Signal detection module

Abstract

The utility model provides a signal detection module. The signal detection module comprises a packaging shell and a photoelectric signal conversion device. The packaging shell is provided with a light-transmitting part; the photoelectric signal conversion device is arranged in the packaging shell and comprises a first photoelectric conversion unit and a second photoelectric conversion unit which are stacked; the first photoelectric conversion unit is provided with a front surface, the front surface of the first photoelectric conversion unit is provided with a photosensitive area in the middle, and the second photoelectric conversion unit is provided with a front surface; the front surface of the second photoelectric conversion unit is provided with a photosensitive area in the middle; the second photoelectric conversion unit is located between the first photoelectric conversion unit and the light transmitting part, and a plurality of welding protruding points for supporting the first photoelectric conversion unit and the second photoelectric conversion unit to be spaced are arranged between the first photoelectric conversion unit and the second photoelectric conversion unit.

Description

Technical Field

[0001] The present application belongs to the technical field of dual-color temperature measurement, and in particular relates to a signal detection module. Background Art

[0002] Two-color temperature measurement is also called colorimetric temperature measurement. It uses the ratio of radiation intensity in two adjacent bands to measure temperature. During measurement, the two-color thermometer will simultaneously sense two different wavelengths of infrared radiation emitted by the object, and then determine the temperature of the object by calculating the ratio of the radiation intensity of the two wavelengths. The two-color thermometer generally includes a signal detection module and a signal processing module, wherein the signal detection module is used to receive and detect light signals. Specifically, a photoelectric signal conversion unit is used to realize the function of receiving and detecting light signals. Therefore, the signal detection module generally includes two photoelectric signal conversion units arranged in a packaging shell, and a packaging shell with a base. The two photoelectric signal conversion units in the related art need to be spaced apart from each other by means of a separate support structure, which makes the installation of the photoelectric signal conversion unit more complicated. Utility Model Content

[0003] According to an embodiment of the present application, a signal detection module is provided, the signal detection module comprising:

[0004] The packaging shell is provided with a light-transmitting portion;

[0005] A photoelectric signal conversion device is arranged in the packaging shell, and the photoelectric signal conversion device includes a stacked first photoelectric conversion unit and a second photoelectric conversion unit; the first photoelectric conversion unit has a front face, the front face of the first photoelectric conversion unit has a photosensitive area located in the middle, and the second photoelectric conversion unit has a front face; the front face of the second photoelectric conversion unit has a photosensitive area located in the middle; the second photoelectric conversion unit is located between the first photoelectric conversion unit and the light-transmitting portion, and there are multiple welding bumps between the first photoelectric conversion unit and the second photoelectric conversion unit to support the spacing between the two.

[0006] In some embodiments, a first pad is provided on the front side of the second photoelectric conversion unit and is located outside the photosensitive region of the second photoelectric conversion unit and is electrically connected to the photosensitive region of the second photoelectric conversion unit;

[0007] A second pad is provided on the front of the first photoelectric conversion unit, which is located outside the photosensitive area of ​​the first photoelectric conversion unit and electrically connected to the photosensitive area of ​​the first photoelectric conversion unit; the orthographic projection of the second photoelectric conversion unit on the front of the first photoelectric conversion unit is staggered with the second pad.

[0008] In some embodiments, the packaging shell includes a tube seat and a tube cap, the tube cap and the tube seat form an accommodating space, the light-transmitting portion is located on the top of the tube cap, and the photoelectric signal conversion device is located in the accommodating space; the tube seat includes a tube seat body on which the photoelectric signal conversion device is attached, and a plurality of pins arranged through the tube seat body; the plurality of pins include a first pin and a second pin, the front side of the second photoelectric conversion unit faces away from the first photoelectric conversion unit, the first pin is connected to the second pad through a first lead, and the second pin is connected to the first pad through a second lead.

