Small-size surface-mounted circuit protection component

Abstract

The utility model discloses a small-size surface-mounted circuit protection component, which belongs to the technical field of circuit protection, aims at solving the problem that the use performance is influenced due to the fact that an existing PTC (Positive Temperature Coefficient) chip is exposed in an external environment, and comprises a polymer conductive composite material base layer, a first conductive hole, a second conductive hole and a component encapsulation layer, according to the utility model, the element encapsulation layer is arranged, the encapsulation film made of the silicone rubber material coats the outer side of the element, and the element encapsulation layer can effectively protect the PTC element from external mechanical impact, vibration or physical damage; according to the technical scheme of the utility model, the element is not damaged in the transportation, installation and use processes, the reliability of the element is improved, the service life of the element is prolonged, and meanwhile, the element encapsulating layer can effectively prevent dust, dirt and water from entering the element, so that the fault risk caused by environmental factors is reduced, and the use performance of the element is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit protection, and in particular relates to a small-size surface-mounted circuit protection component. Background Art

[0002] Overcurrent protection components are used in electronic circuits to protect them from malfunctions or even burnouts due to overheating or overcurrent. In the overcurrent protection settings of circuits, under normal conditions, the current in the circuit is relatively small and the temperature of the thermistor is low. However, when a large current caused by a circuit fault passes through the resettable fuse, its temperature suddenly rises to the "shutoff" temperature, causing its resistance to become very large. This puts the circuit in an approximately "open circuit" state, thereby protecting other components in the circuit. When the fault is eliminated, the temperature of the thermistor drops and its resistance returns to a low resistance state.

[0003] The prior art discloses a surface-mount polymer PTC overcurrent protection element with a small package size and patent publication number CN111640548A. The above patent includes a PTC chip, an insulating layer, an end electrode, and at least one conductive member, wherein a dividing gap is designed on the first conductive electrode to form a first and a second conductive area. The conductive member is arranged at the edge or at least one corner of the first conductive area side of the PTC chip, and is used to conduct electricity between the first conductive area and the second conductive electrode on the PTC chip, and does not contact the end electrode. The main part of the dividing gap of the first conductive electrode is parallel to the longitudinal direction of the first and second end electrodes. The device facilitates the design of the resistance scheme of the overcurrent protection element and reduces the adjustment of the PTC core material formula; however, in actual use, there are still the following deficiencies: from a practical point of view, the PTC chips of the device are exposed to the external environment and are not isolated from the external environment. Therefore, the conductive material is easily affected by environmental factors such as temperature and humidity, resulting in an increase in resistance, which seriously affects its performance.

[0004] Therefore, a small-sized surface-mount circuit protection component is needed to solve the problem in the prior art that the PTC chip is exposed to the external environment and affects its performance. Utility Model Content

[0005] The purpose of the present utility model is to provide a small-sized surface-mounted circuit protection component to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: A small-size surface mount circuit protection component, comprising a polymer conductive composite material base, a first conductive hole, a second conductive hole and a component encapsulation layer, wherein the top of the polymer conductive composite material base is fixedly connected to a first conductive electrode, the bottom of the polymer conductive composite material base is fixedly connected to a second conductive electrode, the top of the first conductive electrode is fixedly connected to a first insulating layer, the bottom of the second conductive electrode is fixedly connected to a second insulating layer, the top of the first insulating layer is fixedly connected to a first solder resist layer, the bottom of the second insulating layer is fixedly connected to a second solder resist layer, the top of the first insulating layer is fixedly connected near one side to a first upper electrode, the bottom of the second insulating layer is fixedly connected near one side to a first lower electrode, the top of the first insulating layer is fixedly connected near the other side to a second upper electrode, and the bottom of the second insulating layer is fixedly connected near the other side to a second lower electrode.

[0007] It is further worth mentioning that the first conductive electrode and the second conductive electrode are both made of silver-plated copper foil.

[0008] It should be further explained that both the first insulating layer and the second insulating layer are made of polyimide.

[0009] As a preferred embodiment, the first solder resist layer and the second solder resist layer are both made of polyetheretherketone.

[0010] As a preferred embodiment, the first conductive via and the second conductive via are both opened through the interior of the multiple component layers.

[0011] As a preferred embodiment, the element encapsulation layer is coated on the outer wall of the multiple layered elements, and the element encapsulation layer is made of silicone rubber.

