Test equipment

Abstract

The utility model provides test equipment. The test equipment provided by the utility model is used for testing the torsion of a chip packaging structure. The test equipment comprises a fixing frame, a claw hand and a control system. Wherein the fixing frame is used for fixing a substrate of the chip packaging structure; the claw is used for clamping a heat dissipation cover of the chip packaging structure; the control system comprises a controller and a power mechanism electrically connected with the controller; wherein the power mechanism is mechanically connected with the claw to drive the claw; the controller is used for controlling the claw to rotate in a horizontal plane in response to a first instruction until the chip wrapped in the substrate is separated from the heat dissipation cover so as to test the torsion of the chip packaging structure; wherein the first instruction is an instruction used for indicating the test torsion. According to the test equipment provided by the invention, the torsion of the chip packaging structure can be effectively measured and analyzed, errors caused by manual test are avoided, the test efficiency can be improved, and the test accuracy is ensured.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a testing device. Background Art

[0002] As chip integration and operating frequencies increase, power consumption and heat generation also increase accordingly. If heat cannot be dissipated in a timely manner, the chip temperature will overheat, affecting its performance and lifespan. To effectively dissipate heat, a heat sink is usually attached to the chip. The heat sink is usually made of a material with excellent thermal conductivity. It can quickly transfer heat from the core area of ​​the chip to the outside, thereby ensuring that the chip operates at a stable temperature and improving its reliability and lifespan.

[0003] Currently, heat sink covers are typically fixed to chips by bonding. However, if the bonding is not tight enough, the heat sink cover may fall off the packaged chip, which places higher demands on the bonding strength between the heat sink cover and the chip.

[0004] Currently, the bonding strength of heat sink covers is primarily assessed using a test mold designed for vertical tension. This test verifies the cover's robustness when subjected to vertical tension, ensuring it won't fall off due to a loose bond. However, during actual use, chips may be subject to forces from multiple directions, particularly torque. Tensile testing alone is insufficient to fully assess bonding reliability. Therefore, the development of a test mold designed to test the torque of the heat sink cover after assembly is urgently needed to more comprehensively assess the bond strength between the cover and the chip. Utility Model Content

[0005] In view of this, the present application provides a testing device for testing the torque of the heat dissipation cover after it is attached, so as to more comprehensively evaluate the bonding strength between the heat dissipation cover and the chip.

[0006] Specifically, this application is implemented through the following technical solutions:

[0007] The present application provides a testing device for testing the torsion of a chip packaging structure; the testing device includes a fixing frame, a gripper, and a control system; wherein,

[0008] The fixing frame is used to fix the substrate of the chip packaging structure;

[0009] The claw is used to clamp the heat dissipation cover of the chip packaging structure;

[0010] The control system includes a controller and a power mechanism electrically connected to the controller; wherein the power mechanism is mechanically connected to the gripper to drive the gripper;

[0011] The controller is used to control the gripper to rotate in a horizontal plane in response to a first instruction until the substrate and the heat dissipation cover are separated to test the torque of the chip packaging structure; wherein the first instruction is an instruction for indicating the test torque.

[0012] Optionally, the controller is further used to control the gripper to move linearly in a horizontal plane in response to a second instruction until the chip and the heat dissipation cover are separated, so as to test the shear stress of the chip packaging structure; wherein the second instruction is an instruction for indicating the shear stress test.

[0013] Optionally, the controller is further used to control the gripper to move linearly in the vertical direction in response to a third instruction until the chip and the heat dissipation cover are separated, so as to test the tensile stress of the chip packaging structure; wherein the third instruction is an instruction for indicating the tensile stress test.

[0014] The optional claw hand includes a first clamping component, a second clamping component and a fixing component; wherein,

[0015] The first clamping member and the second clamping member have a mounting plate located in a vertical plane and a raised portion located in a horizontal plane, and the first clamping member and the second clamping member are L-shaped; the first clamping member and the second clamping member are fixed to the fixing member via the mounting plate in a manner that the raised portions face each other;

[0016] The fixing component is provided with a connecting portion connected to the power structure, and the claw hand is connected to the power mechanism through the connecting portion.

