Temperature compensation system suitable for MPPC

Abstract

The utility model discloses a temperature compensation system suitable for MPPC, which is characterized by comprising a temperature detection module, a signal processing module and a high-voltage module which are connected in sequence, and the high-voltage module is connected with a voltage regulation module. According to the system, high-precision and low-delay temperature compensation can be realized, and the performance stability of the MPPC under different temperature conditions is kept.

Description

Technical Field

[0001] The utility model relates to photoelectric detector technology, which is applicable to temperature compensation technology of multi-pixel photoelectric counter MPPC (Multi PixelPhoton Counter for short MPPC), and is used to solve the problem that the MPPC performance fluctuates due to temperature changes. It is a temperature compensation system suitable for MPPC. Background Art

[0002] An MPPC is a photodetector based on a silicon photomultiplier (SiPM). Its gain is significantly affected by temperature. The gain of an MPPC is related to the bias voltage, while the breakdown voltage increases with temperature. Therefore, under fixed bias voltage conditions, an increase in breakdown voltage reduces the effective overbias voltage, leading to a decrease in gain. Furthermore, rising temperature significantly increases thermal noise, reducing the signal-to-noise ratio. Therefore, temperature compensation of the MPPC is necessary to ensure stable performance and reliable operation under varying temperature conditions.

[0003] Existing temperature compensation methods mainly rely on thermistors to adjust the bias voltage. However, the resistance value of thermistors changes nonlinearly with temperature, which makes the relationship between temperature and resistance complex and requires complex calibration and compensation circuits. Nonlinearity may lead to insufficient compensation accuracy, especially when the temperature changes over a large range. The thermistor's response speed to temperature is relatively slow, especially in an environment with rapid temperature changes, which may cause compensation lag. This lag will affect the ability to respond to temperature changes in real time. Existing technical solutions often have problems such as compensation lag, insufficient accuracy, and complex nonlinear processing, and cannot meet the needs of high-precision application scenarios. Therefore, it is of great significance to develop a system that can compensate for the impact of temperature changes on MPPC performance in real time and accurately. Utility Model Content

[0004] The purpose of the present invention is to address the deficiencies of the prior art and provide a temperature compensation system for MPPCs that can achieve high-precision, low-latency temperature compensation and maintain the performance stability of the MPPC under different temperature conditions.

[0005] The technical solution for achieving the purpose of this utility model is:

[0006] A temperature compensation system suitable for MPPC includes a temperature detection module, a signal processing module, and a high-voltage module connected in sequence, wherein the high-voltage module is connected to a voltage regulation module, wherein:

[0007] The temperature detection module is equipped with an analog temperature sensor TMP117 chip. The TMP117 chip collects the real-time temperature signal of the MPPC and transmits it to the non-inverting input terminal of the first operational amplifier. The core component of the temperature detection module is the TMP117 chip, which is designed for high-precision temperature acquisition. In actual operation, the chip first accurately collects the real-time temperature signal of the MPPC (multi-pixel photon counter) through the built-in sensing unit. The collected temperature signal is output in the form of an analog voltage and transmitted to the non-inverting input terminal of the first operational amplifier through a connecting line.

[0008] The signal processing module is provided with a first operational amplifier, a second operational amplifier and a third operational amplifier. The non-inverting input terminal of the first operational amplifier is connected to the temperature detection module to receive the analog signal of the temperature sensor. The inverting input terminal of the first operational amplifier is connected to the ground through a resistor R1 and is connected to the output terminal of the first operational amplifier through a resistor R2. This connection method forms a basic non-inverting amplifier structure. By adjusting the size of the resistors R1 and R2, the amplification factor of the non-inverting amplifier can be changed to make the transmission voltage meet the MPPC temperature coefficient; the non-inverting input terminal of the second operational amplifier is connected to the voltage regulation module to receive the analog voltage of the voltage regulation module, and the inverting input terminal of the second operational amplifier is connected to the ground through a resistor R1 and is connected to the output terminal of the first operational amplifier through a resistor R2. The output end of the first operational amplifier 1 is connected to the inverting input end of the third operational amplifier through a resistor R3, and the inverting input end of the third operational amplifier is connected to the output end of the third operational amplifier through a resistor R4. The output end of the second operational amplifier is connected to the non-inverting input end of the third operational amplifier through a resistor R5, and the non-inverting input end of the third operational amplifier is connected to the ground through a resistor R6, so that the third operational amplifier forms a subtractor structure. The output end of the third operational amplifier is connected to the pin FB of the high-voltage module boost chip. The three operational amplifiers of the signal processing module each assume different functions to realize signal processing and transmission;

