Novel optical communication ceramic tube shell structure

Abstract

The utility model provides a novel optical communication ceramic tube shell structure, which relates to the technical field of chip packaging, and comprises a ceramic body, the ceramic body is provided with an inner cavity, the side wall of the ceramic body is also provided with an embedded welded junction with a metalized area, and the novel optical communication ceramic tube shell structure also comprises a lead wire which enters the embedded welded junction and is combined and connected with the ceramic body through welding. According to the optical communication ceramic tube shell structure provided by the utility model, the sunken embedded welded junctions are arranged on the two side surfaces of the ceramic body, when the ceramic body and the leads are brazed, the ceramic body is inverted, the welding flux is placed on the surfaces of the embedded welded junctions, the welding flux is attached to the inner wall of the ceramic body, and then the leads on the two sides are clamped by using a clamp, so that the problem that in a traditional structure, the welding flux cannot be damaged is solved. The defect of height difference caused by lead skew due to poor positioning precision when metallized areas on the surfaces of the two sides of a ceramic piece are brazed with leads is overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a novel optical communication ceramic tube shell structure. Background Art

[0002] Dual in-line ceramic package (CDIP) mainly includes Figure 1 The sealing ring, lead, catheter, ceramic body and brazing solder of each part are shown. Traditional dual-in-line ceramic package products usually pre-electroplate a metallized area on the side surface of the ceramic body. The leads are led out from both sides of the package, positioned by a mold, and solder is placed. The solder and the mold are clamped and fixed on the outside using a clip. The solder is infiltrated by high-temperature brazing (800℃~820℃) to achieve the purpose of brazing the lead end with the metallized area on the side of the ceramic block. At present, the above-mentioned brazing method has the following technical problems: First, in the process of brazing the metallized areas on the two sides of the ceramic body and the leads, the positioning accuracy of the solder and the mold is poor, which increases the risk of manual clamping time and yield rate; second, the method of using prefabricated solder for the leads is to place the prefabricated solder leads in the brazing mold for fixed welding. Although the leads can be fixed to the metallized areas on the side of the ceramic body, the manufacturing cost is high and it does not have an advantage in industrial production. Utility Model Content

[0003] The purpose of this utility model is to provide a new optical communication ceramic shell structure to solve the above technical problems.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A novel optical communication ceramic shell structure includes a ceramic body with an inner cavity, an embedded weld with a metallized area on the side wall of the ceramic body, and a lead wire that enters the embedded weld and is welded to the ceramic body.

[0006] Furthermore, the sinking depth of the embedded solder joint is the total lead height plus 0.05 mm or 0.03 mm. Specifically, the sinking depth of the embedded solder joint (Ttotal) = the total lead height (Ltotal) + (0.05 / 0.03) mm.

[0007] Furthermore, when the lead is embedded in the weld, the solder is placed between the lead and the ceramic body, and a fixture is used to flow the excess solder during high-temperature brazing to the side wall, thereby increasing the firmness of the brazing between the ceramic body and the lead.

[0008] Furthermore, the metallized area of ​​the ceramic body is further provided with an inner cavity, an inner cavity opening, a side wall of the ceramic body not connected to the lead wire, and a bottom of the ceramic body.

[0009] Furthermore, a sealing ring is fixed to the metallized area at the inner cavity opening by welding.

[0010] Furthermore, a conduit is welded to the side wall of the ceramic body where no lead is connected at the metallized area.

[0011] Furthermore, the sealing ring and the conduit are made of Kovar metal. Preferably, the sealing ring is made of 4J29 material, and the conduit is made of either 4J29 material or oxygen-free copper material.

[0012] Furthermore, the metallized area is nickel plated on the surface of the tungsten slurry, and the thickness of the nickel layer is 0.6 to 2.0 μm. Preferably, the thickness of the nickel layer is 1.2 to 2.0 μm.

[0013] Furthermore, the solder used for welding is silver-copper solder, and the type is Ag72Cu28 silver-copper solder.

[0014] Furthermore, the material of the ceramic body is alumina ceramic, and the alumina ceramic is 92% alumina ceramic.

[0015] Furthermore, in order to improve the welding performance of the ceramic body, the lead wire is pre-plated with nickel by electroplating or chemical plating before welding to the ceramic body, and the nickel layer thickness is 0.6-2.0 μm, preferably, the nickel layer thickness is 0.6-1.3 μm.

[0016] The beneficial effects of the utility model are:

[0017] 1. The optical communication ceramic shell structure proposed by the utility model is provided with sunken embedded welding holes on both sides of the ceramic body. When brazing the ceramic body and the lead, the ceramic body is inverted, and solder is placed on the surface of the embedded welding hole to make the solder fit the inner wall of the ceramic body. Then, the leads on both sides are clamped with a clamp. This avoids the poor positioning accuracy caused by brazing the metallized areas on both sides of the ceramic surface and the leads in the traditional structure, which in turn causes the height difference defect caused by the skewed leads.