[0017] Optionally, the mounting plate is fixed to the fixing component by bolts, and the mounting plate can be moved in a direction away from or close to the fixing component to change the distance between the first clamping component and the second clamping component, so as to clamp chip packaging structures with different heat dissipation cover sizes through the claw hand.

[0018] Optionally, the substrate is fixed to the fixing frame by gluing.

[0019] Optionally, a covering portion is provided on the fixing frame, and the substrate is covered in the covering portion.

[0020] Optionally, the fixing frame is made of metal material.

[0021] Optionally, the claw hand is made of metal material.

[0022] Optionally, a contact surface between the raised portion and the heat dissipation cover has a texture structure.

[0023] The test equipment provided in the present application can improve the stability and reliability of the test by setting a fixing frame, a gripper and a control system, and making the fixing frame fix the substrate of the chip packaging structure to prevent it from moving during the test process; further, the gripper firmly clamps the heat dissipation cover to avoid loosening or slipping that may occur during the test, thereby ensuring the consistency of torque application. In addition, the controller responds to the first instruction and drives the power mechanism to rotate the gripper, thereby completing the torque test, which can effectively measure and analyze the torque of the chip packaging structure, avoid errors in manual testing, improve test efficiency, and ensure test accuracy.

[0024] In addition, the test equipment provided by the present application can test the shear stress and tensile stress of the chip packaging structure, so that the test equipment has the function of testing torsion, shear stress and tensile stress. In this way, firstly, the test equipment can measure torsion, shear stress and tensile stress at the same time. The torque test evaluates the bonding strength between the heat dissipation cover and the substrate, the shear stress test measures the performance of the structure under shear force, and the tensile stress test reflects the stability of the chip packaging structure under tensile force. By combining these three tests, the performance of the packaging structure in actual application can be fully understood. Secondly, there is no need to change the equipment, and the torque, shear stress and tensile stress can be tested on the same test equipment, which can reduce the downtime and resource waste during the test process and improve the test efficiency. Finally, performing different types of tests on the same test equipment can ensure the consistency of the test conditions and improve the reliability of the data.

[0025] Furthermore, the test equipment provided in the present application can, first, flexibly change the spacing between the first clamping part and the second clamping part, so that the claw can clamp heat sink covers of different sizes; secondly, after adjusting to the appropriate clamping width, the claw can clamp the heat sink cover more firmly, avoiding loosening or slipping due to size mismatch, and ensuring the uniformity and consistency of force applied during the test; finally, this flexible adjustment mechanism can reduce the wear of the clamping parts, especially when facing heat sink covers of different sizes, without the need for forced clamping or replacement of parts, which can extend the service life of the test equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a testing device shown as an exemplary embodiment of the present application;

[0027] Figure 2 This is a schematic diagram of a chip packaging structure according to an exemplary embodiment of the present application;

[0028] Figure 3 A partial schematic diagram of a testing device shown as another exemplary embodiment of the present application;

[0029] Figure 4A perspective view of a gripper according to an exemplary embodiment of the present application;

[0030] Figure 5 This is a front view of a gripper shown as an exemplary embodiment of the present application;

[0031] Figure 6 This is a schematic diagram of a first clamping component according to an exemplary embodiment of the present application.

[0032] Description of reference numerals:

[0033] 1: Fixed frame;

[0034] 11: covering part;

[0035] 2: Claw Hand;

[0036] 21: first clamping member;

[0037] 211: Mounting plate;

[0038] 212: raised portion;

[0039] 22: second clamping member;

[0040] 23: fixed parts;

[0041] 231: connecting part;

[0042] 3: control system;

[0043] 31: controller;

[0044] 32: Power mechanism;

[0045] 4: Chip packaging structure;

[0046] 41: Substrate;

[0047] 42: heat dissipation cover;

[0048] 43: Chip. DETAILED DESCRIPTION

[0049] Exemplary embodiments are described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numerals in different drawings represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this application.

[0050] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0051] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0052] Specific embodiments are given below to introduce the technical solutions of the present application in detail.