[0009] The voltage regulation module is provided with a three-pin adjustable resistor, pin 1 of the three-pin adjustable resistor is connected to a 5V power supply, pin 2 is connected to the non-inverting input terminal of the second operational amplifier, and pin 3 is grounded. The voltage regulation module is composed of a three-pin adjustable resistor, the purpose of which is to achieve precise control of the circuit input voltage through the adjustment function of the resistor. Pin 1 is connected to the 5V power supply terminal to provide a stable DC voltage, which provides drive for the potential voltage divider function of the circuit. This connection ensures that the circuit can maintain the stability of the input voltage under different adjustment states; pin 2 is connected to the non-inverting input terminal of the second operational amplifier, and pin 2 is the middle tap of the adjustable resistor. By adjusting the resistance value of the variable resistor, the output potential of pin 2 can be dynamically changed, thereby inputting an adjustable signal voltage to the non-inverting input terminal of the second operational amplifier; pin 3 is grounded as the low potential reference point of the circuit, providing a stable zero potential reference for the entire resistance adjustment circuit, ensuring the reliability of circuit operation and signal stability;

[0010] The high-voltage module is provided with an LT8337 boost chip, which has four pins: MON, VOUT, FB, and HV. The FB pin is directly connected to the output of the third operational amplifier and is used to receive the input signal from the signal processing module to control the internal feedback loop of the boost chip. The MON pin is connected to the FB pin through two series resistors R8 and R9 to realize the voltage detection or adjustment function of the internal control loop of the LT8337 boost chip. The VOUT pin is connected to the FB pin through a resistor R7. This connection method provides a reference signal for the feedback control loop. The HV pin is the high-voltage output end of the LT8337 boost chip and is directly connected to the MPPC. It is responsible for providing the required high-voltage power supply for the MPPC to ensure that the MPPC can operate under optimal working conditions. The core of the high-voltage module is the LT8337 boost chip. The function of the LT8337 boost chip depends on the precise connection of multiple pins. The LT8337 boost chip's FB pin is connected directly to the output of the third operational amplifier to receive the input signal from the signal processing module. This controls the LT8337's internal feedback loop and ensures a stable and accurate output voltage. The MON pin of the LT8337 boost chip is connected to the FB pin via series resistors R8 and R9 to monitor the signal voltage at the FB pin. This connection provides voltage detection and adjustment for the LT8337's internal control loop, further enhancing circuit stability. The VOUT pin is connected to the FB pin via resistor R7 as a reference signal source for the feedback loop. This connection helps adjust and optimize the feedback control mechanism to maintain output voltage stability. The HV pin is the high-voltage output terminal of the boost chip and is directly connected to the MPPC (Multi-Pixel Photon Counter). It provides the required high-voltage power supply for the MPPC, ensuring its operation under optimal conditions.

[0011] The resistors R1 and R2 are adjustable resistors.

[0012] This technical solution is applicable to the temperature compensation system of MPPC. It adopts temperature detection module, voltage regulation module, signal processing module and high-voltage module to achieve high-precision and low-latency temperature compensation and maintain the performance stability of MPPC under different temperature conditions.

[0013] This technical solution has the following advantages:

[0014] 1. High-precision temperature compensation: The temperature detection module detects the MPPC temperature in real time, and combined with the signal processing module, it achieves precise matching of the voltage value and the MPPC temperature coefficient, ensuring gain stability and enabling the system to maintain high-precision operation under different temperature conditions;

[0015] 2. Flexible voltage regulation capability: The voltage regulation module provides a flexible reference voltage output through a combination of fixed-value resistors and adjustable resistors to adapt to the bias voltage requirements of different MPPC models;

[0016] 3. Controllable high-voltage output range: The high-voltage module can precisely adjust the high-voltage output range by adjusting resistors R7, R8, and R9, ensuring that the MPPC operates within the optimal bias voltage range and adapts to various operating conditions.

[0017] 4. Wide applicability: This technical solution is not only suitable for temperature compensation of photoelectric counters (MPPCs), but can also be expanded to other photoelectric detectors that are highly dependent on bias voltage, providing a reliable temperature compensation solution for a variety of precision measurement equipment.

