Power module heat dissipation module and electronic equipment

Abstract

The utility model discloses a power module heat radiation module and an electronic device, and relates to the power device technology field, the power module heat radiation module comprises a radiator, a power element and a heat conduction medium, the heat conduction medium comprises a first connection layer, an insulation layer and a second connection layer which are laminated in sequence, one side of the first connecting layer back to the insulating layer is connected with the radiator, and one side of the second connecting layer back to the insulating layer is connected with the power element. The utility model aims to simplify the heat radiation structure design of the power device and reduce the occupied space.

Description

Technical Field

[0001] The utility model relates to the technical field of power devices, in particular to a power module heat dissipation module and electronic equipment. Background Art

[0002] In the related art, electronic components generate heat when working, and it is necessary to dissipate heat from the electronic components in a timely manner to ensure the normal operation of the electronic components.

[0003] See also Figure 1 Taking MOS tube as an example, MOS tube is a commonly used semiconductor device. Due to its fast switching speed, high efficiency and good thermal stability, it is widely used in amplifiers, switches, voltage control, power control and other fields. In the existing MOS tube top heat dissipation structure design, the MOS tube and the heat sink are usually connected by a method of thermal conductive gel + insulating material + screw locking. In this structure, the heat dissipation surface of the MOS tube is in contact with the thermal conductive gel, and the thermal conductive gel conducts heat to the heat sink through the insulating material to achieve efficient heat conduction. However, since the thermal conductive gel needs to be under pressure to fill the gap between the MOS tube and the heat sink, the MOS tube and the heat sink also need to be connected by screw locking, so that the thermal conductive gel, the insulating material and the MOS tube can achieve better thermal surface contact, thereby ensuring the stability and reliability of the heat dissipation structure.

[0004] However, the screw locking method not only takes up space and is not conducive to high-density miniaturization of products, but the installation position of the screws may interrupt the routing area on the circuit board, thereby affecting the integrity of the line signal and the layout of the circuit, affecting the product design. Utility Model Content

[0005] The main purpose of the utility model is to provide a power module heat dissipation module and electronic equipment, aiming to simplify the heat dissipation structure design of power devices and reduce space occupation.

[0006] To achieve the above objectives, the present invention proposes a power module heat dissipation module, comprising:

[0007] heat sink;

[0008] power components; and

[0009] A heat-conducting medium includes a stacked insulating heat-conducting layer and a first connecting layer, wherein the side of the insulating heat-conducting layer facing away from the first connecting layer is connected to the heat sink, and the side of the first connecting layer facing away from the insulating heat-conducting layer is connected to the power element.

[0010] In one embodiment, the insulating heat-conducting layer includes a stacked second connection layer and an insulating layer, the second heat-conducting medium is connected to the heat sink on a side facing away from the insulating layer, and the insulating layer is connected to the first connection layer on a side facing away from the second connection layer.

[0011] In one embodiment, the second connection layer includes a metal layer and a welding layer that are stacked and connected, the side of the metal layer facing away from the welding layer is connected to the insulating layer, and the side of the welding layer facing away from the metal layer is connected to the heat sink.

[0012] In one embodiment, the second connection layer includes a metal layer and an adhesive layer that are stacked and connected, the metal layer is connected to the insulating layer on a side facing away from the welding layer, and the adhesive layer is connected to the heat sink on a side facing away from the metal layer.

[0013] In one embodiment, the first connection layer is made of adhesive.

[0014] In one embodiment, the second connecting layer and the first connecting layer are mirror-symmetrical structures.

[0015] In one embodiment, a receiving groove is formed on a side of the insulating layer facing away from the first connecting layer, and the power element is at least partially fixedly inserted into the receiving groove through the second connecting layer.

[0016] In one embodiment, the insulating layer is one or more of a ceramic sheet, an insulating coating, or an insulating film.

[0017] In one embodiment, the surface of the insulating heat-conducting layer facing away from the heat sink is a heat-conducting surface, and the surface of the power element facing the first connecting layer is a heat source surface;

[0018] The area of ​​the heat conducting surface is A, the area of ​​the heat source surface is B, and A≥B.

[0019] In one embodiment, the power element is a MOS transistor, and a pin for soldering to a circuit board is provided on a side of the MOS transistor facing away from the first connection layer.

[0020] The utility model also provides an electronic device, comprising the power module heat dissipation module as described above.