[0053] Figure 1 This is a schematic diagram of a testing device shown in an exemplary embodiment of the present application. Figure 2 This is a schematic diagram of a chip packaging structure shown in an exemplary embodiment of the present application. Figure 1 and Figure 2 The test equipment provided in this embodiment is used to test the torsion of the chip packaging structure 4; the test equipment includes a fixing frame 1, a gripper 2 and a control system 3; wherein,

[0054] The fixing frame 1 is used to fix the substrate 41 of the chip packaging structure 4;

[0055] The claw hand 2 is used to clamp the heat dissipation cover 42 of the chip packaging structure 4;

[0056] The control system 3 includes a controller 31 and a power mechanism 32 electrically connected to the controller 31; wherein the power mechanism 32 is mechanically connected to the gripper 2 to drive the gripper 2;

[0057] The controller 31 is used to control the gripper 2 to rotate in a horizontal plane in response to a first instruction until the chip 43 enclosed in the substrate 41 and the heat dissipation cover 42 are separated to test the torque of the chip packaging structure 4; wherein the first instruction is an instruction for indicating the test torque.

[0058] Please refer to Figure 2It can be understood that the chip packaging structure 4 includes a substrate 41, a heat dissipation cover 42 and a chip 43; wherein the chip 43 is bonded to the substrate 41. Furthermore, the heat dissipation cover 42 is a cover-like structure, covering the chip 43, and is bonded to the surface of the chip 43 by thermal conductive adhesive, while its edge contacts the substrate 41 to form a closed structure.

[0059] The testing device provided in this embodiment is used to test the torsion of the chip packaging structure 4, and specifically to test the torsion between the chip and the heat dissipation cover.

[0060] For details, please refer to Figure 1 The test equipment includes a fixing frame 1, a gripper 2 and a control system 3, wherein the fixing frame 1 is made of metal material and is used to fix the substrate 41 of the chip packaging structure 4. It can be understood that the fixing frame 1 made of metal material has higher strength and can remain stable during the test process without deformation, which will lead to inaccurate test results.

[0061] It should be noted that the metal material used to make the fixing frame 1 can be selected according to actual needs and is not limited here. For example, in one embodiment, copper can be used as the material for making the fixing frame 1; for another example, in another embodiment, stainless steel can also be used as the material for making the fixing frame 1.

[0062] Please continue to refer to Figure 1 In a possible implementation, the substrate 41 is fixed to the fixing frame 1 by gluing.

[0063] Further, Figure 3 This is a partial schematic diagram of a testing device shown in another exemplary embodiment of the present application. Figure 3 In another possible implementation, a covering portion 11 is provided on the fixing frame 1 , and the substrate 41 is covered in the covering portion 11 .

[0064] Specifically, for example, in one possible implementation, the covering portion 11 is provided with a groove that matches the size of the substrate 41. The substrate 41 is placed in the groove, and the edge of the groove is closely attached to the edge of the substrate 41, forming a secure fixing area. For another example, in another possible implementation, the covering portion 11 can be made of an elastic material and have inner clamping surfaces that automatically adhere to the edge of the substrate 41 when the substrate 41 is installed, thereby clamping the substrate 41. For another example, in another possible implementation, the covering portion 11 forms an annular structure, and the edge of the substrate 41 is surrounded by the annular structure. The annular structure provides uniform support and fixation, thereby clamping the substrate 41.

[0065] It should be noted that enclosing the substrate 41 within the encapsulating portion 11 ensures that the chip package structure 4 is properly fixed in place during testing, thereby preventing a series of problems caused by a loose fixation of the chip package structure 4. For example, when testing the torsion, shear stress, and tensile stress of the chip package structure 4, inaccurate measured data may be avoided due to a loose fixation of the substrate 41.

[0066] It should be noted that, as described above, in order to securely fix the substrate 41 to the fixing frame 1, the substrate 41 can be fixed to the fixing frame 1 by gluing, or by enclosing the substrate 41 with the covering portion 11. In other words, the method for fixing the substrate 41 to the fixing frame 1 can be selected based on actual needs and is not limited herein.

[0067] For further information, please refer to Figures 1 to 3 The gripper 2 is used to grip the heat dissipation cover 42 of the chip package structure 4. In one possible implementation, the gripper 2 can be composed of two symmetrical claws, each of which terminates in a contact surface that contacts the heat dissipation cover 42. This contact surface can be flat. Furthermore, this contact surface has a certain degree of roughness or embedded features to ensure a secure grip and reduce slippage or displacement. For example, in one possible implementation, the contact surface can be configured as a micro-toothed or uneven surface to enhance grip.

