Plastic pin cleaning device and semiconductor packaging system

Abstract

The utility model relates to the field of semiconductor packaging, and particularly provides a plastic pin cleaning device and a semiconductor packaging system. The plastic pin cleaning device comprises a base; the bearing assembly is arranged on the base and comprises a mounting part used for placing a plastic pin, and the mounting part is in sliding connection with the base; the cleaning assembly comprises a spray head arranged above the bearing assembly, after the mounting part moves to the position below the spray head, the spray head can descend towards the mounting part and is switched to be in the working state, the working state comprises the first working state and the second working state, and in the first working state, the spray head is driven to rotate; the spray head can spray a cleaning agent towards the plastic needle placed on the mounting part; and in the second working state, the spray head can blow air towards the plastic pin placed on the mounting part. According to the technical scheme, the problem that in the prior art, an adhesive residue cleaning mode is low in efficiency is solved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, and specifically provides a glue needle cleaning device and a semiconductor packaging system. Background Art

[0002] In existing semiconductor packaging systems, multiple processes involve dispensing. After dispensing is complete or after a period of dispensing, residual glue is likely to form on the dispensing needle. This residual glue can affect the accuracy and quality of the next dispensing operation, so it is necessary to remove the residual glue from the dispensing needle before the next dispensing operation.

[0003] In the existing technology, residual adhesive is typically removed manually. This is a very traditional cleaning method, where the operator manually wipes the dispensing needle with a soft cloth or cotton swab to remove residual adhesive. This method is simple to operate, but it is time-consuming, and the cleaning effect is significantly affected by the operator's skill level. In addition, manual cleaning is difficult to adapt to high-speed production lines, which reduces production efficiency.

[0004] Therefore, this field needs a new technical solution to solve the above problems. Utility Model Content

[0005] In order to solve the problem of low efficiency of the residual glue cleaning method in the prior art, the present invention provides a glue needle cleaning device. The glue needle cleaning device includes: a base; a supporting assembly, the supporting assembly being arranged on the base and including a mounting portion for placing the glue needle, the mounting portion being slidably connected to the base; and a cleaning assembly, the cleaning assembly including a nozzle arranged above the supporting assembly. When the mounting portion moves below the nozzle, the nozzle can descend toward the mounting portion and switch to an operating state. The operating state includes a first operating state and a second operating state. In the first operating state, the nozzle can spray a cleaning agent toward the glue needle placed on the mounting portion; in the second operating state, the nozzle can blow air toward the glue needle placed on the mounting portion.

[0006] The present invention includes a carrier assembly for holding glue needles. After a dispensing operation is complete, glue needles that need cleaning can be placed on the mounting portion and await cleaning. The mounting portion is slidably connected to the base, allowing the needles to be positioned appropriately for placement and moved below the nozzle for cleaning. This allows the glue needle cleaning device of the present invention to be easily integrated into existing semiconductor packaging systems without excessively occupying space within other components within the system. Once the mounting portion is moved below the nozzle, the nozzle lowers toward the mounting portion and switches to an operating state, allowing for cleaning of the glue needles at an appropriate distance, ensuring that the pressure of the cleaning agent sprayed from the nozzle effectively removes the glue. The operating states include a first operating state and a second operating state. In the first operating state, the nozzle sprays cleaning agent toward the glue needles placed on the mounting portion; in the second operating state, the nozzle blows air toward the glue needles placed on the mounting portion. With this arrangement, after thoroughly rinsing the glue needles, the nozzle can also blow air to dry the needles again, facilitating storage or the next dispensing operation.

[0007] In the preferred technical solution of the aforementioned glue needle cleaning device, the supporting assembly includes a transverse movement unit, which includes a first guide rail fixedly connected to the base and a supporting plate slidably connected to the first guide rail, with the mounting portion disposed on the supporting plate. With the aforementioned arrangement, the mounting portion is disposed on the movable supporting plate, allowing for easy movement below the nozzle.