[0021] The power module heat dissipation module provided by the present invention connects the heat sink and the power element by using a first connection layer and an insulating heat-conducting layer, so that the heat of the heat sink of the power element is stably transferred to the first connection layer, and then the insulating heat-conducting layer is used to equalize the heat and increase the heat melting, thereby further transferring the heat to the heat sink. Compared with the traditional screw locking method, the power module heat dissipation module provided by the present invention can have a simpler connection structure and simplify the production process steps. Not only does it make the overall module occupy a small space, which is conducive to high-density miniaturization of the product, but it also does not affect the integrity of the layout of the circuit board and the wiring. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] Figure 1 This is a schematic diagram of the structure of a power module heat dissipation module in the prior art;

[0024] Figure 2 This is a structural diagram of an embodiment of a power module heat dissipation module provided by the utility model.

[0025] Description of Figure Numbers:

[0026] 100. Power module heat dissipation module; 1. Radiator; 2. Power element; 3. Thermal conductive medium; 31. Insulating thermal conductive layer; 311. Second connecting layer; 312. Insulating layer; 32. First connecting layer; 4. Substrate.

[0027] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0029] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0031] The present invention provides a power module heat dissipation module 100 .

[0032] See also Figure 2 In one embodiment of the present invention, the power module heat dissipation module 10000 includes a heat sink 1, a power element 2 and a heat-conducting medium 3; the heat-conducting medium 3 includes a stacked insulating heat-conducting layer and a first connecting layer 32, the insulating heat-conducting layer 31 is connected to the heat sink 1 on the side facing away from the first connecting layer 32, and the first connecting layer 32 is connected to the power element 2 on the side facing away from the insulating heat-conducting layer 31.

[0033] The power module heat dissipation module 100 provided by the present invention connects the heat sink 1 and the power element 2 by using a first connection layer 32 and an insulating heat-conducting layer 31, so that the heat of the heat sink of the power element 2 is stably conducted to the first connection layer 32, and then the insulating heat-conducting layer 31 is used to equalize the heat and increase the heat melt, thereby further conducting the heat to the heat sink 1. Compared with the traditional screw locking method, the power module heat dissipation module 100 provided by the present invention can have a simpler connection structure and simplify the production process steps. Not only does it make the overall module occupy a small space, which is conducive to high-density miniaturization of the product, but it also does not affect the integrity of the layout of the circuit board and the wiring.

[0034] It should be noted that, in one embodiment, the insulating thermally conductive layer 31 can be a thermally conductive insulating coating material directly covered on the heat sink 1 by a processing method such as spraying or printing, such as an epoxy resin composite material containing a high thermal conductivity ceramic filler or a composite material with a high thermal conductivity ceramic filler such as boron nitride (BN). This material has good thermal conductivity and insulation properties. Of course, in another embodiment of the present application, the insulating thermally conductive layer 31 includes a second connecting layer 311 and an insulating layer 312 arranged in a stacked manner, the side of the second thermal conductive medium 3 facing away from the insulating layer 312 is connected to the heat sink 1, and the side of the insulating layer 312 facing away from the second connecting layer 311 is connected to the first connecting layer 32. The first connecting layer 32 and the second connecting layer 311 respectively connect the insulating layer 312 to the heat sink 1 and the power element 2, so as to stably transfer the heat of the heat sink of the power element 2 to the insulating layer 312, and then use the insulating layer 312 to further transfer the heat to the heat sink 1.

[0035] In one embodiment of the present application, the second connection layer 311 includes a stacked and connected metal layer and a solder layer. The side of the metal layer facing away from the solder layer is connected to the insulating layer 312, and the side of the solder layer facing away from the metal layer is connected to the heat sink 1. The metal layer is typically made of a metal material with high thermal conductivity, such as copper or aluminum. Its function is to quickly conduct heat from the heat sink of the power component 2 to the insulating layer 312. The metal layer can be coated on the surface of the insulating layer 312 by electroplating, chemical plating, or spraying. The function of the solder layer is to firmly connect the metal layer to the heat sink surface of the power component 2 or the insulating layer 312 to ensure that the heat conduction path between the metal layer and the power component 2 is as short as possible and has low impedance. On the one hand, soldering can also provide superior structural strength compared to traditional mechanical fixing methods, which can improve the stability of the power module heat dissipation module 100 in high temperature or vibration environments. On the other hand, soldering can achieve nearly seamless interface contact, which helps reduce thermal resistance caused by interface gaps, thereby improving heat conduction efficiency. In addition, the use of a solder layer can reduce the need for precise alignment, help simplify the assembly process, and help improve production efficiency.

