SOC stack including flow distributor combined contact enabler

Abstract

The solid oxide cell stack has a flow distributor combined contact enabler made of pressed metal foil with flow guide and contact areas disposed between the interconnect layers and the cell layers in the stack.

Description

[Technical Field]

[0001] The present invention relates to a solid oxide cell (SOC) stack, particularly a solid oxide electrolysis cell (SOEC) stack or a solid oxide fuel cell (SOFC) stack, that includes multiple elements, each of which is a flow distributor combined contact enabler. [Background technology]

[0002] The present invention can generally be used in SOC stacks and therefore in both SOEC and SOFC modes, although for simplicity some of the following description will refer to the SOEC mode.

[0003] In an SOC stack having an operating temperature between 600°C and 1000°C, preferably between 600°C and 850°C, several cell units are assembled to form a stack and connected to each other by interconnects. The interconnects serve as a gas barrier to separate the anode and cathode sides of adjacent cell units, while allowing current conduction between adjacent cells, i.e., between the anode of one cell and the cathode of the next cell. Furthermore, the interconnects usually have multiple flow paths for the passage of process gases on both sides of the interconnect. To optimize the performance of an SOC stack, a set of advantageous values ​​should be maximized without causing unacceptable consequences for another set of related unfavorable values ​​that should be minimized. Some of these values ​​are as follows:

[0004] [Table 1] Nearly all of the values ​​listed above are interrelated, meaning that changing one value will affect the others. Some relationships between the process gas flow properties in the cell and the above values ​​are noted here: Process gas utilization: The flow paths in the interconnect should be designed to provide equal amounts of process gas to each cell in the stack, ie, there should be no flow "shortcuts" through the stack.

[0005] Parasitic losses: The design of the process gas flow paths in the SOC stack and its cell units should seek to achieve low pressure loss per flow volume, which reduces parasitic losses associated with the blower.

[0006] Electrical efficiency: The interconnect conducts current between the anode and cathode layers of adjacent cells. Therefore, to reduce internal resistance, the conductive contact points (hereinafter simply referred to as "contact points") of the interconnect should be designed to establish good electrical contact to the electrodes (anode and cathode), and the contact points should not be far apart, which would force the current to flow through a longer distance of the electrodes, resulting in higher internal resistance.

[0007] lifespan: It is desirable to maximize the lifetime of the SOC stack, i.e., to be able to use it to generate as much electricity as possible in SOFC mode, and to maximize the amount of electrolysis products (e.g., H and / or CO) in SOEC mode. Stack lifetime depends on many factors, including the selection of interconnects and spacers, flow distribution on both process gas sides of the interconnect, uniformly distributed protective coatings on the materials, operating conditions (temperature, current density, voltage, etc.), cell design and materials, edge reoxidation which reduces lifetime, and many other factors.

[0008] cost: The cost contribution of interconnects (and spacers) can be reduced by not using expensive materials, by reducing the manufacturing time of the interconnects and spacers, by minimizing the number of components, and by minimizing material waste (the amount of material wasted during the manufacturing process).

[0009] size: If the interconnect design ensures high utilization of the active cell area, the overall size of the fuel stack can be reduced. Dead areas with low process gas flow should be reduced and inactive areas on the seal faces should be minimized.

[0010] Production time: The manufacturing time of the interconnects and spacers themselves should be minimized, and the interconnect design should also contribute to the rapid assembly of the entire stack. Generally, every time a component is eliminated by the interconnect design, a manufacturing time benefit is realized.

[0011] Failure rate: The interconnect and spacer manufacturing methods and materials should enable low interconnect failure rates (e.g., undesired holes in the interconnect gas barrier, inconsistent material thickness or properties). Furthermore, the interconnect design reduces the total number of components to be assembled, and the reduced length and number of sealing surfaces can reduce the failure rate of the assembled cell stack.

[0012] Number of components: In addition to minimizing errors and assembly time as discussed above, the reduction in component count translates into lower costs.

