SIP (Session Initiation Protocol) integrated packaging structure of high-precision multi-axis inertial sensing chip for vehicle

Abstract

The utility model relates to the technical field of vehicle multi-axis inertial sensing chips, and discloses a vehicle high-precision multi-axis inertial sensing chip SIP integrated packaging structure, which comprises a substrate, assembling grooves are arranged on two sides in the substrate, welding balls are uniformly arranged at the bottom end of the substrate, a protective layer is fixed at the top end of the substrate, and the protective layer is fixed at the bottom end of the substrate. And a wafer is installed at the top end of the protection layer, connecting blocks are fixed to the two sides of the top end of the interior of the packaging cover, and reinforcing rods are fixed to the bottom ends of the connecting blocks. According to the packaging structure of the utility model, after the packaging cover and the substrate are clamped together, the reinforcing rods in the substrate are clamped with the reinforcing seats at the top end of the substrate, so that the plurality of reinforcing seats support and reinforce the packaging cover; and meanwhile, components such as the first reinforcing rib and the second reinforcing rib are arranged in the packaging cover, so that the structural strength of the reinforcing seat is greatly improved, and the packaging structure is not easy to press and deform when being used.

Description

Technical Field

[0001] The utility model relates to the technical field of multi-axis inertial sensor chips for vehicles, in particular to a SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for vehicles. Background Art

[0002] The automotive multi-axis inertial sensor chip is a sensor used in automotive safety systems. It can detect and measure acceleration, impact, vibration and rotation, and has the characteristics of high precision, fast response speed and strong reliability. The automotive multi-axis inertial sensor chip SIP integrated packaging structure is a packaging device that integrates multiple chips into a package to form a complete basic function.

[0003] Traditional automotive high-precision multi-axis inertial sensor chip SIP integrated packaging structures can damage the chip inside if the packaging structure encounters external pressure during use. Therefore, we propose a high-precision multi-axis inertial sensor chip SIP integrated packaging structure for automotive use to improve this problem. Utility Model Content

[0004] The purpose of the present invention is to provide a high-precision multi-axis inertial sensor chip SIP integrated packaging structure for vehicles to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a SIP integrated packaging structure for a high-precision multi-axis inertial sensor chip for a vehicle, comprising a substrate, assembly grooves being provided on both sides of the interior of the substrate, welding balls being evenly provided on the bottom end of the substrate, a protective layer being fixed to the top end of the substrate, and a chip being mounted on the top end of the protective layer, reinforcement seats being fixed on both sides of the top end of the substrate, a packaging cover being movably provided on the outer side wall of the substrate, an inner cavity being provided on the top end of the packaging cover, and the interior of the inner cavity being filled with cross-distributed first reinforcement ribs and first reinforcement ribs, assembly blocks being fixed on both sides of the interior of the packaging cover, connecting blocks being fixed on both sides of the top end of the packaging cover, and reinforcement rods being fixed to the bottom ends of the connecting blocks.

[0006] As a further technical solution of the present invention, a plurality of the first reinforcing ribs and the second reinforcing ribs are provided, and the plurality of the first reinforcing ribs and the second reinforcing ribs are welded together to form a whole.

[0007] As a further technical solution of the present invention, the cross section of the reinforcement rod is smaller than the cross section of the reinforcement seat, and a snap-fit ​​structure is formed between the reinforcement rod and the reinforcement seat.

[0008] As a further technical solution of the present invention, a plurality of reinforcing rods are provided, and the plurality of reinforcing rods are symmetrically distributed about the central axis of the packaging cover.

[0009] As a further technical solution of the present invention, support bars are fixed on both sides of the top of the packaging cover, and horizontal plates are fixed on the top of the support bars. A thermally conductive silicone block is movably provided on the top of the packaging cover, and heat dissipation fins are fixed on the top of the thermally conductive silicone block. Mounting blocks are fixed on both sides of the thermally conductive silicone block, and locking grooves are provided on the top of the mounting blocks. Locking blocks are movably provided inside the locking grooves, and threaded rods are installed on the tops of the locking blocks, and rotating blocks are installed on the tops of the threaded rods.

