Mini-LED packaging equipment, methods, apparatus and storage media

Abstract

This invention discloses a Mini-LED packaging device, a Mini-LED packaging method, an apparatus, and a computer-readable storage medium. The method, applied to a Mini-LED packaging device, involves adjusting the position of the Mini-LED chip to be fixed on a substrate to embed the electrodes of the Mini-LED chip into a groove. Solder paste is placed on a filter screen inside the groove. During the fixing of the Mini-LED chip, a height limiting plate restricts the upward displacement of the Mini-LED chip during the curing process of the solder paste, allowing the solder paste to pass through the filter screen and enter the gap during curing. This invention reduces the overly stringent requirements for solder paste usage and the process difficulty of Mini-LED chip die bonding by designing the substrate structure, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving display performance.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging technology, and particularly relates to a Mini-LED (Light Emitting Diode) packaging device, Mini-LED packaging method, apparatus, and computer-readable storage medium. Background Technology

[0002] With the rapid development of technology, the size of Mini-LED chips is gradually decreasing, and the corresponding pad positions are also gradually decreasing, which makes the requirements for chip die bonding increasingly higher.

[0003] Currently, due to the small size of Mini-LED chips and correspondingly small solder pads, there are generally two methods to fix Mini-LED chips onto the substrate: stencil printing of solder paste and solder paste application. Both methods require precise control of the solder paste amount, as the amount of solder paste affects the die bonding effect of the Mini-LED chip. Furthermore, with increasingly smaller solder pad sizes, any difference in solder paste application can lead to poor soldering. Insufficient solder paste may reduce the soldering area, causing cold solder joints; excessive solder paste may cause short circuits between the two electrodes; inconsistent solder paste application between the two electrodes, such as one side having more solder paste than the other, can also lead to defects. Even if it doesn't cause the aforementioned cold solder joints or short circuits, it can still have another consequence: the side with more solder paste may be exposed to high temperatures or UV (ultraviolet) radiation. After curing with ultraviolet (UV) light, the expansion volume is greater. The side with less solder paste expands less after high temperature or UV curing. This results in one side of the Mini-LED chip being higher than the other, causing the light-emitting surface of the Mini-LED chip to not be parallel to the substrate. If every Mini-LED chip has this unevenness, it will affect the overall light emission effect, and thus affect the display effect.

[0004] In summary, how to reduce the overly strict requirements on solder paste usage for Mini-LED chip die bonding and the process difficulty of Mini-LED chip die bonding through substrate structure design, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving display performance, has become an urgent technical problem to be solved in the field of chip packaging technology. Summary of the Invention

[0005] The main objective of this invention is to provide a Mini-LED packaging device, a Mini-LED packaging method, an apparatus, and a computer-readable storage medium. The aim is to reduce the overly stringent requirements on solder paste usage for Mini-LED chip die bonding and the complexity of the Mini-LED chip die bonding process by designing the substrate structure, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving display performance.

[0006] To achieve the above objectives, the present invention provides a Mini-LED packaging device, the Mini-LED packaging device including a substrate and a height limiting plate located above the substrate, wherein the Mini-LED chip to be fixed is placed between the substrate and the height limiting plate;

[0007] The substrate has a groove, the position of which corresponds to the position of the electrode of the Mini-LED chip, and the inner wall of the groove has exposed copper metal.

[0008] The groove is provided with a filter screen for receiving solder paste, and there is a gap between the bottom of the groove and the filter screen;

[0009] The height limiting plate is used to limit the upward displacement of the Mini-LED chip during the curing process of the solder paste, so that the solder paste can pass through the filter and enter the gap during curing.

[0010] Optionally, the filter screen is parallel to the bottom of the groove, and the edge area of ​​the filter screen is provided with holes, through which the solder paste enters the gap during curing.

[0011] Optionally, the distance between the height limiting plate and the Mini-LED chip to be fixed is determined based on a first distance between the Mini-LED chip to be fixed and the substrate, and a second distance between the fixed Mini-LED chip and the substrate.

[0012] Optionally, the Mini-LED packaging equipment further includes a carrier connected to the height limiting plate, the height limiting plate being located above the carrier, and a substrate on which the Mini-LED chip is placed being placed between the carrier and the height limiting plate.