[0013] The anode and cathode gas flows are distributed in the SOC stack by having a shared manifold for each of the two process gases. The manifold can be either internal or external. The manifold supplies the process gas to the individual layers in the SOC stack with channels to each layer. The channels are typically located in one layer of the repeating elements included in the SOC stack, i.e., in a spacer or interconnect.

[0014] Interconnects and spacers made of sheet metal are typically made from two separate pieces of sheet material that are sealed together in the SOC stack. This requires a seal between the interconnect and spacer and handling of separate components in manufacturing. Furthermore, because the two separate sheet pieces often have the same outer dimensions, a lot of material is wasted when most of the material in the center of the spacer sheet is removed (e.g., punched out).

[0015] Solid oxide electrolysis cells (SOECs) can be used to convert HO to H, CO to CO, or a combination of HO and CO to syngas (H and CO). This conversion occurs on the cathode side (fuel side) of the SOEC, where the cell contains nickel-containing layers in their reduced state. On the oxy-side (anode) of the SOEC, oxygen is produced, which is usually flushed with air.

[0016] When solid oxide cells are stacked into an SOC stack, the cells are separated by interconnects that have several functions. The interconnect functions include: 1) separating the gases between the fuel and oxy-side of the SOC, i.e., the fuel containing H2O and / or CO2 on the fuel side and the oxy-stream containing air and O2 on the oxy-side of the SOC; 2) distributing both gas streams (fuel or oxy-stream) across the active area of ​​the SOC on their corresponding sides; 3) carrying electrical current from one cell to the next in the stack—from the fuel side of one cell to the oxy-side of the adjacent cell; 4) enabling proper electrical contact between the cells and the interconnects on both sides; 5) providing mechanical support for the SOC; and 6) ensuring all of the above while accommodating the manufacturing tolerances of all components in the stack (cells, seal materials, and the interconnects themselves), i.e., component thickness and straightness tolerances.

[0017] Thus, interconnects carry many functionalities, some of which cancel each other out, and all of which have significant interactions, which complicates the design and limits design freedom. It would therefore be advantageous if some of the interconnect functionality could be separated into other components, reducing the complexity of the interconnect design and providing greater freedom in design, manufacturing, and material selection.

[0018] Contact enablers are commonly used to ensure good contact between the IC and the cell and to some extent absorb small manufacturing tolerances. In particular, on the fuel side of the cell interconnect, thin (<100 μm) meshes, foams, etc. made of nickel or other materials are commonly used to ensure good electrical contact by having a (slightly) deformable element between the nickel-containing cell layer and the interconnect. The nickel mesh or foam can ensure good electrical contact on the fuel side by absorbing some of the local or small manufacturing tolerances.

[0019] Thus, the use of a contact enabler on the fuel side can be used to mitigate functionality 4) and, to some extent, functionality 6) in the interconnect functionality listed above. For example, the use of a nickel contact enabling element on the fuel side is a good way to ensure good electrical contact because the nickel contact enabler can bond to the cell layer on the fuel side, which contains nickel, by interdiffusion between the contact element and the cell. Similarly, the nickel contact enabler can be bonded to the interconnect (typically made of high-temperature ferritic stainless steel).

[0020] The present invention aims to solve the problem of moving more functionality from the interconnect to the contact enabling element on the fuel side by including contact enabling, flow distribution, and manufacturing tolerance absorption in the contact enabling element. Thus, the functionality of the interconnect is reduced to the functionality of 1) gas separator, 2) flow distributor (oxy side only), 3) current conductor between cells, 4) contact enabler (oxy side only), and 5) cell support (oxy side only).

[0021] US6492053 (Reference 1) discloses a fuel cell stack including interconnects and spacers. Both the interconnects and the spacers have inlet and outlet manifolds for the flow of oxygen / fuel. The inlet and outlet manifolds have grooves / passages on their surfaces for the distribution of oxygen / fuel along the anode and cathode. However, the grooves / passages of the interconnects and the spacers are not aligned with each other, and therefore their shapes cannot be combined to achieve multiple inlet points. Also, because the grooves / passages are on the surfaces of both the interconnects and the spacers, the formation of multiple inlet points is not feasible.

