Automatic film pasting device for IC chip packaging
By detecting the combination of the trigger module, lifting module and timing module, the automatic limit of the carrier is achieved, which solves the problem of carrier deviation in the IC chip film mounting device and improves the processing accuracy.
Patent Information
- Application Number
- CN202422757475.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-13
AI Technical Summary
In the conventional IC chip laminating device, the carrier plate is easily deviated during processing, which affects the processing accuracy.
A combination of detection trigger module, lifting module and timing module is adopted. The position of the carrier is automatically sensed through the infrared ranging sensor and comparator chip. The hydraulic cylinder drives the pallet to lift the carrier and press it against the limit plate. The timing module is combined to control the up and down movement of the carrier to achieve automatic limit of the carrier.
The stability of the carrier board during the film lamination process is improved, the position deviation of the carrier board is reduced, and the accuracy of the film lamination process is guaranteed.
Smart Images
Figure CN223390507U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip film lamination technology, and in particular to an automatic film lamination device for IC chip packaging. Background Art
[0002] IC chips are one of the core components of electronic devices. During production, in addition to being sealed and packaged, a layer of protective film must be adhered to the upper surface of the chip to improve the chip's safety performance.
[0003] In the prior art, a film laminating machine for IC chip laminating mainly includes a frame, a conveyor belt is installed on the frame, a film material feeding mechanism is installed beside the conveyor belt, a driving mechanism is fixedly installed on the frame, a film laminating mechanism is fixedly installed on the driving end of the driving mechanism, and the film laminating mechanism is mounted above the conveyor belt.
[0004] When the chip is being processed by film lamination, the operator needs to place the IC chip with the help of a carrier board. There are several placement slots on the carrier board, and the operator can arrange multiple IC chips one by one in the placement slots; the operator places the carrier board on the conveyor belt, and the conveyor belt transports the carrier board to the bottom of the film lamination mechanism. The driving mechanism drives the film lamination mechanism to move to the film material feeding mechanism. After the electrostatic adsorption head on the film lamination mechanism adsorbs the protective film, the driving mechanism drives the film lamination mechanism to move to the top of the carrier board. The driving mechanism drives the film lamination mechanism to move past the chips in sequence so that the electrostatic adsorption head can attach the protective film to the surface of the IC chip. When all the chips on the carrier board have been filmed, the conveyor belt starts and sends the carrier board out.
[0005] However, when the existing film laminating device is processing, the carrier board on which the chip is placed is not restricted, and the carrier board is easily offset during the film laminating process by the film laminating mechanism, affecting the processing accuracy. Utility Model Content
[0006] In order to improve the stability of the carrier board on which the chip is placed during the film laminating process and ensure the accuracy of the film laminating device, the present application provides an automatic film laminating device for IC chip packaging.
[0007] The present application provides an automatic film laminating device for IC chip packaging, which adopts the following technical solutions:
[0008] An automatic film laminating device for IC chip packaging, comprising a frame and a carrier plate, wherein two parallel conveyor belts are mounted on the frame, and two sides of the carrier plate are slidably mounted on the two conveyor belts. Two side plates are fixedly mounted on the frame, and limit plates are fixedly mounted on opposite sides of the two side plates, and the two limit plates are respectively mounted above the two conveyor belts, and the two sides of the carrier plate are respectively embedded between the limit plates and the conveyor belts; and:
[0009] A detection trigger module is fixedly mounted on the frame and is used to output a trigger signal when the carrier moves to the bottom of the film laminating mechanism;
[0010] A lifting module is fixedly mounted on the frame and located between the two conveyor belts, with a support plate fixedly mounted on the driving end thereof and connected to the signal output end of the detection trigger module for receiving the trigger signal and driving the carrier plate to move up to abut against the two carrier plates;
[0011] The timing module is connected to the signal output end of the detection trigger module, and the signal output end is connected to the signal input end of the lifting module, for receiving the trigger signal and controlling the lifting module to reset after a set time.
