Subminiature high-temperature-resistant temperature sensor

Abstract

A subminiature high-temperature-resistant temperature sensor comprises a circuit board, a resistor and a signal extension cord, the circuit board is provided with a first bonding pad and a second bonding pad, a gap is reserved between the first bonding pad and the second bonding pad, and the gap is used for placing the resistor; the resistor crosses the gap and is connected with the first bonding pad and the second bonding pad. The signal extension line comprises a first signal extension line and a second signal extension line, the first signal extension line is connected with the first bonding pad, and the second signal extension line is connected with the second bonding pad. According to the utility model, the ceramic circuit board, the glass bulb packaging resistor and a multi-layer glue sealing mode are used, the moisture-proof, waterproof and high-temperature-resistant capabilities are improved, the stability is enhanced, and the appearance size of the utility model is reduced as much as possible and the response capability and the accuracy are improved through the design of the circuit board structure.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature sensors, in particular to an ultra-small high-temperature resistant temperature sensor. Background Art

[0002] In many industrial fields, such as aerospace, automotive, metallurgy, energy, and chemicals, sensors must operate in extremely high-temperature environments. Traditional sensors often experience significant performance degradation at high temperatures. Therefore, high-temperature sensors are being developed to meet the demands of these specialized operating conditions. For example, operating equipment such as engines, gas turbines, and boilers can generate temperatures of hundreds of degrees Celsius or even higher, placing extremely high demands on the heat resistance and stability of sensors.

[0003] With the development of microelectronics technology, high-temperature sensors are gradually moving towards integration and miniaturization. However, most current high-temperature sensors are large, have low accuracy, and poor response speed, making them unsuitable for certain work scenarios that require high-temperature sensors. Furthermore, large temperature sensors are less stable than their smaller counterparts. Summary of the Invention

[0004] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art and to provide an ultra-small high-temperature resistant temperature sensor that can solve the problems of large size, slow response time, poor accuracy and stability of high-temperature resistant sensor products in the prior art.

[0005] The present application provides an ultra-small high-temperature resistant temperature sensor, including a circuit board, a resistor and a signal extension line. The circuit board is provided with a first soldering pad and a second soldering pad, and a gap is left between the first soldering pad and the second soldering pad, and the gap is used to place the resistor; the resistor is connected to the first soldering pad and the second soldering pad respectively across the gap; the signal extension line includes a first signal extension line and a second signal extension line, the first signal extension line is connected to the first soldering pad, and the second signal extension line is connected to the second soldering pad.

[0006] Furthermore, the first soldering pad and the second soldering pad are both provided with solder joints suitable for soldering signal extension lines. The shape of the first soldering pad is rectangular, and the shape of the second soldering pad is an inverted L-shape. The length of the first soldering pad exceeds the length of the second soldering pad at the bend. The first signal extension line can be extended into the circuit board and directly connected to the first soldering pad, and the second signal extension line is directly connected to the second soldering pad.

[0007] Furthermore, the resistor includes an electrode, a glass shell and a chip. The resistor is packaged in a glass package, the resistor is wrapped in the glass shell, a chip is arranged inside the glass shell, an electrode is bonded to each end of the chip, and the electrodes at both ends of the chip are respectively connected to the first pad and the second pad.

[0008] Furthermore, a shell is provided, which includes a first protective rubber layer and a second protective rubber layer. The second protective rubber layer is coated on the surface of the circuit board, and the second protective rubber layer completely covers the area of ​​the circuit board; the first protective rubber layer is provided between the shell and the circuit board, and the first protective rubber layer is formed by filling.

[0009] Furthermore, the first pad is provided with an extended pad and a wire, the first pad is connected to the extended pad through a wire, a solder joint suitable for welding a signal extension line is provided on the extended pad, the extended pad is connected to the first signal extension line, the shape of the first pad is rectangular, the length of the first pad is equal to the length of the resistor, and the lower end of the extended pad is flush with the lower end of the second pad.

