Oxygen-free copper wire drawing device

Abstract

The utility model relates to an oxygen-free copper wire drawing device which comprises an outer sleeve and a negative pressure part, an inner die is arranged in the outer sleeve, a polishing structure acting on a copper wire is arranged on the inner die, the inner die divides the interior of the outer sleeve into a feeding cavity and a discharging cavity, a vent hole communicated with the feeding cavity and the discharging cavity is formed in the inner die, and the negative pressure part is arranged on the negative pressure part. Trumpet-shaped waste chip adsorption parts are arranged in the positions, close to the feeding cavity and the discharging cavity, of the inner mold, the large opening ends of the two waste chip adsorption parts are oppositely arranged, the discharging cavity is provided with a chip pumping part, the chip pumping part is located at the small opening ends of the waste chip adsorption parts, and the negative pressure part communicates with the chip pumping part through a ventilation pipe. According to the utility model, scraps generated by processing the polished copper wire can be prevented from splashing to the inner side wall of the outer cylinder sleeve or the outside of the outer cylinder sleeve to influence the working environment.

Description

Technical Field

[0001] The utility model relates to the technical field of copper wire processing equipment, in particular to an oxygen-free copper wire drawing device. Background Art

[0002] Oxygen-free copper wire is commonly used in power cables, telecommunications cables, and other applications. The wire is typically formed by repeatedly drawing a copper rod to reduce its diameter. During the drawing process, the wire surface must be treated to improve product quality.

[0003] Utility model application number CN208391758U discloses a polishing die for oxygen-free copper wire drawing, comprising an outer die and an inner die. The outer die is tubular with a tapered inner hole, while the inner die has a tapered outer wall that conforms to the inner hole of the outer die. The inner die has a first bell mouth at its large end and a second bell mouth at its small end. A through hole for polishing is defined between the first and second bell mouths. Debris generated during the wire polishing process can be removed by airflow.

[0004] Although the above-mentioned device can remove the debris generated during the copper wire polishing process through airflow, the debris is easily splashed everywhere during the airflow blowing process. Some of the debris will adhere to the inner wall of the outer mold and the outer surface of the copper wire, and some of the debris will splash to the outside of the outer mold, affecting the device and its surrounding environment. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the utility model provides an oxygen-free copper wire drawing device, and the specific technical solution is as follows:

[0006] An oxygen-free copper wire drawing device includes an outer cylinder sleeve and a negative pressure part. An inner mold is provided inside the outer cylinder sleeve, and a polishing structure acting on the copper wire is provided on the inner mold. The inner mold divides the interior of the outer cylinder sleeve into a feed chamber and a discharge chamber. The inner mold is provided with an air vent connecting the feed chamber and the discharge chamber. The inner mold is provided with a trumpet-shaped waste adsorbent near the feed chamber and the discharge chamber. The large ends of the two waste adsorbents are arranged facing each other. The discharge chamber is provided with a chip extraction part, and the chip extraction part is located at the small end of the waste adsorbent. The negative pressure part is connected to the chip extraction part through a vent pipe.

[0007] As an improvement of the above technical solution: the polishing structure is a polishing hole opened at the central axis of the inner mold, and trumpet grooves are provided at both ends of the polishing hole.

[0008] As an improvement of the above technical solution: the chip extraction part includes an annular sleeve, the center of the annular sleeve is arranged coaxially with the polishing hole, and the outer wall of the annular sleeve is arranged in a circular array with multiple vertical dust suction branch pipes, one end of the vertical dust suction branch pipe is located on the outside of the annular sleeve, and the other side of the vertical dust suction branch pipe passes through the interior of the annular sleeve and extends to the interior of the annular sleeve. The vertical dust suction branch pipe is connected to a horizontal dust suction branch pipe and a dust suction connecting pipe, and the other end of the horizontal dust suction branch pipe extends to the outside of the annular sleeve and faces the polishing hole, and the other end of the dust suction connecting pipe is located inside the annular sleeve.

[0009] As an improvement to the above technical solution: an annular cleaning brush adapted to the copper wire is connected to the inner side of the annular sleeve, and one end of the vertical dust suction branch pipe is located in the annular cleaning brush.

[0010] As an improvement of the above technical solution: the negative pressure part includes a vacuum cleaner, the suction end of the vacuum cleaner is connected to the ventilation pipe, and the other end of the ventilation pipe is connected to the annular sleeve.

[0011] As an improvement to the above technical solution: the waste adsorbent is an activated carbon plate or charcoal.

[0012] As an improvement to the above technical solution: the inner mold is cylindrical, and a plurality of the vent holes are provided, and the plurality of vent holes are distributed on the inner mold in a circular array.

[0013] As an improvement to the above technical solution: a positioning sleeve adapted to the copper wire is provided in the feed cavity, and the positioning sleeve is coaxially arranged with the polishing hole.