[0022] US2010297535 (Reference 2) discloses a bipolar plate for a fuel cell with flow channels. The flow plate has multiple channels for uniformly distributing fluid between the active areas of the fuel cell. This document does not describe a second layer and similar channels therein.

[0023] US2005016729 (Reference 3) discloses ceramic fuel cells supported in thermally conductive interconnect plates, with multiple plates forming a conductive heater called a stack. Multiple stacks are connected to form rod-shaped fuel cells. Multiple stacks are connected end-to-end to form a string of fuel cells. The string can be 1,000 feet long or longer and can be sized to penetrate underground resource formations, such as oil deposits. A preheater brings the string to an operating temperature of over 700°C, and the fuel cells then maintain that temperature through multiple conduits that supply fuel cell fuel and oxidant and transport exhaust gases to the planet's surface. A manifold can be used between the string and the planet's surface to connect the multiple conduits and act as a heat exchanger between the exhaust gases and the oxidant / fuel.

[0024] None of the above known techniques provide a simple and efficient solution to the above problem. [Prior art documents] [Patent documents]

[0025] [Patent Document 1] US6492053 [Patent Document 2] US2010297535 [Patent Document 3] US2005016729 Summary of the Invention [Problem to be solved by the invention]

[0026] Therefore, in view of the considerations raised above, there is a need for a simple and easy, yet robust, effective and precise solution for manufacturing SOC stacks that include flow distributor integrated contact enablers. [Means for solving the problem]

[0027] These and other objects are achieved by the invention described below.

[0028] Summary of the Invention As mentioned above, the standard solution is to have interconnects with at least six functionalities, and these functionalities can be reduced somewhat by introducing contact enablers, which are commonly used between the fuel side of the interconnect and the cell to ensure good contact and to some extent absorb small / local manufacturing tolerances (roughness).

[0029] In one embodiment, the invention is a novel contact enabler on the fuel side of the stack, for example between the cells and the interconnect, in the form of a deep-drawn (pressed) nickel foil (or other material) that is much thicker (approximately 500 μm) than standard solutions that use nickel mesh or foam (<100 μm).

[0030] The deep drawn nickel foil is thick enough to accommodate the fuel distribution channels, which ensures flow distribution in the active area on the fuel side of the cell. The deep drawn nickel foil also ensures proper electrical contact between the cell and the interconnect, just like standard solutions, but because the foil is deformable when manufacturing the stack and the foil can be pressed to a height (+approximately 100 μm) higher than its final shape in the stack - the nickel foil can also absorb all manufacturing tolerances from all components when manufacturing the stack, thus removing this functionality requirement from the interconnect.

[0031] Some of the interconnect functionality is transferred to a novel deep-drawn nickel contact-enabling foil. This reduces the complexity of the interconnect and allows for greater interconnect design freedom. Because the nickel foil handles flow distribution and contact, the interconnect has no fuel-side functionality, and therefore the interconnect design, material selection, and manufacturing method can be optimized for the oxy-side of the cell (and as a gas separator).

[0032] Although nickel foil is compared to standard contact-enabling nickel mesh or foam, a more complex component, because the nickel foil only encounters fuel-side conditions, it only needs to be optimized for fuel-side conditions in terms of flow distribution and contact. Therefore, the additional functionality of the contact-enabling element (nickel foil) results in negligible additional component cost.

[0033] In one embodiment, a significant advantage of the novel deep-drawn nickel foil contact and flow distribution element is its ability to accommodate all manufacturing tolerances of all components used to construct the stack (cells, seal material, interconnects, and the nickel foil itself). This is done by deep-drawing the nickel foil to a height greater than its final height in the stack—it is manufactured with an “overheight.” The nickel foil’s overheight is used to accommodate the (larger) manufacturing tolerances of the stack components while ensuring adequate contact and support to the cells on the fuel side when the stack is manufactured and the stack components are compressed together. Because deep-drawing can create a “creep-able” structure, the nickel foil can be designed to creep during the stack manufacturing process. Additionally, the fact that the nickel foil on the fuel side is in a reducing environment ensures a high creep rate for the nickel compared to the interconnects and cells.

