Heat carrier integration module

Abstract

The utility model discloses a heat carrier integration module which comprises an integration module body, the integration module body is arranged in a mold temperature controller, a first connector is formed on the integration module body and located on one side of the integration module body, and the first connector and the integration module body are not communicated with each other. The integrated module body is provided with a first connector, a water outlet is formed in a pipeline at the bottom end of the first connector, the integrated module body is further provided with a second connector and a third connector, the second connector and the third connector are located on the other side of the integrated module body, and the second connector and the third connector are communicated with the integrated module body. A first connecting pipe opening is formed in the top end of the integrated module body, the first connecting pipe opening is in through connection with the integrated module body, and the first connecting pipe opening is in pipeline connection with a pipeline in the mold temperature controller.

Description

Technical Field

[0001] The utility model relates to the field of mold temperature controllers, in particular to a heat carrier integrated module. Background Art

[0002] Mold temperature controllers, also known as mold temperature controllers, are widely used in industries such as plastic molding, die-casting, rubber tires, rollers, chemical reactors, bonding, and mixing. However, when the existing mold temperature controllers are in use, the used water source inside and the external water source enter the integrated module for storage, which belongs to the same storage chamber. This easily causes the heat carrier wastewater discharged from the mold temperature controller to mix with the new water source flowing into the mold temperature controller. For this reason, a heat carrier integrated module is proposed. Utility Model Content

[0003] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the above-mentioned problems.

[0004] The heat carrier integrated module includes an integrated module body, and the integrated module body is arranged inside the mold temperature controller. The integrated module body is formed with a first connector, and the first connector is located on one side of the integrated module body. The first connector and the integrated module body are not connected to each other, and a drain outlet is formed in the bottom end pipeline of the first connector. The integrated module body is also formed with a second connector and a third connector, and the second connector and the third connector are respectively located on the other side of the integrated module body, and the second connector and the third connector are respectively connected to the integrated module body. A first connecting pipe port is formed at the top of the integrated module body, and the first connecting pipe port is connected to the integrated module body, and the first connecting pipe port is connected to the pipeline inside the mold temperature controller.

[0005] Preferably, the first connector pipeline is formed with a second connecting pipe opening, and the second connecting pipe opening is located on the first connector, and the second connecting pipe opening is connected to the pipeline inside the mold temperature controller through a pipeline.

[0006] Preferably, a first water inlet is formed on one side of the second connector, and a second water inlet is formed on one side of the third connector, and external water can flow into the second and third connectors through the first and second water inlets and be collected into the integrated module body.

[0007] Preferably, the integrated module main body pipeline is formed with an air vent, and the air vent is formed at the side of the integrated module main body, and the air vent is connected to an external exhaust device through a pipeline.

[0008] Compared with the prior art, the beneficial effect of the present invention is that: when the mold temperature controller is in operation, the water source inside the integrated module body can be extracted through the first connecting pipe port and used inside the mold temperature controller, and the hot water generated after the mold temperature controller has been used for a period of time flows into the first connecting body and is then discharged through the discharge port, thereby separating and discharging the water source entering the mold temperature controller and the water source discharged from the mold temperature controller, preventing the new water source and sewage from mixing together.

[0009] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0011] Figure 1 It is a structural diagram of the heat carrier integrated module;

[0012] Figure 2 is another structural schematic diagram of the heat carrier integrated module;

[0013] Figure 3 This is another structural diagram of the heat carrier integrated module.

[0014] As shown in the figure: 1. Integrated module body, 2. First connector, 3. First connecting pipe port, 4. Second connecting pipe port, 5. Drain port, 6. Air vent, 7. Second connector, 8. First water inlet, 9. Third connector, 10. Second water inlet. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] See also Figure 1-3In the embodiment of the present invention, the heat carrier integrated module includes an integrated module body 1, and the integrated module body 1 is arranged inside the mold temperature controller (not shown in the figure), the integrated module body 1 is formed with a first connector 2, and the first connector 2 is located on one side of the integrated module body 1, the first connector 2 and the integrated module body 1 are not connected to each other, and the bottom end of the first connector 2 is formed with a drain port 5, the integrated module body 1 is further formed with a second connector 7 and a third connector 9, and the second connector 7 and the third connector 9 are respectively located on the other side of the integrated module body 1, and The second connector 7 and the third connector 9 are respectively connected to the integrated module body 1. A first connecting pipe port 3 is formed at the top of the integrated module body 1, and the first connecting pipe port 3 is connected to the integrated module body 1, and the first connecting pipe port 3 is connected to the pipeline inside the mold temperature controller. Then, through the first connecting pipe port 3, when the mold temperature controller is running, the water source inside the integrated module body 1 can be extracted and used inside the mold temperature controller, and the hot water generated after the mold temperature controller is used for a period of time flows to the inside of the first connector 2 and is then discharged through the discharge port 5.

[0017] The first connector 2 pipeline is formed with a second connecting pipe port 4, and the second connecting pipe port 4 is located on the first connector 2, and the second connecting pipe port 4 is connected to the pipeline inside the mold temperature controller, so that the hot water generated inside the mold temperature controller flows into the first connector 2 through the second connecting pipe port 4 and is then discharged through the drain port 5 at the bottom end of the first connector 2.

[0018] A first water inlet 8 is formed on one side of the second connector 7, and a second water inlet 10 is formed on one side of the third connector 9. External water can flow into the second connector 7 and the third connector 9 through the first water inlet 8 and the second water inlet 10 and be collected into the integrated module body 1.

[0019] The integrated module body 1 is formed with an air vent 6 on its pipeline, and the air vent 6 is formed on the side of the integrated module body 1. The air vent 6 is connected to the external exhaust equipment through a pipeline, and the air pressure generated inside the integrated module body 1 is discharged through the air vent 6 to prevent the internal pressure from being too high when pumping water.

[0020] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced within the present invention.

Claims

1. Heat carrier integrated module, characterized in that: It includes an integrated module body, and the integrated module body is arranged inside the mold temperature controller. The integrated module body is formed with a first connector, and the first connector is located on one side of the integrated module body. The first connector and the integrated module body are not connected to each other, and a drain outlet is formed in the bottom pipe of the first connector. The integrated module body is also formed with a second connector and a third connector, and the second connector and the third connector are respectively located on the other side of the integrated module body, and the second connector and the third connector are respectively connected with the integrated module body. A first connecting pipe port is formed at the top of the integrated module body, and the first connecting pipe port is connected to the integrated module body, and the first connecting pipe port is connected to the pipe inside the mold temperature controller.

2. The heat carrier integrated module according to claim 1, characterized in that: The first connector pipeline is formed with a second connecting pipe opening, and the second connecting pipe opening is located on the first connector, and the second connecting pipe opening is connected to the pipeline inside the mold temperature controller through a pipeline.

3. The heat carrier integrated module according to claim 1, characterized in that: A first water inlet is formed on one side of the second connector, and a second water inlet is formed on one side of the third connector. External water can flow into the second and third connectors through the first and second water inlets and be collected into the integrated module body.

4. The heat carrier integrated module according to claim 1, characterized in that: The integrated module main body pipeline is formed with an air vent, and the air vent is formed at the side of the integrated module main body, and the air vent is connected to an external exhaust device through a pipeline.

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