[0018] This system can achieve high-precision, low-latency temperature compensation and maintain the performance stability of MPPC under different temperature conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the system structure in the embodiment;

[0020] Figure 2 Schematic diagram of the system circuit in the embodiment. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, but the present invention is not limited thereto.

[0022] Example:

[0023] Reference Figure 1 、 Figure 2 A temperature compensation system suitable for MPPC includes a temperature detection module, a signal processing module, and a high-voltage module connected in sequence, wherein the high-voltage module is connected to a voltage regulation module, wherein:

[0024] The temperature detection module is equipped with an analog temperature sensor TMP117 chip. The TMP117 chip collects the real-time temperature signal of the MPPC and transmits it to the non-inverting input terminal of the first operational amplifier 1. The core component of the temperature detection module is the TMP117 chip, which is designed for high-precision temperature acquisition. In actual operation, the chip first accurately collects the real-time temperature signal of the MPPC (multi-pixel photon counter) through the built-in sensing unit. The collected temperature signal is output in the form of an analog voltage and transmitted to the non-inverting input terminal of the first operational amplifier 1 through a connecting line.

[0025] The signal processing module is provided with a first operational amplifier 1, a second operational amplifier 2 and a third operational amplifier 3. The non-inverting input terminal of the first operational amplifier 1 is connected to the temperature detection module to receive the analog signal of the temperature sensor. The inverting input terminal of the first operational amplifier 1 is connected to the ground through a resistor R1 and is connected to the output terminal of the first operational amplifier 1 through a resistor R2. This connection method forms a basic non-inverting amplifier structure. According to the size of the adjustment resistors R1 and R2, the amplification factor of the non-inverting amplifier can be changed to make the transmission voltage meet the MPPC temperature coefficient; the non-inverting input terminal of the second operational amplifier 2 is connected to the voltage regulation module to receive the analog voltage of the voltage regulation module, and the inverting input terminal of the second operational amplifier 2 is connected to the output terminal of the second operational amplifier 2, forming a A follower circuit is formed; the output end of the first operational amplifier 1 is connected to the inverting input end of the third operational amplifier 3 through a resistor R3, the inverting input end of the third operational amplifier 3 is connected to the output end of the third operational amplifier 3 through a resistor R4, the output end of the second operational amplifier 2 is connected to the non-inverting input end of the third operational amplifier 3 through a resistor R5, and the non-inverting input end of the third operational amplifier 3 is connected to the ground through a resistor R6, so that the third operational amplifier 3 forms a subtractor structure, and the output end of the third operational amplifier 3 is connected to the high-voltage module boost chip pin FB. The three operational amplifiers of the signal processing module each assume different functions to realize signal processing and transmission. In this example, R1=1KΩ, R2=500Ω, R3=R4=R5=R6=2KΩ;

[0026] The voltage regulating module is provided with a three-pin adjustable resistor, pin 1 of the three-pin adjustable resistor is connected to a 5V power supply, pin 2 is connected to the non-inverting input terminal of the second operational amplifier 2, and pin 3 is grounded. The voltage regulating module is composed of a three-pin adjustable resistor, the purpose of which is to achieve precise control of the circuit input voltage through the adjustment function of the resistor. Pin 1 is connected to the 5V power supply terminal to provide a stable DC voltage, which provides drive for the potential voltage divider function of the circuit. This connection ensures that the circuit can maintain the stability of the input voltage under different adjustment states; pin 2 is connected to the non-inverting input terminal of the second operational amplifier 2, and pin 2 is the middle tap of the adjustable resistor. By adjusting the resistance value of the variable resistor, the output potential of pin 2 can be dynamically changed, thereby inputting an adjustable signal voltage to the non-inverting input terminal of the second operational amplifier 2; pin 3 is grounded as the low potential reference point of the circuit, providing a stable zero potential reference for the entire resistance adjustment circuit, ensuring the reliability of circuit operation and signal stability;