[0014] Beneficial effects of the utility model:

[0015] 1. When the oxygen-free copper wire is polished during the wire drawing process, one end of the copper wire passes through the positioning sleeve, the polishing hole and the annular cleaning brush in sequence, and then the copper wire is pulled out from the feed chamber to the discharge chamber through the wire mechanism. When it is pulled out, the surface of the copper wire is polished through the polishing hole. Most of the waste chips generated by polishing will splash into the two waste chip adsorbents placed in the feed chamber and the discharge chamber through the horn grooves at both ends of the polishing hole. At the same time, the vacuum cleaner is started, and some of the waste chips will be adsorbed on the inner wall of the outer cylinder sleeve of the waste chip adsorbent during the suction process. Some of the waste chips will enter the annular sleeve through the vertical dust suction branch pipe and the horizontal dust suction branch pipe, and then be extracted through the vent pipe, thereby avoiding the waste chips generated during the polishing of the copper wire from splashing everywhere on the inner wall of the outer cylinder sleeve or the outside of the outer cylinder sleeve, affecting the working environment.

[0016] 2. During the process of pulling out and polishing the copper wire, the outer side of the copper wire will pass through the annular cleaning brush, and the waste chips adsorbed on the outer side of the copper wire will be cleaned by the annular cleaning brush to maintain the cleanliness of the copper wire after polishing, thereby improving the processing quality of the copper wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the vertical structure of the annular sleeve in the utility model;

[0019] Figure 3 It is a schematic diagram of the structure between the dust suction branch pipe and the horizontal dust suction branch pipe in the present invention.

[0020] Figure numerals: 1, outer sleeve; 100, copper wire; 101, feed chamber; 102, discharge chamber; 2, vacuum cleaner; 21, vent pipe; 3, inner mold; 30, polishing hole; 31, vent hole; 32, horn groove; 4, waste debris adsorbent; 5, positioning sleeve; 6, annular sleeve; 61, vertical dust suction branch pipe; 62, horizontal dust suction branch pipe; 63, dust suction connecting pipe; 7, annular cleaning brush. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0022] Example

[0023] Please refer to Figure 1-Figure 3 The oxygen-free copper wire drawing device includes an outer cylinder sleeve 1 and a negative pressure part. The inner mold 3 is provided inside the outer cylinder sleeve 1, and the inner mold 3 is inserted into the outer cylinder sleeve 1 or fixedly installed inside the outer cylinder sleeve 1. The inner mold 3 is provided with a polishing structure acting on the copper wire. The inner mold 3 divides the interior of the outer cylinder sleeve 1 into a feed chamber 101 and a discharge chamber 102. The inner mold 3 is provided with an air vent 31 connecting the feed chamber 101 and the discharge chamber 102. The inner mold 3 is provided with a trumpet-shaped waste adsorption part 4 near the feed chamber 101 and the discharge chamber 102. The large ends of the two waste adsorption parts 4 are arranged facing each other. The discharge chamber 102 is provided with a chip extraction part, and the chip extraction part is located at the small end of the waste adsorption part 4. The negative pressure part is connected to the chip extraction part through a vent pipe 21.

[0024] In an optional embodiment: the polishing structure is a polishing hole 30 opened at the central axis of the inner mold 3, and a trumpet groove 32 is provided at both ends of the polishing hole 30. The trumpet groove 32 is used to conveniently guide the dust splashed by the waste chips into the feed chamber 101 or the discharge chamber 102, so as to facilitate dust extraction.

[0025] In an optional embodiment: the chip extraction part includes an annular sleeve 6, the center of the annular sleeve 6 is coaxially arranged with the polishing hole 30, and the outer wall of the annular sleeve 6 is circularly arranged with multiple vertical dust suction branch pipes 61, one end of the vertical dust suction branch pipe 61 is located on the outside of the annular sleeve 6, and the other side of the vertical dust suction branch pipe 61 passes through the interior of the annular sleeve 6 and extends to the interior of the annular sleeve 6, and the vertical dust suction branch pipe 61 is connected to a horizontal dust suction branch pipe 62 and a dust suction connecting pipe 63, the other end of the horizontal dust suction branch pipe 62 extends to the outside of the annular sleeve 6 and faces the polishing hole 30, and the other end of the dust suction connecting pipe 63 is located inside the annular sleeve 6, so that the waste chips near the inner side of the waste chip adsorption part 4 can be adsorbed through one end of the vertical dust suction branch pipe 61, and the other end of the vertical dust suction branch pipe 61 can adsorb the waste chips adhered to the surface of the derived copper wire 100, and the waste chips splashed near the polishing hole 30 and the horn groove 32 can be sucked through the horizontal dust suction branch pipe 62.

[0026] In an optional embodiment: an annular cleaning brush 7 adapted to the copper wire is connected to the inner side of the annular sleeve 6, one end of the vertical dust suction branch pipe 61 is in the annular cleaning brush 7, and the annular cleaning brush 7 can clean the surface of the copper wire 100. When the waste debris on the surface of the copper wire 100 is adsorbed by one end of the vertical dust suction branch pipe 61, the waste debris on the annular cleaning brush 7 can also be cleaned to maintain the cleanliness of the annular cleaning brush 7.