[0010] As a further technical solution of the present invention, the cross section of the locking block is smaller than the cross section of the locking groove, and a locking structure is formed between the locking block and the locking groove.

[0011] As a further technical solution of the present invention, a sealing groove is provided at the bottom end of the interior of the packaging cover, a fixing strip is fixed to the bottom end of the outer side wall of the substrate, and a sealing strip is fixed to the top end of the fixing strip.

[0012] As a further technical solution of the present invention, the cross section of the sealing strip is smaller than the cross section of the sealing groove, and a snap-fit ​​structure is formed between the sealing strip and the sealing groove.

[0013] Compared with the prior art, the beneficial effects of the present invention are: the SIP integrated packaging structure of the high-precision multi-axis inertial sensor chip for automobiles not only realizes the reinforcement protection of the packaging structure, realizes better heat dissipation effect of the packaging structure, but also realizes the sealing protection of the packaging structure;

[0014] After the packaging cover and the base plate in the packaging structure are locked together, the reinforcement rods inside the base plate will be locked together with the reinforcement base at the top of the base plate, so that the multiple reinforcement bases support and reinforce the packaging cover. At the same time, because the first reinforcement ribs and the second reinforcement ribs are provided inside the packaging cover, the structural strength of the reinforcement base is greatly increased, and it is not easily deformed by compression when the packaging structure is used.

[0015] By providing components such as heat dissipation fins, thermal conductive silicone blocks, mounting blocks, and cross plates, the heat dissipation fins in the above components can dissipate the heat generated by the chip when it is in use. At the same time, the design of other components makes it easy to disassemble, install, and replace the heat dissipation fins, thereby achieving a better heat dissipation effect of the chip packaging structure.

[0016] When the packaging cover and the substrate in the packaging structure are snapped together to form a whole for packaging, components such as a sealing groove, a fixing strip and a sealing strip are provided. After the packaging cover and the substrate are snapped together, the sealing strip will be snapped together with the sealing groove to seal and protect the packaging structure, thereby greatly increasing the sealing performance between the packaging cover and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the front cross-sectional structure of the present utility model;

[0018] Figure 2 For the utility model Figure 1 A schematic diagram of the partially enlarged surface structure at center A;

[0019] Figure 3 This is a schematic diagram of the top view of the heat dissipation fin structure of the present invention;

[0020] Figure 4 This is a schematic diagram of the top view of the first reinforcing rib of the present invention.

[0021] In the figure: 1. Packaging cover; 2. Assembly block; 3. Assembly groove; 4. Solder ball; 5. Wafer; 6. Protective layer; 7. Base plate; 8. Support bar; 9. Heat sink fin; 10. Thermal conductive silicone block; 11. Reinforcement seat; 12. Mounting block; 13. Locking block; 14. Cross plate; 15. Rotating block; 16. Threaded rod; 17. Locking groove; 18. Connecting block; 19. Reinforcement rod; 20. Sealing groove; 21. Fixing bar; 22. Sealing strip; 23. Inner cavity; 24. First reinforcing rib; 25. Second reinforcing rib. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] See also Figure 1-4The utility model provides an embodiment: a SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle, comprising a substrate 7, assembly grooves 3 are provided on both sides of the interior of the substrate 7, welding balls 4 are evenly provided on the bottom end of the substrate 7, a protective layer 6 is fixed on the top of the substrate 7, and a chip 5 is installed on the top of the protective layer 6, reinforcement seats 11 are fixed on both sides of the top of the substrate 7, a packaging cover 1 is movably provided on the outer wall of the substrate 7, an inner cavity 23 is provided on the top of the packaging cover 1, and the interior of the inner cavity 23 is filled with a cross-distributed first reinforcing rib 24 and a first reinforcing rib 24, and assembly is fixed on both sides of the interior of the packaging cover 1. Block 2, connecting blocks 18 are fixed on both sides of the top of the inner part of the packaging cover 1, and reinforcing rods 19 are fixed to the bottom ends of the connecting blocks 18. Several first reinforcing ribs 24 and second reinforcing ribs 25 are provided. Several first reinforcing ribs 24 and second reinforcing ribs 25 are welded together to form a whole, which has a better and more comprehensive reinforcement effect on the packaging cover 1. The cross section of the reinforcing rod 19 is smaller than the cross section of the reinforcement seat 11. The reinforcing rod 19 and the reinforcement seat 11 form a snap-fit ​​structure. There are several reinforcing rods 19, and the several reinforcing rods 19 are symmetrically distributed about the central axis of the packaging cover 1, so that the support and reinforcement effect of the packaging cover 1 is better;