[0013] To achieve the above objectives, the present invention also provides a Mini-LED packaging method, wherein the Mini-LED packaging method is applied to the Mini-LED packaging equipment as described in any of the preceding claims, and the Mini-LED packaging method includes:

[0014] Adjust the position of the Mini-LED chip to be fixed on the substrate so that the electrode of the Mini-LED chip is embedded into the groove, wherein solder paste is placed on the filter screen inside the groove;

[0015] When fixing the Mini-LED chip, the upward displacement of the Mini-LED chip during the curing process of the solder paste is limited by the height limiting plate, so that the solder paste can pass through the filter and enter the gap during curing.

[0016] Optionally, the height limiting plate is located above the Mini-LED chip, and the method further includes:

[0017] Adjust the distance between the height limiter and the Mini-LED chip to a preset height threshold.

[0018] Optionally, the method further includes:

[0019] A first preset average value is determined based on a first distance between the Mini-LED chip to be fixed and the substrate;

[0020] A second preset average value is determined based on a second distance between the fixed Mini-LED chip and the substrate;

[0021] A preset height threshold is determined based on the first preset average value and the second preset average value.

[0022] Optionally, the method further includes:

[0023] Adjust the position of the substrate on which the Mini-LED chip is placed on the carrier;

[0024] The carrier containing the substrate is placed in a reflow oven to fix the Mini-LED chip.

[0025] Furthermore, to achieve the above objectives, the present invention also provides a Mini-LED packaging apparatus, which is applied to the Mini-LED packaging equipment as described in any of the preceding claims, the Mini-LED packaging apparatus comprising:

[0026] The position adjustment module adjusts the position of the Mini-LED chip to be fixed on the substrate so as to embed the electrode of the Mini-LED chip into the groove, wherein solder paste is placed on the filter screen inside the groove;

[0027] The curing module, when fixing the Mini-LED chip, limits the upward displacement of the Mini-LED chip during the curing process of the solder paste by a height limiting plate, so that the solder paste can pass through the filter and enter the gap during curing.

[0028] In addition, to achieve the above objectives, the present invention also provides a computer-readable storage medium storing a Mini-LED packaging program, wherein the Mini-LED packaging program, when executed by a processor, implements the steps of the Mini-LED packaging method as described above.

[0029] This invention provides a Mini-LED packaging device, a Mini-LED packaging method, an apparatus, and a computer-readable storage medium. The method is applied to the Mini-LED packaging device as described above. The method involves adjusting the position of the Mini-LED chip to be fixed on the substrate to embed the electrodes of the Mini-LED chip into the groove, wherein solder paste is placed on a filter screen inside the groove. When fixing the Mini-LED chip, a height limiting plate restricts the upward displacement of the Mini-LED chip during the curing process of the solder paste, so that the solder paste passes through the filter screen and enters the gap during curing.

[0030] This invention involves placing solder paste on a filter screen inside a groove on a substrate, then adjusting the position of the Mini-LED chip to be fixed on the substrate so that the electrodes of the Mini-LED chip are correspondingly embedded in the groove. The Mini-LED chip is then fixed, and simultaneously, a height limiting plate restricts the upward displacement of the Mini-LED chip during the solder paste curing process. This allows the solder paste to pass through the filter screen and enter the gap between the bottom of the groove and the filter screen during curing. Therefore, through the design of the substrate structure, the overly strict requirements on the amount of solder paste for Mini-LED chip die bonding and the difficulty of the Mini-LED chip die bonding process are reduced, thereby avoiding the adverse effects of inaccurate solder paste dosage on Mini-LED chip die bonding and improving the display effect. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the device structure of the terminal device hardware operating environment involved in the embodiments of the present invention;

[0032] Figure 2 This is a schematic flowchart of the first embodiment of the Mini-LED packaging method of the present invention;

[0033] Figure 3 This is a schematic diagram illustrating a short circuit phenomenon of chip electrodes in an embodiment of the Mini-LED packaging method of the present invention.

[0034] Figure 4 This is a schematic diagram illustrating the unevenness of the chip in an embodiment of the Mini-LED packaging method of the present invention.

[0035] Figure 5 This is a functional module diagram of an embodiment of the Mini-LED packaging device of the present invention.

[0036] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0038] Reference Figure 1 , Figure 1 This is a schematic diagram of the hardware operating environment of the terminal device involved in the embodiment of the present invention.

[0039] like Figure 1 As shown, this embodiment of the invention provides a Mini-LED packaging device, which includes a substrate 1001 and a height limiting plate 1002 located above the substrate 1001. The substrate 1001 is provided with a groove 1003, and a filter screen 1004 is provided inside the groove 1003.

