Insoluble anode pulse copper plating equipment

Abstract

The utility model relates to the field of insoluble anode copper plating, in particular to insoluble anode pulse copper plating equipment which can vertically rotate to replace an electrode, the used electrode is immersed into an electrode tank, and the unused electrode can rotate out of the electrode tank to protect the electrode. Comprising an electroplating pool, an electroplating bath is formed in the electroplating pool and is in a cuboid shape, vertical plates sliding vertically are arranged on the left outer side and the right outer side of the electroplating pool respectively, an insulated disc capable of vertically rotating to switch electrodes is arranged on the inner side of the upper end of each vertical plate, and four different electrodes are evenly and fixedly arranged on the edge of the inner side face of each disc in the circumferential direction. The vertical plate is in a vertical cuboid shape, and a sliding way groove matched with the vertical plate is embedded in the outer surface of the electroplating pool. Rectangular bosses are fixedly arranged on the front side and the rear side of the vertical plate respectively, and rectangular grooves in sliding fit with the rectangular bosses are embedded in the front side face and the rear side face of the slideway groove respectively. The device is easy to operate, convenient to use and suitable for various plating pieces.

Description

Technical Field

[0001] The utility model relates to the field of insoluble anode copper plating, in particular to insoluble anode pulse copper plating equipment. Background Art

[0002] With technological advancements and social development, PCB (Printed Circuit Board) manufacturing technology has rapidly evolved, with increasingly smaller sizes and increasingly demanding production process requirements. Some plated parts can utilize insoluble anodes instead of soluble anodes. Insoluble anodes do not dissolve into the electrolyte during electroplating. These anodes are typically made of chemically stable metals such as titanium and niobium. Electrode construction is typically based on the electrolytic structure design. Flat electrodes are the most commonly used, though circular and curved electrodes are also commonly used. Metal surface treatment processes utilize rectangular and linear electrodes. To quickly expel bubbles between electrodes when gas is generated, mesh, expanded metal mesh, or porous plates are preferred.

[0003] Chinese utility model patent application number 202322248987.6 discloses an insoluble anode copper electroplating device. A variety of electroplating anodes can be installed through the insulating rods provided on the drum. Plate anodes, curved anodes, cylindrical anodes, and mesh anodes can be used as needed to improve the electroplating effect on materials of different shapes, greatly increasing practicality compared to existing technologies. However, during use, it was found that it had defects: electrodes of various shapes were immersed in the electrode tank, and when the electrodes were switched, they rotated horizontally and circumferentially. Unused electrodes were also immersed in the electrode tank, causing varying degrees of damage, which was not conducive to extending the service life of the electrodes. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the utility model provides an insoluble anode pulse copper plating equipment, which can rotate vertically to replace the electrode. The used electrode is immersed in the electrode tank, and the unused electrode can be rotated out of the electrode tank, which protects the electrode and effectively solves the problems raised in the background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an insoluble anode pulse copper plating device, comprising an electroplating pool, wherein an electroplating tank is provided in the electroplating pool, and the electroplating tank is in the shape of a rectangular parallelepiped, and vertically sliding vertical plates are respectively provided on the left and right sides of the electroplating pool, and an insulating disk that can be vertically rotated to switch electrodes is provided on the inner side of the upper end of the vertical plate, and four different electrodes are evenly fixed on the circumferential edge of the inner side of the disk.

[0006] As a preferred technical solution, the vertical plate is in the shape of a vertical cuboid, and a slide groove that matches the vertical plate is embedded in the outer surface of the electroplating pool.

[0007] As a preferred technical solution, rectangular bosses are fixedly provided on the front and rear sides of the vertical plate, and rectangular grooves that slide in cooperation with the rectangular bosses are embedded in the front and rear sides of the slide groove.

[0008] As a preferred technical solution, transverse screws are fixed on the outer side of the disc, and the vertical plate is provided with a through hole for the screw to slide through, and the protruding end of the screw is provided with a locking nut.

[0009] As a preferred technical solution, a fixing block is provided at one end of the electrode facing the disc, and a fixing hole is provided on the fixing block, which is fixed to the edge of the disc by a bolt.

[0010] As a preferred technical solution, a terminal is fixed on the electrode on one side of the fixed block.

[0011] As a preferred technical solution, the terminal is L-shaped.

[0012] As a preferred technical solution, a handle is fixedly provided on the outer side surface of the lower end portion of the vertical plate, and the handle is an N-shaped structure with an inner opening.

[0013] Compared with the prior art, the present invention provides an insoluble anode pulse copper plating device with the following beneficial effects:

[0014] 1. The utility model has a vertically rotatable disk on the inner side of the upper end of the vertical plate for switching electrodes. Different electrodes are fixedly arranged at circumferential intervals on the edge of the inner side of the disk. When in use, the vertical plate can be pulled upwards and different electrodes can be replaced by rotating the disk, so that the downward electrode is immersed in the electrode slot and the other electrodes are located outside the electrode slot, which can avoid damage to other electrodes and help extend the service life.

[0015] 2. The utility model has transverse screws fixed on the outer side of the disc, and the vertical plate is provided with a through hole for the screw to slide through. The end of the screw is provided with a locking nut. When in use, the disc can be locked by the locking nut, thereby positioning the electrode.

[0016] 3. The utility model has a terminal fixed on the electrode on one side of the fixed block, and when in use, the power supply can be connected through the terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the first embodiment of the present utility model;

[0019] Figure 2 It is a schematic diagram of the split structure of the right vertical plate, disk and electrode;

[0020] Figure 3 This is a schematic diagram of the split structure of the right vertical plate and the slideway groove;

[0021] Figure 4 This is a schematic diagram of the enlarged structure of a single electrode from another angle.