[0068] In this embodiment, the heat dissipation cover 42 is grasped by the claw hand 2. Compared with the solution of fixing the heat dissipation cover 42 by glue, no glue is needed, thereby avoiding the adverse effects caused by glue storage, curing, and removal.

[0069] Optionally, in one possible implementation, the gripper 2 is made of a metal material. For example, in one embodiment, the gripper 2 is typically made of a high-strength metal material, such as stainless steel, aluminum alloy, or titanium alloy, to ensure sufficient strength and durability during the clamping process.

[0070] For further information, please refer to Figure 1 The control system 3 includes a controller 31 and a power mechanism 32 electrically connected to the controller 31; wherein the power mechanism 32 is mechanically connected to the gripper 2 to drive the gripper 2.

[0071] Specifically, the controller 31 is the core part of the control system 3 and is used to issue control signals. The motor mechanism 32 is electrically connected to the controller 31, receives the control signals issued by the controller 31 and converts them into actual power to drive the gripper 2. The gripper 2 serves as the actuator of the control system 3 and is connected to the power structure 32 through a mechanical connection for actually performing tasks.

[0072] As described above, this testing device is a device for testing torque. In a specific implementation, when testing torque, the tester will input a first instruction for instructing the test torque into the controller 31. This first instruction can be a command triggered by a physical key or virtual button on the controller 31, or it can be a control instruction from a control device, which is not limited in this embodiment.

[0073] Furthermore, the controller 31 controls the gripper 2 to rotate in a horizontal plane in response to the first instruction until the chip 43 enclosed in the substrate 41 and the heat dissipation cover 42 are separated, so as to test the torsion of the chip packaging structure 4 .

[0074] It should be noted that during the specific test, first, the substrate 41 of the chip package structure 4 is firmly fixed to the fixing frame 1. Secondly, the gripper 2 is made to firmly grasp the heat dissipation cover 42 of the chip package structure 4. Furthermore, the first instruction is triggered. After receiving the first instruction, the controller 31 controls the power mechanism 32 to drive the gripper 2 to rotate in the horizontal plane at a specific speed and direction. When the gripper 2 rotates in the horizontal plane, it applies torque to the heat dissipation cover 42. During the test, the gripper 2 continues to rotate until the heat dissipation cover 42 separates from the chip 43 enclosed in the substrate 41. In this way, by measuring the torque required to separate the heat dissipation cover 42, the torsional characteristics of the chip package structure 4 can be evaluated.

[0075] It should be noted that the speed and direction of rotation of the gripper 2 in the horizontal plane are set according to actual needs and are not limited in this embodiment.

[0076] Furthermore, a force sensor may be embedded in the power mechanism 32 to directly measure the torque applied to the heat dissipation cover 42 through the force sensor.

[0077] The test equipment provided in this embodiment can improve the stability and reliability of the test by providing a fixing frame, a gripper and a control system, and allowing the fixing frame to fix the substrate of the chip packaging structure to prevent it from moving during the test process; further, the gripper firmly clamps the heat dissipation cover to avoid loosening or slipping that may occur during the test, thereby ensuring the consistency of torque application. In addition, the controller responds to the first instruction and drives the power mechanism to rotate the gripper, thereby completing the torque test, which can effectively measure and analyze the torque of the chip packaging structure, avoid errors in manual testing, improve test efficiency, and ensure test accuracy.

[0078] Optionally, the controller 31 is also used to control the gripper 2 to move linearly in a horizontal plane in response to a second instruction until the chip 43 and the heat dissipation cover 42 are separated, so as to test the shear stress of the chip packaging structure 4; wherein the second instruction is an instruction for indicating the shear stress test.

[0079] Specifically, when testing shear stress, first, the substrate 41 of the chip package structure 4 is securely fixed to the fixing frame 1. Next, the gripper 2 is instructed to securely grasp the heat dissipation cover 42 of the chip package structure 4. Furthermore, a second instruction is triggered. Upon receiving the second instruction, the controller 31 controls the power mechanism 32 to drive the gripper 2 to perform linear motion within a horizontal plane. During this linear motion, the gripper 2 applies shear stress to the heat dissipation cover 42. Furthermore, during the test, the gripper 2 continues to perform linear motion within the horizontal plane until the heat dissipation cover 42 separates from the chip 43 encased in the substrate 41. Thus, by measuring the shear stress of the heat dissipation cover 42 during the separation process, the characteristics of the chip package structure 4 can be evaluated.

