Low-temperature cooling forming device for resin tile

Abstract

The utility model relates to the technical field of resin tile processing, in particular to a resin tile low-temperature cooling forming device which comprises a humidifying bin, a spraying assembly, an adjusting assembly, a positioning assembly, a collecting box and a transmission shaft. The spraying assembly is mounted on the humidifying bin; the adjusting assembly is installed on the humidifying bin. The adjusting assembly comprises an adjusting plate, the adjusting plate is connected with an electric push rod a and two ends are connected with mounting rods, and the mounting rods extend into the humidifying bin and are connected with the supporting blocks; the positioning assembly is mounted in the humidifying bin; the positioning assembly comprises a protection plate, one end of the protection plate is connected with a mounting block, and the mounting block is connected with the driving end of an electric push rod b. The collecting boxes are installed at the two ends of the humidifying bin, and the humidifying bin is connected with a transmission shaft. The spraying height of cooling water can be conveniently adjusted, and the cooling effect of the resin tile can be conveniently improved; in the transportation process of the resin tiles, the protection plates are adjusted to position the resin tiles, the situation that the resin tiles rub and damage the humidifying bin is avoided, and the practicability of the low-temperature cooling forming device for the resin tiles is conveniently improved.

Description

Technical Field

[0001] The utility model relates to the technical field of resin tile processing, in particular to a low-temperature cooling and molding device for resin tiles. Background Art

[0002] Resin tiles are divided into natural resin tiles and synthetic resin tiles. The resin on the market is generally synthetic resin tiles. Synthetic resin tiles have the advantages of lasting color, light weight, self-waterproofing, toughness, thermal insulation, sound insulation, corrosion resistance, wind and earthquake resistance, hail resistance, pollution resistance, green environmental protection, fire prevention, insulation, easy installation, etc. Moreover, it has beautiful shape and strong three-dimensional sense, and the color is full of Chinese elements, which makes it widely used in the roof decoration of various permanent buildings, especially the "flat to slope" project that is currently being vigorously promoted in China.

[0003] Chinese patent publication number CN214725734U discloses a low-temperature cooling and molding device for resin tiles, comprising a humidifying bottle and a humidifying chamber. The humidifying chamber has a water inlet at the top, a water inlet pipe fixedly connected to the inside of the water inlet, a diverter fixedly connected to the bottom of the water inlet pipe, and a top liquid collecting plate fixedly connected to both sides of the diverter on the top surface of the humidifying chamber. The two top liquid collecting plates have sliding grooves on the outer surfaces of the sides facing away from each other, and the tops of the two sliding grooves have two adjustment holes, with connecting columns movably inserted into the insides of the four adjustment holes. The low-temperature cooling and molding device for resin tiles uses a bottom collecting plate to collect sprayed cooling water, directing the cooling water to a liquid outlet, where it is filtered by a filter screen to collect the cooling water. The top collecting plate and drainage plate are used to reduce the amount of water droplets condensed from water vapor on the top of the humidifying chamber, thereby collecting the water droplets on the top.

[0004] When the existing resin tile low-temperature cooling and molding device is in use, the cooling water spraying pipe from the top of the humidification chamber cannot adjust the spraying height according to the size of the resin tile, which reduces the cooling effect of the resin tile. In addition, the resin tile does not have a positioning component during transportation, so the movement of the resin tile causes friction damage to the humidification chamber, reducing the practicality of the device. Utility Model Content

[0005] In view of the problems existing in the background technology, a low-temperature cooling and molding device for resin tiles is proposed.

[0006] The utility model provides a low-temperature cooling and forming device for resin tiles, comprising: a humidifying chamber, a spraying assembly, an adjustment assembly, a positioning assembly, a collection box and a transmission shaft;

[0007] The spraying assembly is installed on the humidification chamber;

[0008] The adjustment assembly is installed on the humidification chamber; the adjustment assembly includes an adjustment plate, the adjustment plate is connected to the electric push rod a and the two ends are connected to the mounting rod, the mounting rod extends into the humidification chamber and is connected to the support block;

[0009] The positioning assembly is installed in the humidification chamber; the positioning assembly includes a protection plate, one end of the protection plate is connected to the mounting block, and the mounting block is connected to the driving end of the electric push rod b;

[0010] The collecting boxes are installed at both ends of the humidifying bin, and the humidifying bin is connected with a transmission shaft.