[0027] In an optional embodiment, the negative pressure unit includes a vacuum cleaner 2, the suction end of which is connected to a vent pipe 21, the other end of which is connected to an annular sleeve 6. Furthermore, this end of the vent pipe 21 can be detachably connected to the annular sleeve 6, such as by a snap-fit ​​or threaded connection, for ease of assembly. Specifically, solenoid valves can be installed on the vertical dust suction branch pipe 61 and the horizontal dust suction branch pipe 62 to facilitate the diversion effect of the vertical dust suction branch pipe 61 or the horizontal dust suction branch pipe 62.

[0028] In an optional embodiment, the waste adsorbent 4 is an activated carbon plate or charcoal, which can effectively adsorb waste generated by polishing the copper wire.

[0029] In an optional embodiment: the inner mold 3 is cylindrical, and a plurality of vent holes 31 are provided, and the plurality of vent holes 31 are distributed in a circular array on the inner mold 3, so that the waste chips splashed from the feed cavity 101 can be evenly introduced from the vent holes 31 into the discharge cavity 102 and sucked away.

[0030] In an optional embodiment: a positioning sleeve 5 adapted to the copper wire is provided in the feed cavity 101, and the positioning sleeve 5 is arranged coaxially with the polishing hole 30. Specifically, the positioning sleeve 5 can guide the copper wire 100 fed into the inner part of the outer cylinder sleeve 1, and the positioning sleeve 5 and the annular sleeve 6 can be fixedly connected to the inner mold 3 through a connecting bracket.

[0031] The polishing hole 30 of the polishing hole 30 is polished, and the polishing hole 30 of the polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished. The polishing hole 30 is polished, and the polishing hole 30 is polished, and the polishing hole 30 is polished.

[0032] In the process of pulling out and polishing the copper wire 100, the outer side of the copper wire 100 will pass through the annular cleaning brush 7, and the annular cleaning brush 7 will clean the waste chips adsorbed on the outer side of the copper wire 100, thereby maintaining the cleanliness of the copper wire 100 after polishing, and improving the processing quality of the copper wire 100.

[0033] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Oxygen-free copper wire drawing device, characterized in that, The invention comprises an outer sleeve (1) and a negative pressure part, wherein an inner mold (3) is provided inside the outer sleeve (1), and a polishing structure acting on the copper wire is provided on the inner mold (3), and the inner mold (3) divides the inner part of the outer sleeve (1) into a feed cavity (101) and a discharge cavity (102), and an air vent (31) is provided on the inner mold (3) for communicating with the feed cavity (101) and the discharge cavity (102), and the inner mold (3) is provided with a trumpet-shaped waste adsorption part (4) near the feed cavity (101) and the discharge cavity (102), and the discharge cavity (102) is provided with a waste extraction part, and the waste extraction part is located at the small end of the waste adsorption part (4), and the negative pressure part is connected to the waste extraction part through a vent pipe (21).

2. The oxygen-free copper wire drawing device according to claim 1, characterized in that: The polishing structure is a polishing hole (30) opened at the central axis of the inner mold (3), and both ends of the polishing hole (30) are provided with horn grooves (32).

3. The oxygen-free copper wire drawing device according to claim 2, characterized in that: The chip extraction portion comprises an annular sleeve (6), the annular sleeve (6) and the polishing hole (30) are coaxially arranged, a plurality of vertical dust suction branch pipes (61) are arranged in a circular array on the outer wall of the annular sleeve (6), one end of the vertical dust suction branch pipe (61) is located outside the annular sleeve (6), the other side of the vertical dust suction branch pipe (61) passes through the interior of the annular sleeve (6) and extends to the interior of the annular sleeve (6), the vertical dust suction branch pipe (61) is connected to a horizontal dust suction branch pipe (62) and a dust suction connecting pipe (63), the other end of the horizontal dust suction branch pipe (62) extends to the outside of the annular sleeve (6) and faces the polishing hole (30), and the other end of the dust suction connecting pipe (63) is located inside the annular sleeve (6).

4. The oxygen-free copper wire drawing device according to claim 3, characterized in that: An annular cleaning brush (7) adapted to the copper wire is connected to the inner side of the annular sleeve (6), and one end of the vertical dust suction branch pipe (61) is located in the annular cleaning brush (7).

5. The oxygen-free copper wire drawing device according to claim 4, characterized in that: The negative pressure part comprises a dust collector (2), the dust collection end of the dust collector (2) is connected to a vent pipe (21), and the other end of the vent pipe (21) is connected to an annular sleeve (6).

6. The oxygen-free copper wire drawing device according to claim 1, characterized in that: The waste adsorption member (4) is an activated carbon plate or charcoal.

7. The oxygen-free copper wire drawing device according to claim 1, characterized in that: The inner mold (3) is cylindrical, and a plurality of vent holes (31) are provided. The plurality of vent holes (31) are distributed on the inner mold (3) in a circular array.

8. The oxygen-free copper wire drawing device according to claim 2, characterized in that: A positioning sleeve (5) adapted to the copper wire is provided in the feed cavity (101), and the positioning sleeve (5) is coaxially arranged with the polishing hole (30).

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