[0018] 2. In the present invention, the side walls of the embedded welds between the ceramic body and the lead are metallized areas, and the solder is placed between the lead and the ceramic body. A fixture is used to allow excess solder to flow along the side walls during high-temperature brazing, thereby increasing the firmness of the brazing between the ceramic part and the lead. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of the current dual in-line ceramic package tube shell;

[0020] Figure 2 This is a schematic diagram of a new type of optical communication ceramic shell and tube structure;

[0021] Figure 3 for Figure 2 An exploded view of a portion of the structure shown;

[0022] Figure numerals: 1, sealing ring; 2, ceramic body; 3, catheter; 4, lead wire; 5, embedded weld. DETAILED DESCRIPTION

[0023] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to facilitate a more thorough and comprehensive understanding of the disclosure of the present invention.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0025] The specific embodiments of the present utility model are described below with reference to the accompanying drawings.

[0026] Example 1

[0027] In this embodiment, a new type of optical communication ceramic shell structure is proposed. Please refer to Figure 1 , and see Figure 2 and Figure 3 The optical communication ceramic shell structure includes a conduit 3, a ceramic body 2, an embedded weld 5, a sealing ring 1 and a lead 4, wherein the ceramic body 2 is Figure 2 and Figure 3 In the shaded portion shown, an embedded solder joint 5 is provided at the lateral position of the ceramic body 2, that is, at the side wall, and a metallized area is provided in the embedded solder joint 5.

[0028] Of course, the metallized area is not limited to the embedded solder joint 5, please continue to refer to Figure 2 and Figure 3 The metallized area also includes the inner cavity of the ceramic body 2 (not shown in the figure), the inner cavity opening, that is, the top of the ceramic body 2, the side wall of the ceramic body 2 not connected to the lead 4 and the bottom of the ceramic body 2.

[0029] Further explanation: the ceramic body 2 has two side walls not connected to the lead 4, but only one side wall has a metallized area. Figure 2 and Figure 3 The blank part shown is connected with the conduit 3 by welding; Figure 2 and Figure 3 A sealing ring 1 is fixed to the metallized area at the inner cavity opening by welding.

[0030] Further explanation, the lead 4 has a connector adapted to fit the embedded solder joint 5, the connector is as follows Figure 2As shown, it enters the embedded welding opening 5 and is assembled with the ceramic body 2 through welding.

[0031] In addition, the sinking depth of the embedded solder joint 5 is the total lead height plus 0.05 mm or 0.03 mm. Specifically, the sinking depth of the embedded solder joint 5 (Ttotal) = the total lead height (Ltotal) + (0.05 / 0.03) mm.

[0032] To further supplement, in this embodiment, the solder used for the above-mentioned welding is Ag72Cu28 silver-copper solder. In addition, the specific welding method for the lead 4 and the embedded weld 5 is that the Ag72Cu28 silver-copper solder is placed between the lead 4 and the ceramic body 2, and a clamp is used to flow the excess solder during high-temperature brazing to the side wall, thereby increasing the firmness of the brazing between the ceramic body 2 and the lead 4.

[0033] In this embodiment, the following technologies and parameters need to be explained:

[0034] ① The material of the ceramic body 2 is alumina ceramic.

[0035] ② The metallized area is nickel-plated on the surface of the tungsten slurry, and the thickness of the nickel layer is 0.6 to 2.0 μm.

[0036] ③ Before welding the lead 4 to the ceramic body 2, the lead 4 is pre-plated with nickel by electroplating or chemical plating, and the thickness of the nickel layer is 0.6 to 2.0 μm.

[0037] ④ The sealing ring 1 and the conduit 3 are made of Kovar metal. The sealing ring 1 is made of 4J29 material, and the conduit 3 is made of either 4J29 material or oxygen-free copper material.

[0038] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A novel optical communication ceramic shell and tube structure, characterized by: The invention comprises a ceramic body having an inner cavity, an embedded welding opening with a metallized area on the side wall of the ceramic body, and a lead wire which enters the embedded welding opening and is connected to the ceramic body through welding.

2. The novel optical communication ceramic shell structure according to claim 1, characterized in that: The metallized area of ​​the ceramic body is further provided with an inner cavity, an inner cavity opening, a side wall of the ceramic body not connected with a lead, and a bottom of the ceramic body.

3. The novel optical communication ceramic shell structure according to claim 2, characterized in that: The metallized area at the inner cavity opening is fixed with a sealing ring by welding.

4. The novel optical communication ceramic shell structure according to claim 3, characterized in that: The sidewalls of the ceramic body where no leads are connected are welded with conduits at the metallized areas.

5. The novel optical communication ceramic shell structure according to claim 4, characterized in that: The sealing ring and the guide tube are made of Kovar metal.

6. The novel optical communication ceramic shell structure according to claim 1, characterized in that: Before welding the lead wire to the ceramic body, nickel is pre-plated by electroplating or chemical plating, and the thickness of the nickel layer is 0.6 to 2.0 μm.

7. The novel optical communication ceramic shell structure according to claim 2, characterized in that: The metallized area is nickel-plated on the surface of the tungsten slurry, and the thickness of the nickel layer is 0.6 to 2.0 μm.

8. The novel optical communication ceramic shell structure according to claim 4, characterized in that: The solder used for welding is silver-copper solder.

9. The novel optical communication ceramic housing structure according to claim 1, characterized in that: The material of the ceramic body is alumina ceramic.

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