Radiation heat dissipation film for electronic product protective sleeve

Abstract

The utility model discloses a radiation heat dissipation film for an electronic product protective sleeve, and relates to the technical field of heat dissipation materials. The adhesive tape comprises a release layer, a pressure-sensitive adhesive layer, a metal foil base material layer and a radiation heat dissipation layer which are stacked in sequence, the radiation heat dissipation layer is positioned on one side close to the electronic product; the metal foil base material layer is a copper foil base material layer or an aluminum foil base material layer; the thickness of the metal foil base material layer is 10 [mu] m-100 [mu] m; the radiation heat dissipation layer is a radiation heat dissipation coating; the thickness of the radiation heat dissipation coating ranges from 5 micrometers to 10 micrometers. The pressure-sensitive adhesive layer is a silica gel pressure-sensitive adhesive layer or a heat-conducting pressure-sensitive adhesive layer; the radiation heat dissipation film further comprises an insulation protection layer located on the side, away from the metal foil base material layer, of the radiation heat dissipation layer. By the adoption of the technical scheme, the LED lamp has the advantage of being excellent in heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation materials, in particular to a radiation heat dissipation film used for a protective cover of an electronic product. Background Art

[0002] Mobile phones, tablets, and other electronic products are often protected with protective cases to protect them from drops and collisions, or for aesthetic reasons. As product functionality improves, there's a greater need for heat dissipation during use. However, the thermal insulation provided by protective cases doesn't effectively address temperature rise, leading to intelligent frequency reduction that impacts the user experience. Prolonged high temperatures can also shorten product lifespan. Furthermore, current consumer electronics often use high-power charging methods to achieve faster charging speeds. This results in significant temperature rise during charging, making the thermal insulation provided by protective cases even more pronounced and impacting product use and lifespan, a topic that urgently needs improvement. Utility Model Content

[0003] The purpose of the present invention is to address the defects and shortcomings of the prior art and provide a radiation heat dissipation film for electronic product protective covers, which has the advantage of excellent heat dissipation effect.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a radiation heat dissipation film for a protective cover of an electronic product, comprising: a release layer, a pressure-sensitive adhesive layer, a metal foil substrate layer and a radiation heat dissipation layer stacked in sequence; the radiation heat dissipation layer is located on the side close to the electronic product.

[0005] The utility model is further provided that the metal foil substrate layer is a copper foil substrate layer or an aluminum foil substrate layer.

[0006] The utility model is further provided that the thickness of the metal foil substrate layer is 10 μm-100 μm.

[0007] The present invention is further provided that the radiation heat dissipation layer is a radiation heat dissipation coating.

[0008] The present invention further provides that the thickness of the radiation heat dissipation coating is 5 μm-10 μm.

[0009] The utility model is further provided that the pressure-sensitive adhesive layer is a silicone pressure-sensitive adhesive layer with a thickness of 10 μm-30 μm.

[0010] The utility model is further provided that the pressure-sensitive adhesive layer is a heat-conductive pressure-sensitive adhesive layer.

[0011] The present invention further provides that the radiation heat dissipation film for the electronic product protective cover further comprises: an insulating protective layer located on a side of the radiation heat dissipation layer away from the metal foil substrate layer.

[0012] The present invention is further provided with that the radiation heat dissipation film for the electronic product protective cover is rectangular in shape, is attached to the lower side of the camera hole of the electronic product protective cover, and corresponds to the battery position of the electronic product.

[0013] The utility model is further provided that the radiation heat dissipation film for the electronic product protective cover includes: a main body that is rectangular and attached to the lower side of the camera hole of the electronic product protective cover and corresponds to the battery position of the electronic product; and an extension portion that extends upward from the upper part of the main body to avoid the camera hole.

[0014] After adopting the above technical solution, the beneficial effects of the utility model are as follows: in the utility model, the radiant heat dissipation film includes: a release layer, a pressure-sensitive adhesive layer, a metal foil substrate layer and a radiant heat dissipation layer; the radiant heat dissipation layer can absorb heat from the nearby high-temperature zone in a non-contact manner and transfer the heat to the metal foil substrate layer; the metal foil substrate layer provides mechanical support for the product and, at the same time, acts as a heat-dissipating material to evenly conduct the heat absorbed by the radiant heat dissipation layer; the pressure-sensitive adhesive layer fixes the product in the use location, such as the inside of a mobile phone case; the release layer isolates and protects the pressure-sensitive adhesive layer when the product is not in use, and the release layer is removed when the product is in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0016] Figure 1 It is a structural diagram of embodiment 1;

[0017] Figure 2 It is a structural diagram of embodiment 2;

[0018] Figure 3 is a structural diagram of embodiment 3;

[0019] Figure 4 This is a schematic diagram of the structure of this product covering the inside of the protective cover of electronic products;

[0020] Figure 5 This is another structural diagram of this product covering the inside of the protective cover of electronic products.