[0080] The test device provided in this embodiment controls the gripper to move linearly in a horizontal plane until the chip and the heat dissipation cover are separated by making the controller respond to the second instruction. In this way, the shear stress of the chip packaging structure can be tested, so that the test device has the function of testing both torque and shear stress. In this way, firstly, the test device can measure torque and shear stress at the same time. The torque test evaluates the bonding strength between the heat dissipation cover and the substrate, while the shear stress test measures the performance of the structure under shear force. By combining these two tests, the performance of the packaging structure in actual application can be fully understood. Secondly, there is no need to change the equipment, and the torque and shear stress can be tested on the same test device, which can reduce the downtime and resource waste during the test process and improve the test efficiency. Finally, performing different types of tests on the same test device can ensure the consistency of the test conditions and improve the reliability of the data.

[0081] Optionally, in one possible implementation, the controller 31 is further used to control the gripper 2 to move linearly in the vertical direction in response to a third instruction until the chip 43 and the heat dissipation cover 42 are separated, so as to test the tensile stress of the chip packaging structure 4; wherein the third instruction is an instruction for indicating the tensile stress test.

[0082] Specifically, when testing tensile stress, first, the substrate 41 of the chip package structure 4 is securely fixed to the fixing frame 1. Next, the gripper 2 is caused to securely grasp the heat dissipation cover 42 of the chip package structure 4. Furthermore, a third instruction is triggered. Upon receiving the third instruction, the controller 31 controls the power mechanism 32 to drive the gripper 2 to perform linear motion in a vertical direction. During this linear motion, the gripper 2 applies tensile stress to the heat dissipation cover 42. Furthermore, during the test, the gripper 2 continues to perform linear motion in the vertical direction until the heat dissipation cover 42 separates from the chip 43 encapsulated in the substrate 41. Thus, by measuring the tensile stress of the heat dissipation cover 42 during the separation process, the characteristics of the chip package structure 4 can be evaluated.

[0083] The test equipment provided in this embodiment controls the gripper to move linearly in the vertical direction until the chip and the heat dissipation cover are separated by causing the controller to respond to the third instruction. In this way, the tensile stress of the chip packaging structure can be tested, so that the test equipment has the functions of testing torque, shear stress and tensile stress. In this way, the test equipment can measure torque, shear stress and tensile stress at the same time. The torque test evaluates the bonding strength between the heat dissipation cover and the substrate, the shear stress test measures the performance of the structure under shear force, and the tensile stress test reflects the stability of the structure under tensile force. By combining these three tests, the performance of the packaging structure in actual application can be fully understood.

[0084] In combination with the above description, it can be understood that after receiving the instruction, the controller 31 drives the claw 2 to grasp the heat dissipation cover 42 through the power structure 32 to perform rotational movement to test torque, vertical movement to test tensile stress, and horizontal movement to test shear stress, thereby realizing the measurement of torque, shear stress and tensile stress between the chip 43 in the chip packaging structure 4 and the heat dissipation cover 42. Through its flexible control mechanism, the test equipment has multi-functional detection capabilities, can complete multiple tests on the same device, and provide a more comprehensive performance evaluation.

[0085] Figure 4 This is a three-dimensional diagram of a gripper according to an exemplary embodiment of the present application. Figure 5 This is a front view of a claw hand shown in an exemplary embodiment of this application. Figure 1 、 Figure 4 and Figure 5 In one possible implementation, the gripper 2 includes a first clamping component 21, a second clamping component 22, and a fixing component 23. The first clamping component 21 and the second clamping component 22 have a mounting plate 211 located in a vertical plane and a protrusion 212 located in a horizontal plane. The first clamping component 21 and the second clamping component 22 are L-shaped. The first clamping component 21 and the second clamping component 22 are fixed to the fixing component 23 via the mounting plate 211 in a manner that the protrusions 212 face each other.

[0086] The fixing component 23 is provided with a connecting portion 231 connected to the power structure 32 , and the claw hand 2 is connected to the power mechanism 32 via the connecting portion 231 .