[0010] Furthermore, the first pad is provided with an extended pad and a wire, the first pad is connected to the extended pad through a wire, a solder joint suitable for welding a signal extension line is provided on the extended pad, the extended pad is connected to the first signal extension line, the shape of the first pad is rectangular, the length of the first pad is equal to the length of the resistor, and the lower end of the extended pad is not flush with the lower end of the second pad.

[0011] Furthermore, the electrode extension end is coated with conductive silver paste, the electrode is made of metal, preferably duroplastic wire, the shape of the chip is preferably a square piece, and the material of the resistor is ceramic.

[0012] Furthermore, the circuit board may be a PCB, FPC or other structure, the material of the circuit board is preferably ceramic, and the resistor may be an NTC chip resistor or other chip resistor.

[0013] Furthermore, the shape of the shell is preferably rectangular or circular, and can also be formed by injection molding.

[0014] According to the ultra-small high-temperature resistant temperature sensor provided in the present application, compared with the existing technology, the beneficial effect is that by using a ceramic circuit board, a glass-shell encapsulated resistor and a multi-layer sealing method, the moisture-proof and waterproof capabilities are improved, the stability is enhanced, and by designing the circuit board structure, the external dimensions of the utility model are minimized, and the responsiveness and accuracy are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1This is an overall schematic diagram of an ultra-small high-temperature resistant temperature sensor provided by the utility model;

[0017] Figure 2 A schematic diagram of the internal structure of an ultra-small high-temperature resistant temperature sensor provided by the utility model;

[0018] Figure 3 A schematic diagram of the internal structure of an ultra-small high-temperature resistant temperature sensor provided by the present invention with protective glue added;

[0019] Figure 4 A schematic diagram of the positions of solder pads on a circuit board of a first embodiment of an ultra-small high-temperature resistant temperature sensor provided by the present invention;

[0020] Figure 5 A schematic diagram of the positions of solder pads on a circuit board of a second embodiment of an ultra-small high-temperature resistant temperature sensor provided by the present invention;

[0021] Figure 6 A schematic diagram of the positions of solder pads on a circuit board of a third embodiment of an ultra-small high-temperature resistant temperature sensor provided by the present invention;

[0022] Figure 7 This is a schematic diagram of the resistance structure of an ultra-small high-temperature resistant temperature sensor provided by the utility model.

[0023] Reference numerals:

[0024] 1. Housing; 2. First protective adhesive layer; 3. Circuit board; 4. Second protective adhesive layer; 5. First solder pad; 501. Extension solder pad; 502. Wire; 6. Electrode; 7. Resistor; 701. Glass shell; 702. Chip; 8. Second solder pad; 9. Signal extension line; 901. First signal extension line; 902. Second signal extension line; 10. Gap. DETAILED DESCRIPTION

[0025] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0026] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", "front", "back", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present invention.

[0027] The following will describe in detail the application scenarios of the ultra-small high-temperature resistant temperature sensor of the present application and its contribution to the prior art in conjunction with the accompanying drawings and embodiments. Figures 1 to 4 As shown, the utility model discloses an ultra-small high-temperature resistant temperature sensor, including a circuit board 3, a resistor 7 and a signal extension line 9; a first soldering pad 5 and a second soldering pad 8 are provided on the circuit board 3, and a gap 10 is left between the first soldering pad 5 and the second soldering pad 8, and the gap 10 is used to place the resistor 7, and the resistor 7 is connected to the first soldering pad 5 and the second soldering pad 8 respectively across the gap 10; the signal extension line 9 includes a first signal extension line 901 and a second signal extension line 902, the first signal extension line 901 is connected to the first soldering pad 5, and the second signal extension line 902 is connected to the second soldering pad 8.

