Heat dissipation device for chip packaging

Abstract

The utility model relates to the technical field of chip packaging, and discloses a heat dissipation device for chip packaging, which comprises a substrate assembly, a heat dissipation structure and a packaging chip, the heat dissipation structure is fixedly arranged on the substrate assembly, and the packaging chip is arranged on the substrate assembly and is attached to the heat dissipation structure; the heat dissipation structure comprises a vapor chamber, a heat conduction silica gel gasket and heat dissipation fins, the heat conduction silica gel gasket is fixedly connected to the vapor chamber, the packaging chip is attached to the heat conduction silica gel gasket, and the heat dissipation fins are fixedly connected to the face, away from the heat conduction silica gel gasket, of the vapor chamber. According to the utility model, through the synergistic effect of the vapor chamber, the heat conduction silica gel gasket and the heat dissipation fins, heat generated by packaging the chip can be quickly and effectively dissipated out, the heat conduction silica gel gasket is tightly attached to the chip body, the heat is efficiently transmitted to the vapor chamber, and the vapor chamber uniformly disperses the heat and then transmits the heat to the surrounding environment through the heat dissipation fins.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a heat dissipation device for chip packaging. Background Art

[0002] The heat generated by the chip during operation is also increasing. If the heat cannot be dissipated in a timely and effective manner, the temperature of the chip will be too high, which will not only affect the performance and reliability of the chip, but may also cause damage to the chip and shorten its service life. After searching, the patent document with application number 201520424723.4 discloses a chip packaging structure, which includes a power chip, and the periphery of the power chip is provided with a packaging resin for packaging it, and the packaging resin is provided with a heat dissipation structure for dissipating the heat of the power chip, and the packaging resin is provided with a heat dissipation structure mounting opening corresponding to the position of the power chip. The heat dissipation structure is installed through the heat dissipation structure mounting opening to dissipate the heat of the power chip; a hollow structure of the packaging resin is provided at the power chip, which can reduce the problem that the heat dissipation performance of the chip after packaging does not meet the product requirements due to the poor heat dissipation performance of the packaging resin, and heat dissipation devices of different materials and structures can be provided at the hollow part.

[0003] However, in the prior art, the chip packaging process is complicated. Therefore, in order to improve the chip packaging efficiency and the heat dissipation effect of the chip packaging, a heat dissipation device for chip packaging is proposed. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a heat dissipation device for chip packaging.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a heat dissipation device for chip packaging, comprising a substrate assembly, a heat dissipation structure and a packaged chip, wherein the heat dissipation structure is fixedly mounted on the substrate assembly, and the packaged chip is mounted on the substrate assembly and is fitted with the heat dissipation structure; the heat dissipation structure comprises a heat spreader, a thermally conductive silicone gasket and heat dissipation fins, wherein the thermally conductive silicone gasket is fixedly connected to the heat spreader, the packaged chip is fitted on the thermally conductive silicone gasket, and the heat spreader is fixedly connected with heat dissipation fins on the side away from the thermally conductive silicone gasket.

[0006] As a further description of the above technical solution:

[0007] The substrate assembly includes a substrate carrier. The heat spreader is fixedly connected to a welding portion, and the welding portion is fixedly connected to the substrate carrier.

[0008] As a further description of the above technical solution:

[0009] A positioning hole is provided on the substrate carrier, and a positioning column is fixedly connected to the heat spreader on the same surface as the heat conductive silicone gasket, and the positioning column is arranged in the positioning hole.

[0010] As a further description of the above technical solution:

[0011] There are multiple heat dissipation fins and they are evenly distributed on the heat spreader.

[0012] As a further description of the above technical solution:

[0013] A packaging groove is provided on the substrate carrier, and the thermal conductive silicone gasket is arranged in the packaging groove.

[0014] As a further description of the above technical solution:

[0015] The substrate carrier is fixedly connected with protection plates on both sides of the packaging groove.

