Double-layer adhesive-pulling COB lamp strip

Abstract

The utility model belongs to the technical field of lighting devices, and provides a double-layer pull glue COB lamp strip which comprises a substrate, a light-emitting chip, a first packaging glue body and a second packaging glue body. The light-emitting chip is fixedly connected with the substrate through a conductive bonding material; a plurality of light-emitting chips are arranged along the length direction of the substrate and are electrically connected with one another; the first packaging colloid is laid on the substrate; the second packaging colloid is laid on the first packaging colloid; wherein the first packaging colloid and the second packaging colloid are silica gel with different colors and / or transparency. According to the COB lamp strip, a silica gel packaging material of an existing COB lamp strip is separated into the first packaging colloid and the second packaging colloid which are different in color, material proportion and transparency from an integrated structure, and the two packaging colloids with different characteristics are matched, so that the special illumination use requirements of lateral light emitting, three-face light emitting, light gathering, light scattering, color gradual change and the like can be met; and the limitation of the lighting effect of the traditional COB lamp strip is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of lighting devices, and specifically relates to a double-layer glue-drawn COB light strip. Background Art

[0002] COB light strips are a type of light strip that directly packages LED chips on a circuit board. Through a special packaging process, numerous LED chips are closely arranged together to form a high-density distribution of light points, thereby achieving higher brightness and luminous efficiency, and good color consistency.

[0003] However, due to their structure, COB light strips cannot usually be used with professional optical equipment such as professional optical lenses or reflectors, making it difficult to meet some specific lighting design requirements. In addition, the light emitted by COB light strips is directly emitted by the LED chip at a luminous angle close to 180°. Even after multiple refractions and reflections from the encapsulation colloid, glare is prone to occur, causing damage to the eyes. Summary of the Invention

[0004] In order to solve the problem that the existing COB light strip has a single structure and is difficult to meet some specific lighting design requirements, the present application provides a double-layer glue COB light strip.

[0005] In one embodiment, a double-layer glue-pulled COB light strip includes a substrate, a light-emitting chip, a first encapsulation colloid, and a second encapsulation colloid;

[0006] The light-emitting chip is fixedly connected to the substrate through a conductive adhesive material; a plurality of light-emitting chips are arranged along the length direction of the substrate, and the plurality of light-emitting chips are electrically connected;

[0007] The first encapsulation colloid is applied on the substrate, and the first encapsulation colloid at least completely covers both sides of the plurality of light-emitting chips; the second encapsulation colloid is applied on the first encapsulation colloid, and the second encapsulation colloid does not contact the substrate;

[0008] The first encapsulating colloid and the second encapsulating colloid are silicone rubbers with different colors and / or transparencies.

[0009] In one embodiment, the first encapsulating colloid is transparent silicone, and the second encapsulating colloid is white silicone.

[0010] In one embodiment, the first encapsulating colloid is transparent silicone, and the second encapsulating colloid is colored silicone.

[0011] In one embodiment, both sides of the light emitting chip are bonded to the first encapsulation colloid, and the top of the light emitting chip is bonded to the second encapsulation colloid;

[0012] The first packaging colloid is solid color silicone, and the second packaging colloid is transparent silicone.

[0013] In one solution, the light-emitting chips may be electrically connected by wire bonding, flip-chip technology, or printed circuit board wiring.

[0014] In one solution, the double-layer glue-drawn COB light strip further includes a voltage-dividing resistor, which is connected in series with a plurality of light-emitting chips.

[0015] In one embodiment, the light-emitting chip can achieve a variety of color light-emitting effects through phosphor conversion or circuit control.

[0016] Beneficial effects of this application:

[0017] This application separates the silicone packaging material of the existing COB light strip from an integrated structure into a first packaging colloid and a second packaging colloid with different colors, material ratios, and transparencies. By matching the two parts of packaging colloid with different characteristics, special lighting requirements such as side lighting, three-sided lighting, focusing, scattered light, and color gradient can be achieved, thereby improving the limitations of the lighting effect of traditional COB light strips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 This is a schematic diagram of a double-layer glue-drawn COB light strip in one embodiment of the present application;

[0020] Figure 2 This is a front view of a double-layer glue-drawn COB light strip in one embodiment of the present application;

[0021] Figure 3 This is a side cross-sectional view of a double-layer glue-drawn COB light strip in one embodiment of the present application;

[0022] Figure 4 This is a bottom view of a double-layer glue-drawn COB light strip in one embodiment of the present application;

[0023] Reference numerals in the figures:

[0024] 1. Substrate; 2. Light-emitting chip; 3. First packaging colloid; 4. Second packaging colloid. DETAILED DESCRIPTION

[0025] The specific embodiments of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application and not all embodiments. All other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of this application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0028] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0029] In this application, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0030] To solve the problem that the existing COB light strip has a single structure and is difficult to meet some specific lighting design requirements, the present application provides a double-layer glue-drawn COB light strip, the specific embodiments of which are as follows:

[0031] In one embodiment, see Figures 1 to 4 The double-layer glue-pulled COB light strip includes a substrate 1, a light-emitting chip 2, a first packaging colloid 3 and a second packaging colloid 4.