[0021] Explanation of the accompanying reference numerals: 100, release layer; 110, release film; 120, release paper; 200, pressure-sensitive adhesive layer; 300, metal foil substrate layer; 310, aluminum foil substrate layer; 320, copper foil substrate layer; 400, radiant heat dissipation layer; 500, insulating protective layer. DETAILED DESCRIPTION

[0022] The present invention will be described in further detail below with reference to the accompanying drawings.

[0023] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

[0024] This embodiment provides a radiation heat dissipation film for an electronic product protective cover, referring to Figure 1-Figure 3 The electronic device comprises a release layer 100, a pressure-sensitive adhesive layer 200, a metal foil substrate layer 300, and a heat dissipation layer 400, which are stacked in sequence. The release layer 100 is removed when the product is used. The heat dissipation layer 400 is located on the side closest to the electronic product, and the pressure-sensitive adhesive layer 200 is located on the side closest to the electronic product's protective cover.

[0025] After removing the release layer 100, the overall thickness of this product is between 25μm and 140μm. It requires less space for use and can be used in almost all electronic product protective covers on the market.

[0026] The radiative heat dissipation layer 400 absorbs heat from nearby high-temperature areas without contact and transfers the heat to the metal foil substrate layer 300. In some embodiments, the radiative heat dissipation layer 400 is a radiative heat dissipation coating with a thickness of 5 μm to 10 μm. Specifically, thicknesses may be as follows: 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, and 10 μm. The radiative heat dissipation coating is applied to the surface of the metal foil substrate layer 300 by coating or printing, with an application thickness ranging from 5 μm to 10 μm. The radiative heat dissipation coating can be XT-301 graphene heat dissipation coating from Hefei Aikesiwei New Materials Technology. The radiative heat dissipation coating can also use a resin as a binder and nano-inorganic particles as a heat-radiating filler. The resin can be one of polyurethane, acrylic, or epoxy resins, and the nano-inorganic ions can be one or more of LaAlO₃, SiO₂, Al₂O₃, MoSi₂, La₂NiO₄, or Mg₁₁₆Cu₂Cr₂O₄. One or both of nano-carbon powder and carbon nanotubes can be used as thermal conductivity enhancers. In some embodiments, the radiative heat dissipation layer 400 can also be configured as a non-coated layer, adhered to the metal foil substrate layer 300 via an adhesive layer.

[0027] In some embodiments, the metal foil substrate layer 300 is a copper foil substrate layer 320 or an aluminum foil substrate layer 310, and has a thickness of 10 μm to 100 μm. Specifically, the thickness may be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm. When the radiant heat dissipation layer 400 is a radiant heat dissipation coating, the metal foil substrate layer 300 serves as a printing carrier for the heat dissipation coating, providing mechanical support for the product, and also acts as a heat spreader, evenly distributing the heat absorbed by the radiant heat dissipation layer 400.

[0028] The pressure-sensitive adhesive layer 200 fixes the product to the location of use, such as the inside of a mobile phone case. In some embodiments, the pressure-sensitive adhesive layer 200 is a silicone pressure-sensitive adhesive layer 200. The pressure-sensitive adhesive layer 200 uses silicone, which can form a good bond and fixation to different surface energy materials. The thickness of the silicone pressure-sensitive adhesive layer 200 is 10μm-30μm, and the adhesion range is 3N-10N / 25mm. Specifically, the following thicknesses can be used: 10μm, 15μm, 20μm, 25μm, 30μm. Specifically, Kanglibang KLB series silicone pressure-sensitive adhesive can be used. In some embodiments, the pressure-sensitive adhesive layer 200 can also be a thermally conductive pressure-sensitive adhesive layer 200. The thermally conductive pressure-sensitive adhesive layer 200 is a silicone pressure-sensitive adhesive with added thermally conductive particles, and the thermally conductive particles are one or more of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, and silicon carbide.

[0029] The release layer 100 isolates and protects the pressure-sensitive adhesive layer 200 when the product is not in use, and is removed when the product is in use. The release layer 100 can be either a release film 110 or a release paper 120.

[0030] In some embodiments, the product further includes: an insulating protective layer 500 located on a side of the radiant heat dissipation layer 400 away from the metal foil substrate layer 300 .

