Insulated gate bipolar transistor (IGBT) vacuum carrier

Abstract

The utility model provides an IGBT vacuum carrier, and relates to the IGBT positioning clamp technology field, the IGBT vacuum carrier comprises a carrier body, the carrier body is provided with a vacuum pumping channel in a penetrating manner, the bearing surface of the carrier body is provided with a vacuum adsorption groove communicated with the vacuum pumping channel, and the vacuum adsorption groove is used for vacuum adsorption of an IGBT; according to the utility model, through the carrier body with the vacuumizing channel and the vacuum adsorption groove, the IGBT device can be stably and firmly positioned in a vacuum adsorption mode, the positioning effect is remarkable, the IGBT device cannot be damaged, and the product quality is effectively ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT positioning fixtures, in particular to an IGBT vacuum carrier. Background Art

[0002] IGBT stands for Insulated Gate Bipolar Transistor. When IGBT devices are positioned and produced on a wire bonding machine, an IGBT positioning fixture is usually used to position them to ensure the wire bonding effect. However, since the intermediate layer of the IGBT device is ceramic, the overall material of the device is relatively brittle. It is easy to crack or leave marks on the surface due to the clamping force of the fixture, which greatly affects the quality of the product. Utility Model Content

[0003] The purpose of the present invention is to provide an IGBT vacuum carrier to solve the technical problem in the prior art that the IGBT device is easily damaged by the use of a clamp to position the device, thereby affecting the product quality; the preferred technical solution among the many technical solutions provided by the present invention can produce many technical effects; see the detailed description below.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] The utility model provides an IGBT vacuum carrier, comprising a carrier body, wherein: a vacuum pumping channel is provided through the carrier body, a vacuum adsorption groove connected to the vacuum pumping channel is provided on the bearing surface of the carrier body, and the vacuum adsorption groove is used for vacuum adsorption of the IGBT.

[0006] Preferably, the shape of the vacuum adsorption groove is compatible with the IGBT.

[0007] Preferably, the vacuum adsorption tank includes a main tank body, the main tank body includes a square tank body, and the inner side of the square tank body is connected to at least one of a transverse tank body, a longitudinal tank body or a first inclined tank body.

[0008] Preferably, the vacuum channel is vertically arranged at the center of the main tank body and is communicated with the main tank body.

[0009] Preferably, the vacuum adsorption tank includes a sub-tank body, which is connected to the edge of the main tank body; the sub-tank body includes a rectangular tank body, and a second inclined tank body is connected to the rectangular tank body.

[0010] Preferably, the number of the vacuum adsorption grooves is set to be multiple, and each of the vacuum adsorption grooves is connected to the vacuum extraction channel.

[0011] Preferably, the vacuum adsorption tank is provided with adsorption filter paper; the shape of the adsorption filter paper is adapted to the vacuum adsorption tank.

[0012] Preferably, a sealing strip is embedded in the outer contour of the vacuum adsorption tank.

[0013] Preferably, a positioning block is provided on the carrying surface of the carrier body.

[0014] Preferably, a clearance groove is provided on at least one side of the vacuum adsorption groove on the carrying surface of the carrier body.

[0015] The IGBT vacuum carrier provided by the utility model has at least the following beneficial effects:

[0016] The IGBT vacuum carrier includes a carrier body, which is used to carry the IGBT device.

[0017] The carrier body is provided with a vacuum channel running through it, and a vacuum adsorption groove connected to the vacuum channel is provided on the bearing surface of the carrier body. When producing IGBT devices, the IGBT devices are placed on the vacuum adsorption groove, and the vacuum channel is evacuated to generate negative pressure in the vacuum adsorption groove, thereby firmly adsorbing the IGBT device on the bearing surface of the carrier body. The vacuum adsorption positioning method is adopted, and the IGBT device can be stably positioned without affecting the substrate bonding effect of the IGBT device.

[0018] The utility model can steadily and firmly position the IGBT device by vacuum adsorption through the carrier body with the vacuum channel and the vacuum adsorption groove, which not only has a significant positioning effect but also does not cause damage to the IGBT device, thereby effectively ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a top view schematic diagram of the utility model;

[0021] Figure 2 It is a main schematic diagram of the utility model;

[0022] Figure 3 It is an enlarged view of part A of the present utility model;

[0023] Figure 4It is a structural diagram of the IGBT device of the utility model;

[0024] Figure 5 It is a schematic diagram of the top view of the present invention;

[0025] Figure 6 This is a schematic diagram of the main dimensions of the present invention;

[0026] Figure 7 It is a structural diagram of the filter paper of the utility model;

[0027] Figure 8 It is a structural schematic diagram of the sealing strip of the utility model.

