Small ITX computer case heat dissipation structure

Abstract

The utility model discloses a small ITX computer case heat dissipation structure, and particularly relates to the technical field of case heat dissipation, the small ITX computer case heat dissipation structure comprises an airflow partition plate, the inner wall of the left side of the airflow partition plate is fixedly connected with a pair of power supply supports through bolts, and the tops of the power supply supports are fixedly connected with the top of a case through bolts; the outer wall of the right side of the airflow partition plate is fixedly connected with a pair of fan supports through bolts, and the upper ends and the lower ends of the fan supports are fixedly connected with the right side of the case through bolts. The position of the power supply is changed, the air flow partition plate is additionally arranged at the bottom of the power supply to optimize an air duct, and the wire arrangement groove is formed in the top of the air flow partition plate, so that power supply cables are convenient to arrange, the arrangement space of the power supply cables is increased, and the arrangement effect of the power supply cables is improved. The arrangement space of the cables is increased in the limited cabinet volume, the air flow is further optimized, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chassis heat dissipation, in particular to a small ITX computer chassis heat dissipation structure. Background Art

[0002] A mini-ITX computer case is a miniaturized computer case suitable for assembling small personal computer systems. It adopts compact size and innovative design to meet the modern people's demand for portability and aesthetics of computer equipment. The size of an ITX case is usually within 150mm x 200mm x300mm.

[0003] Currently, small ITX cases are limited by their size and have low heat dissipation efficiency. In addition, the power cables are thick and difficult to organize, which often blocks the air duct, making the heat dissipation of small cases poor.

[0004] Therefore, a small ITX case with excellent heat dissipation is needed to fill the market gap. Utility Model Content

[0005] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] A small ITX computer case heat dissipation structure, comprising:

[0007] An airflow separator, wherein a pair of power supply brackets are fixedly connected to the left inner wall of the airflow separator by bolts, and the tops of the power supply brackets are fixedly connected to the top of the chassis by bolts;

[0008] A pair of fan brackets are fixedly connected to the right outer wall of the air flow dividing plate by bolts, and the upper and lower ends of the fan brackets are fixedly connected to the right side of the chassis by bolts;

[0009] A wire management slot is provided on the top of the airflow separation plate, just below the power supply bracket.

[0010] In a possible implementation, a pair of mounting plates are connected to the inner side of the fan bracket from top to bottom, and one side of the mounting plate is fixedly connected to the right side of the airflow separation plate by bolts.

[0011] In a possible implementation, a pair of fan hanging ears are connected to the inner side of the fan bracket near the bottom of the mounting plate, and one side of the fan hanging ear is fixedly connected to the fan by a bolt.

[0012] In a possible implementation, the power supply bracket is configured as an L-shaped structure.

[0013] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0014] The utility model changes the position of the power supply and adds an air flow separation plate at the bottom of the power supply to optimize the air duct, and provides a cable management groove on the top of the air flow separation plate to facilitate the organization of power cables, increase the space for organizing power cables, increase the space for organizing cables in a limited chassis volume, further optimize the airflow, and improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic structural diagram of the airflow separation plate of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the power supply bracket of the utility model;

[0019] Figure 4 This is a schematic structural diagram of the fan bracket of the present utility model.

[0020] Description of reference numerals:

[0021] 1. Airflow separator; 2. Fan bracket; 3. Power supply bracket; 4. Cable management trough; 5. Fan mounting ears; 6. Mounting plate. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0023] The embodiments of the present application solve the problems in the prior art by providing a small ITX computer case heat dissipation structure.

[0024] The technical solution in the embodiments of the present application is to solve the above problems, and the overall idea is as follows:

[0025] like Figures 1-4 As shown, a small ITX computer case heat dissipation structure includes:

[0026] The air flow separator 1 has a pair of power supply brackets 3 fixedly connected to the left inner wall of the air flow separator 1 by bolts, and the top of the power supply brackets 3 is fixedly connected to the top of the chassis by bolts;

[0027] A pair of fan brackets 2 are fixedly connected to the right outer wall of the air flow separation plate 1 by bolts, and the upper and lower ends of the fan brackets 2 are fixedly connected to the right side of the chassis by bolts;

[0028] A cable management slot 4 is provided at the top of the airflow dividing plate 1, just below the power supply bracket 3, for arranging some thick power cables, thereby increasing the arrangement space for the power cables and increasing the cable arrangement space within the limited chassis volume, thereby further optimizing the airflow.

[0029] In some examples, a pair of mounting plates 6 are connected to the inner side of the fan bracket 2 from top to bottom, and one side of the mounting plate 6 is fixedly connected to the right side of the airflow dividing plate 1 by bolts.

[0030] In some examples, a pair of fan hanging ears 5 are connected to the inner side of the fan bracket 2 near the bottom of the mounting plate 6 , and one side of the fan hanging ear 5 is fixedly connected to the fan by a bolt.

[0031] In some examples, the power supply bracket 3 is configured as an L-shaped structure.

[0032] The utility model changes the position of the power supply to the top of the chassis and adds an air flow separation plate 1 at the bottom of the power supply to optimize the air duct, and provides a cable management groove 4 on the top of the air flow separation plate 1 to facilitate the arrangement of power cables, thereby increasing the arrangement space of the power cables. The cable arrangement space is increased in the limited chassis volume, further optimizing the airflow and improving the heat dissipation effect.

[0033] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A small ITX computer case heat dissipation structure, characterized in that: include: An airflow separator (1), wherein a pair of power supply brackets (3) are fixedly connected to the left inner wall of the airflow separator (1) via bolts, and the tops of the power supply brackets (3) are fixedly connected to the top of the chassis via bolts; A pair of fan brackets (2) are fixedly connected to the right outer wall of the air flow separation plate (1) by means of bolts, and the upper and lower ends of the fan brackets (2) are fixedly connected to the right side of the chassis by means of bolts; A wire management slot (4) is provided on the top of the airflow separation plate (1) directly below the power supply bracket (3).

2. The heat dissipation structure of a small ITX computer case according to claim 1, characterized in that: A pair of mounting plates (6) are connected from top to bottom to the inner side of the fan bracket (2), and one side of the mounting plate (6) is fixedly connected to the right side of the airflow separation plate (1) via bolts.

3. The heat dissipation structure of a small ITX computer case according to claim 1, characterized in that: A pair of fan hanging ears (5) are connected to the inner side of the fan bracket (2) near the bottom of the mounting plate (6), and one side of the fan hanging ear (5) is fixedly connected to the fan by bolts.

4. The heat dissipation structure of a small ITX computer case according to claim 1, characterized in that: The power supply bracket (3) is configured as an L-shaped structure.

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