[0024] Specifically, if Figure 1 and Figure 4 As shown, when the packaging cover 1 and the substrate 7 are assembled together, the reinforcement rod 19 at the bottom end of the packaging cover 1 will be engaged with the reinforcement seat 11 above the substrate 7 and the reinforcement seat 11, and then multiple reinforcement rods 19 will support and reinforce the substrate 7. At the same time, because the top end of the packaging cover 1 is provided with a cross-distributed first reinforcement rib 24 and a second reinforcement rib 25, the structural strength of the packaging cover 1 is greatly increased, thereby improving the overall structural strength of the packaging structure.

[0025] Support bars 8 are fixed on both sides of the top of the packaging cover 1, and cross plates 14 are fixed on the tops of the support bars 8. A thermally conductive silicone block 10 is movably provided on the top of the packaging cover 1, and a heat dissipation fin 9 is fixed on the top of the thermally conductive silicone block 10. Mounting blocks 12 are fixed on both sides of the thermally conductive silicone block 10, and locking grooves 17 are provided on the tops of the mounting blocks 12. Locking blocks 13 are movably provided inside the locking grooves 17. Threaded rods 16 are installed on the tops of the locking blocks 13, and rotating blocks 15 are installed on the tops of the threaded rods 16. The cross section of the locking blocks 13 is smaller than the cross section of the locking grooves 17. A snap-fit ​​structure is formed between the locking blocks 13 and the locking grooves 17, so that the heat dissipation fins 9 are stably mounted on top of the packaging cover 1;

[0026] Specifically, if Figure 1 、 Figure 2 and Figure 3As shown, when the packaging structure is in use, after the chip 5 and other components inside it conduct heat, the heat will be conducted out through the thermally conductive silicone block 10, and then conducted out by the heat dissipation fins 9 through the thermally conductive silicone block 10, thereby improving the heat dissipation performance of the chip packaging structure. Subsequently, a tool can be used to engage with the inside of the rotating block 15 to rotate the rotating block 15. The rotation of the rotating block 15 drives the threaded rod 16 to rotate so that the locking block 13 at the bottom end of the threaded rod 16 moves out from the inside of the locking groove 17, and then the heat dissipation fin 9 is pulled toward one end so that the mounting blocks 12 on both sides are moved out from the inside of the groove body assembled by the cross plate 14 and the support bar 8. The heat dissipation fin 9 can be disassembled and assembled from the top of the packaging cover 1, and then the corresponding replacement and maintenance can be carried out.

[0027] A sealing groove 20 is provided at the bottom end of the interior of the packaging cover 1. A fixing strip 21 is fixed to the bottom end of the outer wall of the substrate 7, and a sealing strip 22 is fixed to the top end of the fixing strip 21. The cross section of the sealing strip 22 is smaller than the cross section of the sealing groove 20. The sealing strip 22 and the sealing groove 20 form a snap-fit ​​structure, which improves the sealing protection effect between the packaging cover 1 and the substrate 7.

[0028] Specifically, if Figure 1 and Figure 3 As shown, when the packaging cover 1 and the substrate 7 are assembled together to form a packaging structure, the sealing groove 20 at the bottom end of the packaging cover 1 will be engaged with the sealing strip 22 at the top end of the fixing strip 21 on the outer wall of the substrate 7 to provide sealing protection for the assembly of the packaging cover 1 and the substrate 7.

