing, the single-crystal silicon rods become round crystals. In the process of processing single-crystal silicon rods, they need to be cut, so semiconductor processing silicon wafer cutting equipment was born.

[0003] Currently, when cutting silicon wafers, they are often cut through a group of cutting structures. However, the cutting efficiency of this method is very limited, and it is impossible to further improve the cutting efficiency of the cutting equipment while ensuring cutting accuracy. At the same time, in the process of cutting silicon wafers, if the silicon wafers are not fixed properly, it is easy to cause the position of the silicon wafers to shift, and then cause the cutting route of the silicon wafers to shift, thereby reducing the yield rate of the silicon wafers after cutting.

[0004] Therefore, it is urgent to provide a semiconductor processing silicon wafer cutting equipment to solve the above problems. Utility Model Content

[0005] The technical problem to be solved by the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a semiconductor processing silicon wafer cutting device.

[0006] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a semiconductor processing silicon wafer cutting equipment, including a processing chamber as a mounting carrier, a cutting mechanism for cutting silicon wafers is provided at the top of the processing chamber, a reciprocating movement mechanism is provided at the bottom of the processing chamber, and a turntable mechanism for placing silicon wafers is provided on the top of the reciprocating movement mechanism, a flushing mechanism for flushing the silicon wafers on the turntable mechanism is provided on one side of the processing chamber, a chamber door is hinged at one end of the processing chamber away from the flushing mechanism, and an observation window is provided on the outside of the chamber door, and a drain pipe is provided at the bottom of the processing chamber.

[0007] The utility model is further configured as follows: the cutting mechanism includes a bidirectional screw located in the middle position of the top end inside the processing chamber, and movable seats are symmetrically provided with threads at both ends of the outer side of the bidirectional screw. Two groups of first sliding rods are commonly installed on the tops of the two ends of the processing chamber, and the two groups of first sliding rods pass through both sides of the two groups of movable seats. A first servo motor that drives the bidirectional screw to rotate is installed on the top of one end of the processing chamber, and electric telescopic rods are symmetrically installed at the middle position of the bottom of the two groups of movable seats, and a cutting assembly is installed at the output end of the electric telescopic rod.

[0008] Through the above technical solution, every time the holding tray is folded back, the electric telescopic rod is controlled to shorten, and the first servo motor is controlled to drive the bidirectional screw to rotate clockwise, so that the two sets of moving seats and the cutting components move closer to each other by a distance of one cutting unit. Then, the electric telescopic rod is controlled to extend, so that the cutting component descends and performs a second cutting process on the folded back silicon wafer. In this way, the silicon wafer can be subjected to multiple longitudinal cutting processes by repeating the process.

[0009] The utility model is further configured as follows: the cutting assembly includes a fixing frame fixedly connected to the output end of the electric telescopic rod, a rotating motor is installed inside the fixing frame, and a cutting blade is installed at the output end of the rotating motor, a protective shell is installed on the outside of the fixing frame, and the cutting blade is located directly below the protective shell.

[0010] Through the above technical solution, the silicon wafer can be stably cut by controlling the rotating motor to drive the cutting blade, and the protective shell can block the debris generated by the cutting to prevent the debris from flying around.

[0011] The utility model is further configured as follows: the reciprocating mechanism includes a second sliding rod located at the bottom of both ends of the processing chamber, and two groups of second sliding rods are symmetrically sleeved on the outer sides with moving sliders, and a moving plate is commonly installed on the tops of the two groups of moving sliders. Electric push rods are symmetrically installed at both ends of the processing chamber away from the chamber door, and the output ends of the two groups of electric push rods are fixedly connected to the bottom of the moving plate.

[0012] Through the above technical solution, by controlling the extension and retraction of the electric push rod, the movable plate can be freely controlled to move back and forth inside the processing chamber, and then combined with the cutting mechanism to realize the cutting processing of silicon wafers. During the process, the movable slider slides on the second slide rod.