[0034] The ability to accommodate large manufacturing tolerances in the stack components reduces component and manufacturing process requirements, thus resulting in lower costs.

[0035] In one embodiment, using nickel foil as the contact-enabling element between the cells and interconnects on the fuel side has the same contact-enabling benefits as standard contact enablers made of nickel mesh or foam because it can create a strong bond to the cells and interconnects. However, using the novel, higher nickel foil as the contact enabler introduces a more flexible element to ensure contact between the cells and interconnects during operation, where thermal expansion can disrupt contact. The nickel foil can bond well to the cells and interconnects and is also able to creep, so it can maintain contact integrity during operation even with large thermal expansion differences between layers (the nickel foil acts as a bonding string between the cells and ICs, which tolerates changes in the distance between the cells and interconnects resulting from differences in thermal expansion of the components and temperature gradients in the stack).

[0036] The invention described in claim 1 is a solid oxide cell stack including a plurality of stacked cell units, as known in the art. Each cell unit includes a cell layer having solid oxide cells and an interconnect layer having interconnects. As known, the interconnect layer separates one cell layer from an adjacent cell layer in the cell stack. In particular, with respect to the present invention, each cell unit in the stack also includes at least one flow distributor-combined contact enabler made of pressed metal foil. This has the functions of both creating a flow pattern for process gases in a desired pattern and amount and creating a predetermined, strong, and reliable mechanical and electrical contact between the interconnect and the adjacent cell layer between which the flow distributor-combined contact enabler is disposed.

[0037] In one embodiment of the present invention, the combined flow distributor contact enabler is specifically positioned on the fuel side of the interconnect, which also faces the fuel side of an adjacent solid oxide cell in a solid oxide cell stack. The flow guide and contact area of ​​the combined flow distributor contact enabler can have specific dimensions, which is possible because the combined flow distributor contact enabler is made of a pressed metal foil, as opposed to a contact enabler made of, for example, a more irregular mesh. The metal foil may have protrusions that are pressed to a precise specific dimension (the thickness of the combined flow distributor contact enabler) or to a precise specific over-dimension (which is then pressed to its final dimension when the stack is assembled and placed under compressive force). Similarly, the flow guides and contact areas of a combined flow distributor contact enabler can be arranged at specific intervals from one another and in specific patterns because it is made from a metal foil that is pressed according to a specific pattern or mold, as opposed to, for example, a metal mesh, which may be more disordered or inconsistent in its appearance and structure.

[0038] In one embodiment of the present invention, each of the flow distributor and contact enablers has a contact area, which is in physical and mechanical contact with the adjacent solid oxide cells and is between 2% and 50% of the total area of ​​the adjacent solid oxide cells. The flow guide and contact area can be elongated, wavy protrusions pressed into the metal foil, which can be positioned and oriented to provide alternating flow paths. In one embodiment, the flow guide and contact area can be elongated, wavy protrusions pressed into the metal foil, each wavy protrusion contacting the metal foil on only one side of the wave. In another embodiment, the wavy protrusions can be curved.

[0039] In one embodiment, the metal foil can be pressed without transferring material from the foil, while in another embodiment, material can be removed from the metal foil, and in further embodiments, the removed material can provide a guide for pressing the metal foil. Additionally, the areas from which material is removed from the metal foil can provide flow paths through the flow distributor and contact enabler. Prior to pressing the metal foil, it can be laser cut, etched, water jet cut (or micro-abrasive water jet cut), or stamped, whatever process best suits the objective of manufacturing the flow distributor and contact enabler. The manufacturing process for the flow distributor and contact enabler can also include simultaneously pressing and cutting the metal foil.