[0011] Preferably, the humidifying chamber is connected with a block for mounting and supporting the electric push rod b; grooves are provided on both sides of the inner wall of the humidifying chamber.

[0012] Preferably, the spray assembly includes a water inlet pipe installed on the humidification chamber, the water outlet end of the water inlet pipe extends to the top of the humidification chamber and is connected to the telescopic pipe, the water outlet end of the telescopic pipe is connected to the rod body, the interior of the rod body is hollow, and a circular opening is provided at the bottom to connect to the spray pipe; both ends of the rod body are connected to support blocks.

[0013] Preferably, the adjustment assembly further comprises a guide post and a telescopic rod;

[0014] The bottom end of the guide column is connected to the humidifying bin, and the upper end is connected below the adjustment plate; the telescopic rod is connected in the groove, and the upper end is connected below the support block.

[0015] Preferably, the positioning assembly further comprises a fixed plate a connected to the block, the fixed plate a is hollow inside, and an opening is provided on one side for connecting to the telescopic plate a, and the telescopic plate a is connected to a protective plate.

[0016] Preferably, the two collecting boxes are respectively connected to a connecting box, and the two connecting boxes are connected to a box body; the two collecting boxes are connected to a bracket, and the bracket is connected to a filter plate, and the filter plate is connected to the inner walls at both ends of the humidification chamber.

[0017] Preferably, the two collecting boxes, the two connecting boxes and the hollow interior of the box body are not connected; an opening is provided on one side of the two collecting boxes, and the opening is connected to the filter plate for filtering and collecting cooling water.

[0018] Compared with the prior art, the present invention has the following beneficial technical effects:

[0019] The utility model connects the two ends of the adjustment plate with the mounting rod, the mounting rod and the support block, the support block is connected to the two ends of the rod body, the rod body is hollow inside, and is connected to the telescopic tube and the spraying pipe, which is convenient for spraying cooling water into the humidification bin, so as to achieve low-temperature cooling and molding of the resin tiles. The adjustment plate is connected to the driving end of the electric push rod a, and the electric push rod a is started to drive the adjustment plate to drive the mounting rod to adjust the height, and the mounting rod drives the support block, and the telescopic tube is synchronously telescoped and adjusted, which is convenient for adjusting the height of the cooling water spraying, and conveniently improves the cooling effect of the resin tiles. Then, the guide rod and the telescopic rod are convenient for guiding the height adjustment, and conveniently improve the adjustment stability; during the transportation of the resin tiles, the protective plate is adjusted to position the resin tiles, so as to avoid the resin tiles causing friction damage to the humidification bin, and conveniently improve the practicality of the resin tile low-temperature cooling and molding device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the internal structure of the humidification chamber in the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the spraying component and the adjustment component in the utility model.

[0023] Figure markings: 1. Humidification chamber; 101. Block; 2. Spraying assembly; 201. Water inlet pipe; 202. Telescopic tube; 203. Rod body; 204. Spraying pipe; 205. Support block; 3. Adjustment assembly; 301. Adjustment plate; 302. Electric push rod a; 303. Mounting rod; 304. Guide column; 305. Telescopic rod; 4. Positioning assembly; 401. Protection plate; 402. Mounting block; 403. Electric push rod b; 404. Fixed plate a; 405. Telescopic plate a; 5. Collection box; 501. Connection box; 502. Box body; 503. Bracket; 504. Filter plate; 6. Drive shaft. DETAILED DESCRIPTION

[0024] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0025] Example 1

[0026] like Figure 1 - Figure 3As shown, the utility model proposes a low-temperature cooling molding device for resin tiles, comprising: a humidifying chamber 1, a spraying assembly 2, an adjusting assembly 3, a positioning assembly 4, a collecting box 5 and a transmission shaft 6; the spraying assembly 2 is installed on the humidifying chamber 1; the adjusting assembly 3 is installed on the humidifying chamber 1; the adjusting assembly 3 includes an adjusting plate 301, the adjusting plate 301 is connected to the electric push rod a302 and the two ends are connected to the mounting rod 303, the mounting rod 303 extends into the humidifying chamber 1 and is connected to the support block 205; the positioning assembly 4 is installed in the humidifying chamber 1; the positioning assembly 4 includes a protective plate 401, one end of the protective plate 401 is connected to the mounting block 402, and the mounting block 402 is connected to the driving end of the electric push rod b403; the collecting box 5 is installed at both ends of the humidifying chamber 1, and the humidifying chamber 1 is connected to the transmission shaft 6. Cooling water is sprayed into the humidification bin 1 through the spraying component 2, and during the spraying process, the resin tiles to be processed are transported on the transmission shaft 6, so that the resin tiles are sprayed by the spraying component 2 during transportation to be low-temperature cooled and processed into shape; the positioning component 4 is used as needed to position the resin tiles in transportation to prevent the resin tiles from causing friction damage to the inner wall of the humidification bin 1 during transportation; the collection boxes 5 at both ends are used to collect and process the cooling water, which conveniently improves the practicality of the resin tile low-temperature cooling and molding device.