[0008] In the preferred technical solution of the aforementioned glue needle cleaning device, the cleaning assembly includes a bracket fixedly connected to the base and a vertically movable unit mounted on the bracket. The vertically movable unit includes a second guide rail and a nozzle holder slidably connected to the second guide rail, and the nozzle is fixed to the nozzle holder. With this arrangement, the nozzle holder slides along the second guide rail, driving the nozzle to slide, thereby lowering the nozzle to a suitable position for cleaning the glue needle.

[0009] In the preferred technical solution of the aforementioned glue needle cleaning device, the vertical movement unit further includes a motor and a connecting rod mechanism. One end of the connecting rod mechanism is fixedly connected to the output shaft of the motor, and the other end is rotatably connected to the nozzle holder. The motor, via the connecting rod mechanism, drives the nozzle holder to reciprocate along the second guide rail. With this arrangement, forward and reverse rotation of the motor respectively causes the nozzle to rise and fall.

[0010] In the preferred technical solution of the aforementioned glue needle cleaning device, the linkage mechanism includes a first linkage and a second linkage that are rotatably connected. The first linkage is fixedly connected to the output shaft, and the second linkage is rotatably connected to the nozzle holder. This arrangement forms a three-link mechanism between the motor and the nozzle holder, enabling simple and efficient control of the nozzle's ascent and descent.

[0011] In the preferred technical solution of the aforementioned glue needle cleaning device, the device also includes an exhaust assembly, located above the cleaning assembly and used to discharge waste gas generated after cleaning the glue needle. The exhaust assembly allows the glue needle cleaning device to coordinate with other waste gas treatment devices, optimizing the production environment and preventing equipment clogging and corrosion.

[0012] In the preferred embodiment of the aforementioned glue needle cleaning device, the nozzle has a liquid inlet, an air inlet, and an outlet that are spaced apart from each other. In the first operating state, the liquid inlet and the outlet are connected; in the second operating state, the air inlet and the outlet are connected. This arrangement allows the flow path for flushing the glue needle with cleaning agent and the air path for air-drying the glue needle to be connected in parallel, facilitating control.

[0013] In the preferred technical solution of the aforementioned glue needle cleaning device, the device further includes a liquid reservoir, the cleaning agent is contained in the liquid reservoir, and the liquid reservoir is in communication with the liquid inlet. The integration of the liquid reservoir in the glue needle cleaning device further enhances its ease of application in existing packaging systems.

[0014] To address the inefficiency of existing residual adhesive cleaning methods, the present invention also provides a semiconductor packaging system. The system includes a glue needle cleaning device according to any of the above preferred technical solutions. With the glue needle cleaning device, the semiconductor packaging system's glue dispensing device can quickly replace used glue needles, maintaining a high yield and production efficiency.

[0015] Beneficial effects: The mounting portion is slidably connected to the base so as to receive the glue needle at a position suitable for placing the glue needle, and can be moved to the bottom of the nozzle for cleaning, so that the glue needle cleaning device of the utility model can be conveniently introduced into the existing semiconductor packaging system without excessively crowding out the space of other devices in the semiconductor packaging system. When the mounting portion is moved to the bottom of the nozzle, the nozzle can be lowered toward the mounting portion and switched to the working state, so as to clean the glue needle at an appropriate distance, ensuring that the pressure of the cleaning agent sprayed from the nozzle can effectively remove the colloid. The working state includes a first working state and a second working state. In the first working state, the nozzle can spray the cleaning agent toward the glue needle placed on the mounting portion; in the second working state, the nozzle can blow air toward the glue needle placed on the mounting portion. Through the above-mentioned arrangement, after the glue needle is fully rinsed, the glue needle cleaning device can also dry the glue needle again by blowing air through the nozzle to facilitate storage or the next dispensing operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

[0017] Figure 1This is a structural diagram of an embodiment of the glue needle cleaning device of the utility model;

[0018] Figure 2 yes Figure 1 A detailed schematic diagram of the embodiment of the glue needle cleaning device shown at point A;

[0019] Figure 3 It is a structural schematic diagram of an embodiment of a nozzle of a glue needle cleaning device of the present invention.

