Novel composite silicon carbide heat conduction substrate
The special design of the composite silicon carbide thermal conductive substrate and the coolant circulation system solve the problem of slow heat volatilization of the thermal conductive substrate, achieving rapid heat transfer and improved thermal conductivity efficiency.
Patent Information
- Application Number
- CN202422669672.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-04
AI Technical Summary
The existing thermal conductive substrate has a slow heat dissipation rate and low thermal conductivity efficiency.
The composite silicon carbide thermal conductive substrate is used. Through the stirring component and the coolant circulation system, the phase change and flow of the coolant are used to accelerate heat transfer. Combined with the special shape design of the thermal conductive substrate, the contact area is increased to improve the heat transfer efficiency.
The rapid volatilization of heat and the improvement of thermal conductivity efficiency are achieved. Through the circulation of coolant and the shape design of the thermal conductive substrate, the speed of heat transfer from the first thermal conductive substrate to the outside is improved.
Smart Images
Figure CN223391483U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat conduction, in particular to a novel composite silicon carbide heat-conducting substrate. Background Art
[0002] Composite silicon carbide is a high-performance material made by combining silicon carbide particles with other materials (such as fibers, metals, etc.) through a specific process. It has high hardness, high wear resistance, high thermal conductivity, excellent mechanical properties and thermal stability.
[0003] The core function of a thermally conductive substrate is to transfer heat from a high-temperature area to a low-temperature area through thermal conduction. In solid materials, heat conduction is primarily achieved by lattice waves (lattice vibrations) and the movement of free electrons. For metal thermally conductive substrates (such as aluminum substrates), the migration of free electrons plays a dominant role in heat conduction, as the metal contains a large number of free electrons, which can quickly transfer thermal energy. For ceramic thermally conductive substrates, heat is primarily conducted through the ceramic material's internal structures, such as particles, grain boundaries, and pores.
[0004] Most of the current thermal conductive substrates transfer heat by contacting themselves with the outside world. This method has slow heat volatilization and low thermal conductivity efficiency. To this end, we propose a new composite silicon carbide thermal conductive substrate that can increase the heat volatilization speed and improve thermal conductivity efficiency. Summary of the Invention
[0005] The purpose of the utility model is to provide a novel composite silicon carbide heat-conducting substrate, which has the advantages of being able to increase the volatilization speed of heat and improve the heat conduction efficiency.
[0006] The above technical objectives of the present invention are achieved through the following technical solutions:
[0007] The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and a heat dissipation device is used to dissipate heat from the bottom of the heat dissipation box. The heat dissipation device is a heat dissipation device, and a heat dissipation device is used to dissipate heat from the bottom of the heat dissipation box.
[0008] By adopting the above technical solution, when heat dissipation is required, the electric pump drives the coolant in the heat dissipation box through the second connecting pipe, the electric pump and the first connecting pipe to enter the heat conduction box. After the coolant in the heat conduction box contacts the first heat conduction substrate, the temperature rises, and the coolant changes from liquid to gas. The stirring component installed in the heat conduction box accelerates the flow of the coolant in the heat conduction box. Then the coolant enters the heat dissipation box through the third connecting pipe. The coolant entering the heat dissipation box transfers the temperature to the second heat conduction substrate, and the heat is dissipated to the outside world through the second heat conduction substrate. In this way, heat is quickly transferred from the first heat conduction substrate to the second heat conduction substrate, and the second heat conduction substrate is quickly transferred to the outside world, thereby increasing the volatilization rate of heat on the first heat conduction substrate and thus improving the heat conduction efficiency.
[0009] It is further configured that the first heat-conducting substrate has a shape of evenly distributed corrugated shapes.
[0010] By adopting the above technical solution, since the shape of the first heat-conducting substrate is a uniformly distributed corrugated shape, the contact area between the first heat-conducting substrate and the coolant can be increased, and heat can be better transferred to the coolant, thereby improving the conversion efficiency.
[0011] It is further configured that the second heat-conducting substrate is in the shape of a uniformly distributed grid.
[0012] By adopting the above technical solution, since the second heat-conducting substrate is in a grid shape, the contact area between the second heat-conducting substrate and the air can be increased, and the heat on the second heat-conducting substrate can be better transferred to the air, thereby improving the heat conduction efficiency.
