Diamond holder paste dipping mechanism
By designing a diamond holder dipping mechanism and utilizing the cooperation of a turntable and a dipping rod, automatic dipping of the diamond holder is achieved, thus solving the problem of low production efficiency in the prior art and improving production efficiency.
Patent Information
- Application Number
- CN202422761804.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-11-12
AI Technical Summary
The existing technology cannot realize automatic dipping of diamond holders, resulting in low production efficiency and failure to meet large-scale production needs.
A diamond holder dipping mechanism was designed, which included a turntable, a loading device, a paste taking device and a dipping rod. The diamond holder was adsorbed by a vacuum pump and the solder paste was dipped into the diamond holder, thus realizing an automated dipping process.
The automatic dipping of diamond holders into paste is realized, production efficiency is improved, the application range is wide, and the practicality is strong.
Smart Images
Figure CN223394605U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of diamond earring production, in particular to a diamond setting paste dipping mechanism. Background Art
[0002] As global consumers pursue personalization and high-quality life, jewelry designs inspired by nature have become a fashion trend. Diamond earrings are particularly popular, satisfying consumers' desire for nature and their pursuit of personalization and high-quality life.
[0003] Diamond stud earrings are primarily composed of an ear stud, a diamond holder, and a diamond. During the production process, energy storage welding is typically used to connect the ear stud and the diamond holder. To strengthen the connection, solder paste is typically added to the joint. However, due to the small size of the diamond holder, existing machines are unable to automatically dip the paste, requiring manual dipping. This prevents automated production, resulting in low production efficiency and an inability to meet large-scale production needs. Utility Model Content
[0004] The technical problem to be solved by the utility model is to provide a diamond holder dipping mechanism for the above-mentioned deficiencies in the prior art, which can automatically and orderly dip the diamond holder into the paste, effectively improving the production efficiency, and has the characteristics of wide application range and strong practicality.
[0005] The technical solution adopted by the utility model is: a diamond holder dipping paste mechanism, comprising a workbench, a turntable rotatably provided on the workbench, a plurality of support blocks provided on the turntable, positioning holes for placing ear needles provided on the support blocks, a column provided on the workbench, a loading device for grabbing the diamond holder provided on the column, a material trough for holding solder paste provided below the turntable, a paste taking device corresponding to the grabbing end of the loading device provided on one side of the material trough, a vibration disk for holding the diamond holder provided on the workbench, a discharge chute provided at the outlet end of the vibration disk, and the discharge chute located below the loading device.
[0006] As a further improvement, the loading device includes an electric slide rail, a slide cylinder, a mounting block, a material feeding pipe and a vacuum pump. The vacuum pump is installed on the workbench, the electric slide rail is installed on the column, the slide cylinder is installed on the slider of the electric slide rail, the mounting block is connected to the output end of the slide cylinder, the material feeding pipe is installed on the mounting block, and the upper end of the material feeding pipe is connected to the vacuum pump through an air pipe.
[0007] Furthermore, the paste-taking device includes a mounting base, a rotating and swinging cylinder, a rotating head and a dipping rod. The rotating and swinging cylinder is installed on a workbench on one side of the material trough through the mounting base. The rotating head is connected to the output end of the rotating and swinging cylinder, and the dipping rod is vertically connected to the rotating head.
[0008] Furthermore, the dipping rod, the material taking tube and the material discharging chute are all on the same vertical plane.
[0009] Furthermore, a linear guide rail is provided between the material storage trough and the vibration plate, a material storage block is slidably provided on the linear guide rail, a V-shaped slide is provided between the material storage block and the discharge chute, and both ends of the V-shaped slide are respectively connected to the material storage block and the discharge chute.
[0010] Furthermore, the V-shaped chute is arranged to be tilted downward from the discharge chute to the storage block, and a baffle plate is provided at the lowest end of the V-shaped chute.
[0011] Furthermore, the discharging chute is arranged at an angle, and a protective plate is provided at the connection between the discharging chute and the V-shaped chute.
