Glue pouring equipment
By designing the positions of the glue filling port and the exhaust port in the inner cavity of the photovoltaic electronic equipment and combining the external atmospheric pressure and the tension of the potting glue, the problems of insufficient glue filling and voids in the photovoltaic electronic equipment are solved, and an efficient and complete potting effect is achieved, thereby improving production efficiency and equipment sealing.
Patent Information
- Application Number
- CN202422637133.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-30
AI Technical Summary
The existing glue potting process for photovoltaic electronic devices is prone to producing voids and bubbles. After the glue is potted, it is reduced or air flows back inside, resulting in insufficient potting and low production efficiency.
A glue filling device is designed. The glue filling port is located at the lower part of the inner cavity of the photovoltaic electronic device, and the exhaust port is located at the top. The potting glue is injected through the glue filling port and overflows to the exhaust port. The external atmospheric pressure and the tension of the potting glue are used to ensure that no voids are generated after the inner cavity is filled, and a sealing structure is used to prevent air from entering.
It achieves complete encapsulation of the inner cavity of photovoltaic electronic equipment, avoids the generation of voids, improves production efficiency and reduces material waste, and ensures the equipment's sealing, waterproof, dustproof and shockproof properties.
Smart Images

Figure CN223393731U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaic electronic equipment, in particular to a glue filling device. Background Art
[0002] The housing of a photovoltaic device contains a circuit board. During operation, heat generated by the circuit board needs to be transferred to the housing. Therefore, potting compound is used to fill the gap between the housing and the circuit board to improve heat transfer efficiency. Furthermore, the potting compound also provides waterproofing, dustproofing, and shockproofing.
[0003] Currently, there are two common glue-potting processes for photovoltaic electronic devices. One involves potting before assembling the outer shell. After potting is complete, the outer shell is installed and then allowed to cure. This method easily creates gaps between the later-installed outer shell and the potting compound, making it difficult to ensure that the potting compound completely fills the outer shell. Another method involves potting through two holes in the outer shell after assembly, with the potting compound being poured from one hole and the other hole used to remove air from the outer shell. This method has two possible scenarios. In one scenario, the vent hole and the potting hole are on the same level. In this method, potting with this method can easily create cavities and bubbles in the internal area at or above the level of the two holes. In another scenario, the potting port is lower than the vent hole. In this method, after potting is completed, gravity can cause the potting compound to overflow from the lower port, resulting in waste and reducing the amount of potting compound inside the photovoltaic device, allowing air to flow back into the device. Therefore, the prior art still has shortcomings and deficiencies. Utility Model Content
[0004] The utility model aims to provide a glue filling device, which solves the technical problem that the conventional glue filling process of photovoltaic electronic equipment will produce cavities and bubbles, and the sealing glue inside the photovoltaic electronic equipment will be reduced after the glue filling is completed, and air will flow back into the interior of the photovoltaic electronic equipment.
[0005] To achieve the above-mentioned purpose, the present invention provides a glue pouring device, which is used to pour glue into the inner cavity of a photovoltaic electronic device. The glue pouring device includes:
[0006] a glue filling port and an exhaust port for communicating with the inner cavity, wherein the glue filling port is located at the lower part of the inner cavity, and the exhaust port is located at the top of the inner cavity;
[0007] A glue filling tube with openings at both ends, one end of which is connected to the glue filling machine and the other end is connected to the glue filling port;
[0008] An exhaust nozzle is arranged at the exhaust port and connected to the exhaust port. The exhaust nozzle is provided with an exhaust nozzle cover, and the exhaust nozzle cover is used to close the exhaust nozzle after the glue filling is completed.
[0009] Preferably, a first hollow channel is provided in the exhaust nozzle, one end of the first hollow channel is connected to the exhaust port, and the other end of the first hollow channel is connected to the outside air.
[0010] Preferably, the end of the first hollow channel communicating with the outside air opens vertically upward, and the end of the first hollow channel communicating with the outside air is higher than the top of the inner cavity of the photovoltaic electronic device.
[0011] Preferably, the exhaust nozzle cover is used to close the end of the first hollow channel connected to the outside air after the glue filling is completed.
[0012] Preferably, the exhaust port is located on the side or top of the photovoltaic electronic device.
[0013] Preferably, it further comprises a glue filling nozzle, which is arranged between the glue filling tube and the glue filling port.
[0014] Preferably, a second hollow channel is provided in the glue pouring nozzle, one end of the second hollow channel is connected to the glue pouring port, and the other end of the second hollow channel is connected to the glue pouring tube.
[0015] Preferably, the opening of one end of the second hollow channel connected to the glue filling tube is vertically upward.