[0036] In one embodiment of the present application, the second connection layer 311 includes a stacked and connected metal layer and an adhesive layer. The side of the metal layer facing away from the solder layer is connected to the insulating layer 312, and the side of the adhesive layer facing away from the metal layer is connected to the heat sink 1. The metal layer is typically made of a highly thermally conductive metal material, such as copper or aluminum, and its function is to quickly conduct heat from the heat sink of the power component 2 to the insulating layer 312. The metal layer can be applied to the surface of the insulating layer 312 by electroplating, chemical plating, or spraying. The adhesive layer securely bonds the metal layer to the heat sink of the power component 2 or the insulating layer 312. The adhesive layer can fill microscopic gaps and reduce air gaps, allowing heat to be conducted more directly and efficiently from the heat source to the heat sink 1, thereby providing superior thermal conductivity compared to traditional mechanical fixing methods. Compared to traditional thermally conductive gels, the adhesive layer produces fewer bubbles and gaps when performing its bonding function, thereby reducing interfacial impedance in the heat conduction path. In addition, bonding technology eliminates the need for complex alignment or fasteners, simplifying the assembly process and making the production process faster, reducing assembly costs, and improving production efficiency. The bonding layer can be made of silicone adhesive, epoxy resin adhesive, or UV-curable adhesive.

[0037] Because some high-performance thermally conductive adhesives may inherently possess sufficient thermal conductivity to directly connect the heat sink of the power component 2 and the heat sink 1, eliminating the need for an additional metal layer, in one embodiment of the present application, the second connection layer 311 is made of adhesive. Furthermore, removing the metal layer can simplify the connection structure, reduce the number of components, and thus reduce assembly complexity and cost.

[0038] In one embodiment of the present application, the second connection layer 311 and the first connection layer 32 are mirror-symmetrical structures. In this way, the first connection layer 32 and the second connection layer 311 can be made of the same thermally conductive adhesive material, which can ensure the consistency of thermal conductivity performance, simplify material selection and supply chain management, reduce material and manufacturing costs, and improve production efficiency. In another embodiment of the present application, the first connection layer 32 and the second connection layer 311 have different compositions, which means that the insulating layer 312 can be welded or bonded to the heat sink 1 and the power element 2 respectively, giving the operator greater flexibility in selecting a heat dissipation solution, making it easier and more convenient to adjust and optimize the heat conduction path.

[0039] In one embodiment of the present application, a receiving groove is defined on the side of the insulating layer 312 facing away from the first connection layer 32. The power component 2 is at least partially fixedly inserted into the receiving groove via the second connection layer 311. The receiving groove is a recess cut into the back of the insulating layer 312, primarily providing a means of securing and positioning the power component 2. The design of the receiving groove not only increases the contact area between the power component 2 and the insulating layer 312, but also ensures good contact between the heat conduction path between the power component 2 and the heat sink 1, thereby improving heat dissipation efficiency.

[0040] In one embodiment of the present application, the insulating layer 312 is one or more of a ceramic sheet, an insulating coating, or an insulating film. Different working environments may require different material properties. For example, a ceramic sheet may be required in a high-temperature environment to provide good thermal conductivity and temperature resistance, while an insulating film may be used in a normal temperature environment to provide better electrical insulation and cost-effectiveness. In addition, in some cases, different types of insulating materials can be stacked to form a multi-layer structure, and each layer of material plays a different role according to its characteristics. For example, a ceramic sheet is used between the power element 2 and the heat sink 1, and an insulating film is used between the power element 2 and the ceramic sheet, so as to achieve comprehensive optimization of the power module heat dissipation module 100 in terms of thermal conduction and electrical isolation.

[0041] In one embodiment of the present application, the side of the insulating heat-conducting layer 31 facing away from the heat sink 1 is the heat-conducting surface, and the side of the power element 2 facing the first connection layer 32 is the heat source surface; wherein, the area of ​​the heat-conducting surface is A, the area of ​​the heat source surface is B, and A ≥ B. A larger heat-conducting surface area can help disperse the heat generated by the heat source surface, reduce local hot spots, and improve the heat dissipation efficiency of the entire power module heat dissipation module 100. Since the thermal resistance is inversely proportional to the area of ​​the conduction path, the thermal resistance can be further reduced by increasing the area of ​​the heat-conducting surface, so that heat can be conducted from the power element 2 to the heat sink 1 more quickly. Taking into account the safety creepage, the single side of the heat-conducting surface and the heat-conducting surface must be at least 0.5mm larger. The larger the difference, the better the heat-balancing effect. However, it should be noted that a too large difference will affect the layout of the TSC chip and cannot achieve a high-density layout of the device. Therefore, a reasonable design needs to be made according to the actual situation. It should be noted that, when the insulating heat-conducting layer 31 is a stacked second connection layer 311 and an insulating layer 312 , the area of ​​the heat-conducting surface is the area of ​​the insulating layer 312 .

