Circuit board insulation structure, vehicle domain controller and vehicle

Abstract

The utility model relates to the technical field of controllers, particularly provides a circuit board insulation structure, a vehicle domain controller and a vehicle, and aims to solve the problem that the insulation mode of a conventional printed circuit board is unstable. For this purpose, the circuit board insulation structure of the utility model comprises a circuit board, the upper surface of which is provided with a grounding area and a wiring area arranged in the grounding area; the insulation assembly is arranged on the upper surface of the circuit board, and the bottom surface of the insulation assembly is attached to the grounding area and the wiring area; and the metal shell covers the circuit board and is attached to the top surface of the insulating component. According to the utility model, the insulation assembly formed by combining the conductive foam and the insulation film is arranged between the grounding area and the wiring area on the circuit board and the metal shell, so that the conduction between the grounding area and the metal shell is realized, and the insulation between the wiring area and the metal shell is ensured; and electrostatic protection and electromagnetic shielding of the circuit board are realized.

Description

Technical Field

[0001] The utility model relates to the technical field of controllers, and specifically provides a circuit board insulation structure, a vehicle domain controller and a vehicle. Background Art

[0002] The automotive domain controller (ADC) emerged alongside the evolution of vehicle electronic and electrical architecture. A vehicle typically controls various modules through several ADCs. As a new type of automotive electronic controller, the ADC divides the functions of various automotive electronics into several domains, such as the powertrain, body electronics, and driver assistance. It then leverages the processing power of powerful multi-core CPU / GPU chips to centralize most of the functions previously assigned to individual ECUs within this relatively centralized control domain, addressing the growing demands of vehicle electronics.

[0003] The printed circuit board (PCB) is an indispensable component of the automotive domain controller. The PCB provides support for electronic components and electrical connection paths, enabling the circuits within the domain controller to connect and operate correctly. To ensure conductivity and shielding performance between the PCB and the metal housing in the domain controller, the conventional solution is to create copper leaks on the PCB surface, apply conductive foam to the leaked copper area, and contact the external metal housing to achieve a connection between the two. Existing manufacturers are mainly focusing on improving the conductivity of conductive foam solutions. However, due to the conductivity of the foam, and considering that the oil filter layer on the surface of the PCB is very thin, if the design is to run wiring on the surface of the PCB, once the oil filter layer is damaged, the wiring arranged on the surface of the PCB will directly become conductive through the conductive foam, and then burn out, causing product failure. Therefore, in PCB circuit design, the wiring of the leaked copper area is often set on the inner layer of the PCB. However, due to the length of the inner layer traces, the electrical performance is correspondingly degraded.

[0004] Most existing car models are priced based on functional configurations, and model upgrades are primarily focused on intelligent upgrades. Correspondingly, there is an increasing demand for high- and low-performance configurations of intelligent controllers. Currently, most OEMs design completely independent domain controllers based on high and low-performance configurations, and these controllers themselves lack upgrade capabilities. This means that if a domain controller is to be upgraded, the entire domain controller must be replaced. Furthermore, the surrounding environment of the domain controller must also be considered, such as requiring significant adjustments to the wiring harness and mounting points. This approach significantly impacts cost and operational complexity. Utility Model Content

[0005] The utility model aims to solve the above technical problem, that is, to solve the problem that the insulation method of the existing printed circuit board is unstable.

[0006] In a first aspect, the utility model provides a circuit board insulation structure, comprising: a circuit board, wherein the upper surface of the circuit board is provided with a grounding area and a routing area arranged in the grounding area; an insulating component, wherein the insulating component is arranged on the upper surface of the circuit board, and the bottom surface of the insulating component is in contact with the grounding area and the routing area; and a metal shell, wherein the metal shell covers the circuit board and is in contact with the top surface of the insulating component.

[0007] Furthermore, the insulating component includes conductive foam and an insulating film wrapped around a set section of the conductive foam; the set section of the conductive foam wrapped around the insulating film forms the insulating part of the insulating component; and the part of the conductive foam not wrapped around the insulating film forms the conductive part of the insulating component.

[0008] Furthermore, the bottom surface of the insulating portion is in contact with the wiring area provided in the grounding area; and the conductive portion is in contact with the remaining area of ​​the grounding area except the wiring area.

[0009] Furthermore, the conductive foam has the same shape as the grounding area and covers the grounding area.

[0010] Furthermore, the conductive foam is EMI conductive foam; the insulating film is PI, PET or PC insulating film.

[0011] In a second aspect, the present invention further provides a vehicle domain controller, comprising: a controller body, wherein a circuit board is disposed within the controller body; an upgrade module, wherein the upgrade module is detachably connected to the controller body; and the circuit board insulation structure as described above.