[0012] By adopting the above technical solution, during the actual film laminating process, the operator loads the IC chips onto the carrier and places the two sides of the carrier on two conveyor belts. When the conveyor belts transport the carrier with multiple IC chips to the bottom of the film laminating mechanism, the detection trigger module outputs a trigger signal. After receiving the trigger signal, the lifting module drives the pallet up, so that the carrier moves up to the top of the two sides and abuts against the bottom of the two limit plates, so that the film laminating mechanism can laminate the IC chips on the carrier. The timing module starts timing after receiving the trigger signal. When the time after receiving the trigger signal reaches the set time and the film laminating mechanism completes the film laminating process on the chips, the timing module controls the hydraulic drive to move the pallet down and reset. During the downward movement of the pallet, the carrier is placed back on the conveyor belts and sent out through the conveyor belts. By coordinating and using the detection trigger module, the lifting module and the timing module, the technical effects of automatically sensing the carrier and automatically lifting the carrier to limit the carrier can be achieved. The friction force on the carrier can improve the stability of the carrier during the film laminating process, providing a guarantee for the film laminating process.
[0013] Preferably, the tops of both sides of the carrier plate are fixedly mounted with limiting columns, and the two limiting plates are respectively provided with sensing holes, and the two sensing holes are both located directly below the film sticking mechanism;
[0014] The detection trigger module includes:
[0015] An infrared distance measuring sensor is fixedly mounted on the frame and mounted above the sensing hole, and is used to detect the distance to the object directly below and output a sensing distance signal;
[0016] The comparator chip is connected to the signal output terminal of the infrared ranging sensor and is used to output the trigger signal when the sensing distance is less than a set value.
[0017] By adopting the above technical solution, when the limit post moves to the bottom of the sensing hole, the top end face of the limit post is located directly below the infrared ranging sensor, and the sensing distance value measured by the infrared ranging sensor is reduced to less than the set value. After comparison by the comparator chip, a trigger signal can be output to achieve the technical effect of automatic sensing of the carrier plate; after receiving the trigger signal, the lifting module drives the support plate to move up to lift the carrier plate, so that the carrier plate moves up. In the process of the carrier plate moving up and pressing against the limit plate, the limit post passes through the sensing hole and extends to the top of the limit plate, which can make the two sides of the carrier plate press against the limit plate. At the same time, the position of the carrier plate is further restricted by the limit post, further reducing the occurrence of position offset of the carrier plate during the film lamination process.
[0018] Preferably, the lifting module includes a hydraulic cylinder, a cylinder body of the hydraulic cylinder is fixedly mounted on the frame, and a drive shaft of the hydraulic cylinder is fixedly connected to the support plate.
[0019] By adopting the above technical solution, the hydraulic cylinder extends or retracts the drive shaft to drive the carrier plate to move up and down.
[0020] Preferably, the timing module includes:
[0021] A timer, connected to the signal output terminal of the comparator chip, for receiving the trigger signal and timing;
[0022] A single chip microcomputer is connected to the signal output terminal of the timer and is used to output a reset control signal when the trigger signal is sent for a set time.
[0023] The signal input end of the hydraulic cylinder is signal-connected to the signal output end of the single-chip microcomputer. The hydraulic cylinder receives the reset control signal and drives the support plate to reset.
[0024] By adopting the above technical solution, the timer and the single chip microcomputer are used in combination to control the time for the hydraulic cylinder to lift the carrier plate, so that the hydraulic cylinder automatically drives the carrier plate to move downward after the film laminating mechanism completes the film laminating process.
[0025] Preferably, a support is fixedly mounted on the frame, a mounting plate is fixedly mounted on a side of the support close to the conveyor belt, and the infrared ranging sensor is fixedly mounted on the mounting plate.
[0026] By adopting the above technical solution, the infrared ranging sensor can be fixedly installed above the sensing hole through the mounting plate on the support.
[0027] Preferably, the end corners of the limiting pillars are all rounded.