[0012] Beneficial effects
[0013] Compared with the prior art, the present invention has the following advantages:
[0014] The utility model discloses a diamond holder paste dipping mechanism. Under the action of a vibration plate, the diamond holder is output in an orderly manner through a discharging chute. Under the action of an inclined arrangement, the diamond holder enters a V-shaped chute. Under the action of gravity, the larger end of the diamond holder faces upward and is transported to a storage block through the V-shaped chute. The slider is controlled by an electric slide rail to reach the top of the storage block. The output end of the slide cylinder moves downward, driving the material taking pipe to move downward. When the material taking pipe contacts the diamond holder, the vacuum pump starts to work and draws a vacuum, so that the material taking pipe adsorbs the diamond holder. Then, under the control of the electric slide rail, the diamond holder is adsorbed above the paste taking device. The rotation and swing of the paste taking device The cylinder rotates the rotating head to rotate the dipping rod into the material trough to dip the solder paste. After dipping is completed, it rotates 180° under the action of the rotating swing cylinder, so that the dipping rod is arranged upward. At this time, under the action of the slide cylinder, the material taking tube drives the diamond holder to move downward, so that the diamond holder contacts the dipping rod, thereby completing the dipping process. Afterwards, under the action of the electric slide rail and the slide cylinder, the diamond holder dipped in solder paste is placed in the positioning hole to wait for the next step. The entire dipping process fully realizes automated loading, and the diamond drag can be automatically and orderly dipped in paste, effectively improving production efficiency. It is easy to use and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the main structure of the utility model;
[0016] Figure 2 for Figure 1 A magnified schematic diagram of the structure at B in the middle;
[0017] Figure 3 This is a schematic diagram of the top structure of the utility model;
[0018] Figure 4 for Figure 3 Enlarged schematic diagram of the structure at A in the middle;.
[0019] Among them: 1- workbench, 2- loading device, 3- turntable, 4- support block, 5- positioning hole, 6- mounting seat, 7- rotary swing cylinder, 8- material trough, 9- dipping rod, 10- rotating head, 11- vacuum pump, 12- linear guide, 13- material storage block, 14- V-type slide, 15- column, 16- discharging chute, 17- vibration plate, 18- protective plate, 19- diamond support, 20- material baffle, 21- electric slide, 22- slider, 23- slide cylinder, 24- mounting block, 25- material taking pipe. DETAILED DESCRIPTION
[0020] The present invention will be further described below with reference to the specific embodiments in the accompanying drawings.
[0021] See Figure 1-4As shown, the present invention is a diamond holder dipping paste mechanism, comprising a workbench 1, a turntable 3 is rotatably provided on the workbench 1, a plurality of support blocks 4 are provided on the turntable 3, and a positioning hole 5 for placing an ear needle is provided on the support block 4, a column 15 is provided on the workbench 1, and a loading device 2 for grabbing a diamond holder 19 is provided on the column 15, a material trough 8 for holding solder paste is provided below the turntable 3, and a paste taking device corresponding to the grabbing end of the loading device 2 is provided on one side of the material trough 8, and the workbench 1 is provided with a material for holding the diamond holder 19. 9 of the vibration plate 17, the vibration plate 17 outlet end is provided with a discharge chute 16, the discharge chute 16 is located below the feeding device 2, under the action of the vibration plate 17, the diamond holder 19 is orderly output through the discharge chute 16, under the action of the inclined arrangement, enter the V-shaped chute 14, under the action of gravity, the larger end of the diamond holder 19 is facing upward, and is transported to the storage block 13 through the V-shaped chute 14, and the slider 22 is controlled by the electric slide rail 21 to reach the top of the storage block 13, and the output end of the slide cylinder 23 is downward. The movement drives the material taking tube 25 to move downward. When the material taking tube 25 contacts the diamond holder 19, the vacuum pump 11 starts to work and draws vacuum, so that the material taking tube 25 adsorbs the diamond holder 19. Then, under the control of the electric slide 21, the diamond holder 19 is adsorbed above the paste taking device. The rotary swing cylinder 7 of the paste taking device rotates the rotary head 10 to rotate the dipping rod 9 into the material tank 8 to dip the solder paste. After the dipping is completed, the rotary swing cylinder 7 rotates 180 degrees under the action of the rotary swing cylinder 7, so that the dipping rod 9 is arranged upward. At this time, under the action of the slide cylinder 23, the material taking tube 25 drives the diamond holder 19 to move downward, so that the diamond holder 19 contacts the dipping rod 9, so that the solder paste on the dipping rod 9 sticks to the bottom of the diamond holder 19, thereby completing the dipping process. Afterwards, under the action of the electric slide rail 21 and the slide cylinder 23, the diamond holder 19 dipped in solder paste is placed in the positioning hole 5 to wait for the next step. The entire dipping process fully realizes automated loading, and the diamond holder can be automatically and orderly dipped in paste, effectively improving production efficiency.