[0028] The first soldering pad 5 and the second soldering pad 8 are both provided with solder points suitable for soldering the signal extension line 9. The first signal extension line 901 can extend into the circuit board 3 and be directly connected to the first soldering pad 5. The second signal extension line 902 can be directly connected to the second soldering pad 8. The shape of the first soldering pad 5 is rectangular, and the shape of the second soldering pad 8 is an inverted L-shape. The length of the first soldering pad 5 exceeds the length of the resistor 7, which facilitates the first signal extension line to extend into the circuit board 3 and be connected to the first soldering pad 5. By setting the position and structure of the first soldering pad 5 and the second soldering pad 8, the size of the circuit board can be reduced on the basis of simplifying the circuit board manufacturing process, thereby reducing the size of the high-temperature resistant temperature sensor.

[0029] like Figure 7 The resistor 7 shown in the figure comprises an electrode 6, a glass shell 701, and a chip 702. The resistor 7 is encapsulated using glass. The chip 702 is housed within the glass shell 701. An electrode 6 is connected to each end of the chip 702, which is connected to a first solder pad 5 and a second solder pad 8, respectively. The electrodes 6 are made of metal, preferably durumilite, which is resistant to soldering heat corrosion. The electrodes 6 are coated with conductive silver paste to improve their conductivity and device sensitivity. The chip 702 is preferably square to facilitate complete sealing of the glass shell 701. The chip 702 is made of ceramic, which is resistant to high temperatures. The sealing provided by the glass shell 701 provides moisture and water resistance while withstanding higher temperatures. By combining a ceramic circuit board with an SMT glass-encapsulated resistor, the semi-finished product can be made extremely small. This smaller temperature sensor offers higher temperature measurement accuracy and faster response time.

[0030] A shell 1 is also provided, which includes a first protective adhesive layer 2 and a second protective adhesive layer 4. The second protective adhesive layer 4 is coated on the surface of the circuit board 3, and the second protective adhesive layer 4 completely covers the area of ​​the circuit board 3 to achieve a protective effect; the first protective adhesive layer 2 is arranged between the shell 1 and the circuit board 3, and part of the circuit board 3 is placed in the shell, and the first protective adhesive layer 2 is formed by filling. Through the protection of two layers of protective adhesive, the effect of moisture-proof and waterproof can be achieved, and the product is more stable and has more reliable performance while minimizing the size of the product.

[0031] like Figure 5 In another embodiment shown, the first pad 5 is provided with an extended pad 501 and a wire 502. The first pad 5 is connected to the extended pad 501 through the wire 502. The extended pad 501 is provided with a solder joint suitable for welding the signal extension line 9. The extended pad 501 is connected to the first signal extension line 901. The shape of the first pad 5 is rectangular. The length of the first pad 5 is equal to the length of the resistor 7. The lower end of the extended pad 501 is flush with the lower end of the second pad 8. By designing the arrangement structure of the first pad 5 and the second pad 8 on the circuit board, the connection position of the signal extension line 9 and the circuit board is changed, so that the high-temperature resistant temperature sensor responds faster.

[0032] like Figure 6 In another embodiment shown, the first pad 5 is provided with an extended pad 501 and a wire 502. The first pad 5 is connected to the extended pad 501 through the wire 502. A solder joint suitable for welding the signal extension line 9 is provided on the extended pad 501. The extended pad 501 is connected to the first signal extension line 901. The shape of the first pad 5 is rectangular. The length of the first pad 5 is equal to the length of the resistor 7. The bottom of the extended pad 501 is not flush with the lower end of the second pad 8.

[0033] The shape of the housing 1 is preferably rectangular or circular; the material of the circuit board 3 is preferably ceramic. The rectangular or circular shape of the housing 1 can minimize the size of the high-temperature resistant temperature sensor, and the material of the circuit board 3 is ceramic and can withstand high temperatures.

[0034] The circuit board 3 may also be a PCB, FPC or other structure, and the resistor 7 may also be an NTC chip resistor or other chip resistor.