[0012] Compared with the prior art, the small-sized surface mount circuit protection component provided by the present invention has at least the following beneficial effects:

[0013] (1) By setting up a component encapsulation layer, an encapsulation film made of silicone rubber is coated on the outside of the component. The component encapsulation layer can effectively protect the PTC component from external mechanical shock, vibration or physical damage. It is crucial to ensure that the component is not damaged during transportation, installation and use, and helps to improve the reliability and life of the component. At the same time, the component encapsulation layer can effectively prevent dust, dirt and moisture from entering the interior of the component, thereby reducing the risk of failure caused by environmental factors and ensuring the performance of the component.

[0014] (2) By setting the first solder resist layer and the second solder resist layer, the quality and stability of the circuit connection can be ensured, which helps to ensure good contact between the electrode sheet and the PTC material, helps to reduce contact resistance, improve conductivity, and reduce electrical problems caused by poor connection quality; at the same time, the first conductive hole and the second conductive hole are set inside the component, and the conductive hole can be designed to optimize the current transmission path, thereby reducing resistance and heat, and the current can pass through the PTC material more effectively, so that it can respond more quickly to the overcurrent protection function when triggered. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of the utility model from a first perspective;

[0016] Figure 2 This is a schematic diagram of the structure of the utility model from a second perspective;

[0017] Figure 3 This is a schematic diagram of the structure of the present invention;

[0018] Figure 4 It is a cross-sectional schematic diagram of the present utility model.

[0019] In the figure: 1. Polymer conductive composite material base; 2. First conductive electrode; 3. Second conductive electrode; 4. First insulating layer; 5. Second insulating layer; 6. First solder resist layer; 7. Second solder resist layer; 8. First upper electrode; 9. First lower electrode; 10. Second upper electrode; 11. Second lower electrode; 12. First conductive hole; 13. Second conductive hole; 14. Component encapsulation layer. DETAILED DESCRIPTION

[0020] The present invention will be further described below with reference to the embodiments.

[0021] See also Figure 1-4 The utility model provides a small-size surface-mount circuit protection component, including a polymer conductive composite material base 1, a first conductive hole 12, a second conductive hole 13 and a component encapsulation layer 14. The top of the polymer conductive composite material base 1 is fixedly connected to a first conductive electrode 2, the bottom of the polymer conductive composite material base 1 is fixedly connected to a second conductive electrode 3, the top of the first conductive electrode 2 is fixedly connected to a first insulating layer 4, the bottom of the second conductive electrode 3 is fixedly connected to a second insulating layer 5, the top of the first insulating layer 4 is fixedly connected to a first solder resist layer 6, the bottom of the second insulating layer 5 is fixedly connected to a second solder resist layer 7, the top of the first insulating layer 4 is fixedly connected near one side to a first upper electrode 8, the bottom of the second insulating layer 5 is fixedly connected near one side to a first lower electrode 9, the top of the first insulating layer 4 is fixedly connected near the other side to a second upper electrode 10, and the bottom of the second insulating layer 5 is fixedly connected near the other side to a second lower electrode 11.

[0022] Further as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, it is worth noting that the first conductive electrode 2 and the second conductive electrode 3 are both made of silver-plated copper foil. The silver-plated copper foil has high electrical conductivity and can effectively conduct current. Copper itself has good conductivity, and the silver layer further improves the conductivity, reduces the resistance, and helps to reduce energy loss and heat generation.

[0023] Further as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, it is worth mentioning that the first insulating layer 4 and the second insulating layer 5 are both made of polyimide material. The polyimide material itself has good electrical insulation properties, can effectively isolate and block current, prevent short circuits and electrical interference between different parts of the circuit, help maintain the stable working state of the PTC element, and ensure its normal electrical performance and safety.

[0024] Further as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, it is worth mentioning that the first solder resist layer 6 and the second solder resist layer 7 are both made of polyetheretherketone (PEEK), which has excellent chemical stability and can resist erosion and corrosion by many chemicals. It can effectively protect the metal lines and welding points of the circuit board from the influence of the external environment, thereby improving the reliability and service life of the components.

[0025] According to the above working process, it can be seen that by setting the first solder resist layer 6 and the second solder resist layer 7, the quality and stability of the circuit connection can be ensured, which helps to ensure good contact between the electrode sheet and the PTC material, helps to reduce contact resistance, improve conductivity, and reduce electrical problems caused by poor connection quality.

[0026] Further as Figure 3 and Figure 4 As shown, it is worth mentioning that the first conductive hole 12 and the second conductive hole 13 are both opened through the interior of multiple component layers. The conductive holes can be designed to optimize the current transmission path, thereby reducing resistance and heat. The current can pass through the PTC material more effectively, so that it can respond more quickly to the overcurrent protection function when triggered.