[0028] Reference numerals

[0029] 1. Carrier body; 2. Vacuum channel; 3. Vacuum adsorption groove; 31. Main groove body; 311. Square groove body; 312. Horizontal groove body; 313. Longitudinal groove body; 314. First inclined groove body; 32. Secondary groove body; 321. Rectangular groove body; 322. Second inclined groove body; 4. Positioning block; 5. Yield groove; 6. Filter paper; 7. Sealing strip; 8. IGBT device. DETAILED DESCRIPTION

[0030] To make the purpose, technical solution, and advantages of the present invention more clear, the technical solution of the present invention will be described in detail below. Obviously, the embodiments described are only some of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0031] Example 1:

[0032] The utility model provides an IGBT vacuum carrier, referring to Figure 1 and Figure 2 As shown, the IGBT vacuum carrier includes a carrier body 1 .

[0033] A vacuum channel 2 is provided through the carrier body 1 , and a vacuum adsorption groove 3 connected to the vacuum channel 2 is provided on the carrying surface of the carrier body 1 . The vacuum adsorption groove 3 is used for vacuum adsorption of the IGBT device 8 .

[0034] When in use, the IGBT vacuum carrier is placed on the workbench and clamped. At this time, the vacuum channel 2 is connected to the vacuum tube, and the IGBT device 8 is placed on the vacuum adsorption groove 3. The vacuum is turned on, and the vacuum adsorption groove 3 generates negative pressure to steadily adsorb the IGBT device 8. After that, wire bonding can be carried out.

[0035] The utility model uses a carrier body 1 with a vacuum channel 2 and a vacuum adsorption groove 3 to stably adsorb the IGBT device 8 by vacuum adsorption, which not only has a significant positioning effect but also does not cause damage to the IGBT device 8, and can effectively ensure product quality.

[0036] Example 2

[0037] Example 2 is based on Example 1:

[0038] like Figures 1 to 4 As shown, the shape of the vacuum adsorption groove 3 is adapted to the IGBT device 8 .

[0039] Specifically, the outer contour of the vacuum adsorption groove 3 is slightly smaller than the bottom surface of the substrate of the IGBT device 8 , so that the IGBT device 8 can be adsorbed stably.

[0040] As an optional embodiment, the vacuum adsorption tank 3 includes a main tank body 31, and the main tank body 31 corresponds to Figure 4 The lower body portion of the IGBT device 8 is shown.

[0041] The main slot body 31 includes a square slot body 311 , and the inner side of the square slot body 311 is connected to at least one of the transverse slot body 312 , the longitudinal slot body 313 or the first inclined slot body 314 .

[0042] The square groove body 311 , the transverse groove body 312 , the longitudinal groove body 313 and the first inclined groove body 314 cooperate with each other, and the vacuum adsorption effect is significant.

[0043] Specifically, the number of the transverse trough body 312 and the longitudinal trough body 313 is set to one, and the square trough body 311, the transverse trough body 312 and the longitudinal trough body 313 form a field shape; the number of the first inclined trough bodies 314 is set to two, and the two first inclined trough bodies 314 are cross-arranged on the two diagonals of the square trough body 311.

[0044] As an optional embodiment, the vacuum channel 2 is vertically arranged at the center of the main tank body 31 and is connected to the main tank body 31. In this way, the adsorption force of the vacuum adsorption tank 3 is relatively balanced, further improving the adsorption effect on the IGBT device 8.

[0045] As an optional embodiment, the vacuum adsorption tank 3 includes a sub-tank body 32, which is connected to the edge of the main tank body 31. The sub-tank body 32 corresponds to Figure 4 The upper side portion of the IGBT device 8 is shown.

[0046] The auxiliary trough body 32 includes a rectangular trough body 321 , and the inner side of the rectangular trough body 321 is connected to the second inclined trough body 322 . The rectangular trough body 321 and the second inclined trough body 322 cooperate with each other, and the vacuum adsorption effect is significant.

[0047] Specifically, the number of the second inclined trough bodies 322 is set to two, one end of the second inclined trough body 322 is connected to the corner of the rectangular trough body 321, and the other end of the second inclined trough body 322 is connected to the midpoint of the long side of the rectangular trough body 321, and the two second inclined trough bodies 322 form a V shape.

[0048] As an optional embodiment, the number of the vacuum adsorption grooves 3 is set to be multiple, and each vacuum adsorption groove 3 is connected to a vacuum pumping channel 2 .

