Silicon wafer texturing groove body device and battery manufacturing equipment

Abstract

The utility model relates to the technical field of battery manufacturing, in particular to a silicon wafer texturing groove body device and battery manufacturing equipment, the silicon wafer texturing groove body device comprises a first groove body, a second groove body, a circulating pipeline and a circulating pump, the first groove body is used for containing chemical liquid, and a liquid inlet hole of the second groove body is connected with a liquid supply device to receive supplemented chemical liquid; the second tank body is communicated with the first tank body so as to receive the chemical liquid in the first tank body. Besides, the circulating pipeline is used for communicating the first tank body with the second tank body, the circulating pump is arranged on the circulating pipeline, and the circulating pump is used for driving the chemical liquid in the circulating pipeline to circularly flow, so that the chemical liquid circularly flows between the first tank body and the second tank body. According to the silicon wafer texturing groove body device and the battery manufacturing equipment provided by the invention, the supplemented chemical liquid can be received by additionally arranging the second groove body, and the chemical liquid circularly flows between the first groove body and the second groove body by utilizing the circulating pipeline and the circulating pump, so that the uniformity of the chemical liquid in the first groove body is improved.

Description

Technical Field

[0001] The present application relates to the field of battery manufacturing technology, and in particular to a silicon wafer texturing trough device and battery manufacturing equipment. Background Art

[0002] In the field of solar cell manufacturing, creating a light-trapping texture on the surface of silicon wafers is a key step in the solar cell manufacturing process. Chemical solutions are used to etch the silicon wafer surface to create this light-trapping texture, thereby improving the solar cell's light absorption rate. Most related technologies directly add the chemical solution to a tank, using a circulation pipeline and a circulation pump to control the flow rate and direction of the chemical solution within the tank. However, this approach still results in uneven distribution of the chemical solution within the tank, resulting in poor quality of the texture on the silicon wafer surface, affecting the performance and appearance of the silicon wafer. Utility Model Content

[0003] The present application discloses a silicon wafer texturing tank device and battery manufacturing equipment, which can improve the uniformity of chemical liquid in the first tank and avoid texturing quality problems caused by uneven distribution of chemical liquid.

[0004] In order to achieve the above objectives, in a first aspect, the present application discloses a silicon wafer texturing tank device, comprising:

[0005] a first tank body, the first tank body being configured to contain a chemical liquid;

[0006] a second tank body, the second tank body being provided with a liquid inlet hole, the liquid inlet hole being configured to be connected to a liquid supply device to receive a replenished chemical liquid, and the second tank body being in communication with the first tank body to receive the chemical liquid in the first tank body;

[0007] a circulation pipeline connected to the first tank body and the second tank body;

[0008] A circulation pump is provided in the circulation pipeline, and is used to drive the chemical liquid in the circulation pipeline to circulate, so that the chemical liquid circulates between the first tank body and the second tank body.

[0009] In some possible implementations, the circulation pipeline includes a main pipeline and a liquid outlet pipe, the liquid outlet pipe is provided in the first tank body, the main pipeline is connected to the second tank body, and the main pipeline at least partially extends into the first tank body and is connected to the middle portion of the liquid outlet pipe, so that the chemical liquid in the second tank body flows into the first tank body through the main pipeline and the liquid outlet pipe;

[0010] The circulation pump is arranged on the main line.

[0011] In some possible implementations, the liquid outlet pipe is provided with a plurality of liquid outlet holes, and the plurality of liquid outlet holes are spaced apart along the length direction of the liquid outlet pipe.

[0012] In some possible implementations, the liquid outlet pipe is disposed on a side wall surface of the first trough body, and the liquid outlet pipe is located in a middle position of the first trough body in a height direction.

[0013] In some possible implementations, there are multiple liquid outlet pipes, and the multiple liquid outlet pipes are respectively arranged on different side walls of the first tank body;

[0014] The main pipeline includes a main pipeline and multiple branch pipes. The main pipeline is connected to the second tank body, and the main pipeline is connected to the multiple branch pipes. The multiple branch pipes are respectively connected to the multiple liquid outlet pipes in a one-to-one correspondence.