[0028] By adopting the above technical solution, the rounded corners at the end of the limiting column can reduce the occurrence of collisions between the limiting column and the hole wall of the sensing hole during the rising process.
[0029] In summary, the automatic film laminating device for IC chip packaging of the present application has at least one of the following beneficial technical effects:
[0030] 1. By coordinating and using the detection trigger module, lifting module, and timing module, the carrier can be automatically sensed and lifted to limit its position. The friction force on the carrier improves its stability during the laminating process, providing a guarantee for the laminating process.
[0031] 2. With the setting of the limit posts, when the carrier plate moves up and abuts against the limit plate, the limit posts pass through the sensing holes and extend above the limit plate. This allows both sides of the carrier plate to abut against the limit plate while further restricting the position of the carrier plate through the limit posts, further reducing the possibility of the carrier plate shifting during the film lamination process.
[0032] 3. Due to the rounded corners at the end of the limit column, the collision between the limit column and the wall of the sensing hole during the rising process can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 This is a schematic diagram of an embodiment of the present application used to show the installation positions of the detection module and the lifting module.
[0034] Figure 2 yes Figure 1 Enlarged schematic diagram of point A in the middle.
[0035] Figure 3 This is a schematic diagram of an embodiment of the present application used to illustrate the internal signal transmission of the film-sticking device.
[0036] Explanation of the accompanying reference numerals: 1. Frame; 11. Support; 12. Mounting plate; 2. Carrying plate; 21. Limiting column; 3. Conveyor belt; 4. Side plate; 5. Limiting plate; 51. Sensing hole; 6. Detection trigger module; 61. Infrared ranging sensor; 7. Lifting module; 71. Support plate; 72. Hydraulic cylinder; 8. Film-applying mechanism. DETAILED DESCRIPTION
[0037] The following is combined with Figure 1-3 This application is described in further detail.
[0038] Example
[0039] The embodiment of the present application discloses an automatic film laminating device for IC chip packaging. Figure 1 、 Figure 2 as well as Figure 3, including a frame 1 and a carrier plate 2, two parallel conveyor belts 3 are installed on the frame 1, and both sides of the carrier plate 2 are slidingly set on the two conveyor belts 3, and two side plates 4 are fixedly installed on the frame 1, and limit plates 5 are fixedly installed on the opposite sides of the two side plates 4, and the two limit plates 5 are respectively mounted above the two conveyor belts 3, and the two sides of the carrier plate 2 are respectively embedded between the limit plates 5 and the conveyor belts 3; and: a detection trigger module 6, fixedly mounted on the frame 1, for outputting a trigger signal when the carrier plate 2 moves to the bottom of the film-sticking mechanism 8; a lifting module 7, fixedly mounted on the frame 1, located between the two conveyor belts 3, and a supporting plate 71 is fixedly mounted on the driving end, which is connected to the signal output end of the detection trigger module 6 for receiving the trigger signal and driving the carrier plate 2 to move up until it is against the two carrier plates 2; a timing module, connected to the signal output end of the detection trigger module 6, and the signal output end is connected to the signal input end of the lifting module 7 for receiving the trigger signal and controlling the lifting module 7 to reset after a set time.
[0040] During the actual film laminating process, the operator loads the IC chip onto the carrier 2 and places both sides of the carrier 2 on two conveyor belts 3; when the conveyor belt 3 transports the carrier 2 with multiple IC chips to the bottom of the film laminating mechanism 8, the detection trigger module 6 outputs a trigger signal, and the lifting module 7 drives the support plate 71 to move up after receiving the trigger signal, so as to drive the carrier 2 to move up to the top of both sides and to abut against the bottom of the two limit plates 5, so that the film laminating mechanism 8 can perform film laminating on the IC chip on the carrier 2; the timing module starts timing after receiving the trigger signal, and when the time after receiving the trigger signal reaches the set time and the film laminating mechanism 8 completes the film laminating process on the chip, the timing module controls the hydraulic drive support plate 71 to move down and reset. During the downward movement of the support plate 71, the carrier 2 is placed again on the conveyor belt 3 and sent out through the conveyor belt 3.