[0013] The utility model is further configured as follows: the turntable mechanism includes a rotatable rotating tube located in the middle position of the top of the movable plate, the top of the rotating tube is installed with a bottom bin, and the top of the bottom bin is installed with a containing plate, the bottom of the movable plate is provided with a driving assembly for driving the rotating tube to rotate, the bottom of the movable plate is installed with an air pump, and the input end of the air pump is connected with the bottom of the rotating tube through a conduit, the top of the containing plate is evenly provided with through holes connected with the top of the bottom bin, and an electromagnetic valve is installed on the outside of the bottom bin.

[0014] Through the above technical solution, the vacuum pump is controlled to cooperate with the rotating tube to evacuate the interior of the bottom bin, so that the interior of the bottom bin is in a negative pressure state, and the silicon wafers are tightly sucked to the top of the holding plate. After the silicon wafers are cut, the bin door is opened and the electromagnetic valve is controlled to open to allow the pressure inside the bottom bin to return to normal, which is convenient for replacing the next group of silicon wafers to be processed. After the cutting mechanism cuts the silicon wafers longitudinally, it controls the drive component to drive the holding plate to rotate 90°, and the silicon wafers can be cut horizontally through the cutting mechanism.

[0015] The utility model is further configured as follows: the driving assembly includes a second servo motor located at the bottom of the movable plate, the output shaft of the second servo motor is installed with a worm, and the bottom end of the outer side of the rotating tube is installed with a worm wheel meshing with the worm.

[0016] Through the above technical solution, the second servo motor is controlled to drive the worm to rotate, and the transmission of the worm and worm wheel drives the rotating tube to rotate 90° clockwise each time and then stably rotate 90° counterclockwise, so that the cutting mechanism can perform horizontal cutting on the silicon wafer after performing longitudinal cutting on the silicon wafer.

[0017] The present utility model is further configured as follows: the flushing mechanism includes a transverse frame, which is obliquely arranged on one side of the interior of the processing chamber, a connecting water pipe is installed on one side of the transverse frame, and flushing nozzles connected to the interior of the connecting water pipe are evenly installed on the other side of the transverse frame, a water supply pump is installed at the bottom of one end of the processing chamber, and the output end of the water supply pump is connected to the interior of the connecting water pipe, and the input end of the water supply pump is connected to an external water supply pipe.

[0018] Through the above technical solution, the water supply pump is controlled to cooperate with the external water supply pipe to transport the flushing water to the connecting water pipe, and then multiple groups of flushing nozzles on the other side of the horizontal frame spray the flushing water onto the surface of the silicon wafer being cut. Since the horizontal frame is set at an angle, it can cooperate with the reciprocating movement mechanism to comprehensively flush all parts of the surface of the silicon wafer.

[0019] The utility model is further configured as follows: connecting bearings are symmetrically installed at both ends of the outer side of the bidirectional screw rod, and the outer rings of the two sets of connecting bearings are respectively fixedly connected to the inner ends of the processing chamber.

[0020] The above technical solution helps to ensure the stability of the bidirectional lead screw during rotation when the first servo motor drives the bidirectional lead screw to rotate.

[0021] The beneficial effects of the utility model are as follows:

[0022] 1. The present invention cuts silicon wafers by setting up two sets of cutting components, and can ensure that the distance between the two sets of cutting components is always the same, thereby further improving the cutting efficiency of the cutting equipment while ensuring cutting accuracy.

[0023] 2. The utility model freely controls the pressure inside the bottom bin through the cooperation of the vacuum pump and the electromagnetic valve. When the bottom bin is in a negative pressure state, the bottom of the silicon wafer on the holding plate can be forced to be tightly sucked, so that the silicon wafer can always be relatively stable during the cutting process, ensuring that the cutting path of the silicon wafer by the cutting equipment will not deviate, thereby ensuring the yield rate of the silicon wafer after cutting processing. It can also drive the silicon wafer to rotate quickly 90° by controlling the holding plate, so that the cutting mechanism can switch from longitudinal cutting to transverse cutting of the silicon wafer, thereby further improving the cutting efficiency of the cutting equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0025] Figure 2 This is a three-dimensional schematic diagram of the utility model after the warehouse door is disassembled;

[0026] Figure 3 This is a three-dimensional schematic diagram of the utility model after the warehouse door and the processing warehouse top are disassembled;

