Evaporator parallel connection type loop heat pipe heat dissipation device
By introducing the design of heat-conducting fins, fans, liquid cooling pipes and dust-proof plates into the loop heat pipe, the problems of temperature rise and dust influence after the loop heat pipe absorbs heat are solved, and efficient heat dissipation and continuous heat transfer are achieved.
Patent Information
- Application Number
- CN202423105815.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-12-17
AI Technical Summary
After the loop heat pipe absorbs heat, its temperature rises, resulting in a decrease in the heat dissipation rate. In addition, existing equipment cannot effectively filter dust in the air, affecting the heat dissipation effect.
An evaporator-parallel loop heat pipe cooling device was designed, which includes heat-conducting fins, a fan, a liquid cooling pipe, a heat-absorbing metal plate and a dustproof plate. The fan drives the low-temperature air to dissipate heat, the liquid cooling pipe absorbs heat and cools down, and the dustproof plate filters dust, thus achieving continuous heat transfer and efficient heat dissipation.
The heat dissipation rate of the loop heat pipe is improved, the decrease in heat dissipation rate caused by dust adhesion is avoided, and continuous heat transfer and efficient cooling effects are achieved.
Smart Images
Figure CN223388999U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of evaporator loop heat pipes, in particular to an evaporator parallel type loop heat pipe heat dissipation device. Background Art
[0002] The loop heat pipe condenser has the following main advantages: the heat transfer performance is less affected by gravity than traditional heat pipes; the structural shape is diverse and can form a compact arrangement to meet different usage requirements; the source and sink can be easily separated to perform long-distance heat transfer, etc. After the loop heat pipe absorbs heat, the temperature rises, resulting in a decrease in the heat absorption rate of the loop heat pipe.
[0003] Currently, the temperature of the loop heat pipe rises after absorbing heat, and the loop heat pipe cannot be easily dissipated and cooled. In addition, the existing equipment cannot filter dust in the air, which easily causes dust to affect the heat dissipation of the loop heat pipe, affecting the heat dissipation and cooling rate and practicality of the equipment. Therefore, those skilled in the art provide a loop heat pipe heat dissipation device with an evaporator in parallel to solve the problems raised in the above background technology. Utility Model Content
[0004] The purpose of the present invention is to provide a loop heat pipe heat dissipation device with parallel evaporators to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a loop heat pipe heat dissipation device with parallel evaporators, comprising three evaporators, wherein one side of the evaporators is connected to a first conduit for conducting steam, and the other side of the evaporators is connected to a second conduit for conducting liquid, one end of the second conduit is connected to a liquid distributor, and the other side of the liquid distributor is connected to a loop heat pipe, the three first conduits are connected in series, the other ends of the first conduits are connected to one end of the loop heat pipe, the loop heat pipe is arranged in a serpentine shape, a plurality of evenly arranged heat-conducting fins are sheathed on the outside of the loop heat pipe, and a heat dissipation assembly is installed on top of the heat-conducting fins;
[0006] The heat dissipation assembly includes an air guide frame installed on the surface of multiple heat-conducting fins, two fans are installed inside the air guide frame, a cooling frame is installed on the top of the fan, and the air guide frame and the cooling frame are installed by multiple bolts.
[0007] Preferably, a liquid cooling pipe for cooling is installed inside the cooling rack, a heat-absorbing metal plate is laid on the bottom of the cooling rack, and a plurality of evenly arranged air guide holes are opened on one side of the heat-absorbing metal plate.
[0008] Preferably, a heat absorbing frame is installed inside the cooling frame and above the liquid cooling pipe, a plurality of evenly arranged heat dissipating fins are installed inside the heat absorbing frame, and a plurality of evenly arranged ventilation holes are opened on one side of the heat dissipating fins.
[0009] Preferably, a dustproof plate is installed on the top of the air guide frame to prevent dust from entering the cooling frame, and the dustproof plate is fixed to the air guide frame by bolts.
[0010] Preferably, a plurality of evenly arranged grooves are respectively provided on both sides of the heat-absorbing metal plate.
[0011] Preferably, one side of the heat-conducting fin is provided with two groups of evenly arranged heat dissipation holes.
[0012] Compared with the prior art, the beneficial effects of the present invention are:
[0013] 1. In the present invention, by providing a first conduit, a second conduit and a liquid distributor, a gas-liquid phase change occurs on the capillary structure surface of the bottom surface of the evaporator, and the generated steam enters the loop heat pipe through the first conduit. Under the action of the pressure difference, the steam absorbs heat, cools down and condenses through the loop heat pipe and the heat-conducting fins. The steam changes phase from the loop heat pipe to liquid and enters the liquid distributor. The liquid distributor is used to make the fluid evenly enter the three evaporators, absorb heat and change phase again, thereby completing a thermodynamic cycle. When the heat source continues to generate heat, such a cycle will continue, thereby continuously transferring the heat generated by the heat source to the cold source. The heat dissipation component can absorb heat and cool the loop heat pipe, thereby improving the cooling and heat dissipation rate of the loop heat pipe.