[0009] In some embodiments, the plurality of solder bumps serve as supporting bumps, the plurality of solder bumps are spaced apart and arranged around the periphery of the photosensitive region of the first photoelectric conversion unit and staggered with the second solder pads; and / or,

[0010] The tops of the first pin and the second pin are located between the plane where the front surface of the first photoelectric conversion unit is located and the plane where the front surface of the second photoelectric conversion unit is located.

[0011] In some embodiments, the front surface of the second photoelectric conversion unit faces the first photoelectric conversion unit, and the front surface of the first photoelectric conversion unit is provided with a third pad and a fourth pad located outside the photosensitive region of the first photoelectric conversion unit and electrically isolated from the photosensitive region of the first photoelectric conversion unit, the fourth pad is electrically connected to the third pad, and the third pad is located on a side of the fourth pad away from the photosensitive region of the first photoelectric conversion unit;

[0012] In the stacking direction of the first photoelectric conversion unit and the second photoelectric conversion unit, the orthographic projection of the second photoelectric conversion unit on the front surface of the first photoelectric conversion unit is staggered with the third pad, and the photosensitive area of ​​the second photoelectric conversion unit is opposite to the photosensitive area of ​​the first photoelectric conversion unit; the first pad is opposite to the fourth pad and is connected by at least partial welding of the multiple welding bumps.

[0013] In some embodiments, the packaging shell includes a tube seat and a tube cap, the tube cap and the tube seat form an accommodating space, the light-transmitting portion is located on the top of the tube cap, and the photoelectric signal conversion device is located in the accommodating space; the tube seat includes a tube seat body on which the photoelectric signal conversion device is attached, and a plurality of pins arranged through the tube seat body; the plurality of pins include a third pin and a fourth pin; the third pin is connected to the second soldering pad through a third lead, and the fourth pin is connected to the third soldering pad through a fourth lead.

[0014] In some embodiments, the tops of the third pin and the fourth pin are located between the plane where the front surface of the first photoelectric conversion unit is located and the plane where the front surface of the second photoelectric conversion unit is located.

[0015] In some embodiments, the second pad and the third pad are located on opposite sides of the photosensitive region of the first photoelectric conversion unit;

[0016] The multiple welding bumps include a first type of welding bumps for connecting the first welding pad and the fourth welding pad, and the multiple welding bumps also include a second type of welding bumps; the second type of welding bumps serve as supporting bumps and are located on opposite sides of the photosensitive area of ​​the first photoelectric conversion unit and the photosensitive area of ​​the second photoelectric conversion unit as the first type of welding bumps.

[0017] In some embodiments, a connection wiring connecting the second pad and the photosensitive area of ​​the first photoelectric conversion unit is provided on the front surface of the first photoelectric conversion unit;

[0018] The supporting protrusions and the connecting wirings are staggered; and / or,

[0019] At least one of the first photoelectric conversion unit and the second photoelectric conversion unit is provided with a fifth pad for arranging the supporting bump;

[0020] The fifth pad is staggered with the photosensitive region of the first photoelectric conversion unit, the second pad, and the connection wiring.

[0021] In some embodiments, the signal detection module further includes an insulating adhesive for bonding the photoelectric signal conversion device and the tube socket.

[0022] In some embodiments, optical glue is filled between the first photoelectric conversion unit and the second photoelectric conversion unit; and / or,

[0023] There is a space between the second photoelectric conversion unit and the light-transmitting portion; and / or,

[0024] The welding bumps are solder balls.