[0013] Further configuration: protrusions are symmetrically provided on both sides of the first heat-conducting substrate, grooves adapted to the protrusions are provided on the heat-conducting box body, and flat head bolts for fastening the first heat-conducting substrate and the heat-conducting box body are provided on the protrusions.
[0014] By adopting the above technical solution, the first heat-conducting substrate and the heat-conducting box body are firmly connected by the flat-head bolts, so that the first heat-conducting substrate and the heat-conducting box body can be tightly connected.
[0015] Further configuration: a support plate is fixedly connected to the heat dissipation box body, and the electric pump is fixedly installed on the support plate.
[0016] By adopting the above technical solution, the electric pump is installed on the support plate, and the support plate can support the electric pump so that it can work stably.
[0017] It is further provided that a bearing is installed on the first fixing frame, the movable rod is clamped and connected to the bearing, and a bolt for fixing the first fixing frame is provided on the first fixing frame.
[0018] By adopting the above technical solution, since the first movable frame is provided with a bearing, the movable rod can be rotated more flexibly on the first fixed frame.
[0019] It is further provided that a first handle and a second handle with the same structure are symmetrically provided on both sides of the heat dissipation box body. The first handle includes a fixing plate fixedly mounted on the heat dissipation box body, and a pull ring is rotatably connected to the fixing plate.
[0020] By adopting the above technical solution, a first handle and a second handle are provided on both sides of the heat dissipation box body, which makes it convenient for staff to move the entire device.
[0021] In summary, the present invention has the following beneficial effects: when heat dissipation is required, the electric pump drives the liquid coolant in the heat dissipation box to enter the heat conduction box through the second connecting pipe, the electric pump and the first connecting pipe, the first heat conduction substrate is provided with a corrugated shape to increase the contact area with the coolant, the coolant entering the heat conduction box is heated after contacting the first heat conduction substrate, and the coolant changes from liquid to gas, and then the coolant enters the heat dissipation box through the third connecting pipe, and the coolant entering the heat dissipation box transfers the temperature to the second heat conduction substrate, the second heat conduction substrate is equipped with evenly distributed heat sinks, and the second heat conduction substrate transfers heat to the outside world through the heat sinks, the heat conduction box and the heat dissipation box are respectively equipped with servo motors, and the servo motors drive the fan blades to rotate, thereby increasing the speed of the coolant movement. Through the above method, under the action of the coolant, heat is quickly transferred from the first heat conduction substrate to the second heat conduction substrate, and the second heat conduction substrate is quickly transferred to the outside world, thereby increasing the volatilization speed of the heat on the first heat conduction substrate, and then improving the heat conduction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The present invention will be further described below with reference to the accompanying drawings.
[0023] Figure 1 It is a structural diagram of a new type of composite silicon carbide thermal conductive substrate;
[0024] Figure 2 This is a schematic diagram of the front elevation structure of a new type of composite silicon carbide thermal conductive substrate;
[0025] Figure 3 This is a schematic diagram of the internal structure of a new composite silicon carbide thermal conductive substrate;
[0026] Figure 4 This is a schematic diagram of the side elevation structure of a new type of composite silicon carbide thermal conductive substrate;
[0027] Figure 5 This is a schematic diagram of the internal structure of a new type of composite silicon carbide thermal conductive substrate;
[0028] Figure 6It is an enlarged schematic diagram of the stirring component structure.
[0029] In the figure: 1. first heat-conducting substrate; 2. heat-conducting housing; 21. groove; 101. bump; 102. flat-head bolt; 3. first connecting pipe; 4. second connecting pipe; 5. third connecting pipe; 6. electric pump; 61. liquid inlet; 62. liquid outlet; 63. support plate; 7. coolant; 8. heat-dissipating housing; 9. first fixing frame; 91. movable rod; 92. fan blade; 93. servo motor; 94. bearing; 95. bolt; 10. second heat-conducting substrate; 11. first handle; 111. pull ring; 112. fixing plate; 12. second handle. DETAILED DESCRIPTION
[0030] The specific implementation of the present utility model will be further described below with reference to the accompanying drawings.
[0031] The technical solution adopted in this utility model is:
[0032] A novel composite silicon carbide heat-conducting substrate comprises a heat-conducting box 2, a heat-dissipating box 8 and a coolant 7. Figure 1 As shown, Figure 3 The heat-conducting box body 2 shown is fixedly mounted with a first heat-conducting substrate 1, which has a uniformly distributed corrugated shape. Bumps 101 are symmetrically provided on the left and right sides of the first heat-conducting substrate 1. The heat-conducting box body 2 is provided with grooves 21 adapted to the bumps 101, and the bumps 101 are provided with flat head bolts 102 for fastening the first heat-conducting substrate 1 and the heat-conducting box body 2.
