A circuit board solder paste thickness detection device

Abstract

The application discloses a circuit board tin paste thickness detection device, relates to the tin paste thickness detection field, and solves the problem that existing tin paste thickness detection devices are difficult to guarantee horizontal detection of tin paste, and comprises a device shell and a moving block, the inner side of the device shell is provided with an electric sliding table, the bottom of the electric sliding table is provided with a laser and a receiver, the inner wall of the bottom of the device shell is provided with a roller conveying frame, and the outer side of the device shell is provided with a control panel; further comprising: a fixed plate mechanism for correcting and positioning the circuit board and horizontally lifting, the fixed plate mechanism is installed on the inner side of the device shell, and the fixed plate mechanism comprises two push plates arranged on the two sides of the roller conveying frame; the fixed plate mechanism can first make the two push plates abut against the two sides of the circuit board, realizes the center positioning of the circuit board, then lifts the bottom of the circuit board, and makes the circuit board in a horizontal state below the laser and the receiver, so that the horizontal detection effect is achieved.

Description

Technical Field

[0001] This invention relates to the field of solder paste thickness detection, specifically to a circuit board solder paste thickness detection device. Background Technology

[0002] Circuit board solder paste is a key material used for soldering electronic components. It is a paste-like mixture made by mixing solder powder, flux, and other surfactants, thixotropic agents, etc. It is mainly used in the soldering process of surface mount technology, and forms a strong electrical and mechanical connection after being heated and melted.

[0003] Solder paste thickness measurement is a crucial and indispensable step in surface mount technology (SMT) production. The thickness directly determines the amount of solder at the final solder joint; too much or too little solder can lead to serious soldering defects. Typically, a laser thickness gauge is used to measure solder paste thickness. A laser emits a thin laser beam at a specific angle onto the circuit board, and a camera observes the thin straight line formed by the laser beam on the board. The height of the solder paste will create a height difference with its base, resulting in a discontinuity in the laser line. Based on this discontinuity, the height difference between the solder paste and the circuit board can be calculated using trigonometric functions. Existing thickness measurement devices place the circuit board under two lasers for measurement. However, because the pins of electronic components are inserted into the circuit board and soldered with solder paste, and each pin has a different length, it is difficult to keep the top surface of the circuit board, placed flat under the lasers, level, which affects the accuracy of the laser's solder paste thickness measurement. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit board solder paste thickness detection device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A circuit board solder paste thickness detection device includes: a device housing and a movable block disposed inside the device housing; an electric slide table cooperating with the movable block is fixedly installed inside the device housing; a laser for emitting laser light onto the solder paste and a receiver for receiving reflected light are disposed at the bottom of the electric slide table; data signals are transmitted to a computer via the laser and the receiver to detect the solder paste thickness; a roller conveyor is fixedly installed on the bottom inner wall of the device housing; and a control panel is fixedly installed on the outer side of the device housing; the device also includes: a plate fixing mechanism for correcting, positioning, and horizontally lifting the circuit board; the plate fixing mechanism is installed inside the device housing and includes two rollers symmetrically arranged on the rollers. The conveyor has push plates on both sides, which can correct and position the circuit board, improving the accuracy of solder paste thickness detection. A stop mechanism is used to block and discharge the conveyed circuit board. This stop mechanism is installed on both sides of the roller conveyor and includes two symmetrically arranged baffles on both sides of the roller conveyor. The baffles can block the circuit board during conveying, allowing the laser and receiver to perform solder paste thickness detection on the circuit board. An angle adjustment mechanism is used to synchronously adjust the laser and receiver. This angle adjustment mechanism is installed at the bottom of the moving block and includes a turntable at the bottom of the moving block. The turntable can synchronously adjust the angles of the laser and receiver.