[0041] By detecting and using the trigger module 6, the lifting module 7 and the timing module, the technical effect of automatically sensing the carrier plate 2 and automatically lifting the carrier plate 2 to limit the carrier plate 2 can be achieved. The carrier plate 2 is affected by friction, which can improve the stability of the carrier plate 2 during the film laminating process by the film laminating mechanism 8, thereby providing a guarantee for the film laminating process.
[0042] Reference Figure 1 、 Figure 2 as well as Figure 3, limit columns 21 are fixedly installed on the top of both sides of the carrier plate 2, and sensing holes 51 are respectively opened on the two limit plates 5, and the two sensing holes 51 are located directly below the film-sticking mechanism 8; the detection trigger module 6 includes: an infrared ranging sensor 61, fixedly installed on the frame 1, mounted above the sensing hole 51, for detecting the distance between the object directly below and outputting a sensing distance signal; a comparator chip, connected to the signal output end of the infrared ranging sensor 61, for outputting a trigger signal when the sensing distance is less than a set value.
[0043] When the limit column 21 moves to the bottom of the sensing hole 51, the top end surface of the limit column 21 is located directly below the infrared ranging sensor 61, and the sensing distance value measured by the infrared ranging sensor 61 is reduced to less than the set value. After comparison by the comparator chip, a trigger signal can be output to achieve the technical effect of automatically sensing the carrier plate 2; after receiving the trigger signal, the lifting module 7 drives the support plate 71 to move up to lift the carrier plate 2, so that the carrier plate 2 moves up. In the process of the carrier plate 2 moving up to be tightly pressed against the limit plate 5, the limit column 21 passes through the sensing hole 51 and extends to the top of the limit plate 5, so that the two sides of the carrier plate 2 can be pressed against the limit plate 5, and the position of the carrier plate 2 can be further restricted by the limit column 21, thereby further reducing the occurrence of position offset of the carrier plate 2 during the film laminating process.
[0044] In the embodiment of the present application, the lifting module 7 includes a hydraulic cylinder 72, the cylinder body of the hydraulic cylinder 72 is fixedly mounted on the frame 1, and the drive shaft of the hydraulic cylinder 72 is fixedly connected to the support plate 71. The hydraulic cylinder 72 extends or retracts the drive shaft to drive the carrier plate 2 to move up and down.
[0045] Reference Figure 3 The timing module includes: a timer, which is connected to the signal output end of the comparator chip, and is used to receive the trigger signal and time; a single-chip microcomputer, which is connected to the signal output end of the timer, and is used to output a reset control signal when the trigger signal is sent for a set time; the signal input end of the hydraulic cylinder 72 is connected to the signal output end of the single-chip microcomputer, and the hydraulic cylinder 72 receives the reset control signal and drives the support plate 71 to reset.
[0046] By using the timer and the single chip microcomputer in combination, the time for the hydraulic cylinder 72 to lift the carrier plate 2 can be controlled, so that the hydraulic cylinder 72 automatically drives the carrier plate 2 to move downward after the film laminating mechanism 8 completes the film laminating process.
[0047] Reference Figure 1 and Figure 2 A support 11 is fixedly mounted on the frame 1, a mounting plate 12 is fixedly mounted on the side of the support 11 close to the conveyor belt 3, and the infrared distance sensor 61 is fixedly mounted on the mounting plate 12. The infrared distance sensor 61 can be fixedly mounted above the sensing hole 51 through the mounting plate 12 on the support 11.
[0048] Reference Figure 2 The end corners of the limiting column 21 are all rounded. Due to the rounded corners of the end corners of the limiting column 21, the collision between the limiting column 21 and the hole wall of the sensing hole 51 during the rising process can be reduced.