[0033] like Figure 3 As shown, Figure 5 As shown and Figure 6 As shown, stirring assemblies are fixedly installed at the bottom of the heat conducting box 2 and the heat dissipating box 8 respectively. The stirring assembly includes a first fixed frame 9 fixedly installed inside the heat conducting box 2. A movable rod 91 is rotatably connected to the first fixed frame 9. The movable rod 91 is provided with a plurality of fan blades 92 fixedly connected thereto. One end of the movable rod 91 is provided with a servo motor 93 installed in the heat conducting box 2. The output shaft of the servo motor 93 is fixedly connected to the movable rod 91.
[0034] like Figure 2The left side of the heat dissipation box 8 is provided with an electric pump 6, which is provided with a liquid inlet 61 and a liquid outlet 62. The left side of the heat dissipation box 8 is fixedly connected to a support plate 63, and the electric pump 6 is fixedly installed on the support plate 63. The left side of the heat conduction box 2 is fixedly connected to a first connecting pipe 3, and the lower end of the first connecting pipe 3 is fixedly connected to the liquid outlet 62 of the electric pump 6. The liquid inlet 61 of the electric pump 6 is fixedly connected to the left side of the second connecting pipe 4, and the right side of the second connecting pipe 4 is fixedly connected to the left side of the heat dissipation box 8. The bottom of the heat dissipation box 8 is fixedly installed with a second heat conduction substrate 10, and the shape of the second heat conduction substrate 10 is a uniformly distributed grid shape. The right side of the heat dissipation box 8 is fixedly connected to a third connecting pipe 5, and the upper end of the third connecting pipe 5 is fixedly connected to the heat conduction box 2, which is used for the gaseous coolant 7 to enter the heat dissipation box 8 from the heat conduction box 2. As shown Figure 4 As shown, a first handle 11 and a second handle 12 with the same structure are symmetrically provided on the left and right sides of the heat dissipation box 8. The first handle 11 includes a fixing plate 112 fixedly mounted on the heat dissipation box 8, and a pull ring 111 is rotatably connected to the fixing plate 112 to facilitate the staff to move the entire device.
[0035] Working principle:
[0036] When the object needs to dissipate heat, the staff will place the first heat-conducting substrate 1 close to the object that needs to be dissipated heat, and the heat on the object will be transferred to the first heat-conducting substrate 1. The temperature of the first heat-conducting substrate 1 will rise, and the heat on the first heat-conducting substrate 1 will be transferred to the coolant 7. The temperature of the coolant 7 will rise, and the coolant 7 will change from liquid to gas. The staff will turn on the electric pump 6 and the servo motor 95. Since the second connecting pipe 4 is fixedly connected to the liquid inlet 61 of the electric pump 6, one end of the first connecting pipe 3 is fixedly connected to the liquid inlet 61 of the electric pump 6, and the other end of the first connecting pipe 3 is fixedly connected to the heat-conducting box 2, the liquid coolant in the heat-conducting box 8 will be cooled by the electric pump 6. The liquid 7 passes through the first connecting pipe 3, the second connecting pipe 4 and the electric pump 6 into the heat conducting box 2, and the servo motor 93 in the heat conducting box 2 rotates. The rotation of the servo motor 93 drives its output shaft to rotate, and the output shaft of the servo motor 93 rotates to drive the movable rod 91 fixedly connected to it to rotate. The rotation of the movable rod 91 drives the fan blade 92 fixedly connected to it to rotate, and the rotation of the fan blade 92 pushes the coolant 7 to continue to move forward. At this time, the gaseous coolant 7 in the heat conducting box 2 is squeezed and flows to the third connecting pipe 5. Since the two ends of the third connecting pipe 5 are respectively connected to the heat conducting box 2 and the heat dissipation box 8, the gaseous coolant 7 passes through the third connecting pipe 5 and enters the heat dissipation box 8.