[0016] Preferably, the exhaust nozzle is connected to the exhaust port by threading, bonding, snap-fitting or rivets, and / or the glue filling nozzle is connected to the glue filling port by threading, bonding, snap-fitting or rivets.
[0017] Preferably, the exhaust nozzle and the exhaust port are sealed by a seal or an interference fit, and / or the glue pouring nozzle and the glue pouring port are sealed by a seal or an interference fit.
[0018] Compared with the above-mentioned background technology, the glue filling equipment provided by the present invention has a glue filling port located at the lower part of the inner cavity of the photovoltaic electronic device, and an exhaust port located at the top of the inner cavity of the photovoltaic electronic device. The potting glue is injected into the inner cavity through the glue filling port. When the liquid level of the potting glue rises to fill the inner cavity of the photovoltaic electronic device and overflows into the exhaust port, the exhaust port cover seals the exhaust port. On the one hand, the potting glue cannot overflow from the glue filling port due to the external atmospheric pressure. On the other hand, since the liquid potting glue has a certain tension, air cannot enter the inner cavity from the glue filling port, which can ensure that air will not enter the inner cavity of the photovoltaic electronic device after glue filling, thereby avoiding the occurrence of potting glue missing cavities. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.
[0020] Figure 1 This is a structural diagram of the glue filling equipment provided in Example 1 of the present utility model;
[0021] Figure 2 for Figure 1 The cross-sectional diagram of the glue filling equipment shown is during glue filling;
[0022] Figure 3 for Figure 1 The schematic cross-sectional view of the potting equipment after the potting glue is filled with the inner cavity of the photovoltaic electronic device;
[0023] Figure 4 A structural diagram of a glue filling device provided by another embodiment of the present invention;
[0024] Figure 5 for Figure 4 Exploded view of the glue filling equipment shown;
[0025] Figure 6 for Figure 4 The cross-sectional diagram of the glue filling equipment shown is during glue filling;
[0026] Figure 7 for Figure 4 The schematic cross-sectional view of the potting equipment after the potting glue fills the inner cavity of the photovoltaic electronic device.
[0027] Figures 1 to 7 Reference numerals in the accompanying drawings: 10, photovoltaic electronic device; 11, glue filling port; 12, exhaust port; 13, inner cavity; 20, glue filling tube; 30, exhaust nozzle; 301, first hollow channel; 31, exhaust nozzle cover; 40, glue filling nozzle; 401, second hollow channel; 50, potting glue. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0029] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0030] The utility model provides a glue filling device, which can improve the problem of a photovoltaic electronic device 10 that bubbles are easily generated and the glue is not fully filled due to defects in the glue filling process.
[0031] Please refer to Figures 1 to 3 One embodiment of the present invention provides a glue filling device, which is used to fill glue into the inner cavity 13 of the photovoltaic electronic device 10. The glue filling device includes a glue filling port 11 and an exhaust port 12 for communicating with the inner cavity 13. The glue filling port 11 is located at the lower part of the inner cavity 13, and the exhaust port 12 is located at the top of the inner cavity 13; the glue filling device also includes a glue filling tube 20 and an exhaust nozzle 30. Openings are provided at both ends of the glue filling tube 20. One end of the glue filling tube 20 is used to be connected to the glue filling machine, and the other end of the glue filling tube 20 is connected to the glue filling port 11; the exhaust nozzle 30 is provided at the exhaust port 12, and the exhaust nozzle 30 is connected to the exhaust port 12. The exhaust nozzle 30 is provided with an exhaust nozzle cover 31, and the exhaust nozzle cover 31 is used to close the exhaust nozzle 30 after glue filling is completed.
[0032] During operation, after the glue filling machine injects the potting glue 50 into the glue filling tube 20, the potting glue 50 is injected into the inner cavity 13 through the glue filling port 11. During the process of injecting the potting glue 50 into the inner cavity 13 of the photovoltaic electronic device 10, since the density of the potting glue 50 is much greater than that of air, the original air in the inner cavity 13 of the photovoltaic electronic device 10 is discharged from the exhaust port 12 set at the highest position of the inner cavity 13 of the photovoltaic electronic device 10. During the glue filling process, the liquid level of the potting glue 50 rises vertically until the inner cavity 13 of the photovoltaic electronic device 10 is filled with the potting glue 50. When the liquid level of the potting glue 50 rises to fill the inner cavity 13 of the photovoltaic electronic device 10 and overflows into the exhaust nozzle 30, the glue injection is stopped at this time, and the exhaust nozzle cover 31 is placed on the exhaust nozzle 30 to seal it, and then the glue filling tube 20 is removed. Since the liquid potting glue 50 has a certain tension, air cannot enter the inner cavity 13 from the potting glue port 11, and the potting glue 50 cannot overflow from the potting glue port 11 due to the external atmospheric pressure. This can ensure that air does not enter the inner cavity 13 of the photovoltaic electronic device 10, resulting in a cavity where the potting glue 50 is missing. After removing the potting glue tube 20, immediately seal the potting glue port 11, then remove the exhaust nozzle 30 and seal the exhaust port 12. The photovoltaic electronic device 10 can continue to be produced without waiting for the potting glue 50 to solidify, which can improve production efficiency. Alternatively, the potting glue port 11 can be sealed after removing the potting glue tube 20, and the exhaust nozzle 30 can be removed after the potting glue 50 is completely solidified, and then the exhaust port 12 can be sealed.