[0027] Figure 4 It is a three-dimensional schematic diagram of the cutting assembly of the utility model;

[0028] Figure 5 This is a schematic diagram of the longitudinal moving mechanism of the utility model from a first perspective;

[0029] Figure 6 This is a schematic diagram of the longitudinal moving mechanism of the utility model from a second perspective;

[0030] Figure 7 It is a vertical cross-sectional perspective diagram of the serving tray of the present invention;

[0031] Figure 8 For this utility model Figure 7 A magnified view of point A;

[0032] Figure: 1, processing chamber; 2, cutting mechanism; 201, bidirectional screw; 202, moving seat; 203, first slide; 204, first servo motor; 205, electric telescopic rod; 206, cutting assembly; 2061, fixed frame; 2062, rotating motor; 2063, cutting blade; 2064, protective shell; 3, reciprocating mechanism; 301, second slide; 302, moving slider; 303, moving plate; 304, electric Push rod; 4. Turntable mechanism; 401. Serving plate; 402. Rotating tube; 403. Drive assembly; 4031. Second servo motor; 4032. Worm; 4033. Worm gear; 404. Vacuum pump; 405. Bottom bin; 406. Through hole; 407. Solenoid valve; 5. Flushing mechanism; 501. Horizontal rack; 502. Flushing nozzle; 503. Connecting water pipe; 504. Water supply pump; 6. Bin door; 7. Observation window; 8. Drain pipe. DETAILED DESCRIPTION

[0033] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0034] like Figure 1 - Figure 4 As shown, a cutting mechanism 2 for cutting silicon wafers is provided at the top of the processing chamber 1. The cutting mechanism 2 includes a bidirectional screw rod 201 located in the middle position of the top of the processing chamber 1. The two ends of the outer side of the bidirectional screw rod 201 are symmetrically threaded with a moving seat 202. Two groups of first slide rods 203 are commonly installed on the top of the two ends of the processing chamber 1, and the two groups of first slide rods 203 pass through the two sides of the two groups of moving seats 202. A first servo motor 204 that drives the bidirectional screw rod 201 to rotate is installed on the top of one end of the processing chamber 1. An electric telescopic rod 205 is symmetrically installed in the middle position of the bottom of the two groups of moving seats 202. A cutting assembly 206 is installed at the output end of the electric telescopic rod 205. The cutting assembly 206 includes a fixed frame fixedly connected to the output end of the electric telescopic rod 205. 2061, a rotating motor 2062 is installed inside the fixed frame 2061, and a cutting blade 2063 is installed at the output end of the rotating motor 2062, a protective shell 2064 is installed on the outside of the fixed frame 2061, and the cutting blade 2063 is located directly below the protective shell 2064. Whenever the holding tray 401 is folded back once, the electric telescopic rod 205 is controlled to shorten, and the first servo motor 204 is controlled to drive the bidirectional screw 201 to rotate clockwise, so that the two sets of moving seats 202 and the cutting assembly 206 move closer to each other by a distance of one cutting unit, and then the electric telescopic rod 205 is controlled to extend, so that the cutting assembly 206 descends and performs a second cutting process on the folded back silicon wafer. In this way, the silicon wafer can be subjected to multiple longitudinal cutting processes.