[0040] Those skilled in the art will understand that Figure 1 The terminal device structure shown does not constitute a limitation on the terminal device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0041] The Mini-LED chip to be fixed is placed between the substrate and the height restriction plate. Specifically, the Mini-LED chip to be fixed to the substrate is placed between the substrate and the height restriction plate.

[0042] The substrate has grooves positioned corresponding to the electrodes of the Mini-LED chip, and the inner walls of the grooves are made of exposed copper. Specifically, grooves are provided at the corresponding pad positions on the substrate, and the positions of these grooves correspond to the positions of the Mini-LED chip electrodes. It should be noted that the openings in the grooves are slightly larger than the size of the Mini-LED chip electrodes to embed the electrodes of the Mini-LED chip. The inner walls of the grooves are entirely made of exposed copper for conductivity.

[0043] The groove contains a filter screen for receiving solder paste, with a gap between the bottom of the groove and the filter screen. Specifically, when solder paste is applied to the groove, it is actually placed on the filter screen, and the gap between the bottom of the groove and the filter screen is used to catch any excess solder paste during curing.

[0044] The height limiter is used to restrict the upward displacement of the Mini-LED chip during the solder paste curing process, allowing the solder paste to pass through the filter and enter the gap during curing. Specifically, the height limiter restricts the upward displacement of the Mini-LED chip during curing, ensuring that the Mini-LED chip does not cause significant unevenness after the solder paste expands during curing. Under the action of the height limiter, the curing solder paste will exert more force towards the filter, allowing excess solder paste to pass through the filter and enter the gap between the bottom of the groove and the filter.

[0045] Furthermore, in one feasible embodiment, the filter screen is parallel to the bottom of the groove, and the edge area of ​​the filter screen is provided with holes, through which solder paste enters the gap during curing.

[0046] Specifically, the filter screen is parallel to the bottom of the groove, and circular holes are provided in the edge area of ​​the filter screen, but no holes are provided in the middle of the filter screen. The diameter of the circular holes is larger than the diameter of the solder powder in the solder paste. The solder paste expanding during curing enters the gap between the bottom of the groove and the filter screen through the circular holes.

[0047] It should be noted that the holes at the edge of the filter screen in this invention are circular, and the diameter of these circular holes is larger than the diameter of the solder powder in the solder paste. It should be understood that, based on different design requirements for practical applications, in different feasible implementations, the shape and size of the holes at the edge of the filter screen can be any shape and size that prevents uncured solder paste from falling through the holes to the bottom of the groove, while allowing the expanding solder paste during curing to pass through. The Mini-LED packaging method of this invention does not limit the shape or size of these holes.

[0048] Furthermore, in one feasible embodiment, the distance between the height limiting plate and the Mini-LED chip to be fixed is determined based on a first distance between the Mini-LED chip to be fixed and the substrate, and a second distance between the fixed Mini-LED chip and the substrate.

[0049] Specifically, the height limiting plate is positioned above the Mini-LED chip. The distance between the height limiting plate and the Mini-LED chip should follow these rules: First, it should not be too close to the unfixed Mini-LED chip to avoid the solder paste expanding and causing the Mini-LED chip to move upwards, creating excessive pressure between the Mini-LED chip and the height limiting plate, which could damage the light-emitting surface of the Mini-LED chip. Second, the height limiting plate should not be too far from the Mini-LED chip, otherwise it will not achieve its purpose of height limiting. Third, the height of the height limiting plate should be set based on past experience, i.e., calculating the height difference between the height of the unfixed Mini-LED chip and the average height of the fixed Mini-LED chip before and after curing, which is used as the position of the height limiting plate relative to the Mini-LED chip. When calculating the average height of the fixed Mini-LED chip, the height of any abnormally high Mini-LED chips that are sticking out should be removed.

[0050] Furthermore, in one feasible embodiment, the Mini-LED packaging device further includes a carrier connected to a height-limiting plate located above the carrier, and a substrate on which the Mini-LED chip to be fixed is placed between the carrier and the height-limiting plate.

[0051] Specifically, the carrier is connected to the height restriction plate, which is located above the carrier. The carrier is used to place the substrate, on which the Mini-LED chip to be fixed is placed. The substrate with the Mini-LED chip to be fixed is placed between the carrier and the height restriction plate.