[0015] In some possible implementations, the first trough body is provided with a first through hole and a first circulation hole, the first through hole being located at the bottom of the first trough body, the first through hole being used to connect the first trough body with the second trough body, and the first circulation hole being located above the first through hole along the height direction of the first trough body, the first circulation hole being configured to connect to the circulation pipeline;

[0016] The second trough body is provided with a second through hole and a second circulation hole, the second through hole is located at the upper part of the second trough body, and the second through hole is communicated with the first through hole, so that the first trough body and the second trough body are communicated;

[0017] The second circulation hole is located at the bottom of the second tank body, and the second circulation hole is configured to be connected to the circulation pipeline.

[0018] In some possible embodiments, along the height direction of the first trough body, the second trough body is located below the first trough body, and the first through hole is located on the bottom surface of the first trough body, the second through hole is located on the top surface of the first trough body, and the second through hole is connected to the first through hole.

[0019] In some possible implementations, the second through hole is provided with a first filter element, the first filter element is configured to filter the chemical liquid flowing out of the first tank body, and / or,

[0020] A second filter element is provided at the second circulation hole, and the second filter element is configured to filter the chemical liquid flowing out of the second tank body.

[0021] In some possible implementations, the volume of the second trough body is smaller than the volume of the first trough body.

[0022] In a second aspect, the present application further discloses a battery manufacturing device, which includes the silicon wafer texturing trough device as described in the first aspect above.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] The present application provides a texturing tank device, which includes a first tank, a second tank, a circulation pipeline and a circulation pump. The first tank is used to hold a chemical liquid. The liquid inlet of the second tank is connected to the liquid supply device to receive the supplementary chemical liquid. The second tank is connected to the first tank to receive the chemical liquid in the first tank. In addition, the circulation pipeline is used to connect the first tank and the second tank. The circulation pump is provided in the circulation pipeline. The circulation pump is used to drive the chemical liquid in the circulation pipeline to circulate so that the chemical liquid circulates between the first tank and the second tank. It can be seen that the silicon wafer texturing tank device of the present application receives the supplementary chemical liquid by adding a second tank, and uses the circulation pipeline and the circulation pump to circulate the chemical liquid between the first tank and the second tank, thereby improving the uniformity of the chemical liquid in the first tank and avoiding the quality problem of the velvet surface caused by uneven distribution of the chemical liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is a structural diagram of a silicon wafer texturing tank device in the related art;

[0027] Figure 2 A schematic structural diagram of a silicon wafer texturing tank device provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of the structure of the battery manufacturing equipment provided in an embodiment of the present application.

[0029] Description of reference numerals:

[0030] a-tank body; b-circulation pipe; c-circulation pump; d-liquid outlet pipe;

[0031] 100-Silicon wafer texturing tank device;

[0032] 1-first tank body; 11-first through hole; 12-first circulation hole; 121-first filter element;

[0033] 2-second tank body; 21-liquid inlet hole; 22-second through hole; 221-second filter element; 23-second circulation hole;

[0034] 3-circulation pipeline; 31-main pipeline; 311-main pipeline; 3111-first flow guide pipe; 3112-second flow guide pipe; 312-diversion pipe; 32-liquid outlet pipe; 321-liquid outlet hole;

[0035] 4-circulation pump;

[0036] 200-Battery manufacturing equipment; 201-Cleaning tank; 202-Robotic arm. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0038] In this application, terms such as "upper," "lower," "top," "bottom," and "inner" indicate positions or locations based on those shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to specific positions, or to their construction or operation in a specific position.

[0039] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0040] Furthermore, the terms "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0041] Furthermore, the terms "first," "second," and the like are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0042] In the solar cell manufacturing process, constructing an efficient light-trapping texture on the silicon wafer surface is a crucial step, directly related to the solar cell's ability to capture and convert light energy into electricity. This process utilizes the principle of chemical etching, using chemical fluids to finely treat the silicon wafer surface. This creates a micro-nanoscale textured surface, enhancing light absorption and improving the cell's photoelectric conversion efficiency.