[0040] In one embodiment of the present invention, as described and illustrated above, the metal foil is made of nickel or is at least coated with nickel. The thickness of the metal foil used to manufacture the flow distributor and contact enabler may be between 50 μm and 1200 μm, preferably between 100 μm and 300 μm. Meanwhile, after the metal foil of the flow distributor and contact enabler is pressed, the height of the flow distributor and contact enabler is between 200 μm and 3000 μm, preferably between 400 μm and 1000 μm. Therefore, due to the pressed protrusions in the metal foil, the flow distributor and contact enabler has a height greater than the thickness of the metal foil itself after it is pressed.

[0041] Also, as described above, the combined flow distributor contact enabler may be fabricated to an "excess" thickness prior to assembly in a solid oxide cell stack. Thus, the height of the combined flow distributor contact enabler prior to assembly between the interconnect and the solid oxide cell is 20 μm to 1000 μm, preferably 50 μm to 200 μm, greater than the height of the combined flow distributor contact enabler when placed in the solid oxide cell stack after the fabrication of the solid oxide cell stack is completed. Thus, after fabrication of the solid oxide cell stack, which may involve compression forces and elevated temperatures, the height of the combined flow distributor contact enabler is reduced while still providing good mechanical and electrical contact with the interconnect and adjacent cell units.

[0042] Thus, in one embodiment of the present invention, the flow distributor integrated contact enabler is connected to the solid oxide cell by diffusion bonding at least on a portion of the surface of the flow distributor integrated contact enabler facing the solid oxide cell.

[0043] In one embodiment of the invention, a well-defined orientation and position of the flow distributor and contact enabler relative to at least its adjacent interconnect is achieved by at least one fixed guide adapted to interact with said interconnect to provide a specific position of said flow distributor and contact enabler relative to said interconnect, which may be made of a bent part, an at least partially stamped and bent portion of the flow distributor and contact enabler, or material placed by spot welding or laser welding.

[0044] In one embodiment of the present invention, at least a majority of the surface of the interconnect facing the combined flow distributor and contact enabler is flat and has no protruding flow guide and contact areas. In a further embodiment of the present invention, the solid oxide cell stack is a solid oxide electrolysis cell stack.

[0045] Features of the invention 1. A solid oxide cell stack including a plurality of stacked cell units, each cell unit including a cell layer including a solid oxide cell and an interconnect layer including an interconnect, wherein one interconnect layer separates one cell layer from an adjacent cell layer in the cell stack; the cell unit further includes at least one flow distributor combined contact enabler, the at least one flow distributor combined contact enabler being made of a pressed metal foil and including a flow guide combined contact area, the flow distributor combined contact enabler being disposed between the interconnect layer and the cell layer, and providing physical and electrical contact between the interconnect layer and the cell layer; The solid oxide cell stack.

[0046] 2. The solid oxide cell stack of feature 1, wherein the flow distributor integrated contact enabler is disposed on a fuel side of the interconnect facing a fuel side of an adjacent solid oxide cell in the solid oxide cell stack.

[0047] 3. The solid oxide cell stack according to feature 1 or 2, wherein the flow guide composite contact area has specific dimensions.

[0048] 4. The solid oxide cell stack according to any one of Features 1 to 3, wherein the flow guide composite contact areas are arranged at specific intervals and in a specific pattern.

[0049] 5. The solid oxide cell stack of any one of Features 1 to 4, wherein each of the flow distributor integrated contact enablers has a contact area to an adjacent solid oxide cell, the contact area being between 2% and 50% of the total area of ​​the adjacent solid oxide cell.

[0050] 6. The solid oxide cell stack of any one of features 1 to 5, wherein the flow guide composite contact areas are arranged in a pattern adapted to provide alternating flow paths.

[0051] 7. The solid oxide cell stack according to any one of Features 1 to 6, wherein the flow guide composite contact area is a pressed, elongated, wave-shaped protrusion in the metal foil.