[0052] Based on the Mini-LED packaging equipment described above, various embodiments of the Mini-LED packaging method of the present invention are proposed.

[0053] Currently, due to the small size of Mini-LED chips and correspondingly small solder pads, there are generally two methods to fix Mini-LED chips onto the substrate: stencil printing of solder paste and solder paste application. Both methods require precise control of the amount of solder paste used, as the amount of solder paste affects the die bonding effect of the Mini-LED chip. Furthermore, with the solder pad size becoming increasingly smaller, any amount of solder paste can lead to poor soldering. Too little solder paste may reduce the soldering area and cause cold solder joints; too much solder paste may cause short circuits between the two electrodes. Inconsistent solder paste application between the two electrodes can also lead to defects, such as one side having more solder paste and the other less. Even if it does not cause the aforementioned cold solder joints or short circuits, it will have another consequence: the side with more solder paste will expand more after high temperature or UV curing, while the side with less solder paste will expand less. This results in the Mini-LED chip being higher on one side and lower on the other, causing the light-emitting surface of the Mini-LED chip to not be parallel to the substrate. If every Mini-LED chip has this unevenness, it will affect the overall light emission effect, and thus the display effect.

[0054] To address the above-mentioned issues, this invention proposes a Mini-LED packaging method. This Mini-LED packaging method is applied to any of the Mini-LED packaging devices described above.

[0055] This invention involves placing solder paste on a filter screen inside a groove on a substrate, then adjusting the position of the Mini-LED chip to be fixed on the substrate so that the electrodes of the Mini-LED chip are correspondingly embedded in the groove. The Mini-LED chip is then fixed, and simultaneously, a height-limiting plate restricts the upward displacement of the Mini-LED chip during the solder paste curing process. The height-limiting plate primarily limits the upward displacement of the Mini-LED chip, ensuring that excessive displacement between Mini-LED chips or between the positive and negative electrodes of the same Mini-LED chip does not cause differences in light emission. Therefore, when the upward displacement of the Mini-LED chip is too large, the pressure from the height-limiting plate allows the solder paste to pass through the filter screen and enter the gap between the bottom of the groove and the filter screen during curing. Therefore, by designing the substrate structure and height limiting board, the relative flatness of the Mini-LED chip is ensured, the overly strict requirements on the amount of solder paste for Mini-LED chip die bonding and the process difficulty of Mini-LED chip die bonding are reduced, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving the display effect.

[0056] Please refer to Figure 2 , Figure 2This is a flowchart illustrating a first embodiment of the Mini-LED packaging method of the present invention. It should be noted that although the logical order is shown in the flowchart, in certain situations, the Mini-LED packaging method of the present invention may, of course, perform the steps shown or described in a different order than that shown here.

[0057] In a first embodiment of the Mini-LED packaging method of the present invention, the Mini-LED packaging method includes:

[0058] Step S10: Adjust the position of the Mini-LED chip to be fixed on the substrate so as to embed the electrode of the Mini-LED chip into the groove, wherein solder paste is placed on the filter screen inside the groove;

[0059] In this embodiment, solder paste is placed on a filter screen inside a groove in the substrate using a Mini-LED packaging device. Then, the position of the Mini-LED chip to be fixed on the substrate is adjusted so that the electrodes of the Mini-LED chip are embedded into the corresponding grooves.

[0060] For example, such as Figure 3 As shown, traditional substrate pads are planar, formed by exposed copper. In this structure, after solder paste is applied, the paste sits above the pads and above the substrate plane, which can easily cause short circuits between the two electrodes. In this embodiment, however, the Mini-LED packaging equipment first applies solder paste to the grooves in the substrate. At this point, the solder paste is actually placed on a screen within the groove, ensuring sufficient amount of solder paste to contact the electrode portions of the Mini-LED chip before it solidifies and expands. Then, the Mini-LED packaging equipment places the Mini-LED chip onto the substrate, specifically embedding the positive and negative electrodes of the Mini-LED chip into the two corresponding grooves in the substrate.

[0061] Step S20: When fixing the Mini-LED chip, the upward displacement of the Mini-LED chip during the curing process of the solder paste is limited by the height limiting plate, so that the solder paste can pass through the filter and enter the gap during curing.

