Aging test board for tantalum capacitor
By designing a highly versatile aging test board, the aging test problem of tantalum capacitors with different package types is solved, flexible connection and heat dissipation of devices are achieved, device damage is avoided, and the structure is simple and convenient.
Patent Information
- Application Number
- CN202422543369.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-10-22
AI Technical Summary
In the existing technology, the aging board for tantalum capacitors can only adapt to one package type and cannot adapt to tantalum capacitors of different package types, resulting in the inability to perform aging tests. In addition, the existing aging board structure is prone to discharge and poor contact between devices.
An aging test board including a PCB substrate was designed. It was equipped with square compartments and positive and negative connection modules. It adopted gold finger quick plug-in connection, a fuse module to prevent discharge, a hollow design to increase heat dissipation, and pin headers and DuPont wires to avoid poor contact, thus achieving flexible connection and heat dissipation of devices.
The versatility of the aging test board is achieved, the discharge and poor contact problems between devices are avoided, the heat dissipation performance of the devices is improved, and damage caused by poor contact is prevented. The structure is simple and convenient and easy to use.
Smart Images
Figure CN223389843U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an aging test technology and use equipment thereof, in particular to an aging test board for tantalum capacitors. Background Art
[0002] During the manufacturing process of tantalum capacitors, due to human factors or fluctuations in raw materials, process conditions, and equipment conditions, it is impossible for all final products to achieve the expected inherent reliability. In each batch of finished products, there are always some products with some potential defects and weaknesses. These potential defects and weaknesses will manifest as early failures under certain stress conditions. The average life of components with early failures is much shorter than that of normal products.
[0003] In order to ensure the quality of the products, tantalum capacitors will be tested before the components leave the factory or before use, and those devices that barely pass the test will be eliminated. The aging test can shorten the time of early failure of components and fully expose the failure mechanism of most components, so that the components enter the accidental failure period in advance, ensuring the reliability of the components when put into use.
[0004] Aging is a crucial process in the production of tantalum capacitors. The process involves connecting the sample to a burn-in board, which is then connected to a burn-in machine. This connects the sample to the burn-in machine for reliability evaluation. The goal of aging is to restore capacitors with minor defects and eliminate those with major defects early. Tantalum capacitors are self-healing, capable of repairing defects in the oxide film.
[0005] In the existing technology, one packaging type of the sample to be tested corresponds to one aging board, and different aging boards are made according to different packaging types. If the sample to be tested cannot be packaged into the packaging type supported by the existing aging board, a new aging board can only be remade, otherwise the aging test cannot be carried out.
[0006] Therefore, it is necessary to provide an aging test board for tantalum capacitors to solve the above problems. Utility Model Content
[0007] The purpose of the utility model is to provide an aging test board for tantalum capacitors.
[0008] The utility model achieves the above-mentioned purpose through the following technical solutions:
[0009] A tantalum capacitor aging test board includes a PCB substrate. The PCB substrate is provided with a plurality of product placement chambers for placing tantalum capacitors. Positive and negative electrode connection modules are provided corresponding to the product placement chambers for placing tantalum capacitors. The tantalum capacitor to be tested is connected to the positive and negative electrode connection modules and then placed in the product placement chamber to form a tantalum capacitor quick connection structure. The tantalum capacitor is connected to the corresponding aging test. The PCB substrate has a corresponding connection part of an aging box, which is connected and placed in the aging box to form a tantalum capacitor aging test connection structure.
[0010] Furthermore, the product placement room is composed of square compartments.
[0011] Furthermore, the positive and negative electrode connection modules include correspondingly arranged positive electrode connection posts and negative electrode connection posts.
[0012] Furthermore, the positive electrode connecting post and the negative electrode connecting post are respectively connected to the positive electrode and the negative electrode of the tantalum capacitor through wires.
[0013] Furthermore, the corresponding connection part of the aging box is composed of gold fingers, which form a quick plug-in connection structure.
[0014] Furthermore, a fuse module is also provided on the PCB substrate.
[0015] Furthermore, the insurance module is composed of a insurance tube.
[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: the square compartment is not limited by the size of the device and is more versatile; the hollow design effectively increases the heat dissipation of the device, while avoiding the arcing phenomenon caused by discharge caused by contact between devices; the wiring form is more flexible in the form of pin headers and DuPont wires, the material is easy to replace and there will be no line aging problems, and it can also prevent the discharge caused by poor contact from damaging the device; at the same time, the present invention has a simple structure and is easy and convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a structural diagram of the present utility model.
