Semiconductor refrigeration system

Abstract

The utility model relates to a semiconductor refrigeration system which comprises a refrigeration box, a liquid inlet and a liquid outlet are arranged in the refrigeration box, the outer side of the refrigeration box is connected with a refrigeration sheet, a plurality of refrigeration cavities are formed in the refrigeration box, and an upper conduction part or a lower conduction part is arranged between every two adjacent refrigeration cavities. The upper communicating part and the lower communicating part are staggered in the distribution direction of the refrigerating cavity, the refrigerating cavity is communicated through the upper communicating part or the lower communicating part at a time to form a refrigerating channel enabling a refrigerant to pass through the interior of the refrigerating box in a roundabout mode, and the head end and the tail end of the refrigerating channel are communicated with the liquid inlet and the liquid outlet respectively. The refrigerant can pass through the refrigeration box in a circuitous mode, so that the stroke of the refrigerant passing through the refrigeration box is increased, the refrigerant can be fully cooled, and the refrigeration effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration system. Background Art

[0002] Semiconductor refrigeration system, also known as electronic refrigeration system or thermoelectric refrigeration system, is a device that uses the thermoelectric effect of semiconductor materials to achieve refrigeration.

[0003] Existing semiconductor refrigeration systems usually have a cavity for refrigerant to pass through, and semiconductor refrigeration plates are arranged on the outside of the cavity to achieve a cooling effect on the refrigerant.

[0004] However, due to the length of the cavity itself, the path of the refrigerant passing through the cavity is relatively short, resulting in the refrigerant not being fully cooled, which easily affects the cooling effect.

[0005] Therefore, further improvement is needed. Utility Model Content

[0006] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a semiconductor refrigeration system that can increase the travel of the refrigerant in the refrigeration box so that the refrigerant can be fully cooled and the refrigeration effect is improved.

[0007] The purpose of this utility model is achieved in this way:

[0008] A semiconductor refrigeration system includes a refrigeration box having a liquid inlet and a liquid outlet, a refrigeration plate connected to the outside of the refrigeration box, and a plurality of refrigeration chambers formed in the refrigeration box. Upper conductive parts or lower conductive parts are provided between adjacent refrigeration chambers. The upper conductive parts and the lower conductive parts are staggered along the distribution direction of the refrigeration chambers. The refrigeration chambers are connected once through the upper conductive parts or the lower conductive parts to form a refrigeration channel that allows the refrigerant to pass through the interior of the refrigeration box in a circuitous manner. The head and tail ends of the refrigeration channel are respectively connected to the liquid inlet and the liquid outlet.

[0009] As a specific solution, the refrigeration box includes a heat-conducting base and a box cover that are connected to each other. The outer side of the heat-conducting base is connected to the refrigeration plate. A number of long fins and short fins are distributed on the inner side of the heat-conducting base. A number of isolation plates are provided on the inner side of the box cover. The long fins and the short fins are arranged adjacent to each other. The long fins and the upper side of the box cover form an upper conductive part, and the short fins and the isolation plates form a lower conductive part.

[0010] As a specific solution, the heat conducting base and the box cover are detachable from each other, and a sealing silicone is provided between the heat conducting base and the box cover, and the sealing silicone is tightly matched with the heat conducting base and the box cover respectively.

[0011] As a specific solution, a sensor mounting hole is provided on the outside of the refrigeration box, and a temperature sensor is provided in the sensor mounting hole.

[0012] As a specific solution, a positioning plate is connected to the bottom of the refrigeration box, and positioning holes corresponding to the refrigeration plates are provided on the positioning plate. The positioning plate and the refrigeration box are fixed by screws.

[0013] As a specific solution, the outer side of the refrigeration box is provided with a heat-insulating cover, and the heat-insulating cover is provided with avoidance holes at positions corresponding to the liquid inlet and the liquid outlet, and the liquid inlet and the liquid outlet extend outward through the avoidance holes.

[0014] As a specific solution, a radiator is connected to a side of the refrigeration fin facing away from the refrigeration box, and a cooling fan is connected to a side of the radiator facing away from the refrigeration fin.