[0062] In this embodiment, when the Mini-LED chip is fixed by the Mini-LED packaging equipment, the upward displacement of the Mini-LED chip during the solder paste curing process is limited by the height limiting plate, so that the solder paste enters the gap between the bottom of the groove and the filter screen through the filter screen inside the groove during curing.

[0063] For example, such as Figure 4As shown, when there is a difference in the amount of solder paste between the two electrodes, the expansion amount of the solder paste after curing changes, which can easily lead to the Mini-LED chip not being horizontal. In this embodiment, during the Mini-LED chip curing process, a height limiting plate is used above the Mini-LED chip to restrict the upward displacement of the Mini-LED chip during the solder paste curing process. At this time, the expanded solder paste cannot push the Mini-LED chip upward, but will instead exert more force towards the filter screen, thus passing through the filter screen and entering the gap between the bottom of the groove and the filter screen.

[0064] In this embodiment, the Mini-LED packaging method of the present invention involves placing solder paste on a filter screen inside a groove in a substrate using a Mini-LED packaging device. Then, the position of the Mini-LED chip to be fixed on the substrate is adjusted, thereby embedding the electrodes of the Mini-LED chip into the corresponding groove. When the Mini-LED packaging device fixes the Mini-LED chip, a height limiting plate restricts the upward displacement of the Mini-LED chip during the solder paste curing process, thereby allowing the solder paste to pass through the filter screen inside the groove and enter the gap between the bottom of the groove and the filter screen during curing.

[0065] Thus, in this embodiment of the invention, solder paste is placed on a filter screen inside a groove on the substrate, and then the position of the Mini-LED chip to be fixed on the substrate is adjusted so that the electrodes of the Mini-LED chip are correspondingly embedded in the groove. The Mini-LED chip is then fixed, and simultaneously, a height limiting plate restricts the upward displacement of the Mini-LED chip during the solder paste curing process. This allows the solder paste to pass through the filter screen and enter the gap between the bottom of the groove and the filter screen during curing. Therefore, through the design of the substrate structure, the overly strict requirements on the amount of solder paste for Mini-LED chip die bonding and the difficulty of the Mini-LED chip die bonding process are reduced, thereby avoiding the adverse effects of inaccurate solder paste dosage on Mini-LED chip die bonding and improving the display effect.

[0066] Furthermore, based on the first embodiment of the Mini-LED packaging method of the present invention described above, a second embodiment of the Mini-LED packaging method of the present invention is proposed.

[0067] In this embodiment, the height limiting plate is located above the Mini-LED chip. The Mini-LED packaging method of the present invention may further include:

[0068] Step A: Adjust the distance between the height limiting plate and the Mini-LED chip to a preset height threshold.

[0069] In this embodiment, the distance between the height limiting plate and the Mini-LED chip is adjusted to a preset height threshold using a Mini-LED packaging device.

[0070] For example, before fixing the Mini-LED chip to be fixed, a height limiting plate is set at a position at a preset height threshold of the Mini-LED chip using a Mini-LED packaging device.

[0071] Furthermore, in one feasible embodiment, the Mini-LED packaging method of the present invention may further include:

[0072] Step B: Determine a first preset average value based on the first distance between the Mini-LED chip to be fixed and the substrate;

[0073] Step C: Determine the second preset average value based on the second distance between the fixed Mini-LED chip and the substrate;

[0074] Step D: Determine a preset height threshold based on the first preset average value and the second preset average value.

[0075] In this embodiment, a first preset average value is determined by the Mini-LED packaging equipment based on a first distance between the Mini-LED chip to be fixed and the substrate, and a second preset average value is determined based on a second distance between the fixed Mini-LED chip and the substrate. Then, the distance between the height limiting plate and the Mini-LED chip, i.e., the preset height threshold, is determined based on the first preset average value and the second preset average value.

[0076] For example, after the Mini-LED chip is die-bonded and then cured at high temperature, the solder paste will expand. Therefore, the height of the Mini-LED chip relative to the substrate changes before and after curing. For instance, before curing, the average height difference between the surface of all Mini-LED chips and the substrate is 100μm, which is the first preset average value. After high-temperature curing and expansion, the average height difference between the surface of the Mini-LED chip and the substrate becomes 130μm, which is the second preset average value. At this time, the height of the height limiting board and the Mini-LED chip is set to 30μm to ensure that the height of the Mini-LED chip surface relative to the substrate does not exceed 30μm after curing and expansion, that is, the preset height threshold is 30μm.