[0031] Reference Figure 4 This product is rectangular and is attached to the underside of the camera hole in the electronic product protective case, corresponding to the battery position of the electronic product. After attachment, this product occupies 30%-70% of the area inside the electronic product protective case.

[0032] Reference Figure 5 This product consists of a rectangular main body that attaches to the underside of the camera hole in the electronic product's protective case, corresponding to the battery position; and an extension that extends upward from the upper portion of the main body, avoiding the camera hole. Once attached, the product occupies 60% to 99% of the inner surface of the electronic product's protective case.

[0033] This product has excellent adhesion to surfaces such as silicone, plastic, and metal, making it suitable for a wide range of protective cases with varying surface materials. Its adhesion to plastic surfaces is >600g / 25mm, and to silicone surfaces >300g / 25mm, achieving excellent adhesion to flat surfaces of varying materials. For a 66W fast-charging mobile phone on the market, a silicone phone case was used to protect it. When the heat dissipation film was applied to the inside of the silicone case, covering the battery area and occupying 50% of the case's inner surface, the outside temperature of the phone dropped by an average of 4°C during 66W fast charging compared to a case without the film. When the heat dissipation film was applied to the inside of the silicone case, covering the battery area and occupying 80% of the case's inner surface, the outside temperature dropped by 6°C during 66W fast charging compared to a case without the film.

[0034] Three specific embodiments are provided below:

[0035] Example 1: Reference Figure 1 The radiation heat dissipation film includes: a release film 110, a pressure-sensitive adhesive layer 200, an aluminum foil substrate layer 310 and a radiation heat dissipation layer 400 which are stacked in sequence.

[0036] Example 2: Reference Figure 2 The radiation heat dissipation film includes: a release paper 120, a pressure-sensitive adhesive layer 200, a copper foil substrate layer 320 and a radiation heat dissipation layer 400 which are stacked in sequence.

[0037] Example 3: Reference Figure 3 The radiation heat dissipation film includes: a release paper 120, a pressure-sensitive adhesive layer 200, an aluminum foil substrate layer 310, a radiation heat dissipation layer 400 and an insulating protective layer 500 stacked in sequence.

[0038] The above is only used to illustrate the technical solution of the present invention and is not intended to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A radiation heat dissipation film for a protective cover of an electronic product, characterized in that: include: A release layer (100), a pressure-sensitive adhesive layer (200), a metal foil substrate layer (300), and a radiation heat dissipation layer (400) are stacked in sequence; the radiation heat dissipation layer (400) is located on a side close to the electronic product.

2. The radiation heat dissipation film for the electronic product protective cover according to claim 1, characterized in that: The metal foil substrate layer (300) is a copper foil substrate layer (320) or an aluminum foil substrate layer (310).

3. The radiation heat dissipation film for the electronic product protective cover according to claim 2, characterized in that: The thickness of the metal foil substrate layer (300) is 10 μm-100 μm.

4. The radiation heat dissipation film for an electronic product protective cover according to claim 1, characterized in that: The radiation heat dissipation layer (400) is a radiation heat dissipation coating.

5. The radiation heat dissipation film for the electronic product protective cover according to claim 4, characterized in that: The thickness of the radiation heat dissipation coating is 5 μm-10 μm.

6. The radiation heat dissipation film for an electronic product protective cover according to claim 1, characterized in that: The pressure-sensitive adhesive layer (200) is a silicone pressure-sensitive adhesive layer (200) with a thickness of 10 μm-30 μm.

7. The radiation heat dissipation film for an electronic product protective cover according to claim 1, characterized in that: The pressure-sensitive adhesive layer (200) is a heat-conductive pressure-sensitive adhesive layer (200).

8. The radiation heat dissipation film for an electronic product protective cover according to claim 1, characterized in that: The radiation heat dissipation film for the electronic product protective cover further comprises: an insulating protective layer (500) located on a side of the radiation heat dissipation layer (400) away from the metal foil substrate layer (300).

9. The radiation heat dissipation film for an electronic product protective cover according to any one of claims 1 to 8, characterized in that: The radiation heat dissipation film for the electronic product protective cover is rectangular in shape, attached to the lower side of the camera hole of the electronic product protective cover, and corresponds to the battery position of the electronic product.

10. The radiation heat dissipation film for an electronic product protective cover according to any one of claims 1 to 8, characterized in that: The radiation heat dissipation film for the electronic product protective cover includes: a main body in a rectangular shape, attached to the lower side of the camera hole of the electronic product protective cover and corresponding to the battery position of the electronic product; and an extension portion extending upward from the upper part of the main body to avoid the camera hole.

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