[0043] Currently, the most common method for texturing silicon wafers involves injecting a chemical solution directly into a tank, using a circulation pipeline and pump to control the liquid's flow rate and direction in order to achieve uniform etching of the wafer. While this approach improves the efficiency of the chemical solution to a certain extent, it still cannot avoid the problem of uneven distribution of the chemical solution within the tank, which in turn affects the uniformity and quality of the textured structure on the silicon wafer surface, thereby reducing the overall performance of the solar cell.

[0044] In order to solve the above problems, the inventors improved the structure of the silicon wafer texturing tank device and designed the following Figure 1 The structure shown in the figure is used to improve the uniformity of the chemical liquid in the tank. Specifically, the silicon wafer texturing tank device includes a tank a, a circulation pipe b, and a circulation pump c. During the silicon wafer texturing process, the chemical liquid is directly added to the tank a. The circulation pipe b is connected to the liquid inlet and liquid outlet of the tank a, so that the chemical liquid circulates through the circulation pipe b and the tank a through the circulation pump c.

[0045] However, the inventors found that Figure 1 As shown, the chemical liquid added directly to tank a may react with the silicon wafer before it circulates evenly, resulting in poor uniformity of the wafer's textured surface and reduced performance. Furthermore, the excessive length of the liquid outlet pipe d within tank a can lead to excessive local pressure within tank a, resulting in poor uniformity of the chemical liquid within tank a.

[0046] Based on this, an embodiment of the present application provides a silicon wafer texturing trough device, which adds a second trough to receive the added chemical liquid, and uses a circulation pipeline and a circulation pump to circulate the chemical liquid between the first trough and the second trough, thereby improving the uniformity of the chemical liquid in the first trough.

[0047] The technical solution of the present application will be further described below with reference to the embodiments and drawings.

[0048] See also Figure 2 , Figure 2A schematic structural diagram of a silicon wafer texturing tank device provided in an embodiment of the present application. An embodiment of the present application provides a silicon wafer texturing tank device 100, which includes a first tank body 1, a second tank body 2, a circulation pipeline 3 and a circulation pump 4. The first tank body 1 is used to hold a chemical liquid, so that the silicon wafer reacts with the chemical liquid in the first tank body 1, thereby preparing a light-trapping texture structure of the silicon wafer. The second tank body 2 is provided with a liquid inlet 21, and the liquid inlet 21 is configured to connect to a liquid supply device, so that the second tank body 2 receives freshly replenished chemical liquid through the liquid inlet 21. In addition, the second tank body 2 is communicated with the first tank body 1, and the second tank body 2 is used to receive the chemical liquid in the first tank body 1, and the circulation pipeline 3 is connected to the first tank body 1 and the second tank body 2, and the circulation pump 4 is provided in the circulation pipeline 3. The circulation pump 4 is used to drive the chemical liquid in the circulation pipeline 3 to circulate, so that the chemical liquid circulates between the first tank body 1 and the second tank body 2. The silicon wafer texturing tank device 100 adds a second tank 2 so that the continuously added chemical liquid first enters the second tank 2. The chemical liquid then enters the first tank 1 after passing through the second tank 2 and the circulation pipeline 3. This ensures that the added chemical liquid circulates a sufficient distance before entering the first tank 1, allowing the chemical liquid in the first tank 1 to be evenly distributed, thereby avoiding the phenomenon of excessive concentration of the chemical liquid in some areas. As a result, the textured structure of the silicon wafer prepared in the first tank 1 is more uniform, and the texture quality of the silicon wafer surface is better, which is conducive to improving the performance and appearance of the silicon wafer.