[0012] Furthermore, the controller body is provided with an expansion interface; the upgrade module is provided with a plug-in portion; the upgrade module is connected to the controller body by plugging the plug-in portion into the expansion interface.

[0013] Furthermore, the area where the upgrade module fits the controller body is coated with thermal conductive glue.

[0014] Furthermore, a liquid cooling device is provided in the controller body, and the liquid cooling device is provided with a liquid inlet and a liquid outlet; the liquid inlet and the liquid outlet are connected to the vehicle cooling pipeline.

[0015] In a third aspect, the present invention further provides a vehicle, comprising the vehicle domain controller as described above.

[0016] In the case of adopting the above technical solution, the utility model arranges the insulating assembly formed by combining the conductive foam and the insulating film between the grounding area and the wiring area on the circuit board and the metal shell, thereby achieving both conduction between the grounding area and the metal shell and insulation between the wiring area and the metal shell, thereby achieving functions such as electrostatic protection and electromagnetic shielding for the circuit board. The insulating assembly does not require additional assembly costs, and only one component, the insulating assembly, needs to be installed during the assembly process, which makes assembly more convenient, ensures the consistency of the installation of the conductive foam and the insulating film, and facilitates production line operations. The thickness of the insulating film wrapped around the conductive foam is in the micron level, and the compression state of the insulating assembly formed by the combination of the conductive foam and the insulating film can be consistent with the compression state of the conductive foam, ensuring properties such as waterproof sealing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] In the attached figure:

[0019] Figure 1 An exploded schematic diagram of the circuit board insulation structure in an embodiment of the present application;

[0020] Figure 2 for Figure 1 An assembly diagram of the insulating portion of the insulating assembly in the circuit board insulation structure shown, the circuit board, and the metal housing;

[0021] Figure 3 and Figure 4 This is a schematic diagram of the structure of an existing vehicle domain controller;

[0022] Figure 5 This is an exploded schematic diagram of a vehicle domain controller in an embodiment of the present application;

[0023] Figure 6 for Figure 5 The schematic diagram of the structure of the controller body of the vehicle domain controller shown;

[0024] Figure 7 for Figure 5 The schematic diagram of the structure of the upgrade module of the vehicle domain controller is shown.

[0025] Reference numerals:

[0026] 1. Circuit board; 11. Grounding area; 12. Routing area; 2. Insulation component; 21. Conductive foam; 22. Insulation film; 3. Metal shell; 4. Controller body; 41. Expansion interface; 42. Cover; 43. Liquid inlet; 44. Liquid outlet; 5. Upgrade module; 51. Connector; 6. Thermal adhesive. DETAILED DESCRIPTION

[0027] The following describes preferred embodiments of the present invention with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely intended to illustrate the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art may adjust these embodiments as needed to suit specific applications.

[0028] First, it should be noted that in the description of this utility model, terms such as "upper," "lower," "left," "right," "vertical," "horizontal," "longitudinal," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the device or component described must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, it should not be understood as limiting the utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance.

[0029] Furthermore, it should be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0030] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a circuit board insulation structure, comprising: a circuit board 1, an insulation component 2 and a metal shell 3. The insulation component 2 is disposed between the circuit board 1 and the metal shell 3.

[0031] Specifically, the top surface of the circuit board 1 is provided with a grounding area 11 and a routing area 12 disposed within the grounding area 11. The grounding area 11 is provided on the top surface of the circuit board 1 to meet the conductive grounding requirements of the circuit board 1. Routing is disposed within the circuit board 1 and near its top surface. The local area where the routing passes through the grounding area 11 constitutes the routing area 12. In one specific embodiment, the circuit board 1 is a printed circuit board (PCB), and the grounding area 11 is an exposed copper area disposed on the PCB surface. The PCB contains surface routing, located beneath the solder mask layer (also known as the solder mask layer). These routings can specifically be high-speed signal lines, etc., connecting components such as chips within the PCB to connectors to achieve electrical signal transmission. The solder mask layer of the PCB is very thin. If routing within the PCB is arranged near the top surface of the PCB, damage to the solder mask layer can cause the routing beneath it to become conductive, resulting in signal loss or burnout. The local area within the exposed copper area of ​​the grounding area 11 where the routing passes through constitutes the routing area 12.