[0032] In this embodiment, the light-emitting chip 2 is fixedly connected to the substrate 1 via a conductive adhesive material. Several light-emitting chips 2 are arranged along the length of the substrate 1, and the plurality of light-emitting chips 2 are electrically connected. The substrate 1 is the basic structure for the electrical connection of the COB light strip, providing physical support for the light-emitting chip 2 and also serving as a heat dissipation channel for the COB light strip. Common substrates 1 include aluminum substrates 1 and ceramic substrates 1. The light-emitting chip 2 is typically an LED chip, which uses high-quality semiconductors that can efficiently convert electrical energy into light energy when powered. The conductive adhesive material can specifically be conductive silver glue, which has excellent conductivity and bonding strength, and can meet the requirements of electrical connection and mechanical fixation between the light-emitting chip 2 and the substrate 1.

[0033] In this embodiment, the first encapsulating colloid 3 and the second encapsulating colloid 4 are silicones of different colors and / or transparencies. The silicone has excellent optical properties, weather resistance, and flexibility, and can better protect the light-emitting chip 2. At the same time, transparent silicone and silicone with a low pigment concentration have high light transmittance, which can evenly scatter the light.

[0034] In this embodiment, a first encapsulant 3 is applied to a substrate 1, completely covering at least two sides of a plurality of light-emitting chips 2. A second encapsulant 4 is applied to the first encapsulant 3, without contacting the substrate 1. This means that light from the light-emitting chips 2 is typically emitted at a near 180° angle, with light from the two sides passing through the first encapsulant 3. Light from the upper side passes sequentially through the first encapsulant 3 and the second encapsulant 4, or directly through the second encapsulant 4.

[0035] During the packaging process, after the light-emitting chip 2 is bonded to the substrate 1 and dried, a dispensing machine is used to apply the first packaging colloid 3 to the substrate 1 according to design requirements, so that the light-emitting chip 2 is completely covered by the first packaging colloid 3 or is applied until only the upper side of each light-emitting chip 2 is exposed; after the first packaging colloid 3 is cured, the second packaging colloid 4 is applied to the upper side of the light-emitting chip 2 or on top of the first packaging colloid 3 using the dispensing machine again.

[0036] Therefore, the present application separates the silicone packaging material of the existing COB light strip from an integrated structure into a first packaging colloid 3 and a second packaging colloid 4 with different colors, material ratios, and transparencies, and combines the first packaging colloid 3 and the second packaging colloid 4 with different characteristics to achieve special lighting usage requirements such as side lighting, three-sided light output, focusing, scattered light, and color gradient, thereby improving the limitations of the lighting effect of traditional COB light strips.

[0037] In one embodiment, the first encapsulating colloid 3 is transparent silicone, and the second encapsulating colloid 4 is white silicone.

[0038] When the pigment concentration of the second encapsulant 4 is low, light from both sides of the light-emitting chip 2 can be emitted with low scattering loss through the first encapsulant 3. Light from the upper and side surfaces of the light-emitting chip 2 is blocked and absorbed by the pigment in the second encapsulant 4 and then emitted with lower luminous efficiency, thereby reducing the probability of glare during use of the COB light strip. When the pigment concentration of the second encapsulant 4 is high, the second encapsulant 4 will block the propagation of light, and light from the light-emitting chip 2 can only be emitted through the first encapsulant 3 on both sides. In this case, the COB light strip is a side-lit light strip.

[0039] In one embodiment, the first encapsulating colloid 3 is transparent silicone, and the second encapsulating colloid 4 is colored silicone.

[0040] In this embodiment, the second encapsulating colloid 4 is silicone with a low concentration of color pigment added. When the COB light strip is powered on, the light on both sides of the light-emitting chip 2 is emitted in its original color through the first encapsulating colloid 3; the light on the upper side of the light-emitting chip 2 can produce a light effect of the color corresponding to the pigment in the second encapsulating colloid 4 when passing through the second encapsulating colloid 4. Therefore, under the joint action of the first encapsulating colloid 3 and the second encapsulating colloid 4, the COB light strip can have a color gradient effect or be used for atmosphere lighting.

[0041] In one embodiment, the first encapsulating colloid 3 is solid-color silicone, and the second encapsulating colloid 4 is transparent silicone.