[0049] In some embodiments, the circulation pipeline 3 includes a main pipeline 31 and a liquid outlet pipe 32. The circulation pump 4 is provided in the main pipeline 31. The liquid outlet pipe 32 is provided inside the first tank body 1. The main pipeline 31 is connected to the second tank body 2, and the main pipeline 31 at least partially extends into the first tank body 1 and is connected to the middle of the liquid outlet pipe 32, so that the chemical liquid in the second tank body 2 flows into the first tank body 1 through the main pipeline 31 and the liquid outlet pipe 32. Since the main pipeline 31 is connected to the middle of the liquid outlet pipe 32, the liquid outlet of the liquid outlet pipe 32 is discharged at both ends, and the chemical liquid can flow out at both ends of the liquid outlet pipe 32. On the one hand, the discharge of the chemical liquid at both ends of the liquid outlet pipe 32 can shorten the travel distance of the chemical liquid flow, shorten the time for the chemical liquid to circulate evenly, thereby improving the efficiency of silicon wafer velvet preparation and the quality of the silicon wafer velvet. On the other hand, the chemical liquid is discharged from both ends of the liquid outlet pipe 32. Compared with the liquid outlet from a single end of the liquid outlet pipe 32, it can effectively disperse the local pressure of the chemical liquid when it flows out of the first trough body 1, so that the fluctuation of the chemical liquid in the first trough body 1 is smaller, and the generation of bubbles in the chemical liquid is reduced, avoiding the surface of the silicon wafer being attached by bubbles and causing bright spot defects on the silicon wafer velvet, effectively reducing the defective rate of silicon wafer velvet preparation.

[0050] Please refer again Figure 2Optionally, the liquid outlet pipe 32 is provided with a plurality of liquid outlet holes 321, which are spaced apart along the length of the liquid outlet pipe 32. Compared to directly discharging the chemical liquid from both ends of the liquid outlet pipe 32, the liquid outlet pipe 32 is provided with a plurality of liquid outlet holes 321, and the chemical liquid is then discharged from the liquid outlet holes 321. In this way, the outflow of the chemical liquid can be effectively controlled, so that the local pressure of the chemical liquid in the first tank body 1 is reduced, the fluctuation of the chemical liquid in the first tank body 1 is reduced, and the chemical liquid in the first tank body 1 is in a uniform flow state, so that the chemical liquid can act evenly on the surface of the silicon wafer, thereby improving the velvet structure quality of the silicon wafer surface.

[0051] Optionally, the liquid outlet pipe 32 is provided on the side wall surface of the first trough body 1, and the liquid outlet pipe 32 is located in the middle position of the first trough body 1 in the height direction. As a result, the liquid flowing out through the liquid outlet pipe 32 can flow evenly in the first trough body 1, which is conducive to the uniform effect of the chemical liquid on the surface of the silicon wafer, thereby achieving a uniform and consistent velvet structure of the silicon wafer. In addition, the liquid outlet pipe 32 is located in the middle position of the first trough body 1 in the height direction, which can better control the flow rate and flow direction of the chemical liquid, thereby optimizing the flow pattern of the chemical liquid in the first trough body 1, avoiding the local excessively fast or excessively slow flow of the chemical liquid in the first trough body 1, and effectively improving the efficiency and uniformity of the velvet formation on the silicon wafer surface.

[0052] Optionally, there are multiple liquid outlet pipes 32, and the discharge of liquid through multiple liquid outlet pipes 32 can effectively improve the smoothness of the chemical liquid circulation. In addition, the multiple liquid outlet pipes 32 are respectively arranged on different side walls of the first tank body 1. On the one hand, there is still a period of time from the chemical liquid flowing from the side wall of the first tank body 1 to the contact with the silicon wafer surface. During this period of time, the chemical liquid can continue to circulate, so that the bubbles generated by the circulation of the chemical liquid are dissipated, thereby ensuring the quality of the silicon wafer surface preparation. On the other hand, the liquid outlet pipes 32 are arranged on the side wall of the first tank body 1, which can effectively improve the space utilization rate of the first tank body 1, thereby improving the efficiency of silicon wafer surface texturing.

[0053] Exemplarily, two liquid outlet pipes 32 can be provided, and the two liquid outlet pipes 32 can be provided on two opposite sidewalls of the first tank body 1. Furthermore, the two liquid outlet pipes 32 can extend along the sidewalls on which they are located, and the heights of the two liquid outlet pipes 32 on the two sidewalls of the first tank body 1 are substantially equal, so that the chemical liquid can flow out through the two opposite sidewalls. This can correspond to the two sides of the silicon wafer in the first tank body 1, so that the distance at which the chemical liquid acts on the silicon wafer surface is substantially consistent, which is conducive to improving the uniformity of the chemical liquid in the first tank body 1 and the consistency of the texture structure on the silicon wafer surface.