[0052] 8. The solid oxide cell stack according to any one of Features 1 to 7, wherein the flow guide composite contact area is an elongated, straight and wavy protrusion pressed into the metal foil.

[0053] 9. The solid oxide cell stack of any one of Features 1-8, wherein the flow guide composite contact areas are elongated, straight and corrugated protrusions pressed into the metal foil, each protrusion contacting the metal foil on only one side of its corrugation.

[0054] 10. The solid oxide cell stack of any one of Features 1 to 9, wherein the flow guide composite contact area is a pressed, elongated, curved, and wavy protrusion in the metal foil.

[0055] 11. The solid oxide cell stack of any one of Features 1 to 10, wherein the pressed metal foil includes areas of the metal foil from which metal foil material has been removed.

[0056] 12. The solid oxide cell stack of feature 11, wherein the removed metal foil material provides a guide for pressing the metal foil.

[0057] 13. The solid oxide cell stack of features 11 or 12, wherein the removed metal foil material provides a flow path through the flow distributor combined contact enabler.

[0058] 14. The solid oxide cell stack according to any one of features 1 to 13, wherein the metal foil is laser cut or etched or water jet cut and / or micro-abrasive water jet cut or stamped prior to the pressing.

[0059] 15. The solid oxide cell stack of any one of Features 1 to 14, wherein the metal foil is simultaneously stamped and cut.

[0060] 16. The solid oxide cell stack according to any one of features 1 to 15, wherein the metal foil is made of nickel.

[0061] 17. The solid oxide cell stack of any one of Features 1 to 16, wherein the metal foil is coated with nickel.

[0062] 18. The solid oxide cell stack according to any one of Features 1 to 17, wherein the thickness of the metal foil is between 50 μm and 1200 μm, preferably between 100 μm and 300 μm.

[0063] 19. The solid oxide cell stack according to any one of Features 1 to 18, wherein the height of the flow distributor combined contact enabler after the metal foil of the flow distributor combined contact enabler is pressed is between 200 μm and 3000 μm, preferably between 400 μm and 1000 μm.

[0064] 20. The solid oxide cell stack of any one of Features 1 to 19, wherein the height of the flow distributor integrated contact enabler prior to assembly between the interconnect and the solid oxide cell is 20 μm to 1000 μm, preferably 50 μm to 200 μm, greater than the height of the flow distributor integrated contact enabler when positioned within the solid oxide cell stack after fabrication of the solid oxide cell stack is complete.

[0065] 21. The solid oxide cell stack of any one of Features 1 to 20, wherein the flow distributor integrated contact enabler is connected to the interconnect by diffusion bonding on at least a portion of a surface of the flow distributor integrated contact enabler facing the interconnect.

[0066] 22. The solid oxide cell stack of any one of Features 1-21, wherein the flow distributor integrated contact enabler is connected to the solid oxide cell by diffusion bonding on at least a portion of a surface of the flow distributor integrated contact enabler facing the solid oxide cell.

[0067] 23. The solid oxide cell stack of any one of features 1-22, wherein the flow distributor integrated contact enabler includes at least one fixed guide adapted to interact with the interconnect to effect a specific position of the flow distributor integrated contact enabler relative to the interconnect.

[0068] 24. The solid oxide cell stack of feature 23, wherein the at least one fixed guide is made of a bent part, an at least partially stamped and bent portion of the flow distributor combined contact enabler, or material placed by spot welding or laser welding.

[0069] 25. The solid oxide cell stack of any one of features 1-24, wherein at least a majority of the surface of the interconnect facing the flow distributor integrated contact enabler is flat and does not have protruding flow guide and contact areas.

[0070] 26. The solid oxide cell stack according to any one of Features 1 to 25, wherein the solid oxide cell stack is a solid oxide electrolysis cell stack. [Brief explanation of the drawings]

[0071] The present invention is further illustrated by the accompanying drawings, which show examples of embodiments of the invention.

[0072] FIG. 1 shows an isometric top view of a flow distributor combined contact enabler.

