Optical evaluation board and evaluation system of electric chip

Abstract

The utility model provides an optical evaluation board and an evaluation system of an electric chip. The optical evaluation board comprises a radio frequency connector, the electric chip, an optical chip, a lens assembly and an optical signal transmitter. The radio frequency connector receives a differential electric signal and outputs the differential electric signal to the electric chip, the electric chip converts the differential electric signal into a current signal and outputs the current signal to the optical chip, the optical chip converts the current signal into an optical signal and transmits the optical signal to the lens assembly and the optical signal transmitter, and the performance of the electric chip during electro-optical conversion can be obtained by analyzing the output optical signal; or the optical signal transmitter and the lens assembly receive the optical signals and output the optical signals to the optical chip, the optical chip converts the optical signals into current signals and outputs the current signals to the electric chip, the electric chip converts the current signals into differential electric signals and transmits the differential electric signals to the radio frequency connector, and the electric chip performance during photoelectric conversion can be obtained by analyzing the output electric signals. According to the utility model, the real performance of the electric chip during photoelectric communication can be obtained, and the device has the advantages of reliable test result, low cost and high portability.

Description

Technical Field

[0001] The utility model relates to a performance testing device for an electric chip, in particular to an optical evaluation board and an evaluation system for the electric chip. Background Art

[0002] Optoelectronic communication chips typically consist of optical and electrical chips, used to achieve photoelectrical or electrical-optical conversion. They are widely used in big data interconnection, wireless communications, and industrial automation. The high-speed performance parameters of the electrical chip are crucial for optoelectronic communication chips. These high-speed performance parameters primarily include S-parameters and electrical eye diagrams.

[0003] To evaluate the high-speed performance parameters of electronic chips, high-frequency probes are typically used for probing. However, high-frequency probe testing can damage the chip and only provides isolated performance parameters, failing to accurately measure the chip's true performance during optoelectronic communication. Therefore, determining the true performance of electronic chips during optoelectronic communication has become a pressing issue for those skilled in the art.

[0004] It should be noted that the above technical background is merely for the purpose of providing a clear and complete description of the technical solutions of the present invention and to facilitate understanding by those skilled in the art. It should not be assumed that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present invention. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an optical evaluation board and evaluation system for an electrical chip, so as to solve the problem in the prior art that the true performance of the electrical chip during optoelectronic communication cannot be obtained.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides an optical evaluation board for an electric chip, the optical evaluation board for the electric chip comprising at least: an RF connector, an electric chip, an optical chip, a lens assembly, and an optical signal transmitter; the RF connector transmits differential electrical signals; a first end of the electric chip is connected to the RF connector, and a second end is connected to the optical chip; the electric chip converts the differential electrical signal provided by the RF connector into a current signal; or the electric chip converts the current signal provided by the optical chip into a differential electrical signal; the optical chip is disposed between the electric chip and the lens assembly; the optical chip converts the current signal provided by the electric chip into a differential electrical signal. into an optical signal; or the optical chip converts the optical signal transmitted by the lens assembly into an electric current signal; the lens assembly is arranged between the optical chip and the optical signal transmitter; the lens assembly transmits the optical signal output by the optical chip to the optical signal transmitter; or the lens assembly receives the optical signal output by the optical signal transmitter and transmits it to the optical chip; the optical signal transmitter includes a first optical fiber connector, an optical fiber and a second optical fiber connector, the first optical fiber connector, the optical fiber and the second optical fiber connector are connected in sequence, and the first optical fiber connector is connected to the lens assembly; the optical signal transmitter transmits the optical signal.

[0007] Optionally, the electrical chip and the optical chip are connected via a gold bonding wire, and the length of the gold bonding wire is 250 μm-500 μm.

[0008] Optionally, the lens assembly includes a first lens and a second lens; the optical signal output by the optical chip is collimated by the first lens and focused by the second lens and transmitted to the optical signal transmitter; or the optical signal output by the optical signal transmitter is collimated by the second lens and focused by the first lens and transmitted to the optical chip.

[0009] Optionally, the first optical fiber connector is an MT female connector.

[0010] Optionally, the second optical fiber connector is an MPO male connector.

[0011] Optionally, the optical evaluation board of the electric chip further includes a PCB board, and the electric chip and the optical chip are packaged on the PCB board in a COB form.

[0012] More optionally, the lens assembly is fixed on the PCB board by optical glue.

[0013] More optionally, the first optical fiber connector is fixed to the lens assembly by optical glue.