[0037] After the gaseous coolant 7 enters the heat dissipation box 8, as in the heat conduction box 2, the servo motor 93 rotates to drive the movable rod 91 to rotate, and the rotation of the movable rod 91 drives the fan blades 92 to rotate. Under the push of the fan blades 92, the coolant 7 continues to move in the heat dissipation box 8, and the gaseous coolant 7 contacts the second heat conduction substrate 10. The heat of the gaseous coolant 7 is transferred to the second heat conduction substrate 10. Subsequently, the temperature of the second heat conduction substrate 10 rises, and the temperature of the coolant 7 drops. The coolant 7 changes from gas to liquid, and the second heat conduction substrate 10 transfers the heat to the outside world. The temperature of the second heat conduction substrate 10 drops, and as in the heat conduction box 2, it then re-enters the heat conduction box 2 under the drive of the electric pump 6. In this way, under the transfer of the coolant 7, heat is quickly transferred from the first heat conduction substrate 1 to the second heat conduction substrate 10, and the second heat conduction substrate 10 transfers it to the outside world, thereby increasing the volatilization rate of the heat on the first heat conduction substrate 1, thereby improving the heat conduction efficiency.
[0038] The above are only preferred embodiments of the present invention and do not constitute any form of limitation to the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention fall within the scope of the technical solution of the utility model.
Claims
1. A novel composite silicon carbide heat-conducting substrate, comprising a heat-conducting box (2), a heat-dissipating box (8) and a coolant (7), characterized in that: A first heat-conducting substrate (1) is fixedly mounted on the heat-conducting box (2), and stirring assemblies with identical structures are fixedly mounted inside the heat-conducting box (2) and the heat-dissipating box (8), respectively. The stirring assembly comprises a first fixed frame (9) fixedly mounted inside the heat-conducting box (2), a movable rod (91) rotatably connected to the first fixed frame (9), a plurality of fan blades (92) fixedly connected to the movable rod (91), a servo motor (93) mounted inside the heat-conducting box (2) is provided at one end of the movable rod (91), an output shaft of the servo motor (93) is fixedly connected to the movable rod (91), and an electric pump (6) is provided on one side of the heat-dissipating box (8). The electric pump (6) is provided with a liquid inlet (61) and a liquid outlet (62); one end of the heat-conducting box (2) is fixedly connected to a first connecting pipe (3); one end of the first connecting pipe (3) is fixedly connected to the liquid outlet (62) of the electric pump (6); the liquid inlet (61) of the electric pump (6) is fixedly connected to a second connecting pipe (4); one end of the second connecting pipe (4) is fixedly connected to the heat-dissipating box (8); a second heat-conducting substrate (10) is fixedly installed on the bottom of the heat-dissipating box (8) for heat dissipation of the heat-dissipating box (8); a third connecting pipe (5) is fixedly connected to one side of the heat-dissipating box (8); one end of the third connecting pipe (5) is fixedly connected to the heat-conducting box (2).
2. The novel composite silicon carbide thermally conductive substrate according to claim 1, characterized in that: The first heat-conducting substrate (1) is in a uniformly distributed corrugated shape.
3. The novel composite silicon carbide thermally conductive substrate according to claim 1, characterized in that: The second heat-conducting substrate (10) is in the shape of a uniformly distributed grid.
4. The novel composite silicon carbide thermally conductive substrate according to claim 1, characterized in that: Bumps (101) are symmetrically provided on both sides of the first heat-conducting substrate (1), a groove (21) adapted to the bumps (101) is provided on the heat-conducting box body (2), and a flat-head bolt (102) for fastening the first heat-conducting substrate (1) and the heat-conducting box body (2) is provided on the bumps (101).
5. The novel composite silicon carbide thermally conductive substrate according to claim 1, characterized in that: A support plate (63) is fixedly connected to the heat dissipation box (8), and the electric pump (6) is fixedly mounted on the support plate (63).
6. The novel composite silicon carbide thermally conductive substrate according to claim 1, characterized in that: A bearing (96) is installed on the first fixing frame (9), the movable rod (91) is tightly connected to the bearing (96), and a bolt (97) for fixing the first fixing frame (9) is provided on the first fixing frame (9).
7. The novel composite silicon carbide thermally conductive substrate according to claim 1, characterized in that: A first handle (11) and a second handle (12) having the same structure are symmetrically arranged on both sides of the heat dissipation box (8). The first handle (11) includes a fixing plate (112) fixedly mounted on the heat dissipation box (8), and a pull ring (111) is rotatably connected to the fixing plate (112).