[0025] The main technical effects achieved by the embodiments of the present application are:

[0026] The signal detection module provided in the embodiment of the present application is configured such that the photoelectric signal conversion device of the signal detection module includes a stacked first photoelectric conversion unit and a second photoelectric conversion unit; a plurality of welding bumps are provided between the first photoelectric conversion unit and the second photoelectric conversion unit to support the spacing between the first photoelectric conversion unit and the second photoelectric conversion unit, so that the first photoelectric conversion unit and the second photoelectric conversion unit can be mounted as a device, which is beneficial to reducing the difficulty of installing the first photoelectric conversion unit and the second photoelectric conversion unit, and is beneficial to reducing cost control. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the three-dimensional structure of a signal detection module provided in one embodiment of the present application;

[0028] Figure 2 An exploded diagram of a signal detection module provided in one embodiment of the present application;

[0029] Figure 3 A schematic diagram of a partial structure of a signal detection module provided in one embodiment of the present application;

[0030] Figure 4 for Figure 3 A top view of a portion of the structure of the signal detection module shown;

[0031] Figure 5 A schematic diagram of the three-dimensional structure of a photoelectric signal conversion device provided in one embodiment of the present application;

[0032] Figure 6 A side view of a photoelectric signal conversion device provided in one embodiment of the present application;

[0033] Figure 7 A top view of a first photoelectric conversion unit provided in one embodiment of the present application;

[0034] Figure 8 A bottom view of a second photoelectric conversion unit provided in one embodiment of the present application;

[0035] Figure 9 An exploded diagram of another signal detection module provided in one embodiment of the present application;

[0036] Figure 10 A schematic diagram of a partial structure of another signal detection module provided in one embodiment of the present application;

[0037] Figure 11 A top view of another first photoelectric conversion unit provided in one embodiment of the present application;

[0038] Figure 12A bottom view of another second photoelectric conversion unit provided by an embodiment of the present application. DETAILED DESCRIPTION

[0039] Here, the technical solutions in the embodiments (or "implementations") of the present application will be clearly and completely described in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0040] If there are terms related to directional indications or positional relationships in the embodiments of this application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture; if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first" and "second" in the embodiments of this application are only used for descriptive convenience and should not be understood as indicating or implying relative importance.

[0041] The following is combined with Figures 1 to 12 The signal detection module is described in detail.

[0042] Please refer to Figure 1 , and when necessary, combine Figures 2 to 12 As shown, the signal detection module includes a packaging shell 10 and a photoelectric signal conversion device 20. The packaging shell 10 is provided with a light-transmitting portion 1201. The photoelectric signal conversion device 20 is disposed in the packaging shell 10, and the photoelectric signal conversion device 20 includes a first photoelectric conversion unit 21 and a second photoelectric conversion unit 22 stacked together. The first photoelectric conversion unit 21 has a front surface S1, and the front surface S1 of the first photoelectric conversion unit 21 has a photosensitive area 210 located in the middle. The second photoelectric conversion unit 22 has a front surface S2. The front surface S2 of the second photoelectric conversion unit 22 has a photosensitive area 220 located in the middle. The second photoelectric conversion unit 22 is located between the first photoelectric conversion unit 21 and the light-transmitting portion 1201, and a plurality of solder bumps are provided between the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 to support the spacing between the two.

[0043] The signal detection module described in the present application has a photoelectric signal conversion device 20 of the signal detection module configured to include a stacked first photoelectric conversion unit 21 and a second photoelectric conversion unit 22. Multiple solder bumps are provided between the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 to support the separation between them. This allows the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 to be mounted as a single device, thereby reducing the difficulty of installing the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 and facilitating cost control.

[0044] The signal detection module described in the present application may be a dual-color temperature measurement signal detection module, wherein the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 of the signal detection module may be respectively used to receive and detect two optical signals of different wavelengths emitted by the object being measured, such as two infrared radiation signals of different wavelengths.

[0045] In some embodiments, a space is provided between the second photoelectric conversion unit 22 and the light-transmitting portion 1201 .

[0046] Of course, in some other embodiments, no separation space may be provided between the second photoelectric conversion unit and the light-transmitting portion.