[0018] Figure 2 This is a schematic diagram of a test circuit according to an embodiment of the present invention. DETAILED DESCRIPTION
[0019] Example:
[0020] See Figure 1This embodiment shows an aging test board for tantalum capacitors, including a PCB substrate 1. The PCB substrate 1 is provided with a plurality of product placement chambers 3 for placing tantalum capacitors. Positive and negative electrode connection modules are provided corresponding to the product placement chambers 3 for placing tantalum capacitors. The tantalum capacitor to be tested is connected to the positive and negative electrode connection modules and placed in the product placement chamber 3 to form a tantalum capacitor quick connection structure. The tantalum capacitor connection corresponds to the aging test. The PCB substrate 1 has a corresponding connection portion 2 for the aging box, which is connected and placed in the aging box to form a tantalum capacitor aging test connection structure.
[0021] The product placement chamber 3 is composed of square compartments.
[0022] The positive and negative electrode connection modules include correspondingly arranged positive electrode connection posts 3 and negative electrode connection posts 4 .
[0023] The positive electrode connecting post 3 and the negative electrode connecting post 4 are respectively connected to the positive electrode and the negative electrode of the tantalum capacitor through wires.
[0024] The corresponding connection part 2 of the aging box is composed of gold fingers, which form a quick plug-in connection structure.
[0025] A fuse module 6 is also provided on the PCB substrate 1 .
[0026] The safety module 6 is composed of a safety tube.
[0027] See Figure 2 The aging test of this embodiment is suitable for tantalum capacitors with same-direction lead-out. By setting up an aging gold finger in the plug-in area on one side of the PCB substrate, the aging board and the aging test system are connected. The horizontal arrangement area is the positive and negative terminal base for connecting the test device. It can be made into a single row of pin headers to facilitate the use of DuPont wires to connect the positive and positive poles, and the negative poles to the negative poles. In addition, the use of pin headers and DuPont wires can effectively avoid discharge accidents caused by poor contact and virtual connection to damage the device. At the same time, pin headers and DuPont wires can also be used as replacement materials to prevent accidents caused by material aging and metal degradation. The middle part is the device placement position. A square compartment can be made of high-temperature resistant material to avoid direct contact between devices. The walls of each compartment can be made into a hollow type to increase the heat dissipation performance of the device under high temperature conditions. The device placement position and the terminal position of the square compartment constitute a separate workstation. The layout of the separate workstation can be designed and manufactured according to the specific size of the test board. A check circuit is added to the circuit aging board at the early stage of circuit design. During the test, the check circuit can monitor the specific conditions of the devices on the aging board and reflect them to the high-temperature aging test system for monitoring the experimental data, so as to avoid voltage problems in advance and avoid test accidents.
[0028] By continuously applying a certain amount of electrical stress to components over a long period of time at a certain ambient temperature, the combined effect of electrical and thermal stress can accelerate various physical and chemical reaction processes within the components, prompting various potential defects hidden within the components to be exposed early, thereby achieving the purpose of eliminating prematurely failed products.
[0029] Compared with the prior art, the beneficial effects of the present invention are as follows: the square compartment is not limited by the size of the device and is more versatile; the hollow design effectively increases the heat dissipation of the device, while avoiding the arcing phenomenon caused by discharge caused by contact between devices; the wiring form is more flexible in the form of pin headers and DuPont wires, the material is easy to replace and there will be no line aging problems, and it can also prevent the discharge caused by poor contact from damaging the device; at the same time, the present invention has a simple structure and is easy and convenient to use.
[0030] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.
Claims
1. An aging test board for tantalum capacitors, characterized by: The PCB substrate includes a plurality of product placement chambers for tantalum capacitors, and the product placement chambers for tantalum capacitors are provided with positive and negative connection modules. The tantalum capacitor to be tested is connected to the positive and negative connection modules and then placed in the product placement chamber to form a quick connection structure for the tantalum capacitor part. The tantalum capacitor connection corresponds to the aging test. The PCB substrate has corresponding connection parts of the aging box, which are correspondingly connected and placed in the aging box to form a tantalum capacitor aging test connection structure.
2. The aging test board for tantalum capacitors according to claim 1, characterized in that: The product placement room consists of square compartments.
3. The aging test board for tantalum capacitors according to claim 2, characterized in that: The positive and negative electrode connection modules include correspondingly arranged positive electrode connection posts and negative electrode connection posts.
4. The aging test board for tantalum capacitors according to claim 3, characterized in that: The positive electrode connecting post and the negative electrode connecting post are respectively connected to the positive electrode and the negative electrode of the tantalum capacitor through wires.
5. The aging test board for tantalum capacitors according to claim 4, characterized in that: The corresponding connection part of the aging box is composed of gold fingers, which form a quick plug-in connection structure.
6. The aging test board for tantalum capacitors according to claim 5, characterized in that: A fuse module is also provided on the PCB substrate.
7. The aging test board for tantalum capacitors according to claim 6, characterized in that: The insurance module is composed of insurance tubes.