[0014] More optionally, the first optical fiber connector and the second optical fiber connector are fixed at both ends of the optical fiber.

[0015] The present utility model also provides an evaluation system, which at least includes: a differential electrical signal processing device, an optical signal processing device, and the optical evaluation board of the electrical chip; the differential electrical signal processing device outputs a differential electrical signal and transmits it to the optical evaluation board of the electrical chip, the optical evaluation board of the electrical chip converts the differential electrical signal into an optical signal, and the optical signal processing device processes the optical signal output by the optical evaluation board of the electrical chip; the optical signal processing device outputs an optical signal and transmits it to the optical evaluation board of the electrical chip, the optical evaluation board of the electrical chip converts the optical signal into a differential electrical signal, and the differential electrical signal processing device processes the electrical signal output by the optical evaluation board of the electrical chip.

[0016] As described above, the optical evaluation board and evaluation system for electronic chips of the present invention have the following beneficial effects:

[0017] 1. The utility model can obtain the real performance of the electrical chip during optoelectronic communication by evaluating the electrical chip during optoelectronic communication.

[0018] 2. The present invention uses a lens assembly to receive the optical signal output by the optical chip, and fixes the position between the lens assembly and the optical chip, so that the lens assembly can obtain an optical signal with a constant transmission angle and distance, thereby improving the coupling efficiency and coupling quality of the optical signal; the present invention transmits the optical signal between the optical chip and the optical signal processing device through an optical signal transmitter, thereby avoiding the influence of plugging and unplugging actions on the optical signal.

[0019] 3. The present invention connects the electrical chip by using a radio frequency connector. Since the radio frequency connector has the advantages of low loss and high isolation, the present invention improves the transmission efficiency and signal quality of the electrical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a structural schematic diagram of an optical evaluation board for an electrical chip of the present invention.

[0021] Figure 2 Shown is a structural schematic diagram of an optical evaluation board of an electrical chip of the present invention applied on a PCB board.

[0022] Figure 3 Shown is a structural schematic diagram of a lens assembly of an optical evaluation board of an electronic chip of the present invention.

[0023] Figure 4 Shown is a structural schematic diagram of the evaluation system of the present utility model.

[0024] Component number description

[0025] 1 Optical evaluation board for electronic chips

[0026] 11 RF connector

[0027] 12 Electronic Chips

[0028] 13 Optical Chips

[0029] 14 Lens Assembly

[0030] 14a First lens

[0031] 14b Second lens

[0032] 14c Reflector

[0033] 14d Support

[0034] 15 Optical signal transmitter

[0035] 15a First optical fiber connector

[0036] 15b fiber

[0037] 15c Second fiber optic connector

[0038] 16 PCB board

[0039] 2 Differential electrical signal processing device

[0040] 3 Optical signal processing device DETAILED DESCRIPTION

[0041] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0042] See also Figures 1-4 It should be noted that the illustrations provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0043] In order to obtain the performance of the electronic chip during optoelectronic communication, a high-frequency probe can be inserted into the electronic chip port to obtain the output electrical signal, or an optical fiber can be connected to the optical chip interface to obtain the output optical signal. However, inserting a high-frequency probe into the electronic chip port has the risk of damaging the electronic chip, and directly connecting the optical fiber to the optical chip has the effect of plugging and unplugging the output optical signal, so it is impossible to obtain accurate electronic chip performance. In order to obtain the true and accurate performance of the electronic chip during optoelectronic communication, the specific solution of the utility model is as follows:

[0044] Example 1

[0045] like Figure 1 As shown, this embodiment provides an optical evaluation board 1 for an electrical chip. The optical evaluation board 1 for the electrical chip includes: a radio frequency connector 11 , an electrical chip 12 , an optical chip 13 , a lens assembly 14 and an optical signal transmitter 15 .

[0046] like Figure 1 As shown, the RF connector 11 transmits differential electrical signals.

[0047] Specifically, in this embodiment, the RF connector 11 transmits the input electrical signal during electro-optical conversion and the output electrical signal during photoelectric conversion. The performance of the electrical chip during photoelectric conversion can be determined by analyzing the output electrical signal. Specifically, by connecting the RF connector 11 between the differential electrical signal processing device 2 and the electrical chip 12, and utilizing the advantages of low loss and high repeatability of the RF connector 11, the problem of incomplete transmission of high-frequency signals from the electrical chip 12 due to impedance mismatch caused by the direct connection between the differential electrical signal processing device 2 and the electrical chip 12 can be avoided.