[0020] List of reference numerals:

[0021] 100. Glue needle cleaning device; 10. Base; 11. Upper surface; 12. Liquid collecting tank; 20. Carrying assembly; 21. Lateral moving unit; 211. First guide rail; 212. Carrying plate; 22. Mounting portion; 30. Cleaning assembly; 31. Bracket; 32. Vertical moving unit; 321. Second guide rail; 322. Nozzle seat; 323. Connecting rod mechanism; 3231. First connecting rod; 3232. Second connecting rod; 324. Output shaft; 33. Nozzle; 331. Liquid inlet; 332. Air inlet; 333. Nozzle; 40. Liquid storage tank; 50. Exhaust assembly. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0023] It should be noted that, in the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0024] Furthermore, it should be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0025] In order to solve the problem of low efficiency of the residual glue cleaning method in the prior art, the present invention provides a glue needle cleaning device 100. The glue needle cleaning device 100 includes: a base 10; a supporting assembly 20, which is disposed on the base 10 and includes a mounting portion 22 for placing the glue needle, and the mounting portion 22 is slidably connected to the base 10; and a cleaning assembly 30, which includes a nozzle 33 disposed above the supporting assembly 20. When the mounting portion 22 moves below the nozzle 33, the nozzle 33 can descend toward the mounting portion 22 and switch to an operating state. The operating state includes a first operating state and a second operating state. In the first operating state, the nozzle 33 can spray a cleaning agent toward the glue needle placed on the mounting portion 22; in the second operating state, the nozzle 33 can blow air toward the glue needle placed on the mounting portion 22.

[0026] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention's glue needle cleaning device. Figure 1 As shown, the glue needle cleaning device 100 of the present invention includes a base 10, a supporting assembly 20 disposed on the base 10, and a cleaning assembly 30. In one or more embodiments, the base 10 includes an upper surface 11, and the supporting assembly 20 is disposed on the upper surface 11. Exemplarily, the normal of the upper surface 11 is parallel to the Z-axis (the Z-axis extends in the vertical direction), so that the upper surface 11 is configured to extend in the horizontal direction. Alternatively, the upper surface 11 can be configured to form an angle with the Z-axis according to actual needs.

[0027] Continue reading Figure 1In one or more embodiments, the support assembly 20 includes a transverse movement unit 21 and a mounting portion 22. The transverse movement unit 21 includes a first guide rail 211 fixedly connected to the base 10 and a support plate 212 slidably connected to the first guide rail 211. The mounting portion 22 is disposed on the support plate 212 and is used to mount the glue needle to be cleaned. In one or more embodiments, the mounting portion 22 has a through hole extending through the support plate 212 for mounting the glue needle. The cleaning agent can flow from the needle tip into the sump 12 located in the base 10 through a pipe inside the glue needle to avoid contamination of the production environment. Alternatively, the mounting portion 22 can be configured in other suitable forms. In one or more embodiments, the first guide rail 211 extends along the Y-axis (the Y-axis is parallel to the horizontal direction). The first guide rail is configured as a ball screw and is powered by a servo motor to drive the support plate 212 in the horizontal direction, allowing the mounting portion 22, disposed on the support plate 212, to switch between a mounting position and a cleaning position. In the installation position, the mounting portion 22 is positioned away from the cleaning assembly 30 to facilitate receiving the glue needle removed from the dispensing device. In the cleaning position, the mounting portion 22 is positioned close to the cleaning assembly 30 to prevent splashing cleaning agent from affecting other devices in the semiconductor packaging system. Alternatively, the first guide rail 211 may be configured in other suitable forms to provide a guiding function.