[0029] Working principle: When the sensor chip SIP integrated packaging structure of the present invention is in use, the chip 5 is installed above the substrate 7, and the rear packaging cover 1 is engaged with the assembly groove 3 inside the substrate 7 through the assembly block 2, so that the packaging cover 1 and the substrate 7 are assembled together to form a whole, and when the packaging cover 1 and the substrate 7 are engaged together, the sealing groove 20 inside the packaging cover 1 will be engaged with the sealing strip 22 at the top of the substrate 7 for sealing protection. When the sensor chip SIP integrated packaging structure is in use, the heat generated inside it will be conducted to the heat dissipation fins 9 through the thermal conductive silicone block 10, and the rear heat dissipation fins 9 will quickly conduct the heat. At the same time, because the reinforcing rod 19 is added to the interior of the sensor chip SIP integrated packaging structure to support and reinforce the packaging cover 1, and the cross-distributed first reinforcing ribs 24 and second reinforcing ribs 25, the structural strength of the packaging cover 1 is also improved, thereby greatly increasing the overall strength of the sensor chip SIP integrated packaging structure, and can protect the chip 5 and other components inside it.

[0030] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A high-precision multi-axis inertial sensor chip SIP integrated packaging structure for a vehicle, comprising a substrate (7), characterized in that: Both sides of the interior of the substrate (7) are provided with assembly grooves (3), the bottom end of the substrate (7) is evenly provided with welding balls (4), the top end of the substrate (7) is fixed with a protective layer (6), and the top end of the protective layer (6) is installed with a chip (5), both sides of the top end of the substrate (7) are fixed with reinforcement seats (11), the outer side wall of the substrate (7) is movably provided with a packaging cover (1), the top end of the interior of the packaging cover (1) is provided with an inner cavity (23), and the interior of the inner cavity (23) is filled with cross-distributed first reinforcement ribs (24) and first reinforcement ribs (24), both sides of the interior of the packaging cover (1) are fixed with assembly blocks (2), both sides of the top end of the interior of the packaging cover (1) are fixed with connecting blocks (18), and the bottom end of the connecting block (18) is fixed with a reinforcement rod (19).

2. The SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle according to claim 1, characterized in that: A plurality of the first reinforcing ribs (24) and the second reinforcing ribs (25) are provided, and the plurality of the first reinforcing ribs (24) and the second reinforcing ribs (25) are welded together to form a whole.

3. The SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle according to claim 1, characterized in that: The cross section of the reinforcement rod (19) is smaller than the cross section of the reinforcement seat (11), and a snap-fit ​​structure is formed between the reinforcement rod (19) and the reinforcement seat (11).

4. The SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle according to claim 1, characterized in that: A plurality of the reinforcement rods (19) are provided, and the plurality of the reinforcement rods (19) are symmetrically distributed about the central axis of the packaging cover (1).

5. The SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle according to claim 1, characterized in that: Support bars (8) are fixed on both sides of the top of the packaging cover (1), and a horizontal plate (14) is fixed on the top of the support bars (8). A heat-conducting silicone block (10) is movably provided on the top of the packaging cover (1), and a heat dissipation fin (9) is fixed on the top of the heat-conducting silicone block (10). Mounting blocks (12) are fixed on both sides of the heat-conducting silicone block (10), and a locking groove (17) is provided on the top of the mounting block (12). A locking block (13) is movably provided inside the locking groove (17), and a threaded rod (16) is installed on the top of the locking block (13), and a rotating block (15) is installed on the top of the threaded rod (16).

6. The SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle according to claim 5, characterized in that: The cross section of the locking block (13) is smaller than the cross section of the locking groove (17), and a snap-fit ​​structure is formed between the locking block (13) and the locking groove (17).

7. The SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle according to claim 1, characterized in that: A sealing groove (20) is provided at the bottom end of the interior of the packaging cover (1), a fixing strip (21) is fixed to the bottom end of the outer wall of the substrate (7), and a sealing strip (22) is fixed to the top end of the fixing strip (21).

8. The SIP integrated packaging structure of a high-precision multi-axis inertial sensor chip for a vehicle according to claim 7, characterized in that: The cross section of the sealing strip (22) is smaller than the cross section of the sealing groove (20), and a snap-fit ​​structure is formed between the sealing strip (22) and the sealing groove (20).

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