[0014] 2. In the utility model, a fan, an air guide frame, a cooling frame, a liquid cooling pipe, a heat-absorbing metal plate, a heat-absorbing frame and heat dissipation fins are arranged, and the air guide frame and the cooling frame are stacked up and down. The liquid cooling pipe and the heat-absorbing metal plate in the cooling frame are used to absorb heat and cool the air. The liquid cooling pipe is filled with coolant, and the coolant can absorb heat and cool the hot air. The heat dissipation fins in the heat-absorbing frame can conduct heat and flow to the airflow and heat. The two fans in the air guide frame can drive the low-temperature air to dissipate heat and cool the loop heat pipe, thereby avoiding the increase in the temperature of the loop heat pipe causing the heat absorption and cooling rate of the loop heat pipe to decrease.
[0015] 3. In the present invention, a dustproof plate is provided to filter dust in the air, thereby preventing dust from adhering to the outside of the thermal fins and the loop heat pipes and reducing the heat dissipation rate of the thermal fins and the loop heat pipes. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0017] Figure 2 It is a left-side cutaway perspective view of the overall structure of the utility model;
[0018] Figure 3 The overall structure of the utility model Figure 2 Enlarged view of point A in the middle;
[0019] Figure 4 This is a schematic diagram of the structure of the evaporator, the first conduit, the second conduit, the liquid distributor, the loop heat pipe, the heat conducting fins and the heat dissipation holes in the overall structure of the utility model;
[0020] Figure 5 This is a schematic diagram of the structure of the heat-absorbing metal plate, air guide holes and grooves in the overall structure of the utility model;
[0021] Figure 6 It is a structural schematic diagram of the cooling rack, liquid cooling pipe and heat absorbing metal plate in the overall structure of the utility model.
[0022] In the figure: 1. Evaporator; 2. First duct; 3. Second duct; 4. Liquid distributor; 5. Loop heat pipe; 6. Heat-conducting fins; 7. Air guide frame; 8. Fan; 9. Cooling frame; 10. Liquid cooling pipe; 11. Heat-absorbing metal plate; 12. Air guide holes; 13. Heat-absorbing frame; 14. Heat-dissipating fins; 15. Ventilation holes; 16. Dustproof plate; 17. Groove; 18. Heat dissipation holes. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0024] See also Figures 1 to 6 In an embodiment of the present invention, an evaporator parallel type loop heat pipe heat dissipation device includes three evaporators 1, one side of the evaporator 1 is connected to a first conduit 2 for dredging steam, the other side of the evaporator 1 is connected to a second conduit 3 for dredging liquid, one end of the second conduit 3 is connected to a liquid distributor 4, and the other side of the liquid distributor 4 is connected to a loop heat pipe 5. The three first conduits 2 are connected in series, and the other end of the first conduit 2 is connected to one end of the loop heat pipe 5. The loop heat pipe 5 is arranged in a serpentine shape, and a plurality of evenly arranged heat-conducting fins 6 are sheathed on the outside of the loop heat pipe 5, and a heat dissipation component is installed on the top of the heat-conducting fin 6.
[0025] During use, a gas-liquid phase change occurs on the capillary structure surface at the bottom of the evaporator 1, and the generated steam enters the loop heat pipe 5 through the first conduit 2. Under the action of the pressure difference, the steam absorbs heat, cools down and condenses through the loop heat pipe 5 and the heat-conducting fins 6. The steam changes phase from the loop heat pipe 5 to liquid and enters the liquid distributor 4. The liquid distributor 4 is used to make the fluid evenly enter the three evaporators 1, absorb heat and change phase again, thereby completing a thermodynamic cycle. When the heat source continues to generate heat, such a cycle will continue, thereby continuously transferring the heat generated by the heat source to the cold source. The heat dissipation component can absorb heat and cool the loop heat pipe 5, so as to increase the cooling and heat dissipation rate of the loop heat pipe 5.
[0026] In one embodiment, specifically, the heat dissipation assembly includes an air guide frame 7 installed on the surface of multiple heat-conducting fins 6, two fans 8 are installed on the inside of the air guide frame 7, a cooling frame 9 is installed on the top of the fan 8, a liquid cooling pipe 10 for cooling is installed on the inside of the cooling frame 9, a heat-absorbing metal plate 11 is laid on the bottom of the cooling frame 9, and a plurality of air guide holes 12 are evenly arranged on one side of the heat-absorbing metal plate 11, a heat-absorbing frame 13 is installed on the inside of the cooling frame 9 and above the liquid cooling pipe 10, a plurality of heat dissipating fins 14 are evenly arranged on the inside of the heat-absorbing frame 13, a plurality of ventilation holes 15 are evenly arranged on one side of the heat dissipating fins 14, a plurality of grooves 17 are evenly arranged on both sides of the heat-absorbing metal plate 11, two groups of heat dissipating holes 18 are evenly arranged on one side of the heat-conducting fins 6, and the air guide frame 7 and the cooling frame 9 are installed by multiple bolts.