[0047] The front side S2 of the second photoelectric conversion unit 22 of the signal detection module may face the front side S1 of the first photoelectric conversion unit 21, for example Figure 1 The front side S2 of the second photoelectric conversion unit 22 may also be away from the front side S1 of the first photoelectric conversion unit 21, for example Figure 9 The signal detection module 200 is shown.

[0048] The solder bumps may be solder balls, or solder structures in a columnar or other shapes.

[0049] Combine Figures 2 to 12 As shown, in some embodiments, the packaging shell 10 includes a tube base 11 and a tube cap 12. The tube cap 12 and the tube base 11 enclose a receiving space. The photoelectric signal conversion device 20 is located in the receiving space and attached to the tube base 11. The light-transmitting portion is located on the top of the tube cap 12.

[0050] Combine Figure 7 and Figure 8 And attached Figure 11 and attached Figure 12As shown, in some embodiments, the front surface S2 of the second photoelectric conversion unit 22 is provided with a first pad 222 located outside the photosensitive region 220 of the second photoelectric conversion unit 22 and electrically connected to the photosensitive region 220 of the second photoelectric conversion unit 22. For example, the first pad 222 can be electrically connected to the photosensitive region 220 via a connecting wire 219. The front surface S1 of the first photoelectric conversion unit 21 is also provided with a second pad 211 located outside the photosensitive region 210 of the first photoelectric conversion unit 21 and electrically connected to the photosensitive region 210 of the first photoelectric conversion unit 21. The orthographic projection of the second photoelectric conversion unit 22 on the front surface of the first photoelectric conversion unit 21 is staggered from the second pad 211 to facilitate subsequent electrical extraction of the second pad 211.

[0051] In some embodiments, as Figure 7 and Figure 8 As shown, in the signal detection module 100, the front of the second photoelectric conversion unit faces the first photoelectric conversion unit, and the front S1 of the first photoelectric conversion unit 21 is provided with a fourth pad 215 and a third pad 212 located outside the photosensitive area of ​​the first photoelectric conversion unit 21 and electrically isolated from the photosensitive area 210 of the first photoelectric conversion unit 21, the fourth pad 215 is electrically connected to the third pad 212, and the third pad 212 is located on the side of the fourth pad 215 away from the photosensitive area S1 of the first photoelectric conversion unit 21.

[0052] The signal detection module 100 includes a connection wiring 218 provided on the front surface S1 of the first photoelectric conversion unit 21 , and the third pad 212 and the fourth pad 215 are electrically connected via the connection wiring 218 .

[0053] In the stacking direction T along the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22, the orthographic projection of the second photoelectric conversion unit 22 on the front side S1 of the first photoelectric conversion unit 21 is staggered with the third soldering pad 212, so as to facilitate the setting of connecting keys such as leads soldered on the third soldering pad 212.

[0054] The photosensitive region 220 of the second photoelectric conversion unit 22 is opposite the photosensitive region 210 of the first photoelectric conversion unit 21. Preferably, the photosensitive region 220 of the second photoelectric conversion unit 22 and the photosensitive region 210 of the first photoelectric conversion unit 21 are arranged directly opposite each other. In some embodiments, the photosensitive regions 210 and 220 are of equal size and shape. For example, the photosensitive regions 210 and 220 can be circular, square, rectangular, elliptical, or other shapes of equal size. Of course, in other embodiments, the shapes and sizes of the two regions can also be different.

[0055] The plurality of solder bumps include first-type solder bumps. The first solder pad 222 and the fourth solder pad 215 are directly opposite to each other and are soldered to each other via the first-type solder bumps.

[0056] Combine Figures 6 to 8 As shown, the first type of solder bumps may include a solder bump 216 provided on the front side S1 of the first photoelectric conversion unit 21, and a solder bump 224 provided on the front side S2 of the second photoelectric conversion unit 22. That is, the front side S1 of the first photoelectric conversion unit 21 and the front side S2 of the second photoelectric conversion unit 22 are both provided with opposing solder bumps 216 and 224, and the opposing solder bumps 216 and 224 are connected together to form the first type of solder bumps.