[0028] Figure 2 Yes Figure 1 The embodiment of the glue needle cleaning device shown is a detailed schematic diagram at A. Figure 2 As shown, in one or more embodiments, the cleaning assembly 30 includes a bracket 31 fixedly connected to the base 10 and a vertically movable unit 32 disposed on the bracket 31. The bracket 31 is disposed on both sides of the first guide rail 211 perpendicular to its extension direction, forming a shape that spans above the first guide rail 211 to facilitate supporting the spray head 33, enabling the spray head 33 to clean the glue needle from above. Alternatively, the bracket 31 can be configured in other suitable shapes according to actual needs.

[0029] Continue reading Figure 2, the vertical moving unit 32 includes a second guide rail 321 and a nozzle seat 322 slidably connected to the second guide rail 321. The nozzle 33 is fixed on the nozzle seat 322, and the fixing method includes but is not limited to screw connection, clamping, etc. In one or more embodiments, the second guide rail 321 extends along the Z-axis direction so that the nozzle seat 322 drives the nozzle 33 to move in the vertical direction. Alternatively, the extension direction of the second guide rail 321 can also form an angle with the Z-axis. In one or more embodiments, the vertical moving unit 32 also includes a motor and a connecting rod mechanism 323 for driving the movement of the nozzle seat 322. Among them, one end of the connecting rod mechanism 323 is fixedly connected to the output shaft 324 of the motor, and the other end thereof is rotatably connected to the nozzle seat 322. Specifically, the connecting rod mechanism 323 includes a first connecting rod 3231 and a second connecting rod 3232 that are rotatably connected. The first connecting rod 3231 is fixedly connected to the output shaft 324 of the motor. The first connecting rod 3231 can be configured as a rod-shaped component, or it can be configured as Figure 2 The disc shape shown in FIG3 only needs to achieve the effect of converting the rotation of the motor output shaft 324 into circular motion. The second connecting rod 3232 is rotatably connected to the nozzle holder 322. The first connecting rod 3231 drives the second connecting rod 3232 to move circumferentially along the motor output shaft 324. Under the guidance of the second guide rail 321, the second connecting rod 3232 drives the nozzle holder 322 to move in the vertical direction.

[0030] Therefore, after the mounting portion 22 moves along the first guide rail 211 to below the nozzle 33, the nozzle 33 can descend toward the mounting portion 22 and switch to an operating state. The operating state includes a first operating state and a second operating state. In the first operating state, the nozzle 33 can spray a cleaning agent toward the glue needles placed on the mounting portion 22. For example, the cleaning agent is an alcohol solution. In the second operating state, the nozzle 33 can blow air toward the glue needles placed on the mounting portion 22 to dry the glue needles, allowing them to be quickly put back into use.

[0031] Figure 3 This is a schematic diagram of the structure of the nozzle embodiment of the glue needle cleaning device of the utility model. Figure 3 As shown, in one or more embodiments, the nozzle 33 includes a liquid inlet 331, an air inlet 332, and a nozzle 333. In a first operating state, the liquid inlet 331 is connected to the nozzle 333, allowing cleaning agent to enter the nozzle 33 through the liquid inlet 331 and be sprayed onto the glue needle to be cleaned through the nozzle 333. In a second operating state, the air inlet 332 is connected to the nozzle 333, allowing air or other suitable drying gas to enter the nozzle 33 through the air inlet 332 and be blown toward the cleaned glue needle through the nozzle 333, thereby quickly drying it and allowing it to be quickly put back into use.

[0032] Continue reading Figure 1In one or more embodiments, the glue needle cleaning device 100 further includes a liquid storage tank 40 , in which the cleaning agent is contained and the liquid storage tank 40 is connected to the liquid inlet 331 to supply the cleaning agent to the nozzle 33 .

[0033] Continue reading Figure 1 In one or more embodiments, the glue needle cleaning device 100 further includes an exhaust assembly 50. The exhaust assembly 50 is disposed above the cleaning assembly 30 and is used to discharge the exhaust gas generated after cleaning the glue needle. Exemplarily, the exhaust device includes an exhaust duct and an airflow driving device disposed in the exhaust duct. The airflow driving device may be a fan. Through the above configuration, the exhaust device can be conveniently connected to the exhaust gas treatment device in the semiconductor packaging system, so that the glue needle cleaning device 100 of the present invention can be directly applied to the existing semiconductor packaging system. Alternatively, the exhaust device can be eliminated.