[0042] In one embodiment of the present application, power element 2 is a MOS transistor. The side of the MOS transistor facing away from the first connection layer 32 is provided with pins for soldering to the circuit board. In the preferred embodiment of the present application, a "TSC" (Top-Side Cooling) MOS transistor is used. This generally refers to a top-contact MOS transistor, which connects to the external circuit via a top metal contact, rather than a bottom metal contact. The top-contact design allows for more efficient thermal management because heat can be conducted directly to the heat sink 11 through the top metal, while a bottom-contact design may require heat to be conducted through another substrate, increasing thermal resistance.

[0043] It should be added that the side of the power element 2 facing away from the insulating layer is generally connected to the substrate. The choice of substrate depends on the specific application and performance requirements. Commonly used substrate materials include circuit boards: this substrate is usually made of glass fiber reinforced epoxy resin, has good electrical insulation properties and low cost, and is suitable for electrical connection with the power element 2; aluminum substrates or copper substrates, aluminum substrates or copper substrates have high thermal conductivity and can effectively conduct the heat generated by the power element to the external environment; ceramic substrates, ceramic substrates have good thermal stability and electrical insulation properties, and are suitable for high temperature and high power applications.

[0044] The present invention also discloses an electronic device, which includes a power module heat dissipation module 100. The specific structure of the power module heat dissipation module 100 refers to the above-mentioned embodiment. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which are not described one by one here.

[0045] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A power module heat dissipation module, characterized in that: The power module heat dissipation module includes: heat sink; power components; and A heat-conducting medium includes a stacked insulating heat-conducting layer and a first connecting layer, wherein the side of the insulating heat-conducting layer facing away from the first connecting layer is connected to the heat sink, and the side of the first connecting layer facing away from the insulating heat-conducting layer is connected to the power element.

2. The power module heat dissipation module according to claim 1, characterized in that: The insulating heat-conducting layer includes a second connecting layer and an insulating layer which are stacked. The side of the second connecting layer facing away from the insulating layer is connected to the heat sink. The side of the insulating layer facing away from the second connecting layer is connected to the first connecting layer.

3. The power module heat dissipation module according to claim 2, characterized in that: The second connection layer includes a metal layer and a welding layer that are stacked and connected. The side of the metal layer facing away from the welding layer is connected to the insulating layer, and the side of the welding layer facing away from the metal layer is connected to the heat sink.

4. The power module heat dissipation module according to claim 2, wherein: The second connection layer includes a metal layer and an adhesive layer that are stacked and connected. The side of the metal layer facing away from the welding layer is connected to the insulating layer, and the side of the adhesive layer facing away from the metal layer is connected to the heat sink.

5. The power module heat dissipation module according to claim 2, characterized in that: The second connection layer is made of adhesive.

6. The power module heat dissipation module according to any one of claims 2 to 5, characterized in that: The first connecting layer and the second connecting layer are mirror-symmetrical structures.

7. The power module heat dissipation module according to claim 2, characterized in that: A receiving groove is formed on a side of the insulating layer facing away from the first connecting layer, and the power element is at least partially fixedly inserted into the receiving groove through the second connecting layer.

8. The power module heat dissipation module according to claim 2, wherein: The insulating layer is one or more of a ceramic sheet, an insulating coating or an insulating film.

9. The power module heat dissipation module according to any one of claims 1 to 5, characterized in that: The side of the insulating heat-conducting layer facing away from the heat sink is a heat-conducting surface, and the side of the power element facing the first connecting layer is a heat source surface; The area of ​​the heat conducting surface is A, the area of ​​the heat source surface is B, and A≥B.

10. The power module heat dissipation module according to claim 1, wherein: The power element is a MOS tube, and a pin for welding to a circuit board is provided on a side of the MOS tube facing away from the first connection layer.

11. An electronic device, characterized in that: It comprises the power module heat dissipation module according to any one of claims 1 to 10.

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