[0022] Specifically, the loading device 2 includes an electric slide 21, a slide cylinder 23, a mounting block 24, a feeding pipe 25 and a vacuum pump 11. The vacuum pump 11 is installed on the workbench 1, the electric slide 21 is installed on the column 15, the slide cylinder 23 is installed on the slider 22 of the electric slide 21, the mounting block 24 is connected to the output end of the slide cylinder 23, and the feeding pipe 25 is installed on the mounting block 24. The upper end of the feeding pipe 25 is connected to the vacuum pump 11 through an air pipe, and the slider 22 is controlled by the electric slide 21 to reach above the material storage block 13. The output end of the slide cylinder 23 moves downward, driving the feeding pipe 25 to move downward. When the feeding pipe 25 contacts the diamond holder 19, the vacuum pump 11 starts to work and draws vacuum, so that the feeding pipe 25 adsorbs the diamond holder 19, thereby completing the grabbing and transportation of the diamond holder 19.
[0023] Preferably, the paste taking device includes a mounting base 6, a rotating oscillating cylinder 7, a rotating head 10 and a dipping rod 9. The rotating oscillating cylinder 7 is mounted on the workbench 1 on one side of the material trough 8 through the mounting base 6. The rotating head 10 is connected to the output end of the rotating oscillating cylinder 7. The dipping rod 9 is vertically connected to the rotating head 10. The rotating oscillating cylinder 7 is a blade-type rotating oscillating cylinder that can only rotate 180°. The rotating oscillating cylinder 7 rotates the dipping rod 9 into the material trough 8 to dip the solder paste by rotating the rotating head 10. After the dipping is completed, it rotates 180° under the action of the rotating oscillating cylinder 7, so that the dipping rod 9 is arranged upward to facilitate dipping the bottom of the diamond holder 19 into the paste.
[0024] Furthermore, the dipping rod, the material taking tube 25 and the material discharging chute 16 are all on the same vertical plane, so that under the action of the electric slide rail 21, the diamond holder 19 can complete the dipping process during the loading process, which is conducive to speeding up production efficiency.
[0025] Furthermore, a linear guide rail 12 is provided between the material storage trough 8 and the vibration plate 17, and a material storage block 13 is slidingly provided on the linear guide rail 12. A V-shaped chute 14 is provided between the material storage block 13 and the discharge chute 16. The two ends of the V-shaped chute 14 are respectively connected to the material storage block 13 and the discharge chute 16. By adjusting the position of the material storage block 13, the V-shaped chute 14 can be accurately aligned with the discharge chute 16, thereby adapting to different installation environments.
[0026] Furthermore, the V-shaped chute 14 is arranged downwardly inclined from the discharge chute 16 toward the storage block 13, and a baffle plate 20 is provided at the lowest end of the V-shaped chute 14. The baffle plate 20 prevents the diamond holder 19 from falling, and the inclined arrangement is conducive to the sliding transportation of the diamond holder 19.
[0027] Furthermore, the discharging chute 16 is arranged at an angle, which is beneficial for the sliding transportation of the diamond holder 19. A protective plate 20 is provided at the connection between the discharging chute 16 and the V-shaped chute 14 to play a protective role and prevent it from falling when the connection is excessive.
