Wafer coating equipment

Abstract

The utility model discloses wafer coating equipment which comprises supporting legs, a shell is mounted at the top ends of the supporting legs, a water outlet is mounted on one side of the bottom end of the shell, an atomizing nozzle is mounted at the bottom end of a guide pipe, and a stirring mechanism is mounted in the shell. The moving groove is formed in the disc body, the threaded rod in the moving groove can rotate, the screwing block can be grabbed to drive the threaded rod to rotate, the threaded rod rotates to drive the limiting plate in threaded connection with the threaded rod to move, the limiting plate and the moving groove form a sliding structure, and the limiting plate can move along the moving groove. The limiting plates move to adjust the positions of the limiting plates, the limiting plates can limit wafers of different sizes, the number of the limiting plates is three, the wafers can be stably limited through triangular limiting, the situation that the wafers deviate when the disc body rotates can be prevented, and therefore the purpose that the wafers are conveniently limited by the wafer coating equipment is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer coating device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and then doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, which is also a wafer. Coating is to coat a very thin transparent film on the surface. The purpose is to reduce light reflection, increase light transmittance, resist UV rays, and suppress glare and ghosting. Different colors of coatings also make the imaging color balance different. In addition, coating can also delay the aging and discoloration of lenses. When coating the wafer, a wafer coating equipment is required.

[0003] To this end, China's patent application number is CN209210916U, which discloses a wafer coating device. The wafer coating device includes: a first container for holding a first liquid; a second container for holding a second liquid; a first dripping unit for dripping the first liquid; a second dripping unit for dripping the second liquid; a base for fixing a wafer, the wafer having a pattern; a glue spreader for evenly coating the liquid on the patterned surface of the wafer; a controller coupled to the first dripping unit, the second dripping unit and the glue spreader, configured to control the first dripping unit to obtain a first amount of the first liquid from the first container and drip the first liquid on the wafer; control the glue spreader to evenly coat the first liquid on the patterned surface of the wafer; control the second dripping unit to obtain a second amount of the second liquid from the second container and drip the second liquid on the wafer; control the glue spreader to evenly coat the second liquid on the patterned surface of the wafer. The present disclosure can overcome the problem of easy generation of voids during the SOD process.

[0004] 1. The above-mentioned wafer coating equipment is proposed to overcome the problem of voids that are easily generated during the SOD process. However, when the above-mentioned device drives the wafer for coating, it only places the wafer on the top of the base. The wafer may shift during processing, causing the wafer to fall off during wafer coating.

[0005] 2. When the wafer is being coated, it is difficult to adjust the height of the disc, and the wafer cannot adapt to different situations. When the wafer is being installed, it will be difficult to install the wafer if the disc position is too low. Utility Model Content

[0006] The purpose of the utility model is to provide a wafer coating device to solve the defects of the existing wafer coating device that it is difficult to limit the wafer and difficult to adjust the height of the wafer.

[0007] In order to solve the above technical problems, the present utility model provides the following technical solutions: a wafer coating device, comprising a support leg;

[0008] A housing is installed at the top of the support leg, a water outlet is installed on one side of the bottom of the housing, a rotating motor is installed at the bottom of the housing, and a telescopic mechanism is installed at the top of the rotating motor;

[0009] A disc is mounted on the top of the telescopic mechanism, and a limiting structure is mounted on the top of the disc. The limiting structure includes a screw block, a limiting plate, a threaded rod, and a movable groove. The movable groove is mounted inside the disc, and a threaded rod is movably connected inside the movable groove. A screw block is mounted on one side of the threaded rod, and the top of the threaded rod is movably connected to the limiting plate.

[0010] A water tank is installed on one side of the shell, a pump body is installed on one side of the top of the water tank, conduits are installed on the top and bottom of the pump body, an atomizing nozzle is installed on the bottom of the conduit, and a stirring mechanism is installed inside the shell.

[0011] When in use, the pump body first works to suck out the evaporated gas, then guides it through the conduit, and then atomizes it through the atomizing nozzle. The atomized coating liquid can be sprayed on the top of the wafer. By atomizing the raw material, the uniformity of the coating on the wafer surface can be improved. The rotating motor will drive the first telescopic rod, the second telescopic rod and the disk body to rotate. The rotation of the disk body will generate centrifugal force. Through the eccentricity, the raw materials are evenly adsorbed on the wafer surface. In addition, through transportation, the size of the eccentricity can be controlled, thereby controlling the strength of the eccentricity and the thickness of the coating.