[0057] In other embodiments, the first type of solder bumps may be disposed only at corresponding positions on the front surface of the first photoelectric conversion unit, or only at corresponding positions on the front surface of the second photoelectric conversion unit.

[0058] It should be noted that, while the first type of welding bump can realize the support of the second photoelectric conversion unit 22 at intervals on the first photoelectric conversion unit 21, it can also realize the electrical connection between the first welding pad 222 of the second photoelectric conversion unit 22 and the fourth welding pad 215, so that the first welding pad 222 of the second photoelectric conversion unit 22 can be led out from the front side of the first photoelectric conversion unit 21.

[0059] In some embodiments, the second pad 211 and the third pad 212 are located on opposite sides of the photosensitive region 210 of the first photoelectric conversion unit 21 , and are subsequently used for the arrangement of connection keys such as external leads.

[0060] In some embodiments, the plurality of solder bumps further include a second type of solder bumps, and the second type of solder bumps are provided between the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 as supporting bumps.

[0061] Combine Figures 6 to 8 As shown, the second type of solder bumps may include a solder bump 214 provided on the front side S1 of the first photoelectric conversion unit 21, and a solder bump 223 provided on the front side S2 of the second photoelectric conversion unit 22. That is, the front side S1 of the first photoelectric conversion unit 21 and the front side S2 of the second photoelectric conversion unit 22 are both provided with opposing solder bumps 214 and 223, and the opposing solder bumps 214 and 223 are directly opposite to each other, so that they can be connected together to form the second type of solder bumps.

[0062] In other embodiments, the second type of solder bumps may be disposed only at corresponding positions on the front surface of the first photoelectric conversion unit, or only at corresponding positions on the front surface of the second photoelectric conversion unit.

[0063] It should be noted that the second type of solder bumps can be used to better support the second photoelectric conversion unit 22 above the first photoelectric conversion unit 21. The second type of solder bumps are electrically isolated from the electrical structures of the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22.

[0064] Combine Figure 6 As shown, in some embodiments, the second type of welding bumps and the first type of welding bumps are located on opposite sides of the photosensitive area 210 of the first photoelectric conversion unit 21 and the photosensitive area 220 of the second photoelectric conversion unit 22, and the second type of welding bumps are staggered with the second pad 211 to avoid affecting the setting of the leads or other electrical connection keys on the second pad 211, and to avoid affecting the signal transmission of the first photoelectric conversion unit 21.

[0065] In some embodiments, a connection wiring 217 connecting the second pad 211 and the photosensitive region 210 of the first photoelectric conversion unit 21 is provided on the front side S1 of the first photoelectric conversion unit 21 .

[0066] The second type of solder bumps are staggered with the connection wiring 217 to avoid affecting the signal transmission of the first photoelectric conversion unit 21 .

[0067] At least one of the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 may be provided with a fifth pad for arranging the second type of solder bump. The fifth pad is staggered with respect to the photosensitive region of the first photoelectric conversion unit 21, the second pad 211, and the connection wiring 217, and the photosensitive region, the first pad 222, and the connection wiring 219 of the second photoelectric conversion unit 22.

[0068] In some embodiments, combined Figures 5 to 8 As shown, taking the example of a fifth pad being provided on both the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 , the fifth pad may include a first sub-pad 213 provided on the first photoelectric conversion unit 21 and a second sub-pad 221 provided on the second photoelectric conversion unit 22 .

[0069] The first sub-pad 213 is staggered with the photosensitive region 210 of the first photoelectric conversion unit 21 , the second pad 211 , the connection wiring 217 , the photosensitive region of the second photoelectric conversion unit 22 , the first pad 222 and the connection wiring 219 .

[0070] The second sub-pad 221 is staggered with the photosensitive area of ​​the first photoelectric conversion unit 21 , the second pad 211 and the connection wiring 217 , the photosensitive area of ​​the second photoelectric conversion unit 22 , the first pad 222 and the connection wiring 219 .