[0035] The housing 1 can also be formed by injection molding.

[0036] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An ultra-small high-temperature resistant temperature sensor, characterized in that: The invention comprises a circuit board (3), a resistor (7) and a signal extension line (9); the circuit board (3) is provided with a first soldering pad (5) and a second soldering pad (8); a gap (10) is left between the first soldering pad (5) and the second soldering pad (8); the gap (10) is used to place the resistor (7); the resistor (7) spans the gap (10) and is connected to the first soldering pad (5) and the second soldering pad (8) respectively; the signal extension line (9) comprises a first signal extension line (901) and a second signal extension line (902); the first signal extension line (901) is connected to the first soldering pad (5), and the second signal extension line (902) is connected to the second soldering pad (8).

2. The ultra-small high-temperature resistant temperature sensor according to claim 1, characterized in that: The first soldering pad (5) and the second soldering pad (8) are both provided with soldering points suitable for soldering the signal extension line (9); the first soldering pad (5) is rectangular in shape, and the second soldering pad (8) is in an inverted L-shape; the length of the first soldering pad (5) exceeds the length of the second soldering pad (8) at the turning point; the first signal extension line (901) can extend into the circuit board (3) and be directly connected to the first soldering pad (5); and the second signal extension line (902) is directly connected to the second soldering pad (8).

3. The ultra-small high-temperature resistant temperature sensor according to claim 2, characterized in that: The resistor (7) comprises an electrode (6), a glass shell (701) and a chip (702). The resistor (7) is encapsulated in a glass encapsulation manner. The chip (702) is encapsulated in the glass shell (701). An electrode (6) is bonded to each end of the chip (702). The electrodes (6) at both ends of the chip (702) are respectively connected to a first pad (5) and a second pad (8).

4. The ultra-small high-temperature resistant temperature sensor according to claim 3, characterized in that: A shell (1) is also provided, the shell (1) comprising a first protective rubber layer (2) and a second protective rubber layer (4), the second protective rubber layer (4) being coated on the surface of the circuit board (3), the second protective rubber layer (4) completely covering the area of ​​the circuit board (3); the first protective rubber layer (2) being provided between the shell (1) and the circuit board (3), and being formed by filling.

5. The ultra-small high-temperature resistant temperature sensor according to claim 3, characterized in that: The first pad (5) is provided with an extended pad (501) and a wire (502); the first pad (5) and the extended pad (501) are connected via the wire (502); a soldering point suitable for soldering the signal extension line (9) is provided on the extended pad (501); the extended pad (501) is connected to the first signal extension line (901); the length of the first pad (5) is equal to the length of the resistor (7); and the lower end of the extended pad (501) is flush with the lower end of the second pad (8).

6. The ultra-small high-temperature resistant temperature sensor according to claim 3, characterized in that: The first pad (5) is provided with an extended pad (501) and a wire (502); the first pad (5) and the extended pad (501) are connected via the wire (502); a soldering point suitable for soldering the signal extension line (9) is provided on the extended pad (501); the extended pad (501) is connected to the first signal extension line (901); the length of the first pad (5) is equal to the length of the resistor (7); and the lower end of the extended pad (501) is not flush with the lower end of the second pad (8).

7. The ultra-small high-temperature resistant temperature sensor according to claim 3, 5 or 6, characterized in that: The extended end of the electrode (6) is coated with conductive silver paste, the electrode (6) is made of metal, the chip (702) is in the shape of a square piece, and the chip (702) is made of ceramic material.

8. The ultra-small high-temperature resistant temperature sensor according to claim 7, characterized in that: The circuit board (3) can adopt a PCB or FPC structure, the material of the circuit board (3) is a ceramic material, and the resistor (7) adopts an NTC chip resistor.

9. The ultra-small high-temperature resistant temperature sensor according to claim 4, characterized in that: The shape of the housing (1) is rectangular or circular, and the housing (1) is formed by injection molding.

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