[0032] The insulation assembly 2 is disposed on the upper surface of the circuit board 1, with its bottom surface aligned with the grounding area 11 and routing area 12 on the circuit board 1. The insulation assembly 2 includes a conductive foam 21 and an insulating film 22 wrapped around a defined portion of the conductive foam 21. The defined portion of the conductive foam 21 wrapped with the insulating film 22 forms the insulating portion of the insulation assembly 2; the portion of the conductive foam 21 not wrapped with the insulating film 22 forms the conductive portion of the insulation assembly 2.

[0033] When the bottom surface of insulating assembly 2 is aligned with grounding area 11 on circuit board 1, the bottom surface of the insulating portion of insulating assembly 2 is aligned with wiring area 12 provided in grounding area 11; the conductive portion of insulating assembly 2 is aligned with the remaining area of ​​grounding area 11, excluding wiring area 12. Conductive foam 21 has the same shape as grounding area 11 and covers grounding area 11; thus, wiring area 12 in grounding area 11 is covered by the insulating portion of insulating assembly 2, while the rest of grounding area 11 is covered by the conductive portion of insulating assembly 2.

[0034] The metal housing 3 covers the circuit board 1 and abuts the top surface of the insulating assembly 2, pressing the insulating assembly 2 between the metal housing 3 and the upper surface of the circuit board 1, ensuring a tight fit between the insulating assembly 2 and the circuit board 1. After the metal housing 3 and the top surface of the insulating assembly 2 are in contact, the bottom surface of the conductive portion of the insulating assembly 2 (i.e., the portion of the conductive foam 21 not wrapped with the insulating film 22) contacts the grounding area 11 on the circuit board 1, and the top surface of the conductive portion contacts the metal housing 3. This creates a pathway between the metal housing 3, the conductive portion of the insulating assembly 2, and the grounding area 11 on the circuit board 1, providing electrical conductivity and achieving electrostatic protection and electromagnetic shielding for the circuit board 1. The insulating portion of the insulating assembly 2 (i.e., the designated section of the conductive foam 21 wrapped with the insulating film 22) is located between the wiring area 12 on the circuit board 1 and the metal housing 3. The insulating film 22 wrapped around the conductive foam 21 provides insulation between the conductive foam 21 and the wiring in the wiring area 12, as well as between the conductive foam 21 and the metal housing 3. This provides insulation protection for the surface wiring of the PCB, and prevents the wiring in the wiring area 12 from being connected to the conductive foam 21 and the metal shell 3, thereby preventing the surface wiring of the PCB from being burned.

[0035] The number of insulating parts in the insulating assembly 2, the width of the insulating film 22 wrapped by each insulating part, and the position of each insulating part on the conductive foam 21 can be determined accordingly according to the number and size of the routing area 12 and its position in the grounding area 11.

[0036] Furthermore, the conductive foam 21 may be EMI conductive foam, and the insulating film 22 may be PI, PET or PC insulating film.

[0037] Compared to the existing circuit insulation solution of first applying an insulating film 22 to the wiring area 12 and then applying a conductive foam 21 to the grounding area 11, the embodiment of the present application forms an insulating component 2 by combining the conductive foam 21 and the insulating film 22, without requiring additional assembly costs. During the assembly process of the circuit board insulation structure, only the insulating component 2 needs to be installed, ensuring the consistency of the installation of the conductive foam 21 and the insulating film 22; it is also more convenient to assemble and facilitate production line operations. The thickness of the insulating film 22 wrapped around the conductive foam 21 is in the micron level. The insulating component 2 formed by the combination of the conductive foam 21 and the insulating film 22 can be consistent with the compressed state of the conductive foam 21 in a compressed state, ensuring properties such as waterproof sealing.

[0038] The structure of the insulating component 2 in the embodiment of the present application covering the grounding area 11 and the routing area 12 on the circuit board 1 allows the routing area 12 to be insulated even when routing near the surface of the PCB. Compared to this solution of the present application, routing on the inner layers of the PCB not only increases the routing length but also causes a corresponding decrease in the electrical performance of the circuit.

[0039] Figure 3 and Figure 4 The figure shows the structure of existing vehicle domain controllers. These are designed as completely independent domain controllers without inherent upgrade capabilities. This means that upgrading a domain controller requires replacing the entire controller. Furthermore, the surrounding environment of the domain controller must be considered, requiring significant adjustments to, for example, the wiring harness and mounting points. This approach significantly impacts cost and operational complexity.

[0040] like Figures 5 to 7 As shown, an embodiment of the present application provides a vehicle domain controller, comprising: a controller body 4 and an upgrade module 5. A circuit board (not shown) is disposed within the controller body 4; the upgrade module 5 is detachably connected to the controller body 4; and the circuit board disposed within the controller body 4 employs the above-described circuit board insulation structure.