[0042] In this embodiment, the sides of the light-emitting chip 2 are bonded to the first encapsulant 3, and the top of the light-emitting chip 2 is bonded to the second encapsulant 4. When the COB light strip is powered on, light from both sides of the light-emitting chip 2 is blocked by the first encapsulant 3. Light can only pass through the second encapsulant 4 and exit from the top side of the light-emitting chip 2, achieving a focused light effect. In particular, by designing a curved surface at the contact surface between the second encapsulant 4 and the light-emitting chip 2, the COB light strip's focused light effect can be further enhanced.

[0043] In one embodiment, the electrical connection between the plurality of light-emitting chips 2 can be achieved by wire bonding, flip-chip technology, or printed circuit board wiring. Wire bonding involves connecting the electrodes of the light-emitting chips 2 to pads on the substrate 1 using metal wires through processes such as thermocompression welding, ultrasonic welding, or gold wire ball welding, thereby achieving electrical connection between the light-emitting chips 2. The electrodes of a flip-chip directly contact corresponding solder joints on the substrate 1 through bumps to form an electrical connection, eliminating the need for metal wire leads. This can reduce chip spacing, improve integration and luminous efficiency, and provide better heat dissipation performance. Printed circuit board wiring involves printing conductive lines on the substrate 1 and connecting the electrodes of each light-emitting chip 2 through these lines, similar to connecting electronic components on a conventional circuit board, allowing current to be transmitted between the light-emitting chips 2, thereby achieving overall circuit connectivity.

[0044] In one embodiment, the double-layer glue-on COB light strip also includes a voltage-divider resistor, which is connected in series with several light-emitting chips 2. The voltage-divider resistor can be used to adjust the current. Since different light-emitting chips 2 have different current requirements, connecting appropriate voltage-divider resistors in series can ensure that each light-emitting chip 2 receives the appropriate operating current, preventing damage to some light-emitting chips 2 due to overcurrent. The voltage-divider resistor can also balance the voltage across different parts of the light strip, ensuring uniform brightness across the entire strip. This is particularly effective when using longer light strips or multiple light strips in series.

[0045] In one embodiment, the light-emitting chip 2 can achieve multiple color luminescence effects through phosphor conversion or circuit control. By combining the color conversion of the light-emitting chip 2 with different combinations of the first encapsulating colloid 3 and the second encapsulating colloid 4, the COB light strip can achieve more diverse optical effects to meet more lighting needs.

[0046] Phosphor conversion utilizes the photoluminescent properties of phosphors. When illuminated by light from the light-emitting chip 2, the phosphor absorbs the energy of that light and re-emit it at a different wavelength, thereby changing the color of the light. Circuit control utilizes the principle of the three primary colors in optics. The COB light strip has three independent channels for the light-emitting chip 2: red, green, and blue. The control circuit can change the current in each channel, thereby adjusting the intensity of the red, green, and blue light. The different colors of light are mixed to create a variety of color luminous effects. Furthermore, through more complex control algorithms and dimming methods, various dynamic effects such as color gradients and flickering can be achieved.

[0047] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A double-layer glued COB light strip, characterized in that: It includes a substrate, a light-emitting chip, a first packaging colloid and a second packaging colloid; The light-emitting chip is fixedly connected to the substrate via a conductive adhesive material; a plurality of light-emitting chips are arranged along the length direction of the substrate, and the plurality of light-emitting chips are electrically connected; The first encapsulation colloid is applied on the substrate, and the first encapsulation colloid at least completely covers two sides of the plurality of light-emitting chips; the second encapsulation colloid is applied on the first encapsulation colloid, and the second encapsulation colloid does not contact the substrate; Wherein, the first encapsulating colloid and the second encapsulating colloid are silicone rubbers with different colors and / or transparencies.

2. The double-layer glue-drawn COB light strip according to claim 1, characterized in that: The first packaging colloid is transparent silica gel, and the second packaging colloid is white silica gel.

3. The double-layer glue-drawn COB light strip according to claim 1, characterized in that: The first packaging colloid is transparent silica gel, and the second packaging colloid is colored silica gel.

4. The double-layer glue-drawn COB light strip according to claim 1, characterized in that: Both sides of the light-emitting chip are bonded to the first packaging colloid, and the top of the light-emitting chip is bonded to the second packaging colloid; The first packaging colloid is solid color silica gel, and the second packaging colloid is transparent silica gel.

5. The double-layer glue-drawn COB light strip according to claim 1, characterized in that: The light-emitting chips can be electrically connected by wire bonding, flip chip technology or printed circuit board wiring.

6. The double-layer glue-drawn COB light strip according to claim 1, characterized in that: It also includes a voltage-dividing resistor, which is connected in series with several of the light-emitting chips.

7. The double-layer glue-drawn COB light strip according to any one of claims 1-6, characterized in that: The light-emitting chip can achieve luminous effects of multiple colors through phosphor conversion or circuit control.

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