[0007] Preferably, the fixed plate mechanism further includes two mounting boxes symmetrically fixedly installed inside the outer shell of the device. The two push plates are respectively located on the outer sides of the two mounting boxes. An electric telescopic rod is fixedly installed on the side of the mounting box away from the push plate. The output end of the electric telescopic rod extends to the inner side of the mounting box and is fixedly installed with a mounting plate. A plurality of push rods are fixedly installed between the side of the mounting plate away from the electric telescopic rod and the outer side of the push plate, and the push rods slide through the mounting box. An mounting rod is rotatably installed on the inner side of the mounting box. A plurality of swing rods are fixedly installed on the outer side of the mounting rod, each located directly below the push rod. The end of the swing rod away from the mounting rod extends to the outer side of the mounting box, and a moving groove for limiting the sliding of the swing rod is opened on the outer side of the mounting box. An arc-shaped rack is fixedly installed on the end of the swing rod near the mounting rod. A first rack is fixedly installed on the bottom of the push rod. A top plate is fixedly installed between the plurality of swing rods.

[0008] Preferably, the stopping mechanism further includes a positioning slide fixedly installed on the outside of the mounting box, two baffles slidably installed on the outside of the two positioning slides, a mounting groove is provided on the side of the mounting box near the positioning slide, and a positioning rod is rotatably installed on the inside of the mounting groove, a one-way gear is fixedly installed on the outside of the positioning rod, a one-way rack that cooperates with the one-way gear is fixedly installed on the side of the baffle near the mounting box, two symmetrically distributed driven gears are fixedly installed on the outside of the positioning rod, two symmetrically distributed second racks are fixedly installed on the side of the push plate near the mounting box, the second racks slide to the inside of the mounting box, and the two second racks are on the same horizontal line as the two driven gears, and two symmetrically distributed springs are fixedly installed between the outside of the baffle and one end of the positioning slide.

[0009] Preferably, the angle adjustment mechanism further includes a first motor fixedly installed on the top of the moving block, the output end of the first motor being fixedly connected to the top of the turntable, two symmetrically distributed mounting seats being fixedly installed on the bottom of the turntable, an adjusting rod being rotatably installed on the inner side of the mounting seat, a connecting plate being fixedly installed on the outer side of the adjusting rod, the two connecting plates being fixedly connected to the outer sides of the laser and the receiver respectively, a second motor being fixedly installed on the bottom of the turntable, and the output end of the second motor being fixedly connected to the adjacent adjusting rod, a synchronous belt being rotatably installed between the two adjusting rods.

[0010] Preferably, the outer side of the device housing is equipped with two symmetrically distributed transparent observation windows.

[0011] Preferably, a plurality of rubber pads are fixedly installed on the side of the push plate away from the push rod, and the pads are evenly distributed.

[0012] Preferably, two symmetrically distributed sleeves are fixedly installed on the inner side of the mounting box, and the outer side of the mounting rod is respectively connected to the two sleeves by two coil springs.

[0013] Preferably, a buffer pad is fixedly installed in the movable groove of the mounting box, and the side of the swing rod away from the top plate is in contact with the outer side of the buffer pad.

[0014] Preferably, a sliding sleeve is fixedly installed on the outer side of the second rack, and a sliding rod for limiting the sliding of the sliding sleeve is fixedly installed on the inner side of the mounting box.

[0015] Preferably, a retaining frame is fixedly installed between the two mounting seats, and the timing belt is located inside the retaining frame.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. The present invention uses a plate fixing mechanism to first make two push plates abut against the two sides of the circuit board to achieve the centering and positioning of the circuit board, and then lift the bottom of the circuit board so that the circuit board is in a horizontal state below the laser and receiver, thereby achieving the effect of horizontal detection and ensuring the accuracy of the laser and receiver in detecting the solder paste thickness.