[0034] Combine Figure 1-Figure 3 In one or more embodiments, the glue needle cleaning device 100 of the present invention is used as follows: first, the mounting portion 22 is positioned in the mounting position. Once the glue needle is placed on the mounting portion 22, the carrier plate 212 is driven to move the mounting portion 22 to the cleaning position. The nozzle 33 is then driven downward, and when it reaches the desired position, the nozzle 33 switches to an operating state. The nozzle 33 first enters a first operating state, spraying a cleaning agent onto the glue needle. After the glue needle is cleaned, the nozzle 33 switches to a second operating state, blowing air toward the glue needle to quickly dry it, allowing it to be stored or returned to the dispensing device for the next dispensing operation.

[0035] The present invention also provides a semiconductor packaging system, comprising the aforementioned glue needle cleaning device 100. In one or more embodiments, the semiconductor packaging system further comprises a glue dispensing device, comprising a detachable glue needle. If residual glue remains on the glue needle after a glue dispensing operation, the glue needle can be placed in the glue needle cleaning device 100 for cleaning. The cleaned glue needle can be reassembled into the glue dispensing device for the next glue dispensing operation.

[0036] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A glue needle cleaning device, characterized in that: The glue needle cleaning device comprises: base; A bearing assembly, the bearing assembly is arranged on the base and includes a mounting portion for placing the glue needle, the mounting portion being slidably connected to the base; A cleaning component, the cleaning component includes a nozzle arranged above the supporting component. When the mounting portion moves to the bottom of the nozzle, the nozzle can be lowered toward the mounting portion and switched to a working state. The working state includes a first working state and a second working state. In the first working state, the nozzle can spray cleaning agent toward the glue needle placed on the mounting portion; in the second working state, the nozzle can blow air toward the glue needle placed on the mounting portion.

2. The glue needle cleaning device according to claim 1, characterized in that: The bearing assembly includes a transverse moving unit, which includes a first guide rail fixedly connected to the base and a bearing plate slidably connected to the first guide rail, and the mounting portion is arranged on the bearing plate.

3. The glue needle cleaning device according to claim 1, characterized in that: The cleaning assembly includes a bracket fixedly connected to the base and a vertical moving unit arranged on the bracket. The vertical moving unit includes a second guide rail and a nozzle seat slidably connected to the second guide rail. The nozzle is fixed on the nozzle seat.

4. The glue needle cleaning device according to claim 3, characterized in that: The vertical moving unit also includes a motor and a connecting rod mechanism, one end of the connecting rod mechanism is fixedly connected to the output shaft of the motor, and the other end thereof is rotatably connected to the nozzle holder. The motor can drive the nozzle holder to reciprocate along the second guide rail through the connecting rod mechanism.

5. The glue needle cleaning device according to claim 4, characterized in that: The connecting rod mechanism includes a first connecting rod and a second connecting rod that are rotatably connected. The first connecting rod is fixedly connected to the output shaft, and the second connecting rod is rotatably connected to the nozzle seat.

6. The glue needle cleaning device according to claim 1, characterized in that: The glue needle cleaning device also includes an exhaust assembly, which is arranged above the cleaning assembly and is used to guide out the waste gas generated after cleaning the glue needle.

7. The glue needle cleaning device according to claim 1, characterized in that: The nozzle has a liquid inlet, an air inlet and a nozzle that are spaced apart from each other. In the first working state, the liquid inlet and the nozzle are connected; in the second working state, the air inlet and the nozzle are connected.

8. The glue needle cleaning device according to claim 7, characterized in that: The glue needle cleaning device further includes a liquid storage tank, the cleaning agent is contained in the liquid storage tank, and the liquid storage tank is connected to the liquid inlet.

9. A semiconductor packaging system, characterized in that: The semiconductor packaging system includes the glue needle cleaning device according to any one of claims 1-8.

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