[0071] The fifth solder pad 213 is only used as a solder pad for setting the second type solder bump and is electrically isolated from other electrical structures of the first photoelectric conversion unit 21 .

[0072] It should be noted that, combined with Figures 9 to 12 As shown, in the signal detection module 200, when the front side of the second photoelectric conversion unit 22' of the photoelectric signal conversion device 20' faces away from the first photoelectric conversion unit 21', the first photoelectric conversion unit 21' is as shown in FIG. Figure 11 As shown, the front side S1 of the first photoelectric conversion unit 21' is not provided with a third pad and a lead connected to the fourth pad 215. The fourth pad 215 and the solder bump 216 thereon are correspondingly used as the second type of solder bump. The solder bump 216 on the fourth pad 215 and the solder bump on the fifth pad 213 are spaced apart and distributed on different sides of the photosensitive area of ​​the first photoelectric conversion unit 21. In some other embodiments, the second type of solder bumps can also be spaced apart and arranged in other directions. For example, the fifth pad 213 and the solder bump 214 thereon can be provided in an area farther away from the second pad 211 and its connecting wiring 217. The first pad 222 on the front side of the second photoelectric conversion unit 22' can be directly used for electrical connection with other structures without the need to provide a solder bump.

[0073] The first pad 222 in the signal detection module 200 can also be arranged to be located on opposite sides of the photosensitive regions of the two photoelectric conversion units with the second pad 211 to facilitate subsequent connection and arrangement.

[0074] In some embodiments, the stem 11 includes a stem body 111 on which the photoelectric signal conversion device is attached, and a plurality of stem pins 112 passing through the stem body 111 to lead out the photoelectric signal conversion device.

[0075] Preferably, the top of the pin 112 near the light-transmitting portion 1201 can be set higher than the plane where the front surface S1 of the first photoelectric conversion unit 21 is located, and lower than the plane where the surface of the second photoelectric conversion unit 22 near the light-transmitting portion 1201 is located. Of course, it can also be flush with one of the two planes.

[0076] For example, combined Figures 2 to 8 As shown, in the signal detection module 100 , the pins 112 include a third pin 1121 and a fourth pin 1122 . The photoelectric signal conversion device 20 is connected to the pins 112 via leads 30 .

[0077] Specifically, the leads 30 of the signal detection module 100 include a third lead 31 and a fourth lead 32. In the signal detection module 100, the third lead 31 connects the third pin 1121 and the second pad 211, and the fourth lead 32 connects the fourth pin 1122 and the third pad 212.

[0078] The tops of the third pin 1121 and the fourth pin 1122 are located between the plane where the front surface S1 of the first photoelectric conversion unit 21 is located and the plane where the surface of the second photoelectric conversion unit 22 facing the light-transmitting portion 1201 is located.

[0079] For example, combining Figures 9 to 12 As shown, in the signal detection module 200, the multiple pins include a first pin 1123 and a second pin 1124, the front side S2 of the second photoelectric conversion unit 22 faces away from the first photoelectric conversion unit 21, the first pin 1123 can be connected to the second solder pad 211 of the photoelectric signal conversion device 20' through a first lead (not shown), and the second pin 1124 is connected to the first solder pad 222 of the photoelectric signal conversion device 20' through a second lead (not shown).

[0080] Accordingly, the tops of the first pin 1123 and the second pin 1124 are located between the plane where the front surface S1 of the first photoelectric conversion unit 21 is located and the plane where the surface of the second photoelectric conversion unit 22 facing the light-transmitting portion 1201 is located, so as to facilitate lead arrangement.

[0081] In some embodiments, the signal detection module further includes an insulating adhesive (not shown) for bonding the photoelectric signal conversion device 20 to the tube seat 11 .