[0012] Furthermore, an evaporator is embedded in the interior of the water tank. The evaporator is serpentine in shape and can evaporate the coating liquid when the evaporator is working.

[0013] Furthermore, the stirring mechanism includes a servo motor, a stirring shaft and a stirring blade. The servo motor is installed at the bottom end of the water tank, the top of the servo motor is installed with a stirring shaft, and stirring blades are installed on both sides of the stirring shaft. When the servo motor is working, it will drive the stirring shaft and the stirring blades to rotate, and the rotation of the stirring blades will stir the coating liquid.

[0014] Furthermore, the telescopic mechanism includes a first telescopic rod, a second telescopic rod, a hydraulic rod and a hydraulic cylinder. The second telescopic rod is installed at the bottom end inside the shell, the bottom end inside the second telescopic rod is installed with a hydraulic cylinder, and the top end of the hydraulic cylinder is installed with a hydraulic rod, and the top end of the hydraulic rod is installed with the first telescopic rod. The operation of the hydraulic cylinder will drive the hydraulic rod to extend and retract, and the extension and retraction of the hydraulic rod will drive the first telescopic rod to extend and retract.

[0015] Furthermore, the first telescopic rod and the second telescopic rod form a sliding structure, the outer diameter of the first telescopic rod is smaller than the inner diameter of the second telescopic rod, and the first telescopic rod can be telescoped inside the second telescopic rod.

[0016] Furthermore, a slider is provided at the bottom end of the limiting plate, a sliding groove is provided inside the movable groove, and the limiting plate and the movable groove constitute a sliding structure, and the limiting plate can slide inside the movable groove.

[0017] Furthermore, external threads are evenly provided on the outer side wall of the threaded rod, and internal threads that cooperate with the external threads are evenly provided on the inner side wall of the limiting plate. The threaded rod and the limiting plate are threadedly connected, and the rotation of the threaded rod can drive the limiting plate to move.

[0018] The wafer coating equipment provided by the utility model has the following advantages: after the wafer is placed on the top of the tray, the position of the limit plate can be adjusted to limit the wafer between the limit plates, so that when the tray rotates, the wafer will not be offset. The operation of the hydraulic cylinder can drive the hydraulic rod to extend and retract, and the extension and retraction of the hydraulic rod adjusts the lifting and lowering of the telescopic rod. The lifting and lowering of the telescopic rod will adjust the height of the tray, so that the tray can adapt to different situations.

[0019] By installing a movable groove inside the disk body, the threaded rod inside the movable groove can rotate, and the screw block can be grasped to drive the threaded rod to rotate. The rotation of the threaded rod will drive the limit plate threadedly connected to it to move. The limit plate and the movable groove form a sliding structure. The limit plate can move along the movable groove. The limit plate moves to adjust the position of the limit plate, so that the limit plate can limit wafers of different sizes. There are three limit plates, and the wafer can be stably limited by the triangular limit, which can prevent the wafer from offsetting when the disk body rotates, so as to achieve the purpose of facilitating the limitation of the wafer by the wafer coating equipment.

[0020] The top of the second telescopic rod is movably connected to the first telescopic rod, and the first telescopic rod can slide inside the second telescopic rod. The operation of the hydraulic cylinder will drive the hydraulic rod to extend and retract, and the extension and retraction of the hydraulic rod can drive the first telescopic rod at the top to slide. The sliding of the first telescopic rod can adjust the height of the top disk body, so that the disk body can adapt to different situations and facilitate the placement of different wafers, thereby achieving the purpose of facilitating the adjustment of the disk body height of the wafer coating equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 This is a schematic diagram of the front cross-sectional structure of the present utility model;

[0023] Figure 3For the utility model Figure 2 A schematic diagram of the enlarged structure of the local section at point A in the middle;

[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of the disk body of the utility model;

[0025] Figure 5 This is a schematic diagram of a partial cross-sectional structure of the telescopic mechanism of the present invention.