[0033] With such a configuration, the potting glue 50 cannot overflow from the potting port 11 due to the external atmospheric pressure. Since the liquid potting glue 50 has a certain tension, air cannot enter the inner cavity 13 from the potting port 11. This ensures that no air enters the inner cavity 13 of the photovoltaic electronic device 10 after potting, thereby avoiding the generation of voids due to missing potting glue 50.
[0034] Please refer to Figures 1 to 3 The exhaust nozzle 30 is provided with a first hollow channel 301, one end of the first hollow channel 301 is connected to the exhaust port 12, and the other end of the first hollow channel 301 is connected to the outside air. The first hollow channel 301 is generally L-shaped.
[0035] Please refer to Figures 1 to 3 One end of the first hollow channel 301 communicating with the outside air opens vertically upward, and the end of the first hollow channel 301 communicating with the outside air is higher than the top of the inner cavity 13 of the photovoltaic electronic device 10.
[0036] Please refer to Figures 1 to 3 The exhaust nozzle cover 31 is used to close one end of the first hollow channel 301 connected to the outside air after the glue filling is completed.
[0037] Please refer to Figures 1 to 3 In this embodiment, the exhaust port 12 is located on the side of the photovoltaic electronic device 10. In other embodiments, the exhaust port 12 can also be located on the top of the photovoltaic electronic device 10. The exhaust port 12 and the glue filling port 11 can be set on the same side or on different sides of the photovoltaic electronic device 10.
[0038] Please refer to Figures 4 to 7 Another embodiment of the present invention provides a glue filling device further comprising a glue filling nozzle 40 , which is disposed between the glue filling tube 20 and the glue filling port 11 .
[0039] For further information, please refer to Figures 4 to 7 A second hollow channel 401 is provided in the glue pouring nozzle 40 . The second hollow channel 401 is roughly L-shaped. One end of the second hollow channel 401 is connected to the glue pouring port 11 , and the other end of the second hollow channel 401 is connected to the glue pouring tube 20 .
[0040] For further information, please refer to Figures 4 to 7 The opening of one end of the second hollow channel 401 connected to the glue filling tube 20 is vertically facing upward.
[0041] The potting compound 50 enters the inner cavity 13 of the photovoltaic device 10 through the potting tube 20 and the potting nozzle 40. When the potting compound 50 level rises to fill the inner cavity 13 of the photovoltaic device 10 and overflows into the first hollow channel 301 of the exhaust nozzle 30, the potting compound is stopped and the exhaust nozzle cover 31 is placed on the exhaust nozzle 30. The exhaust nozzle cover 31 and the exhaust nozzle 30 are sealed together, forming a sealed structure in the inner cavity 13 of the photovoltaic device 10. The potting tube 20 is then removed, and the potting nozzle 40 is placed with the opening facing upward. Because the opening of the potting nozzle 40 is vertically upward and the density of the potting compound 50 is much greater than that of air, air cannot pass downward through the potting compound 50 and enter the interior of the photovoltaic device 10 along the second hollow channel 401 of the potting nozzle 40. Due to the external atmospheric pressure, the potting compound 50 cannot overflow from the opening of the potting nozzle 40, thus ensuring that air does not enter the interior of the photovoltaic device 10 and preventing the formation of a missing cavity of the potting compound 50. After removing the glue tube 20, wait until the potting compound 50 is completely cured before removing the glue nozzle 40 and the exhaust nozzle 30. Then, seal the glue port 11 and the exhaust port 12. Alternatively, the glue tube 20 and the glue nozzle 40 can be removed simultaneously, and then the glue port 11 can be immediately sealed. The exhaust nozzle 30 can then be removed and the exhaust port 12 sealed. In this way, the photovoltaic electronic device 10 can continue to be produced without waiting for the potting compound 50 to cure, thereby improving production efficiency.