[0027] Further as Figure 4As shown, it is worth mentioning that the element encapsulation layer 14 is coated on the outer wall of multiple element layers. The element encapsulation layer 14 can effectively protect the PTC element from external mechanical shock, vibration or physical damage, and can effectively prevent dust, dirt and moisture from entering the interior of the element; and the element encapsulation layer 14 is made of silicone rubber. Silicone rubber has good aging resistance, can maintain its physical and chemical properties for a long time, and has strong resistance to most chemicals and environmental influences. Therefore, it can maintain stability in various complex working environments.

[0028] This solution has the following working process: in actual use, under normal working conditions, the polymer conductive composite material base layer 1 of the PTC element has a low resistance, and the first conductive electrode 2, the second conductive electrode 3, the first conductive hole 12 and the second conductive hole 13 can ensure that current can pass freely. When the current in the circuit exceeds the rated current value of the PTC element, due to the thermal effect of the material, the resistance inside the polymer conductive composite material base layer 1 will begin to rise. The resistance of the PTC material increases sharply with the increase in temperature, resulting in a significant reduction in the current passing through the element, even reaching a state of almost disconnection, limiting the current in the circuit and preventing other electronic components from being damaged by overcurrent. Once the current load decreases, the PTC element begins to cool, and its resistance returns to a lower level, allowing the circuit to resume operation.

[0029] In summary: by setting the first solder resist layer 6 and the second solder resist layer 7, the quality and stability of the circuit connection can be ensured, which helps to ensure good contact between the electrode sheet and the PTC material, helps to reduce contact resistance, improve conductivity, and reduce electrical problems caused by poor connection quality; at the same time, the first conductive hole 12 and the second conductive hole 13 are set inside the component, and the conductive holes can be designed to optimize the current transmission path, thereby reducing resistance and heat, and the current can pass through the PTC material more effectively, so that it can respond to the overcurrent protection function faster when triggered; by setting the component encapsulation layer 14, the encapsulation film made of silicone rubber material is coated on the outside of the component, and the component encapsulation layer 14 can effectively protect the PTC component from external mechanical shock, vibration or physical damage, which is crucial to ensuring that the component is not damaged during transportation, installation and use, and helps to improve the reliability and life of the component. At the same time, the component encapsulation layer 14 can effectively prevent dust, dirt and moisture from entering the interior of the component, thereby reducing the risk of failure caused by environmental factors and ensuring the performance of the component.

Claims

1. A small-sized surface-mount circuit protection component, comprising a polymer conductive composite material base (1), a first conductive hole (12), a second conductive hole (13) and a component encapsulation layer (14), characterized in that: The top of the polymer conductive composite material base layer (1) is fixedly connected to a first conductive electrode (2), the bottom of the polymer conductive composite material base layer (1) is fixedly connected to a second conductive electrode (3), the top of the first conductive electrode (2) is fixedly connected to a first insulating layer (4), the bottom of the second conductive electrode (3) is fixedly connected to a second insulating layer (5), the top of the first insulating layer (4) is fixedly connected to a first solder resist layer (6), the bottom of the second insulating layer (5) is fixedly connected to a second solder resist layer (7), the top of the first insulating layer (4) is fixedly connected to a first upper electrode (8) near one side, the bottom of the second insulating layer (5) is fixedly connected to a first lower electrode (9) near one side, the top of the first insulating layer (4) is fixedly connected to a second upper electrode (10) near the other side, and the bottom of the second insulating layer (5) is fixedly connected to a second lower electrode (11) near the other side.

2. The small-sized surface mount circuit protection component according to claim 1, characterized in that: The first conductive electrode (2) and the second conductive electrode (3) are both made of silver-plated copper foil.

3. The small-sized surface mount circuit protection component according to claim 1, characterized in that: The first insulating layer (4) and the second insulating layer (5) are both made of polyimide material.

4. The small-sized surface mount circuit protection component according to claim 1, characterized in that: The first solder resist layer (6) and the second solder resist layer (7) are both made of polyetheretherketone.

5. The small-sized surface mount circuit protection component according to claim 1, characterized in that: The first conductive hole (12) and the second conductive hole (13) are both opened through the interior of the multiple component layers.

6. The small-sized surface mount circuit protection component according to claim 1, characterized in that: The element encapsulation layer (14) is coated on the outer walls of the multiple element layers, and the element encapsulation layer (14) is made of silicone rubber.

Images