[0016] As a further description of the above technical solution:

[0017] The packaged chip comprises a chip body, the chip body is provided with pins, and the pins are welded on a substrate carrier.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the present invention, the heat generated by the packaged chip can be quickly and effectively dissipated through the synergistic effect of the heat spreader, thermal conductive silicone gasket and heat sink fins. The thermal conductive silicone gasket fits tightly to the chip body and efficiently transfers the heat to the heat spreader. The heat spreader then evenly disperses the heat and transfers it to the surrounding environment through the heat sink fins, greatly reducing the operating temperature of the chip and improving the performance and reliability of the chip.

[0020] 2. Among them, the positioning posts on the heat spreader cooperate with the positioning holes on the substrate carrier, which can effectively improve the installation efficiency of the heat spreader and the welding connection between the welding part and the substrate carrier, ensuring a firm connection between the heat dissipation structure and the substrate assembly, improving the mechanical strength and stability of the entire device, and ensuring that the heat dissipation device will not loosen or shift during the operation of the chip, thereby stably exerting the heat dissipation effect.

[0021] 3. In addition, the design of the positioning posts and positioning holes as well as the packaging slot structure make the assembly of the heat dissipation device more convenient and quick, thereby improving production efficiency. At the same time, this structure also facilitates operation during the chip packaging process, reducing assembly difficulty and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The utility model proposes a three-dimensional heat dissipation device for chip packaging Figure 1 ;

[0023] Figure 2 The utility model proposes a three-dimensional heat dissipation device for chip packaging Figure 2 ;

[0024] Figure 3 This is a schematic diagram of the exploded structure of a heat dissipation device for chip packaging proposed by the present invention;

[0025] Figure 4 is a structural schematic diagram of a substrate assembly;

[0026] Figure 5 Schematic diagram of the heat dissipation structure Figure 1 ;

[0027] Figure 6 Schematic diagram of the heat dissipation structure Figure 2 .

[0028] Legend:

[0029] 1. Substrate assembly; 2. Heat dissipation structure; 3. Packaged chip; 11. Substrate carrier; 12. Protective plate; 13. Package slot; 14. Positioning hole; 21. Heat spreader; 22. Thermal conductive silicone gasket; 23. Welding part; 24. Positioning column; 25. Heat dissipation fin; 31. Chip body; 32. Pin. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Reference Figures 1-6 , the utility model provides an embodiment: a heat dissipation device for chip packaging, comprising a substrate assembly 1, a heat dissipation structure 2 and a packaged chip 3, the heat dissipation structure 2 is fixedly mounted on the substrate assembly 1, the packaged chip 3 is mounted on the substrate assembly 1 and is fitted with the heat dissipation structure 2; the heat dissipation structure 2 comprises a heat spreader 21, a thermally conductive silicone gasket 22 and heat dissipation fins 25, the thermally conductive silicone gasket 22 is fixedly connected to the heat spreader 21, the packaged chip 3 is fitted on the thermally conductive silicone gasket 22, and the heat spreader 21 is fixedly connected with the heat dissipation fins 25 on the side away from the thermally conductive silicone gasket 22. In a specific embodiment, the thermally conductive silicone gasket is a thermally conductive silicone gasket with a thermal conductivity of more than 5.0 W / m·K, and heat dissipation silicone grease is applied between the thermally conductive silicone gasket 22 and the chip body 31 to ensure that the thermally conductive silicone gasket 22 and the chip body 31 fit tightly and there is no air.

[0032] The substrate assembly 1 includes a substrate carrier 11, and a welding portion 23 is fixedly connected to the heat spreader 21. The welding portion 23 is fixedly connected to the substrate carrier 11. The welding portion 23 on the heat spreader 21 is welded to the substrate carrier 11 to form a firm connection, thereby improving the mechanical strength of the entire device. The heat spreader 21 is a metal plate with strong thermal conductivity, preferably an aluminum plate with a thickness of 0.2 mm. In another embodiment, the heat spreader 21 is made of copper metal material.