[0015] As a specific solution, a plurality of heat dissipation slots are provided on the side of the radiator facing the heat dissipation fan.

[0016] The beneficial effects of the utility model are:

[0017] By setting up the refrigeration channel, the refrigerant can pass through the refrigeration box in a circuitous manner, thereby increasing the distance the refrigerant passes through the refrigeration box, so that the refrigerant can be fully cooled and the refrigeration effect is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional schematic diagram of an embodiment of the present utility model.

[0019] Figure 2 It is an exploded schematic diagram of an embodiment of the present utility model.

[0020] Figure 3 It is a structural schematic diagram of an embodiment of the present utility model.

[0021] Figure 4 It is an enlarged view of A in embodiment of the present invention. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] See also Figures 1-4The semiconductor refrigeration system includes a refrigeration box 1, which has a liquid inlet 11 and a liquid outlet 12. The outside of the refrigeration box 1 is connected to a refrigeration plate 2. A plurality of refrigeration chambers 13 are formed in the refrigeration box 1. An upper conductive portion 14 or a lower conductive portion 15 is provided between adjacent refrigeration chambers 13. The upper conductive portion 14 and the lower conductive portion 15 are staggered along the distribution direction of the refrigeration chamber 13. The refrigeration chamber 13 is connected once through the upper conductive portion 14 or the lower conductive portion 15 to form a refrigeration channel that allows the refrigerant to pass through the inside of the refrigeration box 1 in a circuitous manner. The head and tail ends of the refrigeration channel are respectively connected to the liquid inlet 11 and the liquid outlet 12. By setting the refrigeration channel, the refrigerant can pass through the refrigeration box 1 in a circuitous manner, thereby increasing the travel of the refrigerant through the refrigeration box 1, so that the refrigerant can be fully cooled and the refrigeration effect is improved.

[0024] Furthermore, the refrigeration box 1 includes a heat-conducting base 16 and a box cover 17 that cover each other. The outer side of the heat-conducting base 16 is connected to the refrigeration plate 2. A number of long fins 161 and short fins 162 are distributed on the inner side of the heat-conducting base 16. A number of isolation sheets 171 are provided on the inner side of the box cover 17. The long fins 161 and the short fins 162 are arranged adjacent to each other. The long fins 161 and the upper side of the box cover 17 form an upper conductive portion 14, and the short fins 162 and the isolation sheet 171 form a lower conductive portion 15. The heat-conducting base 16 and the box cover 17 can be processed separately and then assembled, which simplifies the manufacturing difficulty of the refrigeration box 1.

[0025] Furthermore, the heat conducting base 16 and the box cover 17 are detachable from each other, and a sealing silicone 3 is provided between the heat conducting base 16 and the box cover 17. The sealing silicone 3 is tightly fitted with the heat conducting base 16 and the box cover 17 respectively, which can reduce the chance of refrigerant leakage from the connection position between the heat conducting base 16 and the box cover 17.

[0026] Furthermore, a sensor mounting hole 18 is provided on the outside of the refrigeration box 1 , and a temperature sensor (not shown) is provided in the sensor mounting hole 18 , so that the user can detect the temperature of the refrigerant inside the refrigeration box 1 .

[0027] Furthermore, a positioning plate 4 is connected to the bottom of the refrigeration box 1, and a positioning hole 41 corresponding to the refrigeration plate 2 is provided on the positioning plate 4. The positioning plate 4 and the refrigeration box 1 are installed and fixed by a screw device. After the positioning plate 4 and the refrigeration box 1 are installed and connected, the refrigeration plate 2 can be positioned at the same time, thereby improving the installation accuracy between the refrigeration plate 2 and the refrigeration box 1.

[0028] Furthermore, an outer sleeve of the refrigeration box 1 is provided with a heat-insulating cover 5, and an avoidance hole 51 is provided at the position of the heat-insulating cover 5 corresponding to the liquid inlet 11 and the liquid outlet 12. The liquid inlet 11 and the liquid outlet 12 extend outward through the avoidance hole 51. The heat-insulating cover 5 can keep the inside of the refrigeration box 1 warm, thereby further improving the cooling effect of the refrigerant in the refrigeration box 1.