[0049] The implementation principle of an automatic film laminating device for IC chip packaging in an embodiment of the present application is as follows: when the limit post 21 moves to the bottom of the sensing hole 51, the top end face of the limit post 21 is located directly below the infrared ranging sensor 61, and the sensing distance value measured by the infrared ranging sensor 61 is reduced to less than the set value. After comparison by the comparator chip, a trigger signal can be output to achieve the technical effect of automatically sensing the carrier plate 2; after receiving the trigger signal, the lifting module 7 drives the support plate 71 to move up to lift the carrier plate 2, so that the carrier plate 2 moves up. In the process of the carrier plate 2 moving up to be tightly pressed against the limit plate 5, the limit post 21 passes through the sensing hole 51 and extends to the top of the limit plate 5, so that the two sides of the carrier plate 2 can be pressed against the limit plate 5, and the position of the carrier plate 2 can be further restricted by the limit post 21, thereby further reducing the occurrence of position offset of the carrier plate 2 during the film laminating process.
[0050] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.
Claims
1. An automatic film laminating device for IC chip packaging, characterized in that: The invention comprises a frame (1) and a carrier plate (2), wherein two parallel conveyor belts (3) are installed on the frame (1), and both sides of the carrier plate (2) are slidably arranged on the two conveyor belts (3), and two side plates (4) are fixedly installed on the frame (1), and limiting plates (5) are fixedly installed on opposite sides of the two side plates (4), and the two limiting plates (5) are respectively mounted above the two conveyor belts (3), and both sides of the carrier plate (2) are respectively embedded between the limiting plates (5) and the conveyor belts (3); as well as: A detection trigger module (6) is fixedly mounted on the frame (1) and is used to output a trigger signal when the carrier plate (2) moves to the bottom of the film laminating mechanism (8); A lifting module (7) is fixedly mounted on the frame (1) and is located between the two conveyor belts (3). A support plate (71) is fixedly mounted on the driving end and is connected to the signal output end of the detection trigger module (6) for receiving the trigger signal and driving the carrier plate (2) to move upward until it contacts the two carrier plates (2). A timing module is connected to the signal output end of the detection trigger module (6), and the signal output end is connected to the signal input end of the lifting module (7), and is used to receive the trigger signal and control the lifting module (7) to reset after a set time.
2. The automatic film laminating device for IC chip packaging according to claim 1, characterized in that: Limiting columns (21) are fixedly mounted on the tops of both sides of the carrier plate (2), and sensing holes (51) are respectively opened on the two limiting plates (5), and the two sensing holes (51) are both located directly below the film sticking mechanism (8); The detection trigger module (6) comprises: An infrared distance measuring sensor (61) is fixedly mounted on the frame (1) and is installed above the sensing hole (51), and is used to detect the distance to an object directly below and output a sensing distance signal; A comparator chip is connected to the signal output terminal of the infrared distance measuring sensor (61) and is used to output the trigger signal when the sensing distance is less than a set value.
3. The automatic film laminating device for IC chip packaging according to claim 2, characterized in that: The lifting module (7) comprises a hydraulic cylinder (72), a cylinder body of the hydraulic cylinder (72) is fixedly mounted on the frame (1), and a drive shaft of the hydraulic cylinder (72) is fixedly connected to the support plate (71).
4. The automatic film laminating device for IC chip packaging according to claim 3, characterized in that: The timing module includes: A timer, connected to the signal output terminal of the comparator chip, for receiving the trigger signal and timing; A single chip microcomputer is connected to the signal output terminal of the timer and is used to output a reset control signal when the trigger signal is sent for a set time. The signal input end of the hydraulic cylinder (72) is signal-connected to the signal output end of the single-chip microcomputer, and the hydraulic cylinder (72) receives the reset control signal and drives the support plate (71) to reset.
5. The automatic film laminating device for IC chip packaging according to claim 2, characterized in that: A support (11) is fixedly mounted on the frame (1), a mounting plate (12) is fixedly mounted on a side of the support (11) close to the conveyor belt (3), and the infrared distance sensor (61) is fixedly mounted on the mounting plate (12).
6. The automatic film laminating device for IC chip packaging according to claim 2, characterized in that: The end corners of the limiting column (21) are all rounded.