[0018] 2. The present invention, through the stop plate mechanism, enables the circuit board to come into contact with two baffles when the roller conveyor is conveying the circuit board. The circuit board can then stop directly below the laser and receiver. After the laser and receiver have completed the detection of the solder paste thickness on the circuit board and the top plate has moved away from the bottom of the circuit board, the two baffles can move away from the circuit board, allowing the roller conveyor to convey and discharge the circuit board. This facilitates the sequential detection and conveying of multiple circuit boards.

[0019] 3. The present invention, through the angle adjustment mechanism, enables the first motor to work with the turntable to adjust the position of the laser and the receiver, thereby adjusting the laser emission position. In conjunction with the electric slide and the moving block, it facilitates the thickness detection of multiple solder pastes on the circuit board. Furthermore, the two connecting plates drive the laser and the receiver to adjust their height, ensuring that the distance between the laser and circuit boards with greater thickness remains consistent, thereby improving the efficiency of solder paste detection on the circuit board. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the roller conveyor frame and pusher plate structure in this invention;

[0022] Figure 3 This is a schematic diagram of the laser and receiver structure in this invention;

[0023] Figure 4 This is a schematic diagram of the swing arm and top plate structure in this invention;

[0024] Figure 5 This is a schematic diagram of the mounting plate and push rod structure in this invention;

[0025] Figure 6 This is a schematic diagram of the mounting rod and arc-shaped rack structure in this invention;

[0026] Figure 7 This is a schematic diagram of the positioning slide and driven gear structure in this invention;

[0027] Figure 8 This is a schematic diagram of the one-way gear and positioning rod structure in this invention.

[0028] In the diagram: 1. Device housing; 2. Moving block; 3. Electric slide table; 4. Laser; 5. Receiver; 6. Roller conveyor frame; 7. Control panel; 8. Push plate; 9. Baffle; 10. Turntable; 11. Mounting box; 12. Electric telescopic rod; 13. Mounting plate; 14. Push rod; 15. Mounting rod; 16. Swing rod; 17. Arc rack; 18. First rack; 19. Top plate; 20. Positioning slide; 21. Positioning rod; 22. One-way gear; 23. One-way rack; 24. Driven gear; 25. Second rack; 26. Spring; 27. First motor; 28. Mounting base; 29. ​​Adjusting rod; 30. Connecting plate; 31. Second motor; 32. Synchronous belt; 33. Transparent observation window; 34. Rubber pad; 35. Sleeve; 36. Buffer pad; 37. Sliding sleeve; 38. Sliding rod; 39. Baffle frame. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1: Please refer to Figures 1-8 The diagram illustrates a circuit board solder paste thickness detection device, comprising a device housing 1 and a movable block 2 disposed inside the device housing 1. An electric slide 3, cooperating with the movable block 2, is fixedly installed inside the device housing 1. The bottom of the electric slide 3 is equipped with a laser 4 for emitting laser light onto the solder paste and a receiver 5 for receiving the reflected light. The laser 4 emits laser light onto the solder paste and reflects it onto the receiver 5, transmitting the data signal to a computer to detect the solder paste thickness. The electric slide 3 can drive the movable block 2 to move horizontally, adjusting the position of the laser 4 and receiver 5, facilitating thickness detection of multiple solder paste locations on the circuit board. A roller conveyor 6 is fixedly installed on the bottom inner wall of the device housing 1, transporting the circuit board to be tested below the laser 4 and receiver 5. A control panel 7 is fixedly installed on the outer side of the device housing 1 for displaying detection data. The device also includes a plate-fixing mechanism for correcting, positioning, and horizontally lifting the circuit board; the plate-fixing mechanism is installed inside the device housing 1.