[0035] like Figure 5 - Figure 8 As shown, a reciprocating mechanism 3 is provided at the bottom of the processing chamber 1, and a turntable mechanism 4 for placing silicon wafers is provided on the top of the reciprocating mechanism 3. The reciprocating mechanism 3 includes a second slide bar 301 located at the bottom of both ends of the processing chamber 1, and two sets of second slide bars 301 are symmetrically sleeved with movable sliders 302 on the outside. A movable plate 303 is commonly installed on the top of the two sets of movable sliders 302. Electric push rods 304 are symmetrically installed at both ends of the processing chamber 1 away from the chamber door 6, and the outputs of the two sets of electric push rods 304 are symmetrically installed. The ends are fixedly connected to the bottom of the movable plate 303. The turntable mechanism 4 includes a rotatable rotating tube 402 located in the middle of the top of the movable plate 303. The top of the rotating tube 402 is equipped with a bottom bin 405, and the top of the bottom bin 405 is equipped with a holding tray 401. The bottom of the movable plate 303 is provided with a driving assembly 403 for driving the rotating tube 402 to rotate. The bottom of the movable plate 303 is equipped with an air pump 404, and the input end of the air pump 404 is connected to the bottom of the rotating tube 402 through a conduit. The holding tray 401 The top of the bottom chamber 405 is evenly provided with through holes 406 that are connected to the top of the bottom chamber 405. An electromagnetic valve 407 is installed on the outside of the bottom chamber 405. The driving component 403 includes a second servo motor 4031 located at the bottom of the movable plate 303. The output shaft of the second servo motor 4031 is installed with a worm 4032. The bottom end of the outer side of the rotating tube 402 is installed with a worm gear 4033 that meshes with the worm 4032. The pressure inside the bottom chamber 405 is freely controlled by the cooperation of the air pump 404 and the electromagnetic valve 407. When the bottom chamber 405 is in a negative pressure state, the bottom of the silicon wafer on the holding plate 401 can be forced to be tightly sucked, so that the silicon wafer can always be relatively stable during the cutting process, ensuring that the cutting path of the silicon wafer by the cutting equipment will not deviate. By controlling the extension and retraction of the electric push rod 304, the movable plate 303 can be freely controlled to move back and forth inside the processing chamber 1, and then cooperated with the cutting mechanism 2 to realize the cutting processing of the silicon wafer. During the process, the movable slider 302 slides on the second slide bar 301.

[0036] When the storage tank 401 is in use, the storage tank 401 is manually opened and the electric push rod 304 is controlled to extend. The electric push rod 304 pushes the movable plate 303 to slide to one side of the storage tank 6 on the second slide rod 301, and then the silicon wafer is placed on the holding tray 401, the storage tank 6 is closed and the electric push rod 304 is controlled to shorten. At the same time, the vacuum pump 404 is controlled to cooperate with the rotating tube 402 to exhaust air inside the bottom storage tank 405, so that the interior of the bottom storage tank 405 is in a negative pressure state, and the silicon wafer is tightly sucked to the top of the holding tray 401. Then, the cutting assembly 206 is controlled to cut the silicon wafer passing thereunder. Whenever the movable plate 303 moves to the farthest distance from the storage tank door 6, the electric push rod 304 is controlled to extend to allow the silicon wafer on the holding tray 401 to move back and forth inside the processing chamber 1. Every time the holding tray 401 turns back, the electric telescopic rod 205 is controlled to shorten, and the first servo motor 204 is controlled to drive the bidirectional screw rod 201 to rotate The clockwise rotation allows the two sets of movable seats 202 to move the cutting components 206 closer to each other by a distance of one cutting unit, and then the electric telescopic rod 205 is controlled to extend, allowing the cutting component 206 to descend and fold the returned silicon wafer for a second cutting process. During the process, the water supply pump 504 is controlled to transport the flushing water to the connecting water pipe 503, and then the flushing nozzle 502 sprays the flushing water in the connecting water pipe 503 onto the silicon wafer being cut. After the silicon wafer is cut longitudinally, the driving component 403 is controlled to cooperate with the rotating tube 402 to drive the holding plate 401 to rotate 90° clockwise, and then repeat the above-mentioned silicon wafer cutting process. The flushing water is collected at the bottom of the processing chamber 1 and discharged by the drain pipe 8. After the silicon wafer is cut, the chamber door 6 is opened and the electromagnetic valve 407 is controlled to open to allow the internal pressure of the bottom chamber 405 to return to normal, and the cutting process is continued after a new group of silicon wafers are replaced.

[0037] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor processing silicon wafer cutting device, comprising a processing chamber (1) as a mounting carrier, characterized in that: A cutting mechanism (2) for cutting silicon wafers is provided at the top of the processing chamber (1), a reciprocating mechanism (3) is provided at the bottom of the processing chamber (1), and a turntable mechanism (4) for placing silicon wafers is provided on the top of the reciprocating mechanism (3), a flushing mechanism (5) for flushing silicon wafers on the turntable mechanism (4) is provided on one side of the processing chamber (1), a chamber door (6) is hingedly connected to one end of the processing chamber (1) away from the flushing mechanism (5), and an observation window (7) is provided on the outside of the chamber door (6), and a drain pipe (8) is provided at the bottom of the processing chamber (1).