[0077] In this embodiment, the Mini-LED packaging method of the present invention adjusts the distance between the height limiting plate and the Mini-LED chip to a preset height threshold using a Mini-LED packaging device; the Mini-LED packaging device determines a first preset average value based on a first distance between the Mini-LED chip to be fixed and the substrate, and determines a second preset average value based on a second distance between the fixed Mini-LED chip and the substrate; then, the distance between the height limiting plate and the Mini-LED chip, i.e., the preset height threshold, is determined based on the first preset average value and the second preset average value.

[0078] In this way, by setting the position of the height limiting plate, the upward offset of the Mini-LED chip after curing is limited, thereby ensuring that the Mini-LED chip will not cause obvious unevenness after the solder paste cures and expands, ensuring the parallelism between the light-emitting surface of the Mini-LED chip and the substrate, thus ensuring the light emission effect.

[0079] Furthermore, based on the first and / or second embodiments of the Mini-LED packaging method of the present invention described above, a third embodiment of the Mini-LED packaging method of the present invention is proposed.

[0080] In this embodiment, the Mini-LED packaging method of the present invention may further include:

[0081] Step E: Adjust the position of the substrate on which the Mini-LED chip is placed on the carrier;

[0082] Step F: Place the carrier containing the substrate into a reflow oven to fix the Mini-LED chip.

[0083] In this embodiment, the position of the substrate on which the Mini-LED chip to be fixed is placed is adjusted on the carrier by the Mini-LED packaging equipment. Then, the carrier on which the substrate is placed is placed in the reflow oven, thereby fixing the Mini-LED chip on the substrate.

[0084] For example, the carrier is connected to the height restriction plate. Specifically, the height restriction plate is supported at the diagonal or four corners of the carrier. Then, the substrate on which the Mini-LED chip to be fixed is placed is placed between the carrier and the height restriction plate. At this time, the distance between the height restriction plate and the Mini-LED chip on the substrate should be a preset height distance of 30μm. Then, the Mini-LED packaging equipment puts the carrier carrying the substrate into the reflow oven to cure the solder paste on the substrate, thereby fixing the Mini-LED chip on the substrate.

[0085] In this embodiment, the Mini-LED packaging method of the present invention adjusts the position of the substrate on which the Mini-LED chip to be fixed is placed on the carrier using a Mini-LED packaging device, and then places the carrier on which the substrate is placed in a reflow oven, thereby fixing the Mini-LED chip on the substrate.

[0086] In this way, by placing the height limiting plate above the carrier and connecting it to the carrier, the height limiting plate is fixed above the Mini-LED chip, thereby limiting the upward offset of the Mini-LED chip during the process of the Mini-LED chip following the carrier into the reflow oven for die bonding.

[0087] Furthermore, embodiments of the present invention also provide a Mini-LED packaging apparatus, and the Mini-LED packaging method of the present invention is applied to the Mini-LED packaging equipment as described in any of the above claims.

[0088] Please refer to Figure 5 , Figure 5 This is a functional module diagram of an embodiment of the Mini-LED packaging device of the present invention, as shown below. Figure 5 As shown, the Mini-LED packaging device of the present invention includes:

[0089] The position adjustment module 10 is used to adjust the position of the Mini-LED chip to be fixed on the substrate so as to embed the electrode of the Mini-LED chip into the groove, wherein solder paste is placed on the filter screen inside the groove.

[0090] The curing module 20 is used to limit the upward displacement of the Mini-LED chip during the curing process of the solder paste by using a height limiting plate when fixing the Mini-LED chip, so that the solder paste can pass through the filter and enter the gap during curing.

[0091] Optionally, the height limiting plate is located above the Mini-LED chip. The Mini-LED packaging device of the present invention further includes:

[0092] The height restriction plate adjustment module is used to adjust the distance between the height restriction plate and the Mini-LED chip to a preset height threshold.

[0093] Optionally, the Mini-LED packaging device of the present invention further includes:

[0094] The first preset average value determination module is used to determine the first preset average value based on the first distance between the Mini-LED chip to be fixed and the substrate;

[0095] The second preset average value determination module is used to determine the second preset average value based on the second distance between the fixed Mini-LED chip and the substrate;

[0096] The threshold determination module is used to determine a preset height threshold based on the first preset average value and the second preset average value.