[0028] When a diamond holder paste dipping mechanism of the present embodiment is in use, under the action of the vibration plate 17, the diamond holder 19 is output in an orderly manner through the discharge chute 16, and under the action of the inclined arrangement, it enters the V-shaped chute 14. Under the action of gravity, the larger end of the diamond holder 19 is facing upward, and is transported to the storage block 13 through the V-shaped chute 14. The slider 22 is controlled by the electric slide 21 to reach the top of the storage block 13, and the output end of the slide cylinder 23 moves downward, driving the material taking pipe 25 to move downward. When the material taking pipe 25 contacts the diamond holder 19, the vacuum pump 11 starts to work and draws vacuum, so that the material taking pipe 25 adsorbs the diamond holder 19, and then under the control of the electric slide 21, the diamond holder 19 is adsorbed above the paste taking device to take the paste. The rotary swing cylinder 7 of the device rotates the rotating head 10 to rotate the dipping rod 9 into the material trough 8 to dip the solder paste. After the dipping is completed, it rotates 180 degrees under the action of the rotary swing cylinder 7, so that the dipping rod 9 is arranged upward. At this time, under the action of the slide cylinder 23, the material taking tube 25 drives the diamond holder 19 to move downward, so that the diamond holder 19 contacts the dipping rod 9, so that the solder paste on the dipping rod 9 sticks to the bottom of the diamond holder 19, thereby completing the dipping process. Afterwards, under the action of the electric slide rail 21 and the slide cylinder 23, the diamond holder 19 dipped in solder paste is placed in the positioning hole 5 to wait for the next step. The entire dipping process fully realizes automated loading, and the diamond drag can be automatically and orderly dipped in paste, effectively improving production efficiency. The diamond holder dipping mechanism of the utility model can automatically and orderly dip the diamond drag in paste, effectively improving production efficiency, and has the characteristics of wide application range and strong practicality.
[0029] The above is only a preferred embodiment of the present invention. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the structure of the present invention. These modifications and improvements will not affect the effect of the implementation of the present invention and the practicality of the patent.
Claims
1. A diamond setting paste dipping mechanism, comprising a workbench (1), a turntable (3) rotatably provided on the workbench (1), a plurality of support blocks (4) provided on the turntable (3), and positioning holes (5) for placing ear needles provided on the support blocks (4), characterized in that: The workbench (1) is provided with a column (15), and the column (15) is provided with a loading device (2) for grabbing a diamond holder (19). A material trough (8) for holding solder paste is provided below the turntable (3), and a paste-taking device corresponding to the grabbing end of the loading device (2) is provided on one side of the material trough (8). The workbench (1) is provided with a vibration plate (17) for holding the diamond holder (19), and a discharge chute (16) is provided at the outlet end of the vibration plate (17), and the discharge chute (16) is located below the loading device (2).
2. A diamond setting paste dipping mechanism according to claim 1, characterized in that: The feeding device (2) includes an electric slide rail (21), a slide cylinder (23), a mounting block (24), a feeding pipe (25) and a vacuum pump (11), wherein the vacuum pump (11) is mounted on the workbench (1), the electric slide rail (21) is mounted on the column (15), the slide cylinder (23) is mounted on the slider (22) of the electric slide rail (21), the mounting block (24) is connected to the output end of the slide cylinder (23), the feeding pipe (25) is mounted on the mounting block (24), and the upper end of the feeding pipe (25) is connected to the vacuum pump (11) through an air pipe.
3. The diamond setting paste dipping mechanism according to claim 2, characterized in that: The paste extracting device comprises a mounting base (6), a rotary oscillating cylinder (7), a rotary head (10) and a dipping rod (9); the rotary oscillating cylinder (7) is mounted on a workbench (1) on one side of a material trough (8) via the mounting base (6); the rotary head (10) is connected to the output end of the rotary oscillating cylinder (7); and the dipping rod (9) is vertically connected to the rotary head (10).
4. The diamond setting paste dipping mechanism according to claim 3, characterized in that: The dipping rod, the material taking pipe (25) and the material discharging chute (16) are all on the same vertical plane.
5. The diamond setting paste dipping mechanism according to claim 1, characterized in that: A linear guide rail (12) is provided between the material storage trough (8) and the vibration plate (17), a material storage block (13) is slidably provided on the linear guide rail (12), a V-shaped chute (14) is provided between the material storage block (13) and the discharge chute (16), and the two ends of the V-shaped chute (14) are respectively connected to the material storage block (13) and the discharge chute (16).
6. The diamond setting paste dipping mechanism according to claim 5, characterized in that: The V-shaped chute (14) is arranged to be tilted downward from the discharge chute (16) toward the storage block (13), and a baffle plate (20) is provided at the lowest end of the V-shaped chute (14).
7. The diamond setting paste dipping mechanism according to claim 5, characterized in that: The discharging chute (16) is arranged obliquely, and a protective plate (18) is provided at the connection between the discharging chute (16) and the V-shaped chute (14).