[0022] Markings in the figure: 1. Electroplating pool; 11. Electroplating tank; 12. Slide groove; 13. Rectangular groove; 2. Vertical plate; 21. Handle; 22. Through hole; 23. Rectangular boss; 3. Disc; 31. Screw; 4. Locking nut; 5. Electroplating anode; 51. Fixing block; 511. Fixing hole; 52. Bolt; 6. Terminal; 7. Electroplating cathode. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example

[0024] like Figures 1 to 4 As shown, an insoluble anode pulse copper plating device includes an electroplating cell 1, within which is a rectangular parallelepiped electroplating tank 11. Vertically sliding uprights 2 are provided on the left and right sides of the electroplating cell 1. Inside the upper ends of the uprights 2, an insulated, vertically rotatable disc 3 for switching electrodes is provided. Four different electrodes are evenly fixed around the inner edge of the disc 3. Electroplating anodes 5 (electrically connected to the positive pole of the power supply via the upper terminal 6) are mounted on the right disc 3. These include a plate anode, a curved anode, a cylindrical anode, and a mesh anode. Electroplating cathodes 7 (cooperating with the electroplating anode 5 to perform electroplating operations) are mounted on the left disc 3.

[0025] The vertical plate 2 is in the shape of a vertical cuboid, and a slideway groove 12 that matches the vertical plate 2 is embedded on the outer surface of the electroplating pool 1 .

[0026] Rectangular bosses 23 are fixedly provided on the front and rear sides of the vertical plate 2 , and rectangular grooves 13 are embedded in the front and rear sides of the slideway groove 12 , respectively, which are slidably matched with the rectangular bosses 23 .

[0027] Transverse screw rods 31 are fixedly provided on the outer side of the disc 3 , and a through hole 22 is provided on the vertical plate 2 for the screw rods 31 to slide through. A locking nut 4 is provided at the protruding end of the screw rod 31 .

[0028] A fixing block 51 is provided at the middle position of one end (end surface) of the electrode facing the disk 3 . The fixing block 51 is provided with a fixing hole 511 . The fixing hole 511 is fixed to the edge of the disk 3 by a bolt 52 .

[0029] A terminal 6 (see Figure 4 The terminal 6 is staggered with the bolt 52 to facilitate the disassembly and assembly of the bolt 52. The terminal 6 is L-shaped.

[0030] A handle 21 is fixedly provided on the outer side surface of the lower end of the vertical plate 2. The handle 21 is an N-shaped structure with an inner opening, which is convenient for workers to grasp in order to lift the vertical plate 2 upward.

[0031] During use, one person lifts the upright plate 2 upward using the handle 21, first loosens the locking nut 4, rotates the disc 3 to change different electrodes, then positions the upright plate 2 using the locking nut 4. The upright plate 2 is then reset so that the downward-facing electrode is immersed in the electrode slot 11 and the other electrodes are located outside of the electrode slot 11. This prevents damage to the other electrodes and helps extend their service life. The locking nut 4 can be used to lock the disc 3, thereby positioning the electrodes.

[0032] The components used in the present invention are all universal standard components or components known to those skilled in the art, and their structures and principles are well known to those skilled in the art.

[0033] It should be noted that, in this document, the directions or positional relationships indicated by the terms "first", "second", "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0034] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so that people familiar with this technology can understand and read them. They are not intended to limit the conditions under which the present invention can be implemented. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in this utility model without affecting the effects and purposes that can be achieved by the present utility model.

[0035] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An insoluble anode pulse copper plating device, comprising an electroplating cell, wherein the electroplating cell is provided with an electroplating tank, the electroplating tank being in the shape of a rectangular parallelepiped, characterized in that: The left and right sides of the electroplating pool are respectively provided with vertically sliding vertical plates, the inner sides of the upper ends of the vertical plates are provided with insulating vertically rotating disks for switching electrodes, and four different electrodes are evenly fixed on the circumferential edge of the inner side of the disk.

2. The insoluble anode pulse copper plating equipment according to claim 1, characterized in that: The vertical plate is in the shape of a vertical cuboid, and a slideway groove matching the vertical plate is embedded on the outer surface of the electroplating pool.

3. The insoluble anode pulse copper plating equipment according to claim 1, characterized in that: Rectangular bosses are fixedly provided on the front and rear sides of the vertical plate respectively, and rectangular grooves that slide in cooperation with the rectangular bosses are embedded in the front and rear side surfaces of the slideway groove respectively.

4. The insoluble anode pulse copper plating equipment according to claim 1, characterized in that: The outer side surfaces of the discs are respectively fixed with transverse screw rods, the vertical plates are provided with through holes for the screw rods to slide through, and the protruding ends of the screw rods are provided with locking nuts.

5. The insoluble anode pulse copper plating equipment according to claim 1, characterized in that: The ends of the electrodes facing the disc are respectively provided with fixing blocks, and the fixing blocks are provided with fixing holes, which are fixed to the edges of the discs through bolts.

6. The insoluble anode pulse copper plating equipment according to claim 5, characterized in that: A terminal is fixed on the electrode on one side of the fixed block.

7. The insoluble anode pulse copper plating equipment according to claim 6, characterized in that: The terminal is L-shaped.

8. The insoluble anode pulse copper plating equipment according to claim 1, characterized in that: A handle is fixedly provided on the outer side surface of the lower end portion of the vertical plate, and the handle is an N-shaped structure with an inner opening.

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