[0054] As another example, when more liquid outlet pipes 32 are provided, for example, four liquid outlet pipes 32, that is, liquid outlet pipes 32 can be provided on all sidewalls of the first tank body 1. In this way, the chemical liquid can be facilitated to enter the first tank body 1, and the efficiency of the chemical liquid circulating evenly between the first tank body 1 and the second tank body 2 can be improved, thereby facilitating the improvement of the efficiency and quality of texturing on the silicon wafer surface.

[0055] Of course, for the side wall surface of the first trough body 1, multiple liquid outlet pipes can also be set on the same side wall surface. When multiple liquid outlet pipes 32 are set, the multiple liquid outlet pipes 32 can be set in sequence along the length direction of the first trough body 1 on the side wall surface where they are located, or they can also be set in sequence along the height direction of the first trough body 1 on the side wall surface where they are located.

[0056] Optionally, the main conduit 31 includes a main conduit 311 and multiple branch conduits 312. The main conduit 311 is connected to the second tank body 2, and the main conduit 311 is connected to the multiple branch conduits 312. The multiple branch conduits 312 are respectively connected to the multiple liquid outlet pipes 32 in a one-to-one correspondence. Thus, after the chemical liquid flows out of the second tank body 2, it enters the corresponding liquid outlet pipe 32 through the main conduit 311 and any branch conduit 312, and then flows into the first tank body 1 through the liquid outlet pipe 32. This can effectively reduce the distance traveled by the chemical liquid, thereby shortening the time it takes for the chemical liquid to circulate evenly and improving the efficiency of the chemical liquid circulation.

[0057] Optionally, the main pipeline 311 includes a first guide pipe 3111 and a second guide pipe 3112, the first guide pipe 3111 is connected to the second tank body 2 and the circulation pump 4, the second guide pipe 3112 is connected to the circulation pump 4 and multiple diversion pipes 312, the chemical liquid in the second tank body 2 enters the second guide pipe 3112 from the first guide pipe 3111 through the circulation pump 4, and then enters the multiple diversion pipes 312 to achieve diversion, so that the chemical liquid enters the first tank body 1, and the circulation pump 4 is used to accelerate the circulation flow of the chemical liquid between the first tank body 1 and the second tank body 2, thereby improving the uniform efficiency of the chemical liquid.

[0058] Please refer again Figure 2 In some embodiments, the first tank body 1 is provided with a first through hole 11 and a first circulation hole 12. The first through hole 11 is located at the bottom of the first tank body 1 and is used to connect the first tank body 1 with the second tank body 2. The first through hole 11 is provided at the bottom of the first tank body 1 and can utilize the gravity of the chemical liquid itself to promote the chemical liquid in the first tank body 1 to flow into the second tank body 2, and then return to the first tank body 1 through the circulation pipe 3 and the circulation pump 4, thereby realizing the circulation flow of the chemical liquid between the first tank body 1 and the second tank body 2, effectively improving the efficiency of uniform circulation of the chemical liquid between the first tank body 1 and the second tank body 2. There can be one or more first through holes 11, and this is not limited in the embodiments of the present application.

[0059] Furthermore, along the height of the first tank body 1, the first circulation hole 12 is located above the first through hole 11, and the first circulation hole 12 is configured to connect to the circulation pipeline 3. Thus, along the height of the first tank body 1, the first circulation hole 12 is located higher than the first through hole 11, enabling the chemical liquid to form a natural liquid flow force within the first tank body 1. Upon entering the first tank body 1, the chemical liquid forms a certain flow velocity and pressure, which facilitates convection and mixing of the chemical liquid within the first tank body 1, reduces accumulation of the chemical liquid within the first tank body 1, and thereby improves the uniform distribution of the chemical liquid within the first tank body 1, reducing quality issues caused by uneven corrosion of the silicon wafer surface by the chemical liquid.

