UV adhesive tape for semiconductor cutting
By designing multiple tearing notches and tear holes on the UV tape and equipping it with a card tearing mechanism, the complexity problem of cutting existing UV tapes is solved, fast and accurate multi-segment tearing is achieved, and the operation process is simplified.
Patent Information
- Application Number
- CN202422799551.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-11-18
AI Technical Summary
Existing UV tapes lack a break mark design when they need to be cut or split at predetermined positions, which leads to increased process complexity and time costs.
Multiple tearing notches located on the same axis are designed, with tearing holes and sliding sockets on the tearing notches, and equipped with a tearing mechanism, including a through-insert strip, a pinching plate and an anti-slip sleeve, to achieve precise tearing of multi-segment breaks.
It enables the UV tape to be quickly and accurately torn to a preset length without tools, simplifying the operation process and reducing time and complexity.
Smart Images
Figure CN223397670U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of adhesive tapes, in particular to a UV adhesive tape for semiconductor cutting. Background Art
[0002] UV tape is a special type of tape, commonly used in the electronics, optoelectronics and other industries. It is characterized by ultraviolet (UV) curing properties, that is, when ultraviolet rays irradiate the adhesive layer of the tape, the viscosity of the tape will change, becoming stronger or no longer sticky. Semiconductor chips may be physically damaged or stressed during the cutting process. As a protective layer, UV tape can effectively prevent the chip surface from being scratched, contaminated or damaged during cutting, transportation or handling. At the same time, UV tape has strong adhesion and can firmly fix the semiconductor material to ensure that it does not move during the entire cutting process, reducing quality problems caused by improper positioning. In the prior art, UV tape usually does not have a multi-segment break design. In situations where the tape needs to be cut or split according to a predetermined position, the lack of a break design requires reliance on tools for manual cutting (such as scissors, blades, etc.), which increases the complexity and time cost of the process operation. Utility Model Content
[0003] The purpose of the utility model is to address the problem that in the prior art, UV tapes usually do not have a multi-segment breaking mark design. Therefore, when the tape needs to be cut or divided according to a predetermined position, the lack of a breaking mark design requires manual cutting with tools (such as scissors, blades, etc.), which increases the complexity and time cost of the process operation. A UV tape for semiconductor cutting is proposed.
[0004] The technical solution of the utility model is as follows: a UV tape for semiconductor cutting, comprising a UV tape body, and also comprising: a plurality of tearing notches located on the same axis arranged on the UV tape body; a plurality of tear holes opened on the tearing notches, each of the tearing notches being provided with a sliding socket; a tearing mechanism arranged in the tearing notch for movably passing through the plurality of sliding sockets.
[0005] Optionally, the tearing mechanism includes a penetrating strip that movably passes through the sliding socket, one end of the penetrating strip is fixedly connected to a pinching plate, the end of the pinching plate away from the penetrating strip is provided with an anti-slip sleeve, and the penetrating strip is provided with anti-slip teeth for being stuck after passing through the anti-slip sleeve.
[0006] Optionally, the pinching plate is provided with a plurality of anti-slip grooves arranged in a linear manner.
[0007] Optionally, a supporting tape ring is provided inside the UV tape body.
[0008] Optionally, a notch is provided on the edge of the tape ring close to the tearing edge.
[0009] Optionally, the UV tape body includes upper and lower corresponding adhesive tapes and adhesive.
[0010] Optionally, the adhesive tape is made of polyester film.
[0011] Optionally, the adhesive tape has a thickness between 20 μm and 100 μm.
[0012] Optionally, the adhesive is made of acrylic resin or epoxy resin.
[0013] Optionally, the adhesive has a thickness between 100 μm and 200 μm.
[0014] In summary, this application includes at least one of the following beneficial technical effects:
[0015] This utility model utilizes the cooperation of the sliding jack, tear notch, tear hole and the card tearing mechanism. When the card tearing mechanism on the UV tape is not activated, the UV tape is just like ordinary tape, completely continuous and can be used as a whole tape, and the functions of adhesion and protection are not affected. At the same time, when the user activates the card tearing mechanism and then tears the UV tape to a specific length, only needs to gently pull along the tearing position, without the need for tools, to accurately tear the UV tape according to the preset breakpoint, achieving the purpose of fast and precise cutting. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic structural diagram of a UV tape for semiconductor cutting is given in the utility model;
[0017] Figure 2 for Figure 1 A magnified schematic diagram of point A in the middle;
[0018] Figure 3 for Figure 1 Enlarged schematic diagram of point B in the middle.
[0019] Figure numerals: 1, UV tape body; 11, tear hole; 12, sliding socket; 13, adhesive tape; 14, adhesive; 15, tear notch; 2, tape loop; 21, notch; 3, through-insert strip; 31, anti-slip teeth; 32, pinch plate; 33, anti-slip groove; 34, anti-slip sleeve. DETAILED DESCRIPTION
[0020] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0021] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention.
[0022] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.