[0087] Please continue to refer to Figure 4 and Figure 5 The first clamping member 21 and the second clamping member 22 have the same shape and are symmetrically mounted on both sides of the fixing member 23. The specific shapes of the first clamping member 21 and the second clamping member 22 will be described below by taking the first clamping member 21 as an example.

[0088] Specifically, the first clamping component 21 is L-shaped, and has a mounting plate 211 vertically placed on a vertical plane and a raised portion 212 horizontally placed in a horizontal plane. The mounting plate 211 and the raised portion 212 are combined together to form an L-shaped clamping component.

[0089] Please refer to Figure 4 In one possible implementation, the mounting plate 211 and the raised portion 212 may be a rectangular plate. Furthermore, in another possible implementation, the mounting plate 211 may be a rectangular plate, and the raised portion 212 may be an array of multiple small rectangular plates.

[0090] It should be noted that the first clamping member 21 can be integrally formed or provided as separate parts. Furthermore, when the first clamping member 21 is provided as a separate part, the connection method between the mounting plate 211 and the raised portion 212 is selected based on actual needs and is not limited herein. For example, in one embodiment, the mounting plate 211 and the raised portion 212 can be mechanically secured using mechanical fasteners such as screws, bolts, screws, rivets, etc.; for another example, in another embodiment, the mounting plate 211 and the raised portion 212 can be connected together by welding.

[0091] Optional, Figure 6 This is a schematic diagram of a first clamping component shown in an exemplary embodiment of the present application. Figure 6 In one possible implementation, the contact surface between the protrusion 212 and the heat dissipation cover 42 has a texture structure to increase the friction coefficient between the protrusion 212 and the heat dissipation cover 42 and provide sufficient clamping force to prevent the heat dissipation cover 42 from sliding during the test and affecting the test data.

[0092] Specifically, the specific morphology of the texture structure is set according to actual needs and is not limited in this embodiment. For example, in one possible implementation, the texture structure may be a grid-like texture structure; for another example, in another possible implementation, the texture structure may be a line-like texture structure; for another example, in yet another possible implementation, the texture structure may be a lattice-like texture structure.

[0093] It should be noted that the method for forming the texture structure can be selected according to actual needs and is not limited in this embodiment. For example, in one possible implementation, a special material such as rubber or silicone can be added to the contact surface between the protrusion 212 and the heat dissipation cover 42 to form a texture structure. In this way, while increasing friction, it can also reduce wear or damage to the heat dissipation cover 42. For another example, in another possible implementation, the texture structure can be formed on the contact surface by grooves. For another example, in yet another possible implementation, tiny barbs or serrations can be added to the contact surface to form a texture structure on the contact surface.

[0094] Please continue to refer to Figure 4 and Figure 5 The first clamping member 21 and the second clamping member 22 are fixed to the fixing member 23 via the mounting plate 211 with their protrusions 212 facing each other. That is, the first clamping member 21 and the second clamping member 22 are symmetrically arranged on both sides of the fixing member 23. This symmetrical fixing method ensures uniform distribution of the clamping force and avoids unnecessary stress concentration during the clamping process.

[0095] It should be noted that the first clamping member 21 and the second clamping member 22 can be fixed to the fixing member 23 by welding, bolting, pinning, etc., and the fixing method is not limited in this embodiment.

[0096] For details, please refer to Figure 4 and Figure 5 The fixing member 23 is provided with a connecting portion 231, which is used to connect to the power structure 32. Through the connecting portion 231, the gripper 2 can be mechanically connected to the power mechanism 32, so that under the command of the controller 31, the power mechanism 32 drives the gripper 2 to perform various operations, such as rotation, linear motion, etc.

[0097] The testing equipment provided in this embodiment provides a specific gripper structure. First, this structure enables the gripper to have efficient and stable clamping capabilities, and can perform multiple operations under the drive of a power mechanism, thereby realizing accurate testing of the torque, shear stress and tensile stress of the chip packaging structure. Second, this modular and symmetrical design can improve the working stability and operating accuracy of the gripper.