[0027] The high-voltage module is provided with an LT8337 boost chip, which is provided with four pins: MON, VOUT, FB and HV. Among them, the FB pin is directly connected to the output end of the third operational amplifier 3, and is used to receive the input signal from the signal processing module to realize the control of the internal feedback loop of the boost chip. The MON pin is connected to the FB pin through two series resistors R8 and R9 to realize the voltage detection or adjustment function of the internal control loop of the LT8337 boost chip. The VOUT pin is connected to the FB pin through the resistor R7. This connection method provides a reference signal for the feedback control loop. The HV pin is the high-voltage output end of the LT8337 boost chip and is directly connected to the MPPC. It is responsible for providing the required high-voltage power supply for the MPPC to ensure that the MPPC can operate under the best working conditions. The core of the high-voltage module is the LT8337 boost chip. The function of the LT8337 boost chip depends on the precise connection and reasonable configuration of multiple pins. The FB pin of the boost chip is directly connected to the output of the third operational amplifier 3. It receives the input signal from the signal processing module to control the internal feedback loop of the LT8337 boost chip, ensuring stable and accurate output voltage. The MON pin of the LT8337 boost chip is connected to the FB pin through series resistors R8 and R9 to monitor the signal voltage at the FB pin. This connection provides voltage detection and adjustment for the LT8337 boost chip's internal control loop, further enhancing circuit stability. The VOUT pin is connected to the FB pin through resistor R7 and serves as the reference signal source for the feedback loop. This connection helps adjust and optimize the feedback control mechanism to maintain output voltage stability. The HV pin is the high-voltage output terminal of the boost chip and is directly connected to the MPPC (Multi-Pixel Photon Counter). It provides the required high-voltage power supply to the MPPC, ensuring its operation under optimal conditions. In this example, R7 = 1 MΩ, R8 = 43 KΩ, and R9 = 10 KΩ.

[0028] In this example, resistors R1 and R2 are adjustable resistors.

[0029] The working process of the temperature compensation system in this example is as follows:

[0030] 1) The TMP117 chip collects the MPPC temperature signal, which is amplified and adjusted by the signal processing module to generate a temperature-compensated voltage signal, which is then input into the signal processing module;

[0031] 2) The voltage regulation module generates a controllable voltage, which is input into the signal processing module together with the temperature compensation signal;

[0032] 3) The signal processing module generates a differential signal through the third operational amplifier 3 and outputs it to the FB pin of the LT8337 boost chip;

[0033] 4) The LT8337 boost chip adjusts the boost circuit based on the feedback signal and outputs a stable high-voltage signal to the MPPC;

[0034] 5) MPPC operates continuously and stably under high voltage support and temperature compensation conditions.

Claims

1. A temperature compensation system suitable for MPPC, characterized in that: It includes a temperature detection module, a signal processing module and a high-voltage module connected in sequence, and the high-voltage module is connected to the voltage regulation module, wherein: The temperature detection module is provided with an analog temperature sensor TMP117 chip, which collects the real-time temperature signal of the MPPC and transmits it to the non-inverting input terminal of the first operational amplifier; The signal processing module is provided with a first operational amplifier, a second operational amplifier and a third operational amplifier. The non-inverting input terminal of the first operational amplifier is connected to the temperature detection module to receive the analog signal of the temperature sensor. The inverting input terminal of the first operational amplifier is connected to the ground through a resistor R1 and to the output terminal of the first operational amplifier through a resistor R2, forming a basic non-inverting amplifier structure; the non-inverting input terminal of the second operational amplifier is connected to the voltage regulation module to receive the analog voltage of the voltage regulation module, and the inverting input terminal of the second operational amplifier is connected to the output terminal of the second operational amplifier to form a follower circuit; the output terminal of the first operational amplifier is connected to the inverting input terminal of the third operational amplifier through a resistor R3, the inverting input terminal of the third operational amplifier is connected to the output terminal of the third operational amplifier through a resistor R4, the output terminal of the second operational amplifier is connected to the non-inverting input terminal of the third operational amplifier through a resistor R5, and the non-inverting input terminal of the third operational amplifier is connected to the ground through a resistor R6, so that the third operational amplifier forms a subtractor structure, and the output terminal of the third operational amplifier is connected to the pin FB of the high-voltage module boost chip; The voltage regulating module is provided with a three-pin adjustable resistor, wherein pin 1 of the three-pin adjustable resistor is connected to a 5V power supply, pin 2 is connected to the non-inverting input terminal of the second operational amplifier, and pin 3 is grounded; The high-voltage module is provided with an LT8337 boost chip, which has four pins: MON, VOUT, FB, and HV. The FB pin is directly connected to the output of the third operational amplifier, the MON pin is connected to the FB pin via two series resistors R8 and R9, the VOUT pin is connected to the FB pin via a resistor R7, and the HV pin serves as the high-voltage output of the LT8337 boost chip and is directly connected to the MPPC.

2. The temperature compensation system suitable for MPPC according to claim 1, characterized in that: The resistors R1 and R2 are adjustable resistors.

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