[0033] A positioning hole 14 is provided on the substrate carrier 11, and a positioning post 24 is fixedly connected to the heat spreader 21 on the same surface of the thermal conductive silicone gasket 22. The positioning post 24 is arranged in the positioning hole 14. During the assembly process, the positioning post 24 on the heat spreader 21 is inserted into the positioning hole 14 on the substrate carrier 11, ensuring the accurate alignment of the heat dissipation structure 2 and the substrate assembly 1. This structural design helps to improve the accuracy and efficiency of assembly, and also ensures the stability of the heat dissipation structure 2 during operation.

[0034] There are multiple heat sink fins 25 and they are evenly distributed on the heat spreader 21. The multiple heat sink fins 25 are evenly distributed on the heat spreader 21 to increase the contact area with the air and improve the heat dissipation efficiency. At the same time, the evenly arranged heat sink fins 25 also help to evenly dissipate heat.

[0035] A packaging groove 13 is defined on the substrate carrier 11 , and a thermally conductive silicone gasket 22 is disposed in the packaging groove 13 .

[0036] The substrate carrier 11 is fixedly connected to protective plates 12 on both sides of the packaging groove 13 .

[0037] The packaged chip 3 includes a chip body 31 . The chip body 31 is provided with pins 32 . The pins 32 are soldered to the substrate carrier 11 .

[0038] Working principle: When the packaged chip 3 is working, the heat generated by the chip body 31 is first conducted to the thermally conductive silicone gasket 22 that is tightly fitted therewith. The thermally conductive silicone gasket 22 has good thermal conductivity and can quickly transfer heat to the heat spreader 21. In a specific embodiment, heat dissipation silicone grease is applied between the thermally conductive silicone gasket 22 and the chip body 31 to ensure that the thermally conductive silicone gasket 22 and the chip body 31 are tightly fitted and there is no air. The heat spreader 21 is a metal plate with strong thermal conductivity, preferably an aluminum plate with a thickness of 0.2 mm, which distributes the heat evenly over the entire plate surface. Then, the heat on the heat spreader 21 is expanded through the fixedly connected heat dissipation fins 25 to expand the heat dissipation area. The heat dissipation fins 25 increase the contact area with the air and improve the heat dissipation efficiency.

[0039] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation device for chip packaging, characterized in that: It comprises a substrate assembly (1), a heat dissipation structure (2) and a packaged chip (3), wherein the heat dissipation structure (2) is fixedly mounted on the substrate assembly (1), and the packaged chip (3) is mounted on the substrate assembly (1) and is arranged in a bonded manner with the heat dissipation structure (2); The heat dissipation structure (2) comprises a heat spreader (21), a heat-conducting silicone gasket (22) and heat dissipation fins (25); the heat-conducting silicone gasket (22) is fixedly connected to the heat spreader (21); the packaged chip (3) is attached to the heat-conducting silicone gasket (22); and the heat spreader (21) is fixedly connected to the heat dissipation fins (25) on a side away from the heat-conducting silicone gasket (22).

2. The heat dissipation device for chip packaging according to claim 1, characterized in that: The substrate assembly (1) comprises a substrate carrier (11), a welding portion (23) is fixedly connected to the heat spreader (21), and the welding portion (23) is fixedly connected to the substrate carrier (11).

3. The heat dissipation device for chip packaging according to claim 2, characterized in that: A positioning hole (14) is provided on the substrate carrier (11); a positioning column (24) is fixedly connected to the heat spreader (21) on the same surface of the heat-conducting silicone gasket (22); and the positioning column (24) is arranged in the positioning hole (14).

4. The heat dissipation device for chip packaging according to claim 3, characterized in that: A plurality of heat dissipation fins (25) are provided and are evenly distributed on the heat spreader (21).

5. The heat dissipation device for chip packaging according to claim 4, characterized in that: A packaging groove (13) is provided on the substrate carrier (11), and the heat-conducting silica gel gasket (22) is arranged in the packaging groove (13).

6. The heat dissipation device for chip packaging according to claim 5, characterized in that: The substrate carrier (11) is fixedly connected to protective plates (12) on both sides of the packaging groove (13).

7. The heat dissipation device for chip packaging according to claim 6, characterized in that: The packaged chip (3) comprises a chip body (31), the chip body (31) is provided with pins (32), and the pins (32) are welded on a substrate carrier (11).

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