[0027] Among them, the air guide frame 7 and the cooling frame 9 are stacked up and down, and the liquid cooling tube 10 and the heat-absorbing metal plate 11 in the cooling frame 9 are used to absorb heat and cool the air. The liquid cooling tube 10 is filled with coolant, and the coolant can absorb heat and cool the hot air. The heat dissipation fins 14 in the heat-absorbing frame 13 can conduct heat and guide the airflow and heat. The two fans 8 in the air guide frame 7 can drive the low-temperature air to dissipate heat and cool the loop heat pipe 5. The multiple grooves 17 on both sides of the thermal fins 6 can facilitate the flow of air. The thermal fins 6 can facilitate the air blown out by the fan 8 to flow through the thermal fins 6, thereby avoiding the temperature increase of the loop heat pipe 5 causing the rate of heat absorption and cooling of the loop heat pipe 5 to decrease.
[0028] Furthermore, a dustproof plate 16 is installed on the top of the air guide frame 7 to prevent dust from entering the cooling frame 9. The dustproof plate 16 is fixed to the air guide frame 7 by bolts. The dustproof plate 16 can filter the dust in the air to prevent dust from adhering to the outside of the thermal fins 6 and the loop heat pipes 5 to reduce the heat dissipation rate of the thermal fins 6 and the loop heat pipes 5.
[0029] The working principle of this utility model:
[0030] First, start the two fans 8 in the air guide frame 7. At this time, the fan 8 drives the outside air to pass through the dustproof plate 16, the cooling frame 9 and the air guide frame 7 to blow toward the loop heat pipe 5 and the thermal fins 6. At this time, the liquid cooling pipe 10 and the heat-absorbing metal plate 11 in the cooling frame 9 absorb heat and cool the air. The coolant filled in the liquid cooling pipe 10 absorbs heat and cools the hot air. At the same time, the heat dissipation fins 14 in the heat-absorbing frame 13 conduct heat and guide the airflow and heat, so that the fan 8 drives the low-temperature air to dissipate heat and cool the loop heat pipe 5. At the same time, the multiple grooves 17 on both sides of the heat dissipation fins 14 facilitate the flow of air, and the heat dissipation holes 18 facilitate the air blown out by the fan 8 to flow through the thermal fins 6.
[0031] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A loop heat pipe heat dissipation device with parallel evaporators, comprising three evaporators (1), characterized in that: One side of the evaporator (1) is connected to a first conduit (2) for conducting steam, and the other side of the evaporator (1) is connected to a second conduit (3) for conducting liquid, one end of the second conduit (3) is connected to a liquid distributor (4), and the other side of the liquid distributor (4) is connected to a loop heat pipe (5), three of the first conduits (2) are connected in series, and the other end of the first conduit (2) is connected to one end of the loop heat pipe (5), and the loop heat pipe (5) is arranged in a serpentine shape, and a plurality of evenly arranged heat-conducting fins (6) are sheathed on the outside of the loop heat pipe (5), and a heat dissipation component is installed on the top of the heat-conducting fin (6); The heat dissipation assembly includes an air guide frame (7) installed on the surface of a plurality of heat-conducting fins (6), two fans (8) are installed inside the air guide frame (7), a cooling frame (9) is installed on the top of the fans (8), and the air guide frame (7) and the cooling frame (9) are installed by means of a plurality of bolts.
2. The evaporator parallel type loop heat pipe heat dissipation device according to claim 1, characterized in that: A liquid cooling pipe (10) for cooling is installed inside the cooling frame (9), a heat-absorbing metal plate (11) is laid on the bottom of the cooling frame (9), and a plurality of evenly arranged air guide holes (12) are opened on one side of the heat-absorbing metal plate (11).
3. The evaporator parallel type loop heat pipe heat dissipation device according to claim 2, characterized in that: A heat absorbing frame (13) is installed inside the cooling frame (9) and above the liquid cooling tube (10). A plurality of evenly arranged heat dissipating fins (14) are installed inside the heat absorbing frame (13). A plurality of evenly arranged ventilation holes (15) are opened on one side of the heat dissipating fins (14).
4. The evaporator parallel type loop heat pipe heat dissipation device according to claim 3, characterized in that: A dustproof plate (16) is installed on the top of the air guide frame (7) to prevent dust from entering the cooling frame (9). The dustproof plate (16) is fixed to the air guide frame (7) by bolts.
5. The evaporator parallel type loop heat pipe heat dissipation device according to claim 4, characterized in that: Multiple grooves (17) arranged evenly are respectively provided on both sides of the heat-absorbing metal plate (11).
6. The evaporator parallel type loop heat pipe heat dissipation device according to claim 2, characterized in that: Two groups of evenly arranged heat dissipation holes (18) are provided on one side of the heat-conducting fin (6).