[0031] The board positioning mechanism includes two push plates 8 symmetrically arranged on both sides of the roller conveyor frame 6. The push plates 8 can correct and position the circuit board, thereby improving the accuracy of solder paste thickness detection. The board positioning mechanism also includes two mounting boxes 11 symmetrically fixedly installed inside the device housing 1. The two push plates 8 are respectively located on the outer sides of the two mounting boxes 11. An electric telescopic rod 12 is fixedly installed on the side of the mounting box 11 away from the push plates 8. The output end of the electric telescopic rod 12 extends to the inner side of the mounting box 11 and is fixedly installed with a mounting plate 13. Multiple push rods 14 are fixedly installed between the side of the mounting plate 13 away from the electric telescopic rod 12 and the outer side of the push plates 8. The push rods 14 slide through the mounting box 11, allowing the electric telescopic rod 12 to pass through the mounting plate 11. 3. Multiple push rods 14 move synchronously, and the push rods 14 can push the push plate 8 close to the outer side of the circuit board, so that the two push plates 8 push the outer side of the circuit board synchronously, realizing the centering positioning of the circuit board. The mounting box 11 is rotatably mounted with a mounting rod 15. Multiple swing rods 16 are fixedly mounted on the outer side of the mounting rod 15, respectively located directly below the push rod 14. The end of the swing rod 16 away from the mounting rod 15 extends to the outer side of the mounting box 11, and the outer side of the mounting box 11 is provided with a moving groove for the swing rod 16 to slide in a limited position. An arc-shaped rack 17 is fixedly mounted on the end of the swing rod 16 near the mounting rod 15. The bottom of the push rod 14 is fixedly mounted with a first rack 18. When the electric telescopic rod 12 pulls the push plate 8 close to the outer side of the mounting box 11, the push rod 14 can The first rack 18 is able to contact the arc-shaped rack 17, and the first rack 18 can drive the swing arm 16 to swing through the arc-shaped rack 17, so that the swing arm 16 moves upward and closer to the bottom of the circuit board. A top plate 19 is fixedly installed between the multiple swing arms 16, so that when the swing arm 16 swings, the top plate 19 can lift the circuit board away from the roller conveyor frame 6, so that the circuit board can be horizontally positioned below the laser 4 and the receiver 5, thus achieving centering alignment and horizontal lifting of the circuit board. Two symmetrically distributed transparent observation windows 33 are installed on the outer side of the device housing 1 to facilitate observation of the solder paste detection. Multiple equidistantly distributed rubber pads 34 are fixedly installed on the side of the push plate 8 away from the push rod 14, so that the push plate 8 can move through the rubber pads 34 and the push rod 14. The outer side of the circuit board is in contact to prevent damage to the circuit board. Two symmetrically distributed sleeves 35 are fixedly installed on the inner side of the mounting box 11. The outer side of the mounting rod 15 is connected to the two sleeves 35 by two coil springs respectively. When the swing rod 16 drives the mounting rod 15 to rotate, the mounting rod 15 can retract the coil spring. When the first rack 18 moves away from the arc rack 17, the rebound force of the coil spring can be used to make the mounting rod 15 rotate and reset, so that the swing rod 16 can move away from the circuit board. A buffer pad 36 is fixedly installed in the moving groove of the mounting box 11, and the side of the swing rod 16 away from the top plate 19 is in contact with the outer side of the buffer pad 36. When the swing rod 16 swings and resets, it can contact the outer side of the buffer pad 36, providing protection for the reset of the swing rod 16.

[0032] In this application, the circuit board is clamped and positioned from the side by the push plate 8 to correct the position of the circuit board. Then, the circuit board is lifted by the side without pins to achieve horizontal placement of the circuit board, which solves the problem that the inconsistent pin height at the bottom of the circuit board affects the accuracy of the laser 4 in detecting the solder paste thickness.