[0027] Further explanation: adjustment assembly 3 also includes a guide post 304 and a telescopic rod 305. The bottom end of guide post 304 is connected to humidification chamber 1, and the upper end is connected below adjustment plate 301. Telescopic rod 305 is connected within the groove, and the upper end is connected below support block 205. When the height of adjustment plate 301 is adjusted by electric push rod a302, guide post 304 and telescopic rod 305 are adjusted synchronously, which facilitates adjustment and stability, improves connection with spray assembly 2, and facilitates the connection and use of the components of the resin tile low-temperature cooling molding device.

[0028] Further explanation: the positioning assembly 4 also includes a fixed plate a404 connected to the block 101. The fixed plate a404 is hollow inside, with an open side provided for connecting to the telescopic plate a405. The telescopic plate a405 is connected to the protective plate 401. The fixed plate a404 and the telescopic plate a405 are connected to form a telescopic structure. The telescopic plate a405 is L-shaped, which facilitates the support connection between the mounting block 402 and the protective plate 401. At the same time, the fixed plate a404 and the telescopic plate a405 synchronize the telescopic adjustment of the protective plate 401, which is convenient for improving the stability of the use of the protective plate 401. The other end of the protective plate 401 is connected to the telescopic plate b, which is connected to the fixed plate b. Then, the telescopic plate b and the fixed plate b are the same as the telescopic plate a405 and the fixed plate a404, allowing the synchronous adjustment of the protective plate 401, which is convenient for improving the adjustment and support of the protective plate 401.

[0029] To further illustrate, the spray assembly 2 includes an inlet pipe 201 mounted on the humidification chamber 1. The outlet of the inlet pipe 201 extends upward within the humidification chamber 1 and connects to a telescopic pipe 202. The outlet of the telescopic pipe 202 connects to a rod 203. The rod 203 is hollow, with a circular opening at the bottom that connects to the spray pipe 204. Both ends of the rod 203 are connected to support blocks 205. The telescopic pipe 202 connects the inlet pipe 201 and the rod 203, facilitating adjustment of the spray height based on the size of the resin tile being processed. This facilitates enhanced cooling of the resin tile at low temperatures and improves molding efficiency.

[0030] Example 2

[0031] like Figure 1 and Figure 2 As shown, the present invention proposes a low-temperature cooling and molding device for resin tiles. Based on the above embodiment, this embodiment also records in detail the specific components of the humidification chamber 1 and the collection box 5, as well as the matching method.

[0032] Further explanation: the humidifying chamber 1 is connected with a block 101 for installing and supporting the electric push rod b403; grooves are provided on both sides of the inner wall of the humidifying chamber 1, and the block 101 and the fixed plate a404 are connected to facilitate the support and use of the adjustment component 3.

[0033] Further explanation: the two collection boxes 5 are respectively connected to the connection box 501, and the two connection boxes 501 are connected to the box body 502; the two collection boxes 5 are connected to the bracket 503, and the bracket 503 is connected to the filter plate 504, and the filter plate 504 is connected to the inner wall of the humidification chamber 1 at both ends; the two collection boxes 5, the two connection boxes 501 and the box body 502 are hollow and not connected; an opening is set on one side of the two collection boxes 5, and the opening is connected to the filter plate 504 for filtering and collecting cooling water. The bottom of the inner wall of the humidification chamber 1 is connected to the liquid collection plate, and the openings of the collection boxes 5 at both ends are connected to the liquid collection plate, so that it collects cooling water and filters impurities through the filter holes of the filter plate 504. The collection box 5 is connected to the box body 502 through the connection box 501 to collect liquid into the box body 502. One side of the box body 502 is connected to a drain pipe, and the drain pipe treats and discharges the water collected in the box 502 for use, facilitating the secondary use of water and improving the use effect of the resin tile low-temperature cooling molding device.