[0048] like Figure 1 As shown, the first end of the electrical chip 12 is connected to the RF connector 11, and the second end is connected to the optical chip 13; the electrical chip 12 converts the differential electrical signal provided by the RF connector 11 into a current signal; or the electrical chip 12 converts the current signal provided by the optical chip 13 into a differential electrical signal.

[0049] Specifically, in this embodiment, the differential electrical signal is typically in the form of voltage, and the electrical signal received by the optical chip 13 is typically in the form of current. Therefore, the electrical chip 12 needs to convert the voltage signal into the current signal and vice versa. In practical applications, any electrical chip 12 capable of performing electrical signal conversion between the optical chip 13 and the differential electrical signal processing device 2 is applicable to the present invention, and is not limited to this embodiment.

[0050] like Figure 1 As shown, the optical chip 13 is disposed between the electrical chip 12 and the lens assembly 14 ; the optical chip 13 converts the current signal provided by the electrical chip 12 into an optical signal; or the optical chip 13 converts the optical signal transmitted from the lens assembly 14 into a current signal.

[0051] Specifically, in this embodiment, to reduce the inductance between the electrical chip 12 and the optical chip 13 and thereby increase the operating bandwidth of the electrical chip 12 and the optical chip 13, the electrical chip 12 and the optical chip 13 are connected by a gold bonding wire. The length of the gold bonding wire is set to 250μm-500μm, including but not limited to 300μm, 350μm, 400μm, and 450μm. As an example, the optical chip 13 uses a light-emitting diode to convert an electrical signal into an optical signal, and uses a photodiode to convert the optical signal into an electrical signal. It should be noted that any electronic device that can convert electrical signals into optical signals or vice versa can be used in the optical chip 13, and is not limited to this embodiment.

[0052] like Figure 1 As shown, the lens assembly 14 is arranged between the optical chip 13 and the optical signal transmitter 15; the lens assembly 14 transmits the optical signal output by the optical chip 13 to the optical signal transmitter 15; or the lens assembly 14 receives the optical signal output by the optical signal transmitter 15 and transmits it to the optical chip 13.

[0053] Specifically, in this embodiment, the lens assembly 14 includes a first lens 14a and a second lens 14b. The optical signal output by the optical chip 13 is collimated by the first lens 14a and focused by the second lens 14b before being transmitted to the optical signal transmitter 15. Alternatively, the optical signal output by the optical signal transmitter 15 is collimated by the second lens 14b and focused by the first lens 14a before being transmitted to the optical chip 13. The lens assembly 14 is used to shape and focus the optical signal to improve the transmission efficiency of the optical signal. Furthermore, by fixing the position of the lens assembly 14 and the optical chip 13, the transmission distance and angle of the optical signal are fixed during transmission, thereby ensuring the coupling quality and coupling efficiency of the optical signal.

[0054] like Figure 2 As shown, the optical signal transmitter 15 includes a first optical fiber connector 15a, an optical fiber 15b and a second optical fiber connector 15c. The first optical fiber connector 15a, the optical fiber 15b and the second optical fiber connector 15c are connected in sequence, and the first optical fiber connector 15a is connected to the lens assembly 14; the optical signal transmitter 15 is used to transmit optical signals.

[0055] Specifically, in this embodiment, the optical signal transmitter 15 transmits the input optical signal during photoelectric conversion and the output optical signal during electro-optical conversion. The performance of the electrical chip 12 during electro-optical conversion can be obtained by analyzing the output optical signal. Specifically, the first optical fiber connector 15a and the second optical fiber connector 15c are fixed at both ends of the optical fiber 15b, and the length of the optical fiber 15b can be adjusted or set to be non-adjustable. Specifically, the first optical fiber connector 15a is an MT female head, and the MT female head matches the size of the lens assembly 14; the second optical fiber connector 15c is connected to the optical signal processing device 3, and the second optical fiber connector 15c is an MPO male head, and the MPO male head matches the size of the optical fiber connector of the optical signal processing device 3; connecting the lens assembly 14 and the optical signal processing device 3 through the optical signal transmitter 15 can avoid the instability of the optical signal caused by the direct insertion and removal of the optical fiber in the optical chip 13, improve the transmission efficiency and transmission quality of the optical signal, and reduce the error between the input light and the output light.