[0041] Furthermore, if Figure 6 and Figure 7 As shown, the controller body 4 is provided with an expansion interface 41, and the upgrade module 5 is provided with a plug-in portion 51. The upgrade module 5 is connected to the controller body 4 by plugging the plug-in portion 51 with the expansion interface 41 on the controller body 4 to achieve a connection with the controller body 4, thereby achieving an upgrade of the vehicle domain controller.

[0042] Furthermore, the upgrade module 5 may be a module component for upgrading the vehicle-mounted controller, or may be a PCBA (Printed Circuit Board Assembly).

[0043] A plurality of expansion interfaces 41 can be pre-set on the controller body 4 as needed. In order to protect the pre-set expansion interfaces 41 , a cover plate 42 is further provided on the upper port of the controller body 4 .

[0044] In order to improve the stability of the connection between the upgrade module 5 and the controller body 4, thermal conductive adhesive 6 can be coated on the area where the upgrade module 5 and the controller body 4 are in contact, so that in addition to being plugged into and connected to the expansion interface 41 on the controller body 4 through the plug-in part 51, the upgrade module 5 can also be bonded together through the thermal conductive adhesive 6, which not only improves the stability of the connection between the upgrade module 5 and the controller body 4, but also reduces the load burden of the connection between the plug-in part 51 of the upgrade module 5 and the expansion interface 41 on the controller body 4.

[0045] In addition, in order to cool the vehicle domain controller, a liquid cooling heat sink (not shown in the figure) is also provided in the controller body 4. The liquid cooling heat sink is provided with a liquid inlet 43 and a liquid outlet 44. The liquid inlet 43 and the liquid outlet 44 are connected to the vehicle cooling pipeline, so there is no need to set up a separate cooling source for the vehicle domain controller.

[0046] The vehicle domain controller in this embodiment of the present application is upgraded by removably plugging the upgrade module 5 into the expansion interface 41 provided on the controller body 4. This upgrade solution does not alter the internal structure of the controller body 4; all existing components remain usable, requiring only the components corresponding to the upgrade to be installed, without requiring a complete replacement of the controller body 4. Furthermore, the external conditions of the controller body 4 remain unchanged, with no modifications to the surrounding wiring harness, mounting points, or other environmental factors, resulting in no unnecessary cost increases.

[0047] An embodiment of the present application also provides a vehicle, which includes the vehicle domain controller as described above.

[0048] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A circuit board insulation structure, characterized in that: include: A circuit board, wherein the upper surface of the circuit board is provided with a grounding area and a wiring area provided in the grounding area; an insulating component, the insulating component being disposed on the upper surface of the circuit board, the bottom surface of the insulating component being in contact with the grounding area and the routing area; A metal shell covers the circuit board and fits the top surface of the insulating component.

2. The circuit board insulation structure according to claim 1, wherein: The insulating component includes a conductive foam and an insulating film wrapped around a set section of the conductive foam; The set section of the conductive foam wrapped with the insulating film forms the insulating portion of the insulating assembly; The portion of the conductive foam that does not wrap the insulating film forms the conductive portion of the insulating component.

3. The circuit board insulation structure according to claim 2, characterized in that: The bottom surface of the insulating portion is in contact with the wiring area provided in the grounding area; The conductive portion is in contact with the remaining area of ​​the grounding area except the wiring area.

4. The circuit board insulation structure according to claim 2, wherein: The conductive foam has the same shape as the grounding area and covers the grounding area.

5. The circuit board insulation structure according to any one of claims 2 to 4, characterized in that: The conductive foam is EMI conductive foam; The insulating film is PI, PET or PC insulating film.

6. A vehicle domain controller, characterized in that: include: A controller body, wherein a circuit board is disposed in the controller body; an upgrade module, the upgrade module being detachably connected to the controller body; as well as The circuit board insulation structure according to any one of claims 1 to 5.

7. The vehicle domain controller according to claim 6, characterized in that The controller body is provided with an expansion interface; The upgrade module is provided with a plug-in portion; The upgrade module is connected to the controller body by plugging the plug portion into the expansion interface.

8. The vehicle domain controller according to claim 7, characterized in that The area where the upgrade module is in contact with the controller body is coated with thermal conductive glue.

9. The vehicle domain controller according to any one of claims 6 to 8, characterized in that: The controller body is provided with a liquid cooling heat dissipation device, and the liquid cooling heat dissipation device is provided with a liquid inlet and a liquid outlet; The liquid inlet and the liquid outlet are connected to the entire vehicle cooling pipeline.

10. A vehicle, characterized in that: The vehicle domain controller comprises the vehicle domain controller according to any one of claims 6 to 9.

Images