[0026] Explanation of the reference numerals in the figure: 1. Outer casing; 2. Water tank; 3. Evaporator; 4. Stirring mechanism; 401. Servo motor; 402. Stirring shaft; 403. Stirring blade; 5. Support leg; 6. Rotating motor; 7. Water outlet; 8. Telescopic mechanism; 801. First telescopic rod; 802. Second telescopic rod; 803. Hydraulic rod; 804. Hydraulic cylinder; 9. Disc; 10. Limiting structure; 1001. Twist block; 1002. Limiting plate; 1003. Threaded rod; 1004. Moving groove; 11. Atomizing nozzle; 12. Conduit; 13. Pump body. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 5 , an embodiment provided by the present invention: a wafer coating device, including a support leg 5.

[0029] A shell 1 is installed at the top of the support leg 5, and a water outlet 7 is installed on one side of the bottom end of the shell 1. A rotating motor 6 is installed at the bottom end of the inside of the shell 1, and a telescopic mechanism 8 is installed at the top of the rotating motor 6. The telescopic mechanism 8 includes a first telescopic rod 801, a second telescopic rod 802, a hydraulic rod 803 and a hydraulic cylinder 804. The second telescopic rod 802 is installed at the bottom end of the inside of the shell 1, and a hydraulic cylinder 804 is installed at the bottom end of the inside of the second telescopic rod 802, and a hydraulic rod 803 is installed at the top of the hydraulic cylinder 804. The first telescopic rod 801 is installed at the top of the hydraulic rod 803. The first telescopic rod 801 and the second telescopic rod 802 constitute a sliding structure. The outer diameter of the first telescopic rod 801 is smaller than the inner diameter of the second telescopic rod 802.

[0030] Refer to the attached Figure 2 and attached Figure 5As shown, the first telescopic rod 801 can slide inside the second telescopic rod 802, and the operation of the hydraulic cylinder 804 will drive the hydraulic rod 803 to extend and retract. The extension and retraction of the hydraulic rod 803 can drive the first telescopic rod 801 at the top to slide. The sliding of the first telescopic rod 801 can adjust the height of the top disk body 9, so that the disk body 9 can adapt to different situations and facilitate the placement of different wafers.

[0031] A disk body 9 is installed at the top of the telescopic mechanism 8, and a limiting structure 10 is installed at the top of the disk body 9. The limiting structure 10 includes a screw block 1001, a limiting plate 1002, a threaded rod 1003 and a movable groove 1004. The movable groove 1004 is installed inside the disk body 9. The internal movability of the movable groove 1004 is connected with the threaded rod 1003. The outer wall of the threaded rod 1003 is evenly provided with external threads, and the inner wall of the limiting plate 1002 is evenly provided with internal threads that cooperate with the external threads. The threaded rod 1003 and the limiting plate 1002 are threadedly connected.

[0032] A screw block 1001 is installed on one side of the threaded rod 1003, and the top of the threaded rod 1003 is movably connected to the limit plate 1002. A slider is provided at the bottom end of the limit plate 1002, and a sliding groove is provided inside the movable groove 1004. The limit plate 1002 and the movable groove 1004 constitute a sliding structure.

[0033] Refer to the attached Figure 1-2 and attached Figure 4 As shown, the threaded rod 1003 inside the movable groove 1004 can rotate, and the screw block 1001 can be grasped to drive the threaded rod 1003 to rotate. The rotation of the threaded rod 1003 will drive the limit plate 1002 that is threadedly connected to it to move. The limit plate 1002 and the movable groove 1004 form a sliding structure. The limit plate 1002 can move along the movable groove 1004. The limit plate 1002 moves to adjust the position of the limit plate 1002, so that the limit plate 1002 can limit wafers of different sizes. There are three limit plates 1002, and the wafer can be stably limited by the triangular limit, which can prevent the wafer from offsetting when the disk body 9 rotates.

[0034] A water tank 2 is installed on one side of the housing 1 , and an evaporator 3 is embedded in the interior of the water tank 2 . The evaporator 3 is in the shape of a snake.

[0035] A pump body 13 is installed on one side of the top of the water tank 2, and a conduit 12 is installed at the top and bottom of the pump body 13. An atomizing nozzle 11 is installed at the bottom of the conduit 12. A stirring mechanism 4 is installed inside the outer shell 1. The stirring mechanism 4 includes a servo motor 401, a stirring shaft 402 and a stirring blade 403. The servo motor 401 is installed at the bottom end of the water tank 2, and a stirring shaft 402 is installed at the top of the servo motor 401. Stirring blades 403 are installed on both sides of the stirring shaft 402.