[0033] Example 2: Please refer to Figures 2-8 This embodiment further illustrates Example 1. The stop mechanism shown in the figure includes two baffles 9 symmetrically arranged on both sides of the roller conveyor frame 6. The baffles 9 can block the circuit board in the conveying state, allowing the laser 4 and receiver 5 to perform thickness detection processing on the solder paste on the circuit board. The stop mechanism also includes a positioning slide 20 fixedly installed on the outside of the mounting box 11. The two baffles 9 are respectively slidably installed on the outside of the two positioning slides 20. The mounting box 11 has a mounting groove on the side near the positioning slide 20, and a positioning rod 21 is rotatably installed on the inner side of the mounting groove. A one-way gear 22 is fixedly installed on the outside of the positioning rod 21. A one-way rack 23 that cooperates with the one-way gear 22 is fixedly installed on the side of the baffle 9 near the mounting box 11, so that the one-way gear 22 drives the baffle 9 along the positioning slide 20 through the one-way rack 23. The outer side of the slide 20 moves unidirectionally. Two symmetrically distributed driven gears 24 are fixedly installed on the outer side of the positioning rod 21. Two symmetrically distributed second racks 25 are fixedly installed on the side of the push plate 8 near the mounting box 11. The second racks 25 slide to the inner side of the mounting box 11, and the two second racks 25 are on the same horizontal line as the two driven gears 24. Two symmetrically distributed springs 26 are fixedly installed between the outer side of the baffle 9 and one end of the positioning slide 20, so that when the push plate 8 moves away from the circuit board and approaches the outer side of the mounting box 11, it can drive the second racks 25 to contact the driven gears 24. The second racks 25 drive the positioning rod 21 to rotate through the driven gears 24. The positioning rod 21 drives the one-way gear 22 to rotate, so that the one-way gear 22 rotates freely and cannot drive the one-way rack 23 to move. When the push plate 8 moves away from the mounting box 11, the second rack 25 drives the driven gear 24 to rotate in the opposite direction. The driven gear 24 can then drive the one-way gear 22 to rotate in the opposite direction through the positioning rod 21, causing the one-way gear 22 to drive the one-way rack 23 to move. The one-way rack 23 can then drive the baffle 9 away from the circuit board and compress the spring 26. The roller conveyor 6 can then transport the circuit board that has been inspected. When the second rack 25 disengages from the driven gear 24, the spring force of the spring 26 is used to move the baffle 9 back to its original position, which is convenient for blocking the next circuit board. A sliding sleeve 37 is fixedly installed on the outer side of the second rack 25, and a sliding rod 38 for limiting the sliding of the sliding sleeve 37 is fixedly installed on the inner side of the mounting box 11. When the second rack 25 moves, it can drive the sliding sleeve 37 to move along the outer side of the sliding rod 38, which improves the smoothness of the movement of the second rack 25.

[0034] Example 3: Please refer to Figure 2 and Figure 3 This embodiment further illustrates other embodiments. The angle adjustment mechanism shown in the figure includes a turntable 10 disposed at the bottom of the movable block 2. The turntable 10 can synchronously adjust the angles of the laser 4 and the receiver 5. The angle adjustment mechanism also includes a first motor 27 fixedly installed on the top of the movable block 2. The output end of the first motor 27 is fixedly connected to the top of the turntable 10. Two symmetrically distributed mounting seats 28 are fixedly installed on the bottom of the turntable 10. An adjusting rod 29 is rotatably installed on the inner side of the mounting seat 28. A connecting plate 30 is fixedly installed on the outer side of the adjusting rod 29. The two connecting plates 30 are respectively fixedly connected to the outer sides of the laser 4 and the receiver 5. A second motor 31 is fixedly installed on the bottom of the turntable 10, and the output end of the second motor 31 is fixedly connected to the adjacent adjusting rod 29, so that the first motor 27 can adjust the angles of the laser 4 and the receiver 5. The two motors 31 can drive the corresponding adjusting rods 29 to rotate. A synchronous belt 32 is installed between the two adjusting rods 29 to make the two adjusting rods 29 rotate synchronously and drive the two connecting plates 30 to swing synchronously. As the connecting plates 30 swing, the height of the laser 4 and the receiver 5 can be adjusted, so that the laser 4 and the receiver 5 can detect the thickness of solder paste on circuit boards with greater thickness. The first motor 27 drives the turntable 10 to rotate, and with the cooperation of the electric slide table 3 and the moving block 2, the emission position of the laser 4 can be adjusted, which facilitates accurate thickness detection of solder paste in multiple places on the circuit board. A baffle 39 is fixedly installed between the two mounting bases 28, and the synchronous belt 32 is located inside the baffle 39, so that the baffle 39 provides protection for the synchronous belt 32.