[0034] The working principle of the present invention is as follows: according to the size adjustment device of the resin tile to be processed by low-temperature cooling, by starting the electric push rod a302, the electric push rod a302 driving end causes the adjustment plate 301 to move up and down for adjustment, and both ends of the adjustment plate 301 drive the mounting rod 303, and the mounting rod 303 moves through the humidification bin 1 and the support block 205 to connect, so that the support block 205 adjusts the height synchronously, and the support block 205 drives the rod body 203. When the rod body 203 is in the state of adjusting the height, the upper telescopic tube 202 is telescopically adjusted, and the lower spraying pipe 204 reaches the adjusted spraying height; during the transportation and low-temperature cooling processing of the resin tile, by starting the electric push rod b403, the electric push rod b403 driving end causes the mounting block 402 to move, and the mounting block 402 drives the protective plate 401 to move on the inner wall of the humidification bin 1, and the protective plate 401 moves to the gap between the resin tile and the humidification bin 1, so that the two sides of the resin tile are limited and the inner wall of the humidification bin 1 is protected, so that the low-temperature cooling molding device is used for processing the resin tile.

[0035] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A resin tile low temperature cooling molding device, characterized in that: include: Humidification chamber (1); A spray assembly (2) is mounted on the humidification chamber (1); An adjustment assembly (3) is mounted on the humidification chamber (1); the adjustment assembly (3) includes an adjustment plate (301), the adjustment plate (301) is connected to an electric push rod a (302) and has two ends connected to mounting rods (303), and the mounting rods (303) extend into the humidification chamber (1) and are connected to a support block (205); A positioning assembly (4) is installed in the humidifying chamber (1); the positioning assembly (4) includes a protective plate (401), one end of the protective plate (401) is connected to a mounting block (402), and the mounting block (402) is connected to a driving end of an electric push rod b (403); And a collecting box (5) is installed at both ends of the humidifying chamber (1), and the humidifying chamber (1) is connected to a transmission shaft (6).

2. The resin tile low temperature cooling molding device according to claim 1, characterized in that: The humidifying chamber (1) is connected to a block (101) for mounting and supporting an electric push rod b (403); grooves are provided on both sides of the inner wall of the humidifying chamber (1).

3. The resin tile low temperature cooling molding device according to claim 2, characterized in that: The spray assembly (2) comprises a water inlet pipe (201) mounted on the humidifying chamber (1); a water outlet end of the water inlet pipe (201) extends to the upper portion of the humidifying chamber (1) and is connected to a telescopic pipe (202); the water outlet end of the telescopic pipe (202) is connected to a rod body (203); the rod body (203) is hollow inside, and a circular opening is provided at the bottom thereof for connection to the spraying pipe (204); and both ends of the rod body (203) are connected to support blocks (205).

4. The resin tile low temperature cooling molding device according to claim 3, characterized in that: The adjustment assembly (3) further comprises a guide post (304) and a telescopic rod (305); The bottom end of the guide column (304) is connected to the humidifying chamber (1), and the upper end is connected below the adjustment plate (301); the telescopic rod (305) is connected in the groove and the upper end is connected below the support block (205).

5. A resin tile low temperature cooling molding device according to claim 2 or 4, characterized in that: The positioning assembly (4) further comprises a fixed plate a (404) connected to the block (101). The fixed plate a (404) is hollow inside and has an open side for connecting to a telescopic plate a (405). The telescopic plate a (405) is connected to a protective plate (401).

6. The resin tile low temperature cooling molding device according to claim 1, characterized in that: The two collection boxes (5) are respectively connected to a connection box (501), and the two connection boxes (501) are connected to a box body (502); the two collection boxes (5) are connected to a bracket (503), the bracket (503) is connected to a filter plate (504), and the filter plate (504) is connected to the inner walls at both ends of the humidification chamber (1).

7. The resin tile low temperature cooling molding device according to claim 6, characterized in that: The two collecting boxes (5), the two connecting boxes (501) and the box body (502) are hollow and not connected; an opening is provided on one side of the two collecting boxes (5), and the opening is connected to the filter plate (504) for filtering and collecting cooling water.

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