[0073] FIG. 2 shows an isometric top detailed view of the flow distributor and contact enabler of FIG.

[0074] FIG. 3 shows a top view of a combined flow distributor and contact enabler.

[0075] FIG. 4 shows a top view of the combined flow distributor and contact enabler, including section line AA.

[0076] FIG. 5 shows a cross-sectional side view AA of section line AA of FIG. 4, including detailed section B.

[0077] FIG. 6 shows an enlarged detailed cross-section B of the detailed cross-section of FIG.

[0078] Position number 01. Flow distributor combined contact enabler 02. Flow guide composite contact area 03. Flow path 04. Center hole Detailed Description FIG. 1 shows an isometric top view of a flow distributor combined contact enabler 01 according to one embodiment of the present invention. As described above, the flow distributor combined contact enabler is adapted to be disposed between an interconnect layer and a cell layer (not shown, as these are known to those skilled in the art) to provide physical and electrical contact between the interconnect layer and the cell layer, and also to provide flow distribution of process fluids. The flow distributor combined contact enabler is made of pressed metal foil. When the metal foil is pressed, the flow distributor combined contact enabler is provided with a plurality of flow guide combined contact areas 02. In the embodiment of FIG. 1, the flow distributor combined contact enabler has the shape of a sector of a circle, each of the sectors having a radius adapted to their position separated from the center of the flow distributor combined contact enabler (which has a circular shape in this embodiment). As can be seen in FIG. 1, the flow guide combined contact areas are separated from each other by flow channels 03. At the center of the flow distributor combined contact enabler is a central hole 04. In the embodiment shown in Figure 1, process fluid can flow from the periphery of the flow distributor combined contact enabler, radially inward through flow channels, tangentially along the flow guide combined contact area, and proceeding in alternating flow channels until the process fluid can exit through the central hole.

[0079] The combined flow distributor and contact enabler, in the shape of a sector of a circle, as well as the flow channels can be seen in more detail in Figure 2. The flow channels, in this embodiment, may be made of removed material (e.g., stamped material) in a pressed metal foil.

[0080] FIG. 3 shows the same combined flow distributor and contact enabler as discussed in FIG. 1, but from a top view, the circular shape of the combined flow distributor and contact enabler is more clearly visualized.

[0081] Figure 4 shows a combined flow distributor and contact enabler as seen in a top view, where section line AA is indicated, which in Figure 5 shows cut AA of the combined flow distributor and contact enabler in a side view. The side view shape of the combined flow distributor and contact enabler of this embodiment clearly shows the corrugated flow guide combined contact area. Detail B of Figure 5 is also shown enlarged in Figure 6 to clarify and visualize how cut AA passes partially through the material, i.e., the flow guide combined contact area 2, but also through the void, i.e., the flow path 03, of the combined flow distributor and contact enabler.

Claims

1. A solid oxide cell stack including a plurality of stacked cell units, each cell unit including a cell layer including a solid oxide cell and an interconnect layer including an interconnect, wherein one interconnect layer separates one cell layer from an adjacent cell layer in the cell stack, the cell unit further includes at least one flow distributor combined contact enabler, the at least one flow distributor combined contact enabler being made of a pressed metal foil and including a flow guide combined contact area, the flow distributor combined contact enabler being disposed between the interconnect layer and the cell layer, and providing physical and electrical contact between the interconnect layer and the cell layer; The solid oxide cell stack.

2. 2. The solid oxide cell stack of claim 1, wherein the flow distributor integrated contact enabler is disposed on a fuel side of the interconnect facing a fuel side of an adjacent solid oxide cell in the solid oxide cell stack.

3. The solid oxide cell stack of claim 1 or 2, wherein the flow guide composite contact area has specific dimensions.

4. 4. The solid oxide cell stack according to claim 1, wherein the flow guide composite contact areas are arranged at specific intervals and in a specific pattern.