2. The semiconductor processing silicon wafer cutting equipment according to claim 1, characterized in that: The cutting mechanism (2) comprises a bidirectional screw rod (201) located at the middle position of the top end inside the processing chamber (1), and movable seats (202) are symmetrically provided with threads at both ends of the outer side of the bidirectional screw rod (201), and two groups of first sliding rods (203) are installed on the top of both ends inside the processing chamber (1), and the two groups of first sliding rods (203) both pass through the two sides of the two groups of movable seats (202), and a first servo motor (204) for driving the bidirectional screw rod (201) to rotate is installed on the top of one end of the processing chamber (1), and electric telescopic rods (205) are symmetrically installed at the middle position of the bottom of the two groups of movable seats (202), and a cutting assembly (206) is installed at the output end of the electric telescopic rod (205).

3. The semiconductor processing silicon wafer cutting equipment according to claim 2, characterized in that: The cutting assembly (206) comprises a fixing frame (2061) fixedly connected to the output end of the electric telescopic rod (205); a rotating motor (2062) is installed inside the fixing frame (2061); and a cutting blade (2063) is installed at the output end of the rotating motor (2062); a protective shell (2064) is installed outside the fixing frame (2061); and the cutting blade (2063) is located directly below the protective shell (2064).

4. The semiconductor processing silicon wafer cutting equipment according to claim 1, characterized in that: The reciprocating mechanism (3) comprises a second slide bar (301) located at the bottom of both ends of the processing chamber (1); two groups of second slide bars (301) are symmetrically sleeved with movable sliders (302) on the outside; a movable plate (303) is commonly installed on the top of the two groups of movable sliders (302); electric push rods (304) are symmetrically installed at both ends of the processing chamber (1) away from the chamber door (6), and the output ends of the two groups of electric push rods (304) are fixedly connected to the bottom of the movable plate (303).

5. The semiconductor processing silicon wafer cutting equipment according to claim 1, characterized in that: The turntable mechanism (4) comprises a rotatable rotating tube (402) located at the middle position of the top of the movable plate (303); a bottom bin (405) is installed at the top of the rotating tube (402), and a holding tray (401) is installed at the top of the bottom bin (405); a driving assembly (403) for driving the rotating tube (402) to rotate is provided at the bottom of the movable plate (303); an air pump (404) is installed at the bottom of the movable plate (303), and the input end of the air pump (404) is connected to the bottom of the rotating tube (402) through a conduit; through holes (406) are evenly opened on the top of the holding tray (401) and are connected to the top of the bottom bin (405); and an electromagnetic valve (407) is installed on the outside of the bottom bin (405).

6. The semiconductor processing silicon wafer cutting equipment according to claim 5, characterized in that: The driving assembly (403) includes a second servo motor (4031) located at the bottom of the movable plate (303), the output shaft of the second servo motor (4031) is installed with a worm (4032), and the bottom end of the outer side of the rotating tube (402) is installed with a worm wheel (4033) that meshes with the worm (4032).

7. The semiconductor processing silicon wafer cutting equipment according to claim 1, characterized in that: The flushing mechanism (5) comprises a transverse frame (501) which is tiltedly arranged on one side of the interior of the processing chamber (1); a connecting water pipe (503) is installed on one side of the transverse frame (501); and flushing nozzles (502) which are in communication with the interior of the connecting water pipe (503) are evenly installed on the other side of the transverse frame (501); a water supply pump (504) is installed at the bottom of one end of the processing chamber (1); the output end of the water supply pump (504) is in communication with the interior of the connecting water pipe (503); and the input end of the water supply pump (504) is in communication with an external water supply pipe.

8. The semiconductor processing silicon wafer cutting equipment according to claim 2, characterized in that: Connecting bearings are symmetrically mounted on both ends of the outer side of the bidirectional screw rod (201), and the outer rings of the two sets of connecting bearings are fixedly connected to the inner ends of the processing chamber (1) respectively.

Images