[0056] Example 2

[0057] like Figure 2 As shown, this embodiment provides an optical evaluation board 1 for an electronic chip. The difference between this embodiment and embodiment 1 is that this embodiment further includes a PCB board 16, and the electronic chip 12 and the optical chip 13 are packaged on the PCB board 16 in the form of COB, and the lens assembly 14 of this embodiment further includes a reflector 14c and a support member 14d.

[0058] Specifically, as an example of COB packaging, Figure 2 As shown, the electronic chip 12 is attached to the copper-exposed area of ​​the PCB board 16 via a conductive silver adhesive patch, in order to fix the electronic chip 12 and connect the ground wire of the electronic chip 12 to the PCB board 16; the power supply and low-speed pins of the electronic chip 12 are bonded to the PCB board 16 with gold wires for electrical connection; the first end of the electronic chip 12 is bonded to the high-speed differential transmission line on the PCB board 16 via gold wires and connected to the RF connector 11; the second end of the electronic chip 12 is bonded to the optical chip 13 via gold wires.

[0059] Specifically, as an example of COB packaging, Figure 2 As shown, the optical chip 13 is attached to the copper exposed area of ​​the PCB board 16 through a conductive silver glue patch, in order to fix the optical chip 13 and connect the ground wire of the optical chip 13 to the PCB board 16; in order to increase the working bandwidth of the optical chip 13 and the electrical chip 12, the length of the gold wire between the optical chip 13 and the electrical chip 12 is 250μm-500μm, including but not limited to 300μm, 350μm, 400μm, 450μm, and the ports between the optical chip 13 and the electrical chip 12 can be aligned or not.

[0060] Specifically, if Figure 3As shown, the lens assembly 14 includes a first lens 14a, a second lens 14b, a reflector 14c, and a support member 14d. As an example, to avoid affecting the optical signal transmission between the optical chip 13 and the optical signal transmitter 15, the support member 14d is made of a light-transmitting material; the support member 14d is fixed to the PCB board 16 using optical adhesive, the first lens 14a and the second lens 14b are fixed to the reflector 14c, and the reflector 14c is fixed to the support member 14d; the first lens 14a, the second lens 14b, and the reflector 14c are located above the optical chip 13, facilitating the transmission of the optical signal output by the optical chip 13 to the optical signal transmitter 15, or the transmission of the optical signal output by the optical signal transmitter 15 to the optical chip 13.

[0061] Specifically, if Figure 2 As shown, the optical signal transmitter 15 includes a first optical fiber connector 15a, an optical fiber 15b, and a second optical fiber connector 15c. The first optical fiber connector 15a and the second optical fiber connector 15c are fixed to the ends of the optical fiber 15b, and the length of the optical fiber 15b is set to be adjustable or non-adjustable. The first optical fiber connector 15a is fixed to the lens assembly 14 by optical glue, and the second optical fiber connector 15c connects the optical fiber 15b to the optical fiber connector of the optical signal processing device 3. As an example, the first optical fiber connector 15a is an MT female connector that matches the size of the lens assembly 14; the second optical fiber connector 15c is an MPO male connector that matches the size of the optical fiber interface of the optical signal processing device 3. In actual applications, the fixing method of the RF connector 11, the electronic chip 12, the optical chip 13, the lens assembly 14, and the optical signal transmitter 15 on the PCB board 16 can be selected according to needs, and is not limited to this embodiment.

[0062] In this embodiment, a PCB board 16 is used to fix the positions of the RF connector 11, the electrical chip 12, the optical chip 13, the lens assembly 14 and the optical signal transmitter 15, and the electrical chip 12 and the optical chip 13 are packaged in a COB form. The purpose is to increase the mechanical stability of the optical evaluation board 1 of the electrical chip, so that the optical evaluation board 1 of the electrical chip is easy to carry and has stable performance.

[0063] Example 3

[0064] This embodiment further provides an evaluation system, which at least includes: a differential electrical signal processing device 2 , an optical signal processing device 3 , and an optical evaluation board 1 of the electrical chip of the first or second embodiment.

[0065] Specifically, in this embodiment, Figure 4As shown, during electro-optical conversion, the differential electrical signal processing device 2 outputs a differential electrical signal to the optical evaluation board 1 of the electrical chip. The optical evaluation board 1 converts the differential electrical signal into an optical signal and outputs it to the optical signal processing device 3. The optical signal processing device 3 analyzes the output optical signal to obtain the electrical chip performance during electro-optical conversion. During photoelectric conversion, the optical signal processing device 3 outputs an optical signal to the optical evaluation board 1 of the electrical chip. The optical evaluation board 1 of the electrical chip converts the optical signal into a differential electrical signal and outputs it to the differential electrical signal processing device 2. The differential electrical signal processing device 2 analyzes the output electrical signal to obtain the electrical chip performance during photoelectric conversion.