[0029] Furthermore, a radiator 6 is connected to the side of the refrigeration fin 2 facing away from the refrigeration box 1 , and a cooling fan 7 is connected to the side of the radiator 6 facing away from the refrigeration fin 2 , which can prevent the refrigeration fin 2 from being damaged due to excessive operating temperature and improve the service life of the refrigeration fin 2 .

[0030] Furthermore, a plurality of cooling air slots 61 are provided on the side of the radiator 6 facing the cooling fan 7 to increase the contact area between the airflow and the radiator 6 , thereby further improving the heat dissipation effect of the radiator 6 on the cooling fins 2 .

[0031] The above embodiments are only preferred embodiments of the present invention, and other embodiments are possible. Those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope set by the claims of this application.

Claims

1. A semiconductor refrigeration system, comprising a refrigeration box (1), wherein the refrigeration box (1) has a liquid inlet (11) and a liquid outlet (12), and a refrigeration plate (2) is connected to the outside of the refrigeration box (1), characterized in that: A plurality of refrigeration chambers (13) are formed in the refrigeration box (1), and an upper conductive portion (14) or a lower conductive portion (15) is provided between adjacent refrigeration chambers (13). The upper conductive portion (14) and the lower conductive portion (15) are staggered along the distribution direction of the refrigeration chambers (13). The refrigeration chambers (13) are connected once through the upper conductive portion (14) or the lower conductive portion (15) to form a refrigeration channel that allows the refrigerant to pass through the refrigeration box (1) in a circuitous manner. The first and last ends of the refrigeration channel are respectively connected to the liquid inlet (11) and the liquid outlet (12).

2. The semiconductor refrigeration system according to claim 1, characterized in that: The refrigeration box (1) comprises a heat-conducting base (16) and a box cover (17) which are connected to each other. The outer side of the heat-conducting base (16) is connected to the refrigeration plate (2). The inner side of the heat-conducting base (16) is provided with a plurality of long fins (161) and short fins (162). The inner side of the box cover (17) is provided with a plurality of isolation sheets (171). The long fins (161) and the short fins (162) are arranged adjacent to each other. The long fins (161) and the upper side of the box cover (17) form an upper conductive portion (14), and the short fins (162) and the isolation sheet (171) form a lower conductive portion (15).

3. The semiconductor refrigeration system according to claim 2, characterized in that: The heat conducting base (16) and the box cover (17) are detachable from each other, and a sealing silica gel (3) is provided between the heat conducting base (16) and the box cover (17), and the sealing silica gel (3) is tightly matched with the heat conducting base (16) and the box cover (17), respectively.

4. The semiconductor refrigeration system according to claim 1, characterized in that: A sensor mounting hole (18) is provided on the outside of the refrigeration box (1), and a temperature sensor is provided in the sensor mounting hole (18).

5. The semiconductor refrigeration system according to claim 1, characterized in that: The bottom of the refrigeration box (1) is connected to a positioning plate (4), and the positioning plate (4) is provided with positioning holes (41) corresponding to the refrigeration fins (2). The positioning plate (4) and the refrigeration box (1) are fixed by screws.

6. The semiconductor refrigeration system according to claim 1, characterized in that: The outer side of the refrigeration box (1) is provided with a heat-insulating cover (5), and the heat-insulating cover (5) is provided with avoidance holes (51) at positions corresponding to the liquid inlet (11) and the liquid outlet (12), and the liquid inlet (11) and the liquid outlet (12) extend outward through the avoidance holes (51).

7. The semiconductor refrigeration system according to any one of claims 1 to 6, characterized in that: The side of the refrigeration fin (2) facing away from the refrigeration box (1) is connected to a radiator (6), and the side of the radiator (6) facing away from the refrigeration fin (2) is connected to a cooling fan (7).

8. The semiconductor refrigeration system according to claim 7, characterized in that: A plurality of heat dissipation slots (61) are provided on one side of the radiator (6) facing the heat dissipation fan (7).

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