[0060] Furthermore, the second tank body 2 is provided with a second through hole 22 and a second circulation hole 23. The second through hole 22 is located at the upper portion of the second tank body 2 and is connected to the first through hole 11, thereby connecting the first tank body 1 and the second tank body 2. The second circulation hole 23 is located at the bottom of the second tank body 2 and is configured to connect to the circulation pipeline 3. Similarly, the second through hole 22 is provided at the upper portion of the second tank body 2 for receiving the chemical liquid from the first tank body 1, while the second circulation hole 23 is provided at the bottom of the second tank body 2 so that the chemical liquid in the second tank body 2 is not only affected by the force of the circulation pump 4 but also by the gravity of the chemical liquid itself, promoting the circulation of the chemical liquid within the second tank body 2 and entering the circulation pipeline 3, thereby achieving the circulation of the chemical liquid between the first tank body 1 and the second tank body 2, thereby improving the uniform distribution of the chemical liquid between the first tank body 1 and the second tank body 2, and further improving the efficiency and quality of the silicon wafer surface texturing. The first through hole 11 can be one or more, and this embodiment of the application is not limited to this.

[0061] Optionally, along the height direction of the first trough body 1, the second trough body 2 is located below the first trough body 1, and the first through hole 11 is located on the bottom surface of the first trough body 1, and the second through hole 22 is located on the top surface of the first trough body 1, and the second through hole 22 is connected to the first through hole 11. In this way, the second trough body 2 is located below the first trough body 1, and the two are connected through the second through hole 22 and the first through hole 11, which is conducive to promoting the flow and mixing of the chemical liquid between the first trough body 1 and the second trough body 2, and can effectively shorten the time for the chemical liquid to circulate evenly, thereby improving the efficiency of texturing the silicon wafer surface.

[0062] Optionally, the second through hole 22 is provided with a first filter element 121, which is configured to filter the chemical liquid flowing out of the first tank body 1, and the second circulation hole 23 is provided with a second filter element 221, which is configured to filter the chemical liquid flowing out of the second tank body 2. The first filter element 121 is used to filter the oxides on the surface of the silicon wafer removed after the reaction between the silicon wafer and the chemical liquid, as well as the particles generated during the mechanical treatment process. In this way, the first filter element 121 can prevent these impurities from entering the first tank body 1 again through the circulation pipe. In addition, it can also prevent large particles of impurities from damaging the circulation pump 4 and the circulation pipe 3, and small particles of impurities from damaging and contaminating the silicon wafer surface, thereby extending the service life of the silicon wafer texturing tank body device 100 and reducing its maintenance cost. The second filter element 221 is used to filter tiny particles and contaminants in the added chemical liquid, ensuring the cleanliness of the circulating chemical liquid, thereby improving the quality of the silicon wafer surface texturing, and further improving the quality of the solar cell. For example, when the first filter element 121 is a filter mesh and the second filter element 221 is a filter membrane, the filter mesh can effectively filter out pollutants and solid particles in the first tank body 1, and the filter membrane can selectively remove specific chemical substances in the chemical liquid added to the second tank body 2, thereby improving the purity of the chemical liquid.

[0063] It can be understood that in addition to the aforementioned second through hole 22 provided with a first filter element 121 and the second circulation hole 23 provided with a second filter element 221, there can also be other examples, for example, the second through hole 22 is provided with a first filter element 121, or the second circulation hole 23 is provided with a second filter element 221, and the embodiments of the present application are not limited to this.

[0064] In some embodiments, the volume of the second trough body 2 is smaller than that of the first trough body 1. Since the second trough body 2 is used to receive the added chemical liquid, the smaller second trough body 2 can meet the demand while not only reducing the material usage of the second trough body 2 itself, but also reducing the usage of chemical liquid, thereby effectively reducing the cost of silicon wafer texturing.