[0082] The stacking arrangement of the photoelectric signal conversion device 20 and the adhesive mounting arrangement greatly reduce the arrangement complexity of the two photoelectric conversion units in the dual-color temperature measurement device.

[0083] In some embodiments, a gap is formed between the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 so that the photosensitive regions of the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 do not directly contact each other to sense light. Generally, the gap between the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 is several tens of micrometers, such as about 50 μm.

[0084] The space between the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 may be filled with optical adhesive 40 .

[0085] The optical adhesive 40 fills the hollow area between the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 and can wrap the soldering bumps to fix the soldering bumps and support the first photoelectric conversion unit 21 and the second photoelectric conversion unit 22 .

[0086] The optical adhesive 40 not only provides support but also, when subsequently forming an independent photoelectric signal conversion device, improves the response of the underlying photoelectric conversion unit to light. Preferably, the optical adhesive 40 improves the response of the first photoelectric conversion unit 21 to light, further enhancing the temperature measurement accuracy of the dual-color temperature detector.

[0087] In some embodiments, the optical adhesive 40 is a two-component epoxy potting adhesive.

[0088] Based on the above description, when assembling the signal detection module 100, the tube base 11, the tube cap 12, and the photoelectric signal conversion device 20 can be provided first, and the photoelectric signal conversion device 20 can be attached to the surface of the tube base body 111 of the tube base 11. Then, wire bonding is performed to set the third lead 31 connecting the third pin 1121 and the second pad 211, and the fourth lead 32 connecting the fourth pin 1122 and the third pad 212, forming the following. Figure 3 Next, the tube cap 12 is packaged.

[0089] It should be noted that during the assembly of the signal detection module 100, the photoelectric signal converter 20 can be attached to the surface of the tube base body 111 of the tube base 11 using an insulating adhesive. Specifically, an insulating adhesive material can be first placed between the surface of the tube base body 111 and the photoelectric signal converter 20, and then heated in an incubator to cure the insulating adhesive. The tube cap 12 can be assembled to the tube base body 111 by welding. The tube cap 12 can be welded using capacitive energy storage welding.

[0090] The assembly of the signal detection module 200 is similar, and reference may be made to the relevant description of the assembly of the detection module 100 , which will not be repeated here.

[0091] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application shall be included in the scope of protection of this application.

Claims

1. A signal detection module, characterized in that: The signal detection module includes: The packaging shell is provided with a light-transmitting portion; A photoelectric signal conversion device is arranged in the packaging shell, and the photoelectric signal conversion device includes a stacked first photoelectric conversion unit and a second photoelectric conversion unit; the first photoelectric conversion unit has a front face, the front face of the first photoelectric conversion unit has a photosensitive area located in the middle, and the second photoelectric conversion unit has a front face; the front face of the second photoelectric conversion unit has a photosensitive area located in the middle; the second photoelectric conversion unit is located between the first photoelectric conversion unit and the light-transmitting portion, and there are multiple welding bumps between the first photoelectric conversion unit and the second photoelectric conversion unit to support the spacing between the two.

2. The signal detection module according to claim 1, wherein: A first pad is provided on the front side of the second photoelectric conversion unit and is located outside the photosensitive region of the second photoelectric conversion unit and is electrically connected to the photosensitive region of the second photoelectric conversion unit; A second pad is provided on the front of the first photoelectric conversion unit, which is located outside the photosensitive area of ​​the first photoelectric conversion unit and electrically connected to the photosensitive area of ​​the first photoelectric conversion unit; the orthographic projection of the second photoelectric conversion unit on the front of the first photoelectric conversion unit is staggered with the second pad.