[0023] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0024] It should be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, article, or apparatus. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
[0025] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0026] like Figures 1 to 3As shown, the present invention provides a UV tape for semiconductor dicing, comprising a UV tape body 1. A supporting tape loop 2 is provided within the UV tape body 1. The tape loop 2 has a notch 21 formed along its edge near a tear notch 15. The UV tape body 1 comprises upper and lower adhesive strips 13 and an adhesive 14. The adhesive strips 13 are made of polyester film, a common substrate for UV tapes, offering excellent mechanical strength, high-temperature resistance, transparency, and dimensional stability. The adhesive strips 13 are between 20 μm and 100 μm thick, while the adhesive 14 is made of acrylic resin or epoxy resin. Acrylic resins and epoxy resins rapidly transform from liquid to solid under ultraviolet light, forming a strong adhesive layer. The adhesive 14 is between 100 μm and 200 μm thick. The UV tape body 1 also includes multiple tear notches 15 arranged on the same axis. These notches 15 are pre-defined features that allow users to easily tear the tape when needed without the need for scissors or other tools. Typically, the tearing notch 15 is designed to facilitate tearing of the UV tape body 1 along a predetermined path, ensuring smoother and neater tearing. Multiple tear holes 11 are provided on the tearing notch 15, allowing the tearing notch 15 to be used or unused, depending on user needs. Each tearing notch 15 is provided with a sliding socket 12. A tearing mechanism is provided within the tearing notch 15 for moving through the multiple sliding sockets 12.
[0027] Furthermore, the snap-tear mechanism includes a through-insert 3 that flexibly extends through the sliding socket 12. One end of the through-insert 3 is fixedly connected to a pinch plate 32. The pinch plate 32 is provided with a plurality of linearly arranged anti-slip grooves 33. These grooves increase friction when the fingers grasp the pinch plate 32, thereby preventing it from slipping. The pinch plate 32 is provided with an anti-slip sleeve 34 at the end away from the through-insert 3. The principle behind the through-insert 3 and the anti-slip sleeve 34 is similar to that of a nylon cable tie. One end of a nylon cable tie typically passes through a locking buckle at the head of the tie, which serves as the anti-slip sleeve 34. This is then secured during tightening. The locking buckle has a small gear-like structure. When the cable tie is passed through the buckle and tightened, these gear-like structures firmly grip the tie, preventing it from being pulled back. Once secured, the tie cannot be opened unless it is cut with sufficient force. The through-insertion strip 3 is provided with an anti-dropout clamping tooth 31 for being clamped after passing through the anti-dropout clamping sleeve 34 . The anti-dropout clamping tooth 31 is a structure that is clamped by the anti-dropout clamping sleeve 34 .
[0028] In this embodiment, when semiconductor cutting requires the use of UV tape, such as Figure 1As shown, it depends on whether the user needs multi-stage breaking marks. When necessary, by manually pinching the anti-slip groove 33, the anti-slip groove 33 drives the through-insert 3 to move toward the tearing notch 15 and pass through multiple sliding holes 12, and then the end of the through-insert 3 away from the anti-slip groove 33 is removed from the UV tape body 1. After that, the end of the through-insert 3 away from the anti-slip groove 33 can be inserted into the anti-detachment sleeve 34. After the anti-detachment teeth 31 on the through-insert 3 are stuck by the anti-detachment sleeve 34 and cannot be removed, the through-insert 3 can be pulled out with force, so that the through-insert 3 can tear off the UV tape body 1 along the traces of the tear holes 11. In this way, a tearing notch 15 is opened on each circle of the UV tape body 1. When a circle of the UV tape body 1 is torn off, a section of the UV tape body 1 can be torn off quickly and effortlessly through the tearing notch 15. When the user no longer needs to use the multi-segment tearing pattern, the through-insert strip 3 can be pulled out of the multiple sliding holes 12. The adhesive tape 13 and adhesive 14 in the tearing notch 15 are now firmly connected to the UV tape body 1. Finally, after tearing the UV tape body 1, the tearing holes 11 and sliding holes 12 on the UV tape body 1 do not prevent the UV tape body 1 from being used as a single piece, making it convenient and quick to use.
[0029] The preferred embodiments of the present invention described above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims
1. A UV tape for semiconductor cutting, comprising a UV tape body (1), characterized in that: Also includes: A plurality of tearing notches (15) located on the same axis are provided on the UV tape body (1); A plurality of tear holes (11) are provided on the tearing opening (15), and a sliding insertion hole (12) is provided on each of the tearing openings (15); A tearing mechanism is provided in the tearing opening (15) and is used for movably penetrating the plurality of sliding insertion holes (12).
2. The UV tape for semiconductor dicing according to claim 1, characterized in that: The tearing mechanism comprises a through-insertion strip (3) that movably penetrates the sliding insertion hole (12); one end of the through-insertion strip (3) is fixedly connected to a pinching plate (32); an end of the pinching plate (32) away from the through-insertion strip (3) is provided with an anti-slipping sleeve (34); and the through-insertion strip (3) is provided with an anti-slipping tooth (31) for being stuck after passing through the anti-slipping sleeve (34).
3. The UV tape for semiconductor dicing according to claim 2, characterized in that: The pinching plate (32) is provided with a plurality of anti-slip grooves (33) arranged in a linear manner.
4. The UV tape for semiconductor dicing according to claim 1, characterized in that: A supporting tape ring (2) is provided inside the UV tape body (1).
5. The UV tape for semiconductor dicing according to claim 4, characterized in that: The edge of the adhesive tape ring (2) close to the tearing notch (15) is provided with a notch (21).
6. The UV tape for semiconductor dicing according to claim 1, characterized in that: The UV tape body (1) comprises upper and lower corresponding adhesive tapes (13) and an adhesive (14).
7. The UV tape for semiconductor dicing according to claim 6, characterized in that: The material of the adhesive tape (13) is polyester film.
8. The UV tape for semiconductor dicing according to claim 6, characterized in that: The thickness of the adhesive tape (13) is between 20 μm and 100 μm.
9. The UV tape for semiconductor dicing according to claim 6, characterized in that: The material of the adhesive (14) is acrylic resin or epoxy resin.
10. The UV tape for semiconductor dicing according to claim 7, characterized in that: The thickness of the adhesive (14) is between 100 μm and 200 μm.