[0035] Working principle: First, the operator places the circuit board to be tested at the front end of the roller conveyor 6. The roller conveyor 6 drives the circuit board towards the baffles 9, so that the circuit board contacts the outer sides of the two baffles 9. At this time, the two electric telescopic rods 12 push the corresponding mounting plates 13 towards the circuit board, so that the mounting plates 13 drive multiple push rods 14 to move synchronously. The multiple push rods 14 move along the inner side of the mounting box 11 and push the push plate 8 to contact the outer side of the circuit board, so that the two push plates 8 straighten and center the circuit board. Then, the electric telescopic rods 12 pull the mounting plates 13 back, so that the mounting plates 13 drive the push plates 8 to contact the outer side of the mounting box 11 via the push rods 14. At this point, the push rod 14 drives the first rack 18 to contact the arc-shaped rack 17 on the swing rod 16. The first rack 18 drives the swing rod 16 to swing upward through the arc-shaped rack 17, causing the swing rod 16 to lift the circuit board away from the roller conveyor frame 6 via the top plate 19. The circuit board is then positioned horizontally and centrally below the laser 4 and receiver 5. The laser 4 emits laser light onto the solder paste on the circuit board, and the laser light is reflected onto the receiver 5. The receiver 5 calculates the thickness of the solder paste. Meanwhile, the electric slide 3 drives the moving block 2 to move, which in turn drives the two mounting seats 28 to move via the turntable 10. The two mounting seats 28 then drive the corresponding connecting plates 30 to move. The two connecting plates 30 respectively drive the laser 4 and receiver 5 to move, and the first motor 27 drives the turntable 10 to rotate, so that the laser 4 and receiver 5 can detect the thickness of solder paste in multiple places on the circuit board. Finally, the electric telescopic rod 12 pushes the push plate 8 away from the mounting box 11 through the mounting plate 13 and the push rod 14. The first rack 18 on the push rod 14 drives the swing rod 16 to swing downward and reset through the arc rack 17, so that the top plate 19 puts the circuit board back on the top of the roller conveyor frame 6. At the same time, the push plate 8 drives the second rack 25 to move, so that the second rack 25 drives the driven gear 24 to rotate. The driven gear 24 drives the one-way gear 22 to rotate through the positioning rod 21, so that the one-way gear 24 drives the one-way gear 22 to rotate. 2. The one-way rack 23 moves, which in turn moves the baffle 9 along the outside of the positioning slide 20, moving the baffle 9 away from the circuit board and compressing the spring 26. The roller conveyor 6 can then transport the tested circuit board out. When the second rack 25 disengages from the driven gear 24, the spring 26 pushes the baffle 9 to move and reset along the outside of the positioning slide 20. The operator can then place the next circuit board to be tested onto the roller conveyor 6, so that the circuit board contacts the two baffles 9. This facilitates the sequential transport of multiple circuit boards, thereby facilitating the level detection of the solder paste on the circuit board and ensuring the accuracy of the solder paste thickness detection.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board solder paste thickness detection device, characterized in that, Includes: a device housing and a movable block disposed inside the device housing. An electric slide is fixedly installed inside the device housing. A laser for emitting laser light onto solder paste and a receiver for receiving reflected light are disposed at the bottom of the electric slide. Data signals are transmitted to the computer via the laser and the receiver to detect the thickness of the solder paste. A roller conveyor is installed on the bottom inner wall of the device housing, and a control panel is installed on the outer side of the device housing. Also includes: A board positioning mechanism is used for correcting, positioning, and horizontally lifting circuit boards. The board positioning mechanism is installed inside the device housing and includes two push plates set on both sides of the roller conveyor frame. The push plates can correct and position the circuit boards, thereby improving the accuracy of solder paste thickness detection. The board positioning mechanism also includes two mounting boxes installed inside the device housing. The two push plates are located on the outer sides of the two mounting boxes respectively. An electric telescopic rod is installed on one side of the mounting box, and a mounting plate is installed at the output end of the electric telescopic rod. Multiple push rods are fixedly installed between one side of the mounting plate and the outer side of the push plate. A mounting rod is rotatably installed inside the mounting box. Multiple swing rods are installed on the outer side of the mounting rod, which are located directly below the push rod. The outer side of the mounting box is provided with a moving groove for the swing rods to limit sliding. An arc-shaped rack is installed at one end of the swing rod, and a first rack is fixedly installed at the bottom of the push rod. A top plate is installed between the multiple swing rods. A stop mechanism is used to block and discharge the conveyed circuit boards. The stop mechanism is installed on both sides of the roller conveyor frame. The stop mechanism includes two baffles set on both sides of the roller conveyor frame. The baffles can block the circuit boards in the conveying state, allowing the laser and receiver to perform thickness detection processing on the solder paste on the circuit boards. The bottom of the moving block also includes an angle adjustment mechanism for synchronously adjusting the laser and receiver. The angle adjustment mechanism includes a turntable set at the bottom of the moving block. The turntable can synchronously adjust the angle of the laser and receiver. A first motor is installed on the top of the moving block. The output end of the first motor is fixedly connected to the top of the turntable. Two mounting seats are fixedly installed at the bottom of the turntable. An adjusting rod is rotatably installed on the inner side of the mounting seat. A connecting plate is fixedly installed on the outer side of the adjusting rod. The two connecting plates are fixedly connected to the outer side of the laser and receiver, respectively. A second motor is installed at the bottom of the turntable, and the output end of the second motor is fixedly connected to the adjacent adjusting rod. A synchronous belt is rotatably installed between the two adjusting rods.

2. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The stopping mechanism also includes a positioning slide mounted on the outside of the mounting box. Two baffles are slidably mounted on the outside of the two positioning slides. A mounting groove is provided on one side of the mounting box, and a positioning rod is rotatably mounted on the inside of the mounting groove. A one-way gear is fixedly mounted on the outside of the positioning rod. A one-way rack that cooperates with the one-way gear is mounted on the baffle. Two driven gears are mounted on the outside of the positioning rod. Two symmetrically distributed second racks are fixedly mounted on one side of the push plate. The second racks slide to the inside of the mounting box. Two springs are fixedly mounted between the outside of the baffle and one end of the positioning slide.

3. The circuit board solder paste thickness detection device according to claim 1, characterized in that: Two transparent observation windows are installed on the outside of the device housing.

4. The circuit board solder paste thickness detection device according to claim 1, characterized in that: Multiple rubber pads are fixedly installed on one side of the push plate.

5. The circuit board solder paste thickness detection device according to claim 1, characterized in that: Two sleeves are installed on the inner side of the mounting box, and the outer side of the mounting rod is connected to the two sleeves respectively through two coil springs.

6. The circuit board solder paste thickness detection device according to claim 1, characterized in that: A buffer pad is installed in the movable slot of the mounting box, and one side of the swing arm is in contact with the outer side of the buffer pad.

7. The circuit board solder paste thickness detection device according to claim 2, characterized in that: A sliding sleeve is installed on the outer side of the second rack, and a sliding rod for limiting the sliding of the sliding sleeve is installed on the inner side of the mounting box.

8. The circuit board solder paste thickness detection device according to claim 1, characterized in that: A retaining frame is installed between the two mounting bases, and the timing belt is located inside the retaining frame.

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