5. 5. The solid oxide cell stack of claim 1, wherein each of the flow distributor integrated contact enablers has a contact area to an adjacent solid oxide cell, the contact area being between 2% and 50% of a total area of ​​the adjacent solid oxide cell.

6. The solid oxide cell stack of any one of claims 1 to 5, wherein the flow guide composite contact areas are arranged in a pattern adapted to provide alternating flow paths.

7. 7. The solid oxide cell stack according to claim 1, wherein the flow guide composite contact area is an elongated, wave-shaped protrusion pressed into the metal foil.

8. 8. The solid oxide cell stack according to claim 1, wherein the flow guide composite contact area is an elongated, straight and wavy protrusion pressed in the metal foil.

9. 9. The solid oxide cell stack of claim 1, wherein the flow guide hybrid contact areas are elongated, straight and wavy protrusions pressed into the metal foil, each protrusion contacting the metal foil on only one side of its wave.

10. 10. The solid oxide cell stack according to claim 1, wherein the flow guide composite contact area is an elongated, curved and wavy protrusion pressed in the metal foil.

11. 11. The solid oxide cell stack of claim 1, wherein the pressed metal foil includes areas of the metal foil from which metal foil material has been removed.

12. The solid oxide cell stack of claim 11 , wherein the removed metal foil material provides a guide for pressing the metal foil.

13. 13. The solid oxide cell stack of claim 11 or 12, wherein the removed metal foil material provides a flow path through the flow distributor combined contact enabler.

14. 14. The solid oxide cell stack according to any one of claims 1 to 13, wherein the metal foil is laser cut, etched, water jet cut and / or micro-abrasive water jet cut or stamped prior to the pressing.

15. The solid oxide cell stack of any one of claims 1 to 14, wherein the metal foil is simultaneously pressed and cut.

16. The solid oxide cell stack of any one of claims 1 to 15, wherein the metal foil is made of nickel.

17. The solid oxide cell stack of any one of claims 1 to 16, wherein the metal foil is coated with nickel.

18. A solid oxide cell stack according to any one of the preceding claims, wherein the metal foil has a thickness between 50 μm and 1200 μm, preferably between 100 μm and 300 μm.

19. 19. The solid oxide cell stack according to any one of claims 1 to 18, wherein the height of the flow distributor combined contact enabler after the metal foil of the flow distributor combined contact enabler is pressed is between 200 μm and 3000 μm, preferably between 400 μm and 1000 μm.

20. 20. The solid oxide cell stack of claim 1, wherein the height of the flow distributor integrated contact enabler before assembly between the interconnect and the solid oxide cell is 20 μm to 1000 μm, preferably 50 μm to 200 μm, higher than the height of the flow distributor integrated contact enabler when placed in the solid oxide cell stack after complete fabrication of the solid oxide cell stack.

21. 21. The solid oxide cell stack of claim 1, wherein the flow distributor integrated contact enabler is connected to the interconnect by diffusion bonding on at least a portion of a surface of the flow distributor integrated contact enabler facing the interconnect.

22. 22. The solid oxide cell stack of claim 1, wherein the flow distributor integrated contact enabler is connected to the solid oxide cell by diffusion bonding on at least a portion of a surface of the flow distributor integrated contact enabler facing the solid oxide cell.

23. 23. The solid oxide cell stack of claim 1, wherein the flow distributor integrated contact enabler includes at least one fixed guide adapted to interact with the interconnect to effect a specific position of the flow distributor integrated contact enabler relative to the interconnect.

24. 24. The solid oxide cell stack of claim 23, wherein the at least one fixed guide is made of a bent part, an at least partially stamped and bent portion of the flow distributor integrated contact enabler, or material placed by spot welding or laser welding.

25. 25. The solid oxide cell stack of claim 1, wherein at least a majority of the surface of the interconnect facing the flow distributor integrated contact enabler is flat and does not have protruding flow guide and contact areas.

26. The solid oxide cell stack according to any one of claims 1 to 25, wherein the solid oxide cell stack is a solid oxide electrolysis cell stack.

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