3. The signal detection module according to claim 2, wherein: The packaging shell includes a tube seat and a tube cap, the tube cap and the tube seat enclose a accommodating space, the light-transmitting portion is located on the top of the tube cap, and the photoelectric signal conversion device is located in the accommodating space; the tube seat includes a tube seat body on which the photoelectric signal conversion device is attached, and a plurality of pins arranged through the tube seat body; the plurality of pins include a first pin and a second pin, the front side of the second photoelectric conversion unit faces away from the first photoelectric conversion unit, the first pin is connected to the second pad through a first lead, and the second pin is connected to the first pad through a second lead.

4. The signal detection module according to claim 3, wherein: The plurality of welding bumps serve as supporting bumps, the plurality of bumps being arranged at intervals on the periphery of the photosensitive area of ​​the first photoelectric conversion unit and being staggered with the second pads; and / or, The tops of the first pin and the second pin are located between the plane where the front surface of the first photoelectric conversion unit is located and the plane where the front surface of the second photoelectric conversion unit is located.

5. The signal detection module according to claim 2, wherein: The front surface of the second photoelectric conversion unit faces the first photoelectric conversion unit, and the front surface of the first photoelectric conversion unit is provided with a third pad and a fourth pad located outside the photosensitive region of the first photoelectric conversion unit and electrically isolated from the photosensitive region of the first photoelectric conversion unit, the fourth pad is electrically connected to the third pad, and the third pad is located on a side of the fourth pad away from the photosensitive region of the first photoelectric conversion unit; In the stacking direction of the first photoelectric conversion unit and the second photoelectric conversion unit, the orthographic projection of the second photoelectric conversion unit on the front surface of the first photoelectric conversion unit is staggered with the third pad, and the photosensitive area of ​​the second photoelectric conversion unit is opposite to the photosensitive area of ​​the first photoelectric conversion unit; the first pad is opposite to the fourth pad, and is connected by at least partial welding of the multiple welding bumps.

6. The signal detection module according to claim 5, wherein: The packaging shell includes a tube seat and a tube cap, the tube cap and the tube seat enclose a receiving space, the light-transmitting portion is located on the top of the tube cap, and the photoelectric signal conversion device is located in the receiving space; the tube seat includes a tube seat body on which the photoelectric signal conversion device is attached, and a plurality of pins arranged through the tube seat body; the plurality of pins include a third pin and a fourth pin; the third pin is connected to the second soldering pad through a third lead, and the fourth pin is connected to the third soldering pad through a fourth lead.

7. The signal detection module according to claim 6, wherein: The tops of the third pin and the fourth pin are located between the plane where the front surface of the first photoelectric conversion unit is located and the plane where the front surface of the second photoelectric conversion unit is located.

8. The signal detection module according to claim 5, wherein: The second pad and the third pad are located on opposite sides of the photosensitive region of the first photoelectric conversion unit; The multiple welding bumps include a first type of welding bumps for connecting the first welding pad and the fourth welding pad, and the multiple welding bumps also include a second type of welding bumps; the second type of welding bumps serve as supporting bumps and are located on opposite sides of the photosensitive area of ​​the first photoelectric conversion unit and the photosensitive area of ​​the second photoelectric conversion unit as the first type of welding bumps.

9. The signal detection module according to claim 4 or 8, characterized in that: A connection wiring connecting the second pad and the photosensitive area of ​​the first photoelectric conversion unit is provided on the front side of the first photoelectric conversion unit; The supporting protrusions and the connecting wirings are staggered; and / or, At least one of the first photoelectric conversion unit and the second photoelectric conversion unit is provided with a fifth pad for arranging the supporting bump; The fifth pad is staggered with the photosensitive region of the first photoelectric conversion unit, the second pad, and the connection wiring.

10. The signal detection module according to claim 3, wherein: The signal detection module further includes an insulating adhesive for bonding the photoelectric signal conversion device and the tube seat.

11. The signal detection module according to claim 1, wherein: Optical glue is filled between the first photoelectric conversion unit and the second photoelectric conversion unit; and / or, There is a space between the second photoelectric conversion unit and the light-transmitting portion; and / or, The welding bumps are solder balls.

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