[0066] In summary, the present invention uses an optical evaluation board to perform performance testing on an electrical chip used in optoelectronic communication, and utilizes an optical signal transmitter and a lens assembly to connect the optical chip to an optical signal processing device. Furthermore, the present invention fixes the relative position between the optical chip and the lens assembly. Furthermore, the present invention connects the electrical chip to a differential electrical signal processing device via an RF connector. Therefore, the present invention has the advantages of high quality and high transmission efficiency for output electrical or optical signals. By analyzing the output electrical or optical signals, the present invention can obtain true and accurate electrical chip performance. Furthermore, the present invention also has the advantages of low cost and high portability. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial value.

[0067] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. An optical evaluation board for an electronic chip, characterized in that: The optical evaluation board of the electric chip comprises at least: a radio frequency connector, an electric chip, an optical chip, a lens assembly and an optical signal transmitter; The radio frequency connector transmits differential electrical signals; The first end of the electrical chip is connected to the RF connector, and the second end is connected to the optical chip; the electrical chip converts the differential electrical signal provided by the RF connector into a current signal; or the electrical chip converts the current signal provided by the optical chip into a differential electrical signal; The optical chip is arranged between the electrical chip and the lens assembly; the optical chip converts the current signal provided by the electrical chip into an optical signal; or the optical chip converts the optical signal transmitted by the lens assembly into a current signal; The lens assembly is disposed between the optical chip and the optical signal transmitter; the lens assembly transmits the optical signal output by the optical chip to the optical signal transmitter; or the lens assembly receives the optical signal output by the optical signal transmitter and transmits the optical signal to the optical chip; The optical signal transmitter includes a first optical fiber connector, an optical fiber, and a second optical fiber connector, wherein the first optical fiber connector, the optical fiber, and the second optical fiber connector are connected in sequence, and the first optical fiber connector is connected to the lens assembly; The optical signal transmitter transmits an optical signal.

2. The optical evaluation board for an electronic chip according to claim 1, wherein: The electrical chip and the optical chip are connected via bonding gold wires, and the length of the bonding gold wires is 250 μm-500 μm.

3. The optical evaluation board for an electronic chip according to claim 1, wherein: The lens assembly includes a first lens and a second lens; the optical signal output by the optical chip is collimated by the first lens and focused by the second lens and transmitted to the optical signal transmitter; Alternatively, the optical signal output by the optical signal transmitter is collimated by the second lens and focused by the first lens and transmitted to the optical chip.

4. The optical evaluation board for an electronic chip according to claim 1, wherein: The first optical fiber connector is an MT female connector.

5. The optical evaluation board for an electronic chip according to claim 1, wherein: The second optical fiber connector is an MPO male connector.

6. The optical evaluation board for an electronic chip according to any one of claims 1 to 5, characterized in that: The optical evaluation board of the electric chip further comprises a PCB board, and the electric chip and the optical chip are packaged on the PCB board in the form of COB.

7. The optical evaluation board for an electronic chip according to claim 6, characterized in that: The lens assembly is fixed on the PCB board by optical glue.

8. The optical evaluation board for an electronic chip according to claim 6, wherein: The first optical fiber connector is fixed on the lens assembly by optical glue.

9. The optical evaluation board for an electronic chip according to claim 6, wherein: The first optical fiber connector and the second optical fiber connector are fixed at two ends of the optical fiber.

10. An evaluation system, characterized in that: The evaluation system comprises at least: a differential electrical signal processing device, an optical signal processing device, and an optical evaluation board based on the electrical chip according to any one of claims 1 to 9; The differential electrical signal processing device outputs a differential electrical signal and transmits it to the optical evaluation board of the electrical chip. The optical evaluation board of the electrical chip converts the differential electrical signal into an optical signal. The optical signal processing device processes the optical signal output by the optical evaluation board of the electrical chip. The optical signal processing device outputs an optical signal and transmits it to the optical evaluation board of the electrical chip. The optical evaluation board of the electrical chip converts the optical signal into a differential electrical signal. The differential electrical signal processing device processes the electrical signal output by the optical evaluation board of the electrical chip.

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