[0097] Optionally, the Mini-LED packaging device of the present invention further includes:

[0098] The carrier module is used to adjust the position of the substrate on which the Mini-LED chip is placed on the carrier;

[0099] A chip fixing module is used to place a carrier containing the substrate into a reflow oven to fix the Mini-LED chip.

[0100] The present invention also provides a computer storage medium storing a Mini-LED packaging program, wherein when the Mini-LED packaging program is executed by a processor, the steps of the Mini-LED packaging program method as described in any of the above embodiments are implemented.

[0101] The specific embodiments of the computer storage medium of the present invention are basically the same as the embodiments of the Mini-LED packaging program method of the present invention described above, and will not be repeated here.

[0102] The present invention also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the Mini-LED packaging method of the present invention as described in any of the above embodiments, which will not be elaborated here.

[0103] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0104] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0105] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device (such as TWS earphones, etc.) to execute the methods described in the various embodiments of the present invention.

[0106] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A Mini-LED packaging apparatus, characterized in that, The Mini-LED packaging device comprises a substrate and a height-limiting plate located above the substrate, and the Mini-LED chip to be fixed is placed between the substrate and the height-limiting plate; The substrate is provided with a groove, the position of the groove corresponds to the position of the electrode of the Mini-LED chip, and the inner wall of the groove is provided with metal copper exposure; The inside of the groove is provided with a filter screen for receiving solder paste, and there is a gap between the bottom of the groove and the filter screen; The height-limiting plate is used to limit the upward deviation of the Mini-LED chip during the curing process of the solder paste, so that the solder paste can pass through the filter screen into the gap during curing.

2. The Mini-LED packaging apparatus of claim 1, wherein, The filter screen is parallel to the bottom of the groove, and the edge area of the filter screen is provided with a hole, and the solder paste enters the gap through the hole during curing.

3. The Mini-LED packaging apparatus of claim 1, wherein, The distance between the height-limiting plate and the Mini-LED chip to be fixed is determined based on the first distance between the Mini-LED chip to be fixed and the substrate, and the second distance between the Mini-LED chip to be fixed and the substrate.

4. The Mini-LED packaging apparatus of claim 1, wherein, The Mini-LED packaging device further comprises a carrier connected with the height-limiting plate, and the height-limiting plate is located above the carrier, and the substrate on which the Mini-LED chip is placed is placed between the carrier and the height-limiting plate.

5. A Mini-LED packaging method, characterized in that, The Mini-LED packaging method is applied to the Mini-LED packaging device according to any one of claims 1 to 4, and the Mini-LED packaging method comprises: Adjusting the position of the Mini-LED chip to be fixed on the substrate to embed the electrode of the Mini-LED chip into the groove, wherein the filter screen inside the groove is placed with solder paste; When fixing the Mini-LED chip, the height-limiting plate is used to limit the upward deviation of the Mini-LED chip during the curing process of the solder paste, so that the solder paste can pass through the filter screen into the gap during curing.

6. The Mini-LED packaging method of claim 5, wherein, The height-limiting plate is located above the Mini-LED chip, and the method further comprises: Adjusting the distance between the height-limiting plate and the Mini-LED chip to a preset height threshold.

7. The Mini-LED packaging method of claim 6, wherein, The method further comprises: Determining a first preset average value according to the first distance between the Mini-LED chip to be fixed and the substrate; Determining a second preset average value according to the second distance between the Mini-LED chip to be fixed and the substrate; Determining a preset height threshold according to the first preset average value and the second preset average value.

8. The Mini-LED packaging method of claim 5, wherein, The method further comprises: Adjusting the position of the substrate on which the Mini-LED chip is placed on the carrier; Placing the carrier on which the substrate is placed into a reflow oven to fix the Mini-LED chip.

9. A Mini-LED packaging device, characterized in that, The Mini-LED packaging device is applied to the Mini-LED packaging device according to any one of claims 1 to 4, and the Mini-LED packaging device comprises: A position adjusting module adjusts the position of the Mini-LED chip to be fixed on the substrate to embed the electrode of the Mini-LED chip into the groove, wherein a filter screen inside the groove is placed with tin paste; A curing module limits the upward deviation of the Mini-LED chip in the curing process of the tin paste by a height limiting plate when the Mini-LED chip is fixed, so that the tin paste enters the gap through the filter screen when curing.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a Mini-LED packaging program, and the Mini-LED packaging program is executed by the processor to realize the steps of the Mini-LED packaging method in any one of claims 5 to 8.

Images