[0065] Second, see Figure 3 , Figure 3 This is a structural diagram of a battery manufacturing device provided in an embodiment of the present application. The embodiment of the present application also discloses a battery manufacturing device 200. The battery manufacturing device 200 may include the silicon wafer texturing trough device 100 of the first aspect, a cleaning tank 201, and a robotic arm 202. The cleaning tank 201 is located downstream of the silicon wafer texturing trough device 100. The robotic arm 202 can load silicon wafers in the silicon wafer texturing trough device 100 and transfer them to the cleaning tank 201 for cleaning. The battery manufacturing device 200 having the silicon wafer texturing trough device 100 can also achieve the effect of improving the uniformity of the chemical liquid in the first tank 1 as described in the first aspect.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A silicon wafer texturing tank device, characterized in that: include: a first tank body, the first tank body being configured to contain a chemical liquid; a second tank body, the second tank body being provided with a liquid inlet hole, the liquid inlet hole being configured to be connected to a liquid supply device to receive a replenished chemical liquid, and the second tank body being in communication with the first tank body to receive the chemical liquid in the first tank body; a circulation pipeline connected to the first tank body and the second tank body; A circulation pump is provided in the circulation pipeline, and is used to drive the chemical liquid in the circulation pipeline to circulate, so that the chemical liquid circulates between the first tank body and the second tank body.

2. The silicon wafer texturing tank device according to claim 1, characterized in that: The circulation pipeline includes a main pipeline and a liquid outlet pipe, the liquid outlet pipe is provided in the first tank body, the main pipeline is connected to the second tank body, and the main pipeline at least partially extends into the first tank body and is connected to the middle part of the liquid outlet pipe, so that the chemical liquid of the second tank body flows into the first tank body through the main pipeline and the liquid outlet pipe; The circulation pump is arranged on the main line.

3. The silicon wafer texturing tank device according to claim 2, characterized in that: The liquid outlet pipe is provided with a plurality of liquid outlet holes, and the plurality of liquid outlet holes are arranged at intervals along the length direction of the liquid outlet pipe.

4. The silicon wafer texturing tank device according to claim 2, characterized in that: The liquid outlet pipe is arranged on the side wall surface of the first tank body, and the liquid outlet pipe is located in the middle position of the first tank body along the height direction.

5. The silicon wafer texturing tank device according to claim 4, characterized in that: There are multiple liquid outlet pipes, and the multiple liquid outlet pipes are respectively arranged on different side walls of the first tank body; The main pipeline includes a main pipeline and multiple branch pipes. The main pipeline is connected to the second tank body, and the main pipeline is connected to the multiple branch pipes. The multiple branch pipes are respectively connected to the multiple liquid outlet pipes in a one-to-one correspondence.

6. The silicon wafer texturing tank device according to any one of claims 1 to 5, characterized in that: The first trough body is provided with a first through hole and a first circulation hole, wherein the first through hole is located at the bottom of the first trough body and is used to connect the first trough body with the second trough body. Along the height direction of the first trough body, the first circulation hole is located above the first through hole and is configured to connect the circulation pipeline; The second trough body is provided with a second through hole and a second circulation hole, the second through hole is located at the upper part of the second trough body, and the second through hole is communicated with the first through hole, so that the first trough body and the second trough body are communicated; The second circulation hole is located at the bottom of the second tank body, and the second circulation hole is configured to be connected to the circulation pipeline.

7. The silicon wafer texturing tank device according to claim 6, characterized in that: Along the height direction of the first trough body, the second trough body is located below the first trough body, the first through hole is located on the bottom surface of the first trough body, the second through hole is located on the top surface of the first trough body, and the second through hole is connected to the first through hole.

8. The silicon wafer texturing tank device according to claim 6, characterized in that: The second through hole is provided with a first filter element, and the first filter element is configured to filter the chemical liquid flowing out of the first tank body, and / or, A second filter element is provided at the second circulation hole, and the second filter element is configured to filter the chemical liquid flowing out of the second tank body.

9. The silicon wafer texturing tank device according to any one of claims 1 to 5, characterized in that: The volume of the second trough body is smaller than that of the first trough body.

10. A battery manufacturing device, characterized in that: It comprises a silicon wafer texturing trough device as described in any one of claims 1-9.

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