[0098] Please continue to refer to Figure 4 and Figure 5Optionally, in a possible implementation, the mounting plate 211 is fixed to the fixing component 23 by bolts, and the mounting plate 211 can be moved in a direction away from or close to the fixing component 23 to change the distance between the first clamping component 21 and the second clamping component 22, so as to clamp the chip packaging structure 4 with different heat dissipation cover sizes through the claw hand 2.

[0099] For details, please refer to Figure 6 The mounting plate 211 has a circular hole through which a bolt can be passed and fixed to the fixing component 23. Furthermore, by adjusting the position of the bolt and the nut on the bolt, the movement of the mounting plate 211 relative to the fixing component 23 can be controlled, that is, it can be moved away from or closer to the fixing component 23. In this way, the distance between the first clamping component 21 and the second clamping component 22 can be adjusted, so that the gripper 2 can clamp chip packaging structures 4 with different heat dissipation cover sizes (that is, it can clamp heat dissipation covers 42 of different sizes). In other words, whether it is a larger heat dissipation cover 42 or a smaller heat dissipation cover 42, it can be adapted by adjusting the clamping width of the gripper 2 (the distance between the two clamping components is the clamping width).

[0100] The test equipment provided in this embodiment, first, by adjusting the position of the mounting plate, the spacing between the first clamping component and the second clamping component can be flexibly changed, so that the claw hand can clamp heat dissipation covers of different sizes; second, after adjusting to the appropriate clamping width, the claw hand can clamp the heat dissipation cover more firmly, avoiding loosening or slipping due to size mismatch, and ensuring the uniformity and consistency of force applied during the test; finally, this flexible adjustment mechanism can reduce the wear of the clamping components, especially when facing heat dissipation covers of different sizes, without the need for forced clamping or replacement of components, which can extend the service life of the test equipment.

[0101] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A testing device, characterized in that: The testing device is used to test the torsion of the chip packaging structure; the testing device includes a fixing frame, a gripper and a control system; wherein, The fixing frame is used to fix the substrate of the chip packaging structure; The claw is used to clamp the heat dissipation cover of the chip packaging structure; The control system includes a controller and a power mechanism electrically connected to the controller; wherein the power mechanism is mechanically connected to the gripper to drive the gripper; The controller is used to control the gripper to rotate in a horizontal plane in response to a first instruction until the chip enclosed in the substrate and the heat dissipation cover are separated to test the torque of the chip packaging structure; wherein the first instruction is an instruction for indicating the test torque.

2. The test device according to claim 1, characterized in that The controller is also used to control the gripper to move linearly in a horizontal plane in response to a second instruction until the chip and the heat dissipation cover are separated to test the shear stress of the chip packaging structure; wherein the second instruction is an instruction for instructing the shear stress test.

3. The testing device according to claim 1, wherein: The controller is further configured to control the gripper to move linearly in a vertical direction in response to a third instruction until the chip and the heat dissipation cover are separated, so as to test the tensile stress of the chip packaging structure; wherein the third instruction is an instruction for instructing the tensile stress test.

4. The testing device according to claim 1, wherein: The claw hand includes a first clamping component, a second clamping component and a fixing component; wherein, The first clamping member and the second clamping member have a mounting plate located in a vertical plane and a raised portion located in a horizontal plane, and the first clamping member and the second clamping member are L-shaped; the first clamping member and the second clamping member are fixed to the fixing member via the mounting plate in a manner that the raised portions face each other; The fixing component is provided with a connecting portion connected to the power mechanism, and the claw hand is connected to the power mechanism through the connecting portion.

5. The testing device according to claim 4, characterized in that The mounting plate is fixed to the fixing component by bolts. The mounting plate can be moved in a direction away from or close to the fixing component to change the distance between the first clamping component and the second clamping component, so as to clamp chip packaging structures with different heat dissipation cover sizes through the claw hand.

6. The testing device according to claim 1, wherein: The substrate is fixed on the fixing frame by gluing.

7. The testing device according to claim 1, characterized in that The fixing frame is provided with a covering portion, and the substrate is covered in the covering portion.

8. The testing device according to claim 1, wherein: The fixing frame is made of metal material.

9. The testing device according to claim 1, characterized in that The claw hand is made of metal material.

10. The testing device according to claim 4, characterized in that A contact surface between the raised portion and the heat dissipation cover has a texture structure.

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