[0036] Refer to the attached Figure 2-3 As shown, the wafer can be placed on the top of the tray 9, the coating liquid can be loaded into the water tank 2, and the evaporator 3 can evaporate the coating liquid when it is working. The servo motor 401 will drive the stirring shaft 402 to rotate, and the stirring shaft 402 will drive the stirring blade 403 to rotate. The rotation of the stirring blade 403 will stir the coating liquid, making the coating liquid evaporate faster. The pump body 13 can absorb the evaporated gas and then guide it through the conduit 12. It is atomized by the atomizing nozzle 11, and the atomized coating liquid can be sprayed on the top of the wafer. The uniformity of the coating on the wafer surface can be improved by atomizing the raw materials. The rotating motor 6 will drive the first telescopic rod 801, the second telescopic rod 802 and the tray 9 to rotate. The rotation of the tray 9 will generate centrifugal force. Through the centrifugal rate, the raw materials are evenly adsorbed on the wafer surface. In addition, through transportation, the size of the centrifugal rate is controlled, thereby controlling the strength of the centrifugal rate and the thickness of the coating. Excess coating liquid can be discharged through the water outlet 7.

[0037] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer coating device comprising a support leg (5); Its characteristics are: A housing (1) is installed at the top of the support leg (5), a water outlet (7) is installed on one side of the bottom of the housing (1), a rotating motor (6) is installed at the bottom of the housing (1), and a telescopic mechanism (8) is installed at the top of the rotating motor (6); A disc (9) is mounted on the top of the telescopic mechanism (8), a limiting structure (10) is mounted on the top of the disc (9), the limiting structure (10) comprises a screw block (1001), a limiting plate (1002), a threaded rod (1003) and a movable groove (1004), the movable groove (1004) is mounted inside the disc (9), the threaded rod (1003) is movably connected inside the movable groove (1004), a screw block (1001) is mounted on one side of the threaded rod (1003), and the top of the threaded rod (1003) is movably connected to the limiting plate (1002); A water tank (2) is installed on one side of the housing (1), a pump body (13) is installed on one side of the top end of the water tank (2), a conduit (12) is installed at the top and bottom ends of the pump body (13), an atomizing nozzle (11) is installed at the bottom end of the conduit (12), and a stirring mechanism (4) is installed inside the housing (1).

2. The wafer coating device according to claim 1, characterized in that: An evaporator (3) is embedded in the interior of the water tank (2), and the evaporator (3) is serpentine in shape.

3. The wafer coating device according to claim 1, characterized in that: The stirring mechanism (4) comprises a servo motor (401), a stirring shaft (402) and stirring blades (403); the servo motor (401) is mounted at the bottom end of the water tank (2); the stirring shaft (402) is mounted at the top end of the servo motor (401); and stirring blades (403) are mounted on both sides of the stirring shaft (402).

4. The wafer coating device according to claim 1, characterized in that: The telescopic mechanism (8) comprises a first telescopic rod (801), a second telescopic rod (802), a hydraulic rod (803) and a hydraulic cylinder (804); the second telescopic rod (802) is mounted at the bottom end inside the housing (1); the hydraulic cylinder (804) is mounted at the bottom end inside the second telescopic rod (802); the hydraulic rod (803) is mounted at the top end of the hydraulic cylinder (804); and the first telescopic rod (801) is mounted at the top end of the hydraulic rod (803).

5. The wafer coating device according to claim 4, characterized in that: The first telescopic rod (801) and the second telescopic rod (802) form a sliding structure, and the outer diameter of the first telescopic rod (801) is smaller than the inner diameter of the second telescopic rod (802).

6. The wafer coating device according to claim 1, characterized in that: A slider is provided at the bottom end of the limiting plate (1002), a sliding groove is provided inside the movable groove (1004), and the limiting plate (1002) and the movable groove (1004) constitute a sliding structure.

7. The wafer coating device according to claim 1, characterized in that: External threads are evenly arranged on the outer wall of the threaded rod (1003), and internal threads that cooperate with the external threads are evenly arranged on the inner wall of the limiting plate (1002). The threaded rod (1003) and the limiting plate (1002) are threadedly connected.

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