[0049] Preferably, the number of the vacuum adsorption slots 3 is set to six, which are evenly distributed in two rows and three columns.

[0050] As an optional embodiment, a positioning block 4 is provided on the bearing surface of the carrier body 1 , and the positioning block 4 is used for positioning the IGBT vacuum carrier.

[0051] As an optional embodiment, a clearance groove 5 is provided on at least one side of the vacuum adsorption groove 3 on the carrying surface of the carrier body 1 .

[0052] When taking the IGBT device 8 , the recess 5 makes way for the fingers, making it more convenient to take the device.

[0053] Preferably, each vacuum adsorption groove 3 is provided with a clearance groove 5 on both sides.

[0054] As an optional embodiment, Figure 5 and Figure 6 As shown, the length of the carrier body 1 is set to 200 mm, the width is set to 170 mm, and the thickness is set to 10 mm. The length of the main groove body 31 is set to 38 mm and the width is 34 mm. The length of the auxiliary groove body 32 is set to 25 mm and the width is set to 8 mm.

[0055] Example 3

[0056] Example 3 is based on Example 2:

[0057] like Figure 7 As shown, an adsorption filter paper 6 is attached to the vacuum adsorption tank 3 ; the shape of the adsorption filter paper 6 is adapted to the vacuum adsorption tank 3 , and the shape of the adsorption filter paper 6 is slightly larger than the bottom surface of the substrate of the IGBT device 8 .

[0058] Since the IGBT device 8 has to go through processes such as reflow soldering and cleaning, and is affected by thermal expansion and contraction, the bottom surface of its substrate will undergo slight deformation, and the flatness of the bottom surface cannot be guaranteed, which will affect the vacuum degree. The setting of the adsorption filter paper 6 can effectively overcome this problem and ensure the vacuum adsorption effect.

[0059] Example 4

[0060] Example 4 is based on Example 2:

[0061] like Figure 8 As shown, a sealing strip 7 is embedded in the outer contour of the vacuum adsorption groove 3 .

[0062] The function of the sealing strip 7 is the same as that of the adsorption filter paper 6 , which is used to solve the problem of the vacuum degree being affected by the uneven bottom surface of the substrate of the IGBT device 8 , and can effectively ensure the vacuum adsorption effect.

[0063] In the description of this application, it should be understood that the terms "upper", "lower", "inside", "outside", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0064] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the description of this application, "plurality" or "several" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0065] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; they can refer to direct connection or indirect connection through an intermediate medium; they can refer to internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0066] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An IGBT vacuum carrier, characterized in that: The vehicle comprises a vehicle body, wherein: The carrier body is provided with a vacuum channel running through it, and a vacuum adsorption groove connected to the vacuum channel is provided on the carrying surface of the carrier body, and the vacuum adsorption groove is used for vacuum adsorption of the IGBT; The vacuum adsorption tank is provided with adsorption filter paper; the shape of the adsorption filter paper is adapted to the vacuum adsorption tank.

2. The IGBT vacuum carrier according to claim 1, characterized in that: The shape of the vacuum adsorption groove is adapted to the IGBT.

3. The IGBT vacuum carrier according to claim 1, characterized in that: The vacuum adsorption tank includes a main tank body, which includes a square tank body. The inner side of the square tank body is connected to at least one of a transverse tank body, a longitudinal tank body or a first inclined tank body.

4. The IGBT vacuum carrier according to claim 3, characterized in that: The vacuum channel is vertically arranged at the center of the main tank body and is communicated with the main tank body.

5. The IGBT vacuum carrier according to claim 3, characterized in that: The vacuum adsorption tank includes a secondary tank body, and the secondary tank body is connected and arranged at the edge of the main tank body; The auxiliary trough body comprises a rectangular trough body, and a second inclined trough body is provided in the inner side of the rectangular trough body.

6. The IGBT vacuum carrier according to claim 1, characterized in that: The number of the vacuum adsorption grooves is set to be multiple, and each of the vacuum adsorption grooves is connected to the vacuum pumping channel.

7. The IGBT vacuum carrier according to claim 1, characterized in that: A sealing strip is embedded in the outer contour of the vacuum adsorption tank.

8. The IGBT vacuum carrier according to claim 1, characterized in that: A positioning block is provided on the bearing surface of the carrier body.

9. The IGBT vacuum carrier according to claim 1, characterized in that: A clearance groove is provided on at least one side of the vacuum adsorption groove on the carrying surface of the carrier body.

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