[0042] In the present invention, the exhaust nozzle 30 and the exhaust port 12 are connected by threaded connection, adhesive bonding, snap connection, or riveted connection, and / or the glue filling nozzle 40 and the glue filling port 11 are connected by threaded connection, adhesive bonding, snap connection, or riveted connection, but are not limited to these. In this arrangement, the glue filling nozzle 40 and the exhaust nozzle 30 can be reused for glue filling operations on the next photovoltaic electronic device 10, saving costs and reducing waste.
[0043] The exhaust nozzle 30 is connected to the exhaust port 12 and is sealed therebetween. The exhaust nozzle 30 and the exhaust port 12 are sealed by a sealant or an interference fit, wherein the sealant may be a sealing ring. The exhaust nozzle 30 and the exhaust port 12 may also be sealed with a sealant, but is not limited thereto. And / or, the glue filling nozzle 40 is connected to the glue filling port 11 and is sealed therebetween. The glue filling nozzle 40 and the glue filling port 11 are sealed by a sealant or an interference fit, wherein the sealant may be a sealing ring. The glue filling nozzle 40 and the glue filling port 11 may also be sealed with a sealant, but is not limited thereto. The sealant may be made of a polymer material, or may be a metal material or other elastic material.
[0044] It should be noted that the difference between the two embodiments of the glue filling equipment provided by the present invention is that one embodiment is provided with a glue filling nozzle 40, while the other embodiment is not provided with a glue filling nozzle 40. However, both embodiments can improve the defects of the glue filling process of the photovoltaic electronic device 10 in the prior art. On the one hand, the potting glue 50 cannot overflow from the glue filling port 11 due to the external atmospheric pressure. On the other hand, since the liquid potting glue 50 has a certain tension, air cannot enter the inner cavity 13 from the glue filling port 11, which can ensure that no air will enter the inner cavity 13 of the photovoltaic electronic device 10 after glue filling, thereby avoiding the generation of voids caused by missing potting glue 50.
[0045] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.
[0046] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the present invention.
Claims
1. A glue filling device, characterized in that: The glue pouring device is used to pour glue into the inner cavity of the photovoltaic electronic device, and the glue pouring device includes: a glue filling port and an exhaust port for communicating with the inner cavity, wherein the glue filling port is located at the lower part of the inner cavity, and the exhaust port is located at the top of the inner cavity; A glue filling tube with openings at both ends, one end of which is connected to the glue filling machine and the other end is connected to the glue filling port; An exhaust nozzle is arranged at the exhaust port and connected to the exhaust port. The exhaust nozzle is provided with an exhaust nozzle cover, and the exhaust nozzle cover is used to close the exhaust nozzle after the glue filling is completed.
2. The glue filling equipment according to claim 1, characterized in that: A first hollow channel is provided in the exhaust nozzle, one end of the first hollow channel is communicated with the exhaust port, and the other end of the first hollow channel is communicated with the outside air.
3. The glue filling equipment according to claim 2, characterized in that: One end of the first hollow channel communicating with the outside air opens vertically upward, and the end of the first hollow channel communicating with the outside air is higher than the top of the inner cavity of the photovoltaic electronic device.
4. The glue filling equipment according to claim 3, characterized in that: The exhaust nozzle cover is used to close the end of the first hollow channel connected to the outside air after the glue filling is completed.
5. The glue filling equipment according to claim 4, characterized in that: The exhaust port is located on the side or top of the photovoltaic electronic device.
6. The glue pouring equipment according to any one of claims 1 to 5, characterized in that: It also includes a glue filling nozzle, which is arranged between the glue filling tube and the glue filling port.
7. The glue filling equipment according to claim 6, characterized in that: A second hollow channel is provided in the glue pouring nozzle, one end of the second hollow channel is connected to the glue pouring port, and the other end of the second hollow channel is connected to the glue pouring tube.
8. The glue filling equipment according to claim 7, characterized in that: The opening of one end of the second hollow channel connected to the glue filling tube is vertically upward.
9. The glue filling equipment according to claim 6, characterized in that: The exhaust nozzle is connected to the exhaust port by threading, bonding, snap-fitting or rivets, and / or the glue pouring nozzle is connected to the glue pouring port by threading, bonding, snap-fitting or rivets.
10. The glue pouring equipment according to claim 9, characterized in that: The exhaust nozzle and the exhaust port are sealed by a sealing member or an interference fit, and / or the glue